CN114479773A - Composite thermal interface material composed of foam metal and liquid metal - Google Patents
Composite thermal interface material composed of foam metal and liquid metal Download PDFInfo
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- CN114479773A CN114479773A CN202210138540.0A CN202210138540A CN114479773A CN 114479773 A CN114479773 A CN 114479773A CN 202210138540 A CN202210138540 A CN 202210138540A CN 114479773 A CN114479773 A CN 114479773A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
- C09K5/12—Molten materials, i.e. materials solid at room temperature, e.g. metals or salts
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Abstract
The application discloses a composite thermal interface material consisting of foam metal and liquid metal. The composite thermal interface material is prepared by rolling foam metal filled with liquid metal paste. The liquid metal paste comprises liquid metal and a cross-linking phase material, wherein the weight ratio of Ga, In, Sn and Bi In the liquid metal is (60-75): 15-20): 10-20):0 or (5-10): 40-55): 10-20): 25-30. The composite thermal interface material prepared by the invention has high heat conductivity coefficient which can be as high as 50-120W/m.K, and does not leak after being melted at high temperature.
Description
Technical Field
The invention belongs to the field of thermal interface materials, and particularly relates to a composite liquid metal thermal interface material and a preparation method thereof.
Background
At present, power electronic devices rely heavily on passive cooling systems, and with the increase of integration level of electronic components, how to achieve higher heat conduction rate becomes a hot point of research. Among these, the study of thermal interface materials is critical. Thermal interface materials are a general term for materials used to coat between heat dissipating electronic components and heat generating electronic components to reduce the contact resistance between the two electronic components.
The liquid metal is a low-melting-point alloy, has high thermal conductivity (10-20W/m.K) near the melting point of the liquid metal, and is a common thermal interface material. However, the thermal conductivity of liquid metal alone is still not high enough, and it is desired to use a thermal interface material with a higher thermal conductivity, preferably up to 120W/m.k.
Generally, high heat conduction material powder such as micro-nano-scale alumina powder, copper powder and the like is added into liquid metal, so that the heat conduction coefficient can reach up to 120W/m.K. However, the micro-nano added powder is easy to reduce the heat conducting property of the heat conducting material due to layering and agglomeration in the using process, and the using thermal cycle performance of the micro-nano added powder is poor.
There are also many thermal interface materials in the prior art that combine liquid metal with metal foam (e.g., copper foam, nickel foam, aluminum foam, etc.). Since the foam metal itself is a through-hole that is completely connected together, these materials can better bond with the liquid metal and increase the thermal conductivity of the liquid metal thermal interface material.
It is often desirable for the interfacial thermally conductive material to have a total thickness of no more than 100um, with an optimal thickness of about 50 um. However, in the actual industry, the ultra-thin copper foam with the thickness is very expensive, and the copper foam prepared by the general process is 2mm thick at the thinnest, so that the actual requirement of the interface heat conduction material cannot be met at a proper cost. For example, the thickness of the foam copper produced by the Feimete new material company Limited in Yiyang city is 2mm at the thinnest, the number of the ultrathin foam copper produced by the Kunshan Jiayi Sheng electronic company Limited can be 0.15mm at the thinnest, and the thinnest of the main stream product is still 2 mm; and even 0.15mm thick, exceeds the required thickness of the interface heat conduction material.
In the industry, a composite liquid metal interface heat-conducting metal material with proper cost is expected to have a high heat conductivity coefficient (50-120W/m.K) and a thickness of 20-60 um.
Disclosure of Invention
The invention aims to solve the problem that a high-thermal-conductivity liquid metal composite thermal interface material in the prior art is easy to leak laterally and deteriorate.
The technical scheme of the invention is as follows:
the invention provides a composite thermal interface material consisting of foam metal and liquid metal, which is prepared by rolling the foam metal filled with liquid metal paste.
Preferably, the liquid metal paste comprises a liquid metal and a cross-linking phase material; the liquid metal comprises the following components: ga. The weight ratio of In, Sn and Bi is (60-75): (15-20): 10-20):0 or (5-10): 40-55): 10-20): 25-30.
Preferably, the content of the cross-linking phase material in the liquid metal paste is 2-8% of the mass of the liquid metal.
Preferably, the cross-linked phase material is one or more of metal powder, diamond powder, silicone oil, epoxy resin and polyurethane.
Preferably, the foam metal is selected from one of copper foam, nickel foam, zinc foam and aluminum foam.
Preferably, the porosity of the through holes of the foam metal is 98-99.5%, and preferably 99-99.5%.
Preferably, the thickness of the composite thermal interface material is 30-100 um.
Further preferably, the thickness of the composite thermal interface material is 40-60 um thick.
The invention also provides a preparation method of the composite thermal interface material, which comprises the following steps:
(1) heating and smelting Ga, In, Sn and Bi In proportion to obtain the liquid metal;
(2) adding a cross-linking phase material for 3-8 times, and heating and stirring to obtain the liquid metal paste;
(3) and rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um.
(4) Coating liquid metal paste on one side or two sides of the foam metal to enable the liquid metal paste to soak the foam metal, and then rolling;
(5) and (4) coiling or cutting the material obtained in the step (4) to obtain the composite thermal interface material.
Preferably, the composite thermal interface material cut in step (5) has a preferred single sheet size of 40 x 40 mm.
Compared with the prior art, the invention has the following beneficial effects:
the composite thermal interface material composed of the foam metal and the liquid metal prepared by the invention has high heat conductivity coefficient which can be as high as 50-120W/m.K. In addition, in the composite thermal interface material, the foam metal is relatively cheap and easily available; after the liquid metal and the foam metal are compounded, the leakage is avoided after the liquid metal and the foam metal are melted at high temperature, the phenomena of layering and agglomeration are avoided in long-term use, and the degradation phenomenon is avoided. The composite thermal interface material is convenient to use and can be directly used after being cut into a required shape.
Drawings
FIG. 1 shows a 2mm thick copper foam from Felmett New Material Co., Ltd, Yiyang city used in example 1.
Fig. 2 shows the conductive composite thermal interface material prepared in example 2.
FIG. 3 is a schematic diagram showing the construction of a stirring apparatus prepared in example 6.
FIG. 4 is a partially enlarged view of part A showing the structural view of the stirring apparatus prepared in example 6.
Fig. 5 is a view showing the construction of the stirring apparatus prepared in example 6 in a state in which the supporting elastic ball is naturally extended and rotated.
Detailed Description
Embodiments of the present application will be described in detail by examples, so that how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.
The raw materials and equipment used in the present application are all common raw materials and equipment in the field, and are all from commercially available products, unless otherwise specified. The methods used in this application are conventional in the art unless otherwise indicated.
There are many other possible embodiments of the present invention, which are not listed here, and the embodiments claimed in the claims of the present invention can be implemented.
"comprising" or "including" is intended to mean that the compositions (e.g., media) and methods include the recited elements, but not excluding others. When used in defining compositions and methods, "consisting essentially of … …" is meant to exclude other elements having any significance to the combination of the stated objects. Thus, a composition consisting essentially of the elements defined herein does not exclude other materials or steps that do not materially affect the basic and novel characteristics of the claimed application. "consisting of … …" refers to trace elements and substantial process steps excluding other components. Embodiments defined by each of these transition terms are obtained by the preparation methods disclosed in the patents within the scope of the present application.
Example 1
(1) Heating 60 parts of Ga, 20 parts of In and 20 parts of Sn to 60 ℃ to smelt to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(3) Soaking the foam copper in the liquid metal, and then rolling;
(4) and (4) rolling or cutting the material obtained in the step (3) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The electric conductivity of the finally obtained composite thermal interface material is more than 80W/mK, the thickness is 50um, and the liquid metal is not easy to leak laterally.
Example 2
(1) Heating 65 parts of Ga, 17 parts of In and 18 parts of Sn to 60 ℃ to smelt to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) adding copper powder with the particle size of about 1um for 3-8 times, putting into a stirring device, heating and stirring, wherein the adding weight is 2-8% of that of the liquid metal;
(3) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(4) Coating liquid metal on both sides of the foam copper to enable the liquid metal to soak the foam copper, and then rolling;
(5) and (4) rolling or cutting the material obtained in the step (4) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The conductivity of the finally obtained composite thermal interface material is 120W/mK, and the liquid metal is not easy to leak at the side.
Example 3
(1) Heating 70 parts of Ga, 15 parts of In and 15 parts of Sn to 60 ℃ to smelt to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) adding polyurethane for 3-8 times, and putting the mixture into a stirring device for heating and stirring, wherein the adding weight is 2-8% of that of the liquid metal;
(3) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(4) Coating liquid metal on both sides of the foam copper to enable the liquid metal to soak the foam copper, and then rolling;
(5) and (4) rolling or cutting the material obtained in the step (4) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The conductivity of the finally obtained composite thermal interface material is 50W/mK, and the liquid metal is not easy to leak at the side.
Example 4
(1) Heating 5 parts of Ga, 55 parts of In, 15 parts of Sn and 25 parts of Bi to 60 ℃ for smelting to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(3) Soaking the foam copper in the liquid metal, and then rolling;
(4) and (4) rolling or cutting the material obtained in the step (3) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The finally obtained composite thermal interface material has the conductivity of more than 83W/mK and the thickness of 50um, and the liquid metal is not easy to leak laterally.
Example 5
(1) Heating 7 parts of Ga, 50 parts of In, 15 parts of Sn and 28 parts of Bi to 60 ℃ for smelting to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) adding copper powder with the particle size of about 1um for 3-8 times, putting into a stirring device, heating and stirring, wherein the adding weight is 2-8% of that of the liquid metal;
(3) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(4) Coating liquid metal on both sides of the foam copper to enable the liquid metal to soak the foam copper, and then rolling;
(5) and (4) rolling or cutting the material obtained in the step (4) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The conductivity of the finally obtained composite thermal interface material is 123W/mK, and the liquid metal is not easy to leak at the side.
Example 6
(1) Heating 10 parts of Ga, 40 parts of In, 20 parts of Sn and 30 parts of Bi to 60 ℃ for smelting to obtain the liquid metal; wherein the smelting time is 1-2 h;
(2) adding polyurethane for 3-8 times, and putting the mixture into a stirring device for heating and stirring, wherein the adding weight is 2-8% of that of the liquid metal;
(3) rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um; the porosity of the copper foam is 98-99.5%.
(4) Coating liquid metal on both sides of the foam copper to enable the liquid metal to soak the foam copper, and then rolling;
(5) and (4) rolling or cutting the material obtained in the step (4) to obtain the composite thermal interface material with the thickness of 40 x 40 mm.
The conductivity of the finally obtained composite thermal interface material is 47W/mK, and the liquid metal is not easy to leak at the side.
As shown in fig. 3, 4 and 5, the stirring apparatus in this embodiment includes a tank 1, a stirring assembly 2 is mounted on the tank, the stirring assembly includes a sealing cover 3, a first driving motor 4 is mounted on the sealing cover, a stirring shaft 5 is mounted at the end of an output shaft of the first driving motor, a stirring blade 6 is mounted at the middle bottom of the stirring shaft, a heat conducting cavity 7 is mounted inside the stirring shaft, an electric heating rod 8 is mounted at the top inside the heat conducting cavity, a heat conducting rod 9 is connected to the bottom of the electric heating rod, a heat conducting rod 10 is mounted on the stirring blade, and the heat conducting rod is connected to the heat conducting rod; the upper part of the stirring shaft is provided with a material scattering rod 11, the material scattering rod is internally provided with a mounting cavity 12, the mounting cavity is internally provided with a piston 26 which separates the mounting cavity into a heat transfer cavity 13 and a material feeding cavity 14, the piston is connected with the top of the heat transfer cavity through a spring, the heat transfer cavity is communicated with the heat transfer cavity, the material feeding cavity is internally provided with materials to be fed, the bottom of the material scattering rod is provided with a feed opening 15, a supporting elastic ball 16 is arranged right above the feed opening, two sides of the supporting elastic ball are provided with vertical gaps 17, two sides of each gap are respectively provided with semicircular openings 18, the outer side of the material feeding cavity is provided with a movable cavity 22, a second driving motor 19 is arranged in the movable cavity, the output shaft of the second driving motor is provided with a rotating rod 20, a pair of openings form a circular perforation which is matched with the rotating rod, and the rotating rod is provided with a conical blade 21, one side of the conical blade is provided with a V-shaped opening, the upper part of the piston is provided with a first magnetic block 23, the top of the second driving motor is provided with a second magnetic block 24, and the first magnetic block and the second magnetic block are mutually adsorbed. The first magnetic block is made of high-temperature-resistant magnetic materials, the material scattering rod is provided with a feeding pipe 25, and the feeding pipe penetrates through the heat conduction cavity and the piston to enter the material feeding cavity. The heat conduction rod in the embodiment can be externally connected with a mobile power supply arranged on the sealing cover, and can also be externally connected with a fixed power supply.
In the prior art, the viscosity of liquid metal is inversely proportional to the temperature, the temperature of the stirring blade is lower, so that the viscosity of the liquid metal is higher near the stirring blade, the generated bubbles are difficult to escape and drain,
in the implementation of the embodiment, liquid metal is put into the tank body, the material to be put is added into the feeding cavity through the feeding pipe, the first driving motor and the electric heating rod are turned on, then the electric heating rod generates heat to heat the stirring shaft and the stirring blades, so that the temperature of the stirring blades is raised, the defect that the viscosity of the liquid metal close to the stirring blades is high and generated bubbles are difficult to escape and drain is overcome, the stirring efficiency is improved, meanwhile, the gas in the heated heat conduction cavity expands, the gas pressure above the piston is increased, the piston moves downwards to extrude the supporting elastic ball, the gap is opened, meanwhile, the piston descends to drive the first magnetic block to move downwards to drive the second magnetic block and the second driving motor to move downwards, the second driving motor is turned on to drive the rotating rod to rotate, the conical blades rotate to drive the material to downwards to enter the discharge port and along with the material scattering rod, so that the material is uniformly sprinkled into the liquid metal and the mixing is more uniform (it is necessary to know that the rotating speed of the liquid metal is lower than that of the stirring shaft due to the high viscosity of the liquid metal). When the temperature of the stirring shaft drops, the air pressure above the piston drops, and the supporting elastic ball returns to enable the piston to move upwards, close the gap and stop feeding.
Test example
Different composite thermal interface materials are respectively prepared according to the above embodiments, the composite thermal interface materials are placed on a heat transfer interface, different pressures are respectively applied to the heat transfer interface, whether overflow occurs in the heat transfer process of each composite thermal interface material is observed, and the heat transfer temperature is 60 ℃.
The results of the experiment are shown in table 1.
TABLE 1
The details not described in the specification of the present application belong to the common general knowledge of those skilled in the art.
In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, and a person skilled in the art can solve the technical problem within a certain error range to substantially achieve the technical effect.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a good or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such good or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a commodity or system that includes the element.
The foregoing description shows and describes several preferred embodiments of the present application, but as aforementioned, it is to be understood that the application is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the application, which is to be protected by the claims appended hereto.
Claims (10)
1. A composite thermal interface material composed of foam metal and liquid metal is characterized in that the composite thermal interface material is prepared by rolling the foam metal filled with liquid metal paste.
2. The composite thermal interface material of claim 1, wherein the liquid metal paste comprises a liquid metal and a cross-linking phase material; the liquid metal comprises the following components: ga. The weight ratio of In, Sn and Bi is (60-75): (15-20): 10-20):0 or (5-10): 40-55): 10-20): 25-30.
3. The composite thermal interface material of claim 1, wherein the content of the cross-linking phase material in the liquid metal paste is 2-8% by mass of the liquid metal.
4. The composite thermal interface material of claim 3, wherein the cross-linked phase material is one or more of metal powder, diamond powder, silicone oil, epoxy, polyurethane.
5. The composite thermal interface material of claim 1, wherein the metal foam is selected from one of copper foam, nickel foam, zinc foam, and aluminum foam.
6. The composite thermal interface material of claim 5, wherein the metal foam has a through-hole porosity of 98-99.5%, preferably 99-99.5%.
7. The composite thermal interface material of claim 1, wherein the composite thermal interface material has a thickness of 30-100 um.
8. The composite thermal interface material of claim 7, wherein the composite thermal interface material is 40-60 um thick.
9. A method of making a composite thermal interface material according to any one of claims 1-8, comprising the steps of:
(1) heating and smelting Ga, In, Sn and Bi In proportion to obtain the liquid metal;
(2) adding a cross-linking phase material for 3-8 times, and heating and stirring to obtain the liquid metal paste;
(3) and rolling the through-hole foam metal for one time or multiple times from the original thickness of 1-2 mm to the thickness of 40-100 um.
(4) Coating liquid metal paste on one side or two sides of the foam metal to enable the liquid metal paste to soak the foam metal, and then rolling again;
(5) and (4) coiling or cutting the material obtained in the step (4) to obtain the composite thermal interface material.
10. The method of claim 9, wherein the step (5) of cutting the composite thermal interface material has a preferred single sheet size of 40 x 40 mm.
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| CN202111665501 | 2021-12-31 | ||
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Cited By (1)
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