CN109881042A - A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material - Google Patents
A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material Download PDFInfo
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- CN109881042A CN109881042A CN201910258850.4A CN201910258850A CN109881042A CN 109881042 A CN109881042 A CN 109881042A CN 201910258850 A CN201910258850 A CN 201910258850A CN 109881042 A CN109881042 A CN 109881042A
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- liquid metal
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Abstract
The invention discloses a kind of cladded type 160-200 degree heat transmission tinbase liquid metal materials.By weight percentage, composition of alloy are as follows: B:0.4-0.6wt.%, In:4.0-6.0wt.%, Ga:0.5-1.0wt.%, Sb:1.0-2.0wt.%, V:0.2-0.3wt.%, Zn:30.0-35.0wt.%, Te:0.2-0.4wt.%, surplus are tin.This patent provides the Novel heat dissipation material that can form the liquid metal of solid matrix package fusing at service temperatures, can solve high-end heat dissipation solution needed for electronics industry.The material can also promote the technology of related fields to develop while industrialization obtains very big economic value.
Description
Technical field
The present invention relates to technical field of alloy, specifically, being related to a kind of tin alloy.
Background technique
The fast development of electronic technology makes electronic device volume tend to be miniaturized, and the complexity of simultaneity factor is increasingly
It is high.Due to also requiring the features such as having reliability and being easy maintenance, high heat density heat dissipation is inevitable.The system of this electron device
Producing material material, technique and electronic circuit bring new challenge.It, be to electricity in the heat dissipation design and selection course to electronic device
The density case etc. of heat in subcomponent, quality and heat consumption comprehensively considers.Meanwhile in conjunction with electronic component and entire electricity
Different types of radiating mode is integrated into a module and improves radiating efficiency by the actual needs in sub- industrial environment.
Exist between microelectronic device surface and radiator it is very tiny uneven, thus when contact just
Form contact hole.Since the heat transfer coefficient of air is very low (0.02W/mK), the gap of contact surface, which exists, to be greatly increased
The thermal resistance of whole system, has ultimately caused the low of radiating efficiency.Thermal interfacial material is for filling these contact surfaces sky
The high thermal conductivity medium of gap.Due to establishing effective heat transfer between electronic device and radiator when filling these gaps
Thermal contact resistance can be greatly lowered in channel, so that the efficiency of radiator is fully played.
Traditional thermal interfacial material generally uses silicone grease, but the characteristic for belonging to organic matter in itself makes the heat transfer of the material
Coefficient is unsatisfactory (1-2W/mK).Meanwhile in an atmosphere be used for a long time after can there is a phenomenon where volatilization and aging.Cause
And in the occasion of high-end radiating requirements, the use of silicone grease not can solve the problem of high-density heat dissipation.Ideal hot interface, which uses, removes
Have the characteristics that outside high heat transfer coefficient and outside long service life, it should also be very flexible (be easily installed and dismantle).Closely
The liquid metal thermal interface material occurred over year is to belong to this seed type.Substantially, liquid metal thermal interface material is eutectic
The alloy of point.Due to low fusing point and high heat transfer coefficient (> 40W/mK), thus reducing heater and radiator
Between thermal resistance when have the effect of it is extremely excellent.
Liquid metal necessarily is in liquid or paste (semisolid) when high efficiency and heat radiation, thus is suitably working
Circuit board short circuit accident caused by the alloy side leakage of fusing is faced when used in temperature range as thermal interfacial material.Design
And the liquid metal thermal interface material that industrialization is novel, and allowing the material to effectively inhibit side leakage is current international coverage
Interior hot spot.The heat dissipation problem of electronic field is more and more prominent in national economy field, and efficient heat dissipationization solution is also got over
To be more taken seriously.Various countries have put into a large amount of manpower and material resources and have carried out difficult exploration, but there are no maturations so far
Scheme.This patent proposes a kind of tinbase liquid metal thermal interface material of cladded type from the angle of materialogy.From knot
For structure design is upper, which can entirely prevent that side leakage occurs in use, considerably increase the peace that system is run
Quan Xing.
Summary of the invention
The purpose of the present invention is to overcome the deficiency in the prior art, provides a kind of cladded type 160-200 degree heat transmission tinbase liquid
State metal material.The material has excellent seam-filling ability and heating conduction when being used as thermal interfacial material between 160-200 degree, together
Shi Buhui occurs side leakage and causes electronic device short-circuit.
To achieve the goals above, the present invention adopts the following technical scheme:
A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material.By weight percentage, which is B:
0.4-0.6wt.%,In:4.0-6.0wt.%,Ga:0.5-1.0wt.%,Sb:1.0-2.0wt.%,V:0.2-0.3wt.%,Zn:
30.0-35.0wt.%, Te:0.2-0.4wt.%, surplus are tin.
The preparation method of above-mentioned heat sink material, comprise the following steps that (a) by alloy according to required ingredient with postponing,
It is put into induction furnace and carries out melting, and protected using graphite crucible and argon gas;10 minutes are kept the temperature in 400-500 degree to stir using electromagnetism
Mix sufficiently by alloy melt after mixing evenly, import graphite jig in cast;(b) ingot casting is subjected to cold rolling, rolled per pass
The drafts of system is 15-20%, until rolling required thickness (0.1-0.5mm).
Compared with prior art, the invention has the following beneficial effects:
(1) this patent provides a kind of lateral leakage protection liquid metal thermal interface material of coated, for efficient in electronic device
Heat dissipation.This patent belongs to multi-element alloy system, illustrates design principle for clarity, is illustrated by taking a ternary system as an example.
Shown in FIG. 1 is the constant temperature section of the ternary system phasor comprising tri- elements of A, B and C.Which includes liquid phase and due to
Liquid phase and the spinodal decomposition region generated.When the alloying component single liquid phase state at high temperature in stain part is cooled to this
When temperature, spinodal decomposition just has occurred and generates two kinds of different liquid phases of ingredient, as shown in the upper right of Fig. 1.Subsequent into one
It walks in cooling procedure, both liquid phases can individually be solidified, and matrix and surrounding phase in final thermal interfacial material are formd.By
It is mutually separated in process of setting in two different liquid phases, thus the use after being prepared into thermal interfacial material heated up
Cheng Zhong, matrix phase and surrounding phase melt respectively.As long as it can be seen that the fusing point of surrounding phase be less than matrix phase fusing point, can
Setting at a temperature of formed the cladding fusing of solid matrix liquid metal Novel heat dissipation material mode.By adjusting base
The volume fraction of body phase and surrounding phase can obtain very soft at the working temperature (160-200 degree), and matrix Xiang Keyou
The thermal interfacial material for preventing side leakage is effectively packaged to the surrounding phase of fusing.This is the innovation of this patent, and
One of effective way of side leakage can be occurred when in use by solving liquid metal at present.
(2) for the material after being prepared into the thermal interfacial material of foil-like, use pattern is as shown in Figure 2.The material matrix phase
Fusing point be 210-230 degree, the fusing point of surrounding phase is 120-150 degree.Thus when hot-fluid is passed to from heater, in 160-200
In the operating temperature section of degree, the matrix of the material can mutually maintain solid phase, and without fusing occurs, (solid volume fraction is
20-25%).Simultaneously the setting at a temperature of, surrounding phase has occurred and that fusing, forms cladding of the solid matrix with respect to liquid
The encapsulation effect of phase and the very soft thermal interfacial material obtained.In addition, the thermal interfacial material also has very excellent biography
Hot coefficient (40-50 W/m ﹒ K).In the occasion for high efficiency and heat radiation, can not only be sufficient filling between heater and radiator
Small spaces, can also fundamentally prevent current liquid metal and flow everywhere after being melted down, cause gap increase show
Shape.
(3) the product practicability is wide, and processing smelting process is simple, and production cost is low, is convenient for industrialized large-scale production
And practical application.It is applying and after industrialization, not only can solve industry problems, while can also obtain great market value.
Detailed description of the invention
Fig. 1: one includes A, B and C ternary system phasor schematic cross-section at a constant temperature.The upper right corner is to be designated as distribution life
The two kinds of liquid phases formed after spinodal decomposition.
Fig. 2: the novel liquid metal thermal interfacial material of this patent design.Including matrix phase and surrounding phase two parts.
Specific embodiment
Embodiment 1
A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material.By weight percentage, composition of alloy are as follows: B:
0.4wt.%, In:4.0wt.%, Ga:0.5wt.%, Sb:1.0wt.%, V:0.2wt.%, Zn:30.0wt.%, Te:0.2wt.%, it is remaining
Amount is tin.
The preparation method of above-mentioned heat sink material, including following procedure of processing :(a) configure alloy according to required ingredient
Afterwards, it is put into induction furnace and carries out melting, and protected using graphite crucible and argon gas;10 minutes, which are kept the temperature, in 400-500 degree utilizes electricity
Magnetic stirring sufficiently by alloy melt after mixing evenly, import graphite jig in cast;(b) ingot casting is subjected to cold rolling, per pass
The drafts of secondary rolling is 15-20%, until rolling required thickness (0.1-0.5mm).
For the material after being prepared into the thermal interfacial material of foil-like, use pattern is as shown in Figure 2.The matrix phase of the material
Fusing point is 210 degree, and the fusing point of surrounding phase is 130 degree.Thus when hot-fluid is passed to from heater, in the work temperature of 160-200 degree
It spends in section, the matrix of the material can mutually maintain solid phase and melt (solid volume fraction 22%) without occurring.Exist simultaneously
At a temperature of the setting, surrounding phase has occurred and that fusing, form encapsulation effect of the solid matrix with respect to the surrounding phase of liquid and
The very soft thermal interfacial material obtained.In addition, the thermal interfacial material also has very excellent heat transfer coefficient (45 W/m ﹒
K).In the occasion for high efficiency and heat radiation, the small spaces that can be not only sufficient filling between heater and radiator can also be with
Fundamentally prevent current liquid metal to flow everywhere after being melted down, the status for causing gap to increase.
Embodiment 2
A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material.By weight percentage, composition of alloy are as follows: B:
0.6wt.%, In:6.0wt.%, Ga:1.0wt.%, Sb:2.0wt.%, V:0.3wt.%, Zn:35.0wt.%, Te:0.4wt.%, it is remaining
Amount is tin.
The preparation method of above-mentioned heat sink material, including following procedure of processing :(a) configure alloy according to required ingredient
Afterwards, it is put into induction furnace and carries out melting, and protected using graphite crucible and argon gas;10 minutes, which are kept the temperature, in 400-500 degree utilizes electricity
Magnetic stirring sufficiently by alloy melt after mixing evenly, import graphite jig in cast;(b) ingot casting is subjected to cold rolling, per pass
The drafts of secondary rolling is 15-20%, and straight shape rolls required thickness (0.1-0.5mm).
For the material after the thermal interfacial material for being prepared into foil dress, use pattern is as shown in Figure 2.The matrix phase of the material
Fusing point is 225 degree, and the fusing point of surrounding phase is 132 degree.Thus when hot-fluid is passed to from heater, in the work temperature of 160-200 degree
It spends in section, the matrix of the material can mutually maintain solid phase and melt (solid volume fraction 24%) without occurring.Exist simultaneously
At a temperature of the setting, surrounding phase has occurred and that fusing, form encapsulation effect of the solid matrix with respect to the surrounding phase of liquid and
The very soft thermal interfacial material obtained.In addition, the thermal interfacial material also has very excellent heat transfer coefficient (48W/m ﹒
K).In the occasion for high efficiency and heat radiation, the small spaces that can be not only sufficient filling between heater and radiator can also be with
Fundamentally prevent current liquid metal to flow everywhere after being melted down, the status for causing gap to increase.
Embodiment 3
A kind of cladded type 160-200 degree heat transmission tinbase liquid metal material.By weight percentage, composition of alloy are as follows: B:
0.5wt.%, In:4.2wt.%, Ga:0.8wt.%, Sb:1.5wt.%, V:0.2wt.%, Zn:32.0wt.%, Te:0.3wt.%, it is remaining
Amount is tin.
The preparation method of above-mentioned heat sink material, including following procedure of processing :(a) configure alloy according to required ingredient
Afterwards, it is put into induction furnace and carries out melting, and protected using graphite crucible and argon gas;10 minutes, which are kept the temperature, in 400-500 degree utilizes electricity
Magnetic stirring sufficiently by alloy melt after mixing evenly, import graphite jig in cast;(b) ingot casting is subjected to cold rolling, per pass
The drafts of secondary rolling is 15-20%, until rolling required thickness (0.1-0.5mm).
For the material after being prepared into the thermal interfacial material of foil-like, use pattern is as shown in Figure 2.The matrix phase of the material
Fusing point is 218 degree, and the fusing point of surrounding phase is 140 degree.Thus when hot-fluid is passed to from heater, in the work temperature of 160-200 degree
It spends in section, the matrix of the material can mutually maintain solid phase and melt (solid volume fraction 20%) without occurring.Exist simultaneously
At a temperature of the setting, surrounding phase has occurred and that fusing, form encapsulation effect of the solid matrix with respect to the surrounding phase of liquid and
The very soft thermal interfacial material obtained.In addition, the thermal interfacial material also has very excellent heat transfer coefficient (42 W/m ﹒
K).In the occasion for high efficiency and heat radiation, the small spaces that can be not only sufficient filling between heater and radiator can also be with
Fundamentally prevent current liquid metal to flow everywhere after being melted down, the status for causing gap to increase.
Claims (2)
1. a kind of cladded type 160-200 degree heat transmission tinbase liquid metal material;By weight percentage, the composition of alloy are as follows:
B:0.4-0.6wt.%,In:4.0-6.0wt.%,Ga:0.5-1.0wt.%,Sb:1.0-2.0wt.%,V:0.2-0.3wt.%,Zn:
30.0-35.0wt.%, Te:0.2-0.4wt.%, surplus are tin.
2. a kind of cladded type 160-200 degree heat transmission tinbase liquid metal material described in claim 1, it is characterised in that including such as
Lower procedure of processing :(a) by alloy according to required ingredient with postponing, be put into induction furnace and carry out melting, and use graphite crucible
It is protected with argon gas;400-500 degree keep the temperature 10 minutes using electromagnetic agitation sufficiently by alloy melt after mixing evenly, import graphite
It casts in mold;(b) ingot casting is subjected to cold rolling, the drafts rolled per pass is 15-20%, until rolling required thickness
It spends (0.1-0.5mm).
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110295300A (en) * | 2019-07-16 | 2019-10-01 | 深圳市启晟新材科技有限公司 | A kind of photo-thermal field 100-200 degree control oxygen type liquid metal compatible with stainless steel and its technique |
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CN104553133A (en) * | 2013-10-09 | 2015-04-29 | 纳普拉有限公司 | Junction portion and power distribution wire |
CN105220013A (en) * | 2015-09-17 | 2016-01-06 | 中国科学院理化技术研究所 | A kind of color liquid metal and preparation method thereof |
CN106884107A (en) * | 2017-03-09 | 2017-06-23 | 宁波新瑞清科金属材料有限公司 | A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof |
JP2017170464A (en) * | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
CN108777254A (en) * | 2018-06-29 | 2018-11-09 | 北京梦之墨科技有限公司 | A kind of metal heat interface material and preparation method thereof |
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Patent Citations (6)
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CN101341266A (en) * | 2005-08-30 | 2009-01-07 | 美国铟泰公司 | Technique for increasing the compliance of tin-indium solders |
CN104553133A (en) * | 2013-10-09 | 2015-04-29 | 纳普拉有限公司 | Junction portion and power distribution wire |
CN105220013A (en) * | 2015-09-17 | 2016-01-06 | 中国科学院理化技术研究所 | A kind of color liquid metal and preparation method thereof |
JP2017170464A (en) * | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
CN106884107A (en) * | 2017-03-09 | 2017-06-23 | 宁波新瑞清科金属材料有限公司 | A kind of liquid metal thermal interface material with anti-molten characteristic and preparation method thereof |
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Application publication date: 20190614 |