CN113923950A - Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel - Google Patents
Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel Download PDFInfo
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- CN113923950A CN113923950A CN202111198990.0A CN202111198990A CN113923950A CN 113923950 A CN113923950 A CN 113923950A CN 202111198990 A CN202111198990 A CN 202111198990A CN 113923950 A CN113923950 A CN 113923950A
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- conductive fluid
- magnetic field
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The invention relates to the technical field of cooling of large heat flow density devices, and discloses a device and a method for cooling large heat flow density devices by utilizing a magnetic field and a micro-channel, which solve the problems that the device for cooling large heat flow density devices in the current market needs to be actively driven by a pump, the pump occupies a large space, a large amount of electric energy needs to be consumed, and the driving force of the traditional flow channel actively driven by the magnetic field and the thermoelectric effect is limited. The magnetic field generating device comprises a heating device, wherein a conductive fluid loop is installed at the top of the heating device, the outer wall of the conductive fluid loop is made of red copper metal, a micro-channel structure is arranged in the conductive fluid loop, and the conductive fluid loop is located in a magnetic field area generated by a magnet. The invention can realize the active flow of the liquid metal by utilizing the magnetic field and the thermal current generated by the temperature difference between the channel and the wall surface of the liquid metal, does not need to use the drive of a pump, saves the space, and has the advantages of large heat dissipation area, large driving force and good heat dissipation effect.
Description
Technical Field
The invention belongs to the technical field of cooling of high heat flow density devices, and particularly relates to a device and a method for cooling a high heat flow density device by utilizing a magnetic field and a micro-channel.
Background
The cooling of the large heat flow density device by utilizing the conductive fluid in the current market needs to be driven by an electromagnetic pump, the electromagnetic pump drives the conductive fluid to circulate so as to take out the heat of the large heat flow density device, and the conductive fluid is cooled by water cooling or air cooling and then flows to the electromagnetic pump for circulation. In addition, a scheme is that a thermal current is generated on the surface of the micro-channel structure by utilizing the temperature difference between an electronic device and the environment, and the interaction between a magnetic field and the current is utilized to drive the conductive fluid to flow and exchange heat.
The existing cooling of the heat flux density device has the following defects:
1. the electromagnetic pump drives the conductive fluid to exchange heat, occupies a large space, has limited heat exchange area and needs to consume a large amount of electric energy.
2. By utilizing a thermoelectric effect self-driving mode, the flow channel without the micro-channel structure generates small thermoelectric current and weak driving force.
Disclosure of Invention
Aiming at the situation, in order to overcome the defects of the prior art, the invention provides a device and a method for cooling a high heat flow density device by using a magnetic field and a micro-channel, and effectively solves the problems that the device for cooling the high heat flow density device by using the magnetic field in the current market needs an electromagnetic pump to be actively driven, has a small space-limited heat dissipation area and consumes a large amount of electric energy, and is self-driven by using a thermoelectric effect but has weak driving force in a mode without the micro-channel structure of the constantan material.
In order to achieve the purpose, the invention provides the following technical scheme: the device comprises a heating device, wherein a conductive fluid loop is installed at the top of the heating device, the outer wall of the conductive fluid loop is made of red copper metal, a micro-channel structure is arranged in the conductive fluid loop, the conductive fluid loop is located in a magnetic field area generated by a magnet, and a cooling fan is installed inside the conductive fluid loop.
Preferably, the conductive fluid circuit comprises a conductive fluid, a liquid metal or a conductive metal powder.
Preferably, the conductive fluid is one of gallium, gallium alloy, mercury, potassium-sodium alloy, salt solution or conductive metal powder.
Preferably, the material of the channel structure is constantan sheet.
Preferably, the heat dissipation fan is an electrically driven forced convection type heat dissipation mechanism.
A method for cooling a high heat flux device by using a magnetic field and a micro-channel comprises the following steps:
s1, the conductive fluid circulation loop is arranged above the large heat flow density device to be cooled, the large heat flow density device is arranged below the channel structure, the temperature is high, an electric fan is arranged above the channel structure for heat dissipation, the temperature is low, and a temperature gradient is formed in the vertical direction of the interface of the conductive fluid and the channel structure.
S2, a large heat flow density device is arranged below the channel structure, the temperature is high, an electric fan is arranged above the channel structure for heat dissipation, the temperature is low, and a temperature gradient is formed in the up-down direction of the interface of the conductive fluid and the channel structure. According to the thermoelectric effect principle, a temperature gradient is formed at the interface of the conductive fluid and the channel structure to generate thermoelectric force, thermoelectric current is generated in the conductive fluid and the channel structure, the magnitude of the thermoelectric current is in positive correlation with the thermoelectric coefficient difference between the two materials, the constantan material and the conductive fluid have larger thermoelectric coefficient difference, and the resistance value is small;
s3, the conductive fluid is driven to flow in the circulation loop by the action of electromagnetic force (lorentz force) under the action of the magnetic field, and the driving force is increased as the thermal current is increased.
Compared with the prior art, the invention has the beneficial effects that:
1) compared with a liquid metal cooling device driven by an electromagnetic pump, the device has the advantages that the circulation of the conductive fluid does not need the driving of the electromagnetic pump, and the conductive fluid can circularly flow in a loop under the action of electromagnetic force by utilizing the thermal current generated by the channel structure and the interface of the conductive fluid. The invention has simple structure, small occupied area and large heat dissipation area, and does not need to additionally consume electric energy.
2) Compared with a traditional channel driven by a thermoelectric effect, the channel structure and the conductive fluid have large thermoelectric coefficient difference, the resistance value is small, large thermoelectric current can be generated, the conductive fluid can rapidly flow in a loop under the action of electromagnetic force, the heat exchange coefficient is high, and the heat exchange quantity is large.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention as a whole;
in the figure: 1. a heat generating device; 2. a conductive fluid circuit; 3. a red copper metal outer wall; 4. a channel structure; 5. a magnetic field region; 6. a heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the first embodiment, as shown in fig. 1, the present invention includes a heat generating device 1, a conductive fluid circuit 2 is installed on the upper portion of the heat generating device 1, an outer wall surface of the conductive fluid circuit 2 is a red copper outer wall 3, a channel structure 4 and a magnetic field area 5 are arranged in the conductive fluid circuit 2, and a cooling fan 6 is installed inside the conductive fluid circuit 2.
In the second embodiment, on the basis of the first embodiment, the outer wall of the conductive fluid circuit 2 is made of red copper metal, and the heat of the large heat flow density device is transferred to the conductive fluid by the way that the red copper is already heat-conducting.
In the third embodiment, on the basis of the first embodiment, the conductive fluid circuit 2 includes a conductive fluid, a liquid metal or a conductive metal powder, and the liquid metal flowing through the conductive fluid circuit 2, such as gallium, gallium alloy, mercury, potassium-sodium alloy, etc., is in a high temperature region generated by the thermal power of the high heat flow density device and a low temperature region generated by the rotational cooling of the cooling fan 6.
In the fourth embodiment, on the basis of the first embodiment, the magnetic field region 5 is implemented by using an electromagnetic field or a permanent magnet, and the magnetic field region 5 is arranged so as to determine the counterclockwise or clockwise direction of the conductive fluid according to the self direction.
In the fifth embodiment, on the basis of the first embodiment, the heat dissipation fan 6 is an electrically driven forced convection type heat dissipation mechanism, and the heat dissipation fan 6 is arranged to provide a cold source for the conductive fluid, so that a temperature gradient is formed at the interface between the conductive fluid and the channel structure 4.
A method for cooling a high heat flux device by using a magnetic field comprises the following steps:
s1, the conductive fluid circulation loop is arranged above the large heat flow density device to be cooled, the large heat flow density device is arranged below the channel structure 4, the temperature is high, the heat dissipation fan 6 is arranged above the channel structure to dissipate heat, the temperature is low, and a temperature gradient is formed in the vertical direction of the interface of the conductive fluid and the channel structure 4.
S2, a large heat flow density device is arranged below the channel structure 4, the temperature is high, an electric fan is arranged above the channel structure 4 for heat dissipation, the temperature is low, and a temperature gradient is formed in the up-down direction of the interface of the conductive fluid and the channel structure 4. According to the thermoelectric effect principle, a temperature gradient is formed at the interface of the conductive fluid and the channel structure 4 to generate thermoelectric force, thermoelectric current is generated in the conductive fluid and the channel structure 4, the magnitude of the thermoelectric current is in positive correlation with the thermoelectric coefficient difference between the two materials, and the constantan material and the conductive fluid have larger thermoelectric coefficient difference;
s3, the conductive fluid is driven to flow in the circulation loop by the action of electromagnetic force (lorentz force) under the action of the magnetic field, and the driving force is increased as the thermal current is increased.
The working principle is as follows: when the cooling device works, the conductive fluid circulation loop is arranged above a large heat flow density device to be cooled, and the large heat flow density device is arranged below the channel structure 4 in the conductive fluid loop 2, so that the temperature is high; an electric fan is arranged above the heat sink, so that the temperature is low. A temperature gradient is formed at the interface of the conductive fluid and the channel structure 4, according to the principle of thermoelectric effect, thermoelectric potential is generated at the interface of the conductive fluid and the channel structure 4, thermoelectric current is generated in the conductive fluid, the conductive fluid is driven to flow in a circulation loop under the action of electromagnetic force under the action of a magnetic field area 5, the flow direction of the conductive fluid is anticlockwise or clockwise related to the direction of the magnetic field, under the condition of certain temperature gradient, the flow rate of the conductive fluid is positively related to the thermoelectric coefficient difference between the channel structure 4 and the conductive fluid, the larger the thermoelectric coefficient difference is, the larger the generated thermoelectric current is, the larger the electromagnetic force is, the stronger the driving force is, the flow of the conductive fluid is enhanced, the heat exchange amount is increased, and in the circulation process, heat is taken away through the convection heat exchange of an electrically-driven forced convection fan above.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an utilize magnetic field and microchannel to realize the device cooling of big heat flux density, includes device (1) that generates heat, its characterized in that: the upper portion of the heating device (1) is provided with a conductive fluid loop (2), the outer wall surface of the conductive fluid loop (2) is a red copper metal outer wall (3), a channel structure (4) is arranged in the conductor loop, the heating device (1) is located in a magnetic field area (5), and a cooling fan (6) is arranged inside the conductive fluid loop (2).
2. The device for cooling the device with high heat flux density by using the magnetic field and the micro-channel as claimed in claim 1, wherein: the channel structure (4) is made of a constantan sheet.
3. The device for cooling the device with high heat flux density by using the magnetic field and the micro-channel as claimed in claim 1, wherein: the conductive fluid circuit (2) comprises a conductive fluid, a liquid metal or a conductive metal powder.
4. The device for cooling the device with high heat flux density by using the magnetic field and the micro-channel as claimed in claim 3, wherein: such as one of gallium, gallium alloy, mercury, potassium sodium alloy, salt solution, or conductive metal powder.
5. The device for cooling the device with high heat flux density by using the magnetic field and the micro-channel as claimed in claim 1, wherein: the heat radiation fan (6) is an electrically driven forced convection type heat radiation mechanism.
6. The method of any one of claims 1 to 5 for cooling a device with high heat flux density by using a magnetic field and micro-channels, wherein: the method comprises the following steps:
s1, the conductive fluid loop (2) is arranged above the large heat flow density device to be cooled, the large heat flow density device is arranged below the channel structure (4), the temperature is high, a heat dissipation fan (6) is arranged above the channel structure for heat dissipation, and the temperature is low, so that a temperature gradient is formed in the vertical direction of the interface of the conductive fluid and the channel structure (4).
S2, according to the thermoelectric effect principle, forming a temperature gradient at the interface of the conductive fluid and the channel structure (4) to generate thermoelectric force, and generating thermoelectric current in the conductive fluid and the channel structure (4), wherein the magnitude of the thermoelectric current is positively correlated with the thermoelectric coefficient difference between the two materials, the constantan material and the conductive fluid have larger thermoelectric coefficient difference, and the resistance value is small;
and S3, under the action of the magnetic field, driving the conductive fluid to flow in the circulation loop, wherein the larger the heat current is, the larger the driving force is.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111198990.0A CN113923950A (en) | 2021-10-14 | 2021-10-14 | Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111198990.0A CN113923950A (en) | 2021-10-14 | 2021-10-14 | Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel |
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| CN113923950A true CN113923950A (en) | 2022-01-11 |
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| CN202111198990.0A Pending CN113923950A (en) | 2021-10-14 | 2021-10-14 | Device and method for cooling high-heat-flux-density device by using magnetic field and micro-channel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115045522A (en) * | 2022-07-29 | 2022-09-13 | 中铁建工集团有限公司 | Thermoelectric effect based cooling device and method for large-span steel structure |
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2021
- 2021-10-14 CN CN202111198990.0A patent/CN113923950A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115045522A (en) * | 2022-07-29 | 2022-09-13 | 中铁建工集团有限公司 | Thermoelectric effect based cooling device and method for large-span steel structure |
| CN115045522B (en) * | 2022-07-29 | 2023-12-26 | 中铁建工集团有限公司 | Cooling device and method of large-span steel structure based on thermoelectric effect |
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