CN205161000U - Quick heat abstractor of piezoelectricity driven - Google Patents
Quick heat abstractor of piezoelectricity driven Download PDFInfo
- Publication number
- CN205161000U CN205161000U CN201520829584.3U CN201520829584U CN205161000U CN 205161000 U CN205161000 U CN 205161000U CN 201520829584 U CN201520829584 U CN 201520829584U CN 205161000 U CN205161000 U CN 205161000U
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Abstract
The utility model discloses a quick heat abstractor of piezoelectricity driven contains base and a plurality of setting flexible fin on the base, and wherein, base and flexible fin all adopt the heat conductivity material to make, it is crooked that flexible fin is lamellar, easy emergence vibration, contains oscillation unit and a plurality of setting strip heat dissipation unit on the oscillating component, oscillation unit fixes on the base, and the surface is equipped with the piezoelectric layer that piezoelectric material made, it is insulating between piezoelectric layer and the oscillation unit for drive the oscillation unit oscillation generation when inserting the alternating current on its two sides. The utility model discloses have controllable flexible fin vibration velocity, can accelerate the radiating effect of electron chip in the space narrow, that air flow rate is lower.
Description
Technical field
The utility model relates to heat dissipation of electronic chip field, particularly relates to a kind of rapid heat radiation device of Piezoelectric Driving.
Background technology
At present; known industrial emissions field be used for the method for cool electronic chip be generally by heat sink to be connected directly between with electronic chip together with; promoted the cooling of electronic chip by heat sink thermolysis, the temperature controlling electronic chip is no more than ceiling temperature, to reach protective effect.Heat sinkly in the industry just refer to miniature fin, to be this kind ofly heat sinkly mostly made up of the metal or alloy material that the conductive coefficient such as aluminium alloy, copper is high.
Then the heat sink of current modal industrial emissions field is all fixed structure.And no matter which kind of form heat sink fin is, be arranged in narrow space once heat sink, when air velocity is very low, heat sink thermolysis will be had a greatly reduced quality, and is unfavorable for protecting electronic chip.Therefore, a kind of rapid heat radiation device that still can effectively work in narrow space that is arranged on of utility model is just highly profitable.
Utility model content
Technical problem to be solved in the utility model is for the defect in background technology, provides a kind of rapid heat radiation device protecting the Piezoelectric Driving of electronic chip in narrow, that air velocity is low environment preferably.
The utility model is for solving the problems of the technologies described above by the following technical solutions:
A rapid heat radiation device for Piezoelectric Driving, comprises base and some flexible heat sinks be arranged on base;
Described base and flexible heat sink all adopt thermally conductive materials to make;
Generation vibration is bending in flake, easily for described flexible heat sink, comprises vibration unit and some strip heat-sink units be arranged on oscillating component;
Described vibration unit is fixed on base, and surface is provided with the piezoelectric layer that piezoelectric is made;
Insulate between described piezoelectric layer and vibration unit, for driving vibration unit to produce vibration when its two sides incoming transport is electric.
As the further prioritization scheme of rapid heat radiation device of a kind of Piezoelectric Driving of the utility model, described base and flexible heat sink all adopt aluminium alloy to make.
As the further prioritization scheme of rapid heat radiation device of a kind of Piezoelectric Driving of the utility model, the vibration unit of described flexible heat sink is vertically set on described base.
As the further prioritization scheme of rapid heat radiation device of a kind of Piezoelectric Driving of the utility model, described piezoelectric layer adopts insulating cement to be fixed on described vibration unit.
The utility model adopts above technical scheme compared with prior art, has following technique effect:
The utility model is according to the inverse piezoelectric effect of piezoelectric; to piezoelectric incoming transport electricity; piezoelectric is shunk and diastole; drive the flexible fins free vibration of sticking together thereon to form cross-ventilation simultaneously; the convection transfer rate on flexible fins surface in narrow space can be accelerated like this; accelerate radiating rate, thus it is too high to reach the unlikely temperature of protection electronic chip.
Heat sink compared to common, the convection transfer rate that the utility model has controlled flexible fins vibration velocity, can accelerate the flowing velocity of air, can improve fin surface, can accelerate the radiating effect of electronic chip in narrow, that air velocity is lower space.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is end view of the present utility model.
In figure: 1-base, 2-piezoelectric layer, 3-flexible heat sink.
Embodiment
Below in conjunction with accompanying drawing, the technical solution of the utility model is described in further detail:
As depicted in figs. 1 and 2, the utility model discloses a kind of rapid heat radiation device of Piezoelectric Driving, comprise base and some flexible heat sinks be arranged on base;
Described base and flexible heat sink all adopt thermally conductive materials to make;
Generation vibration is bending in flake, easily for described flexible heat sink, comprises vibration unit and some strip heat-sink units be arranged on oscillating component;
Described vibration unit is fixed on base, and surface is provided with the piezoelectric layer that piezoelectric is made;
Insulate between described piezoelectric layer and vibration unit, for driving vibration unit to produce vibration when its two sides incoming transport is electric.
Described base and flexible heat sink can adopt aluminium alloy to make, and also can be made of copper, or adopt the material that other thermal conductivity are good respectively.
The vibration unit of described flexible heat sink is vertically set on described base, and its Oscillation Amplitude now can be made maximum.
Described piezoelectric layer adopts insulating cement to be fixed on described vibration unit.
During use, base is fixed on the electronic chip of needs heat radiation.Alternating current is passed into two surfaces up and down of piezoelectric layer, can make piezoelectric produce shrink and diastole, and will drive flexible heat sink vibration unit produce vibration, so just can around flexible heat sink generation air-flow.Heat sends from electronic chip, the vibration unit of flexible heat sink is conducted to by base, and be upwards delivered to strip heat-sink unit gradually along vibration unit, finally mainly through strip heat-sink unit vibration, utilize the mode of heat loss through convection to be delivered in air by heat.
Those skilled in the art of the present technique are understandable that, unless otherwise defined, all terms used herein (comprising technical term and scientific terminology) have the meaning identical with the general understanding of the those of ordinary skill in field belonging to the utility model.Should also be understood that those terms defined in such as general dictionary should be understood to have the meaning consistent with the meaning in the context of prior art, unless and define as here, can not explain by idealized or too formal implication.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; be understood that; the foregoing is only embodiment of the present utility model; be not limited to the utility model; all within spirit of the present utility model and principle, any amendment made, equivalent replacement, improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. a rapid heat radiation device for Piezoelectric Driving, is characterized in that, comprises base and some flexible heat sinks be arranged on base;
Described base and flexible heat sink all adopt thermally conductive materials to make;
Generation vibration is bending in flake, easily for described flexible heat sink, comprises vibration unit and some strip heat-sink units be arranged on oscillating component;
Described vibration unit is fixed on base, and surface is provided with the piezoelectric layer that piezoelectric is made;
Insulate between described piezoelectric layer and vibration unit, for driving vibration unit to produce vibration when its two sides incoming transport is electric.
2. the rapid heat radiation device of Piezoelectric Driving according to claim 1, is characterized in that, described base and flexible heat sink all adopt aluminium alloy to make.
3. the rapid heat radiation device of Piezoelectric Driving according to claim 1, is characterized in that, the vibration unit of described flexible heat sink is vertically set on described base.
4. the rapid heat radiation device of Piezoelectric Driving according to claim 1, is characterized in that, described piezoelectric layer adopts insulating cement to be fixed on described vibration unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520829584.3U CN205161000U (en) | 2015-10-26 | 2015-10-26 | Quick heat abstractor of piezoelectricity driven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520829584.3U CN205161000U (en) | 2015-10-26 | 2015-10-26 | Quick heat abstractor of piezoelectricity driven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205161000U true CN205161000U (en) | 2016-04-13 |
Family
ID=55696637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520829584.3U Expired - Fee Related CN205161000U (en) | 2015-10-26 | 2015-10-26 | Quick heat abstractor of piezoelectricity driven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205161000U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283041A (en) * | 2015-10-26 | 2016-01-27 | 南京航空航天大学 | Piezoelectric driven rapid cooling device |
-
2015
- 2015-10-26 CN CN201520829584.3U patent/CN205161000U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105283041A (en) * | 2015-10-26 | 2016-01-27 | 南京航空航天大学 | Piezoelectric driven rapid cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20181026 |