CN209399495U - A kind of air-conditioner outdoor unit and air-conditioning - Google Patents

Abstract

The utility model belongs to the technical field of air conditioners, and discloses an outdoor unit of an air conditioner and an air conditioner, including a circuit board; In contact with each other, the hot end of the semiconductor refrigeration sheet is connected with a fin heat exchanger; a heat pipe is arranged in the heat pipe heat exchanger, and the heat pipe is filled with refrigerant, and the heat pipe includes a heat pipe evaporation end and a heat pipe condensation end The end of the heat pipe radially close to the circuit board is the heat pipe evaporating end, and the end of the heat pipe radially close to the cold end of the semiconductor cooling plate is the heat pipe condensation end. The heat generated by the circuit board is effectively released to the outside air through the triple heat conduction of the heat pipe heat exchanger, the semiconductor refrigeration sheet and the fin heat exchanger, which solves the problem of serious heating of the circuit board of the outdoor unit of the air conditioner in the prior art and protects the circuit board, and enable the air conditioner to cool normally.

Description

Air conditioner outdoor unit and air conditioner

technical field

The utility model relates to the technical field of air conditioners, in particular to an outdoor unit of an air conditioner and an air conditioner.

Background technique

When the air conditioner works continuously for a long time or the temperature is high in summer, the circuit board of the outdoor unit of the air conditioner will heat up severely. If the temperature exceeds a certain temperature, it needs to dissipate heat in time, otherwise the circuit board of the external unit will be damaged, or the protection program of the air conditioner will be activated to stop cooling.

Utility model content

The embodiment of the utility model provides an outdoor unit of an air conditioner and an air conditioner to solve the problem of severe heating of the circuit board of the outdoor unit of the air conditioner in the prior art. In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. This summary is not an overview, nor is it intended to identify key/critical elements or delineate the scope of these embodiments. Its sole purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is presented later.

According to the first aspect of the embodiment of the present invention, there is provided an outdoor unit of an air conditioner, including a circuit board; The hot end of the semiconductor refrigeration sheet is connected to a finned heat exchanger; the heat pipe heat exchanger is provided with a heat pipe, and the heat pipe is filled with refrigerant, and the heat pipe includes a heat pipe evaporation end and a heat pipe condensation end. The end of the heat pipe radially close to the circuit board is the heat pipe evaporating end, and the end of the heat pipe radially close to the cold end of the semiconductor cooling plate is the heat pipe condensation end.

When the heat pipe heat exchanger is in operation, the evaporating end of the heat pipe absorbs the heat generated by the circuit board, so that the refrigerant in the heat pipe boils and turns into steam. The steam with heat moves from the evaporating end of the heat pipe to the condensing end of the heat pipe, and when the steam transfers heat to the condensing end of the heat pipe, the steam condenses into liquid. The condensed liquid returns to the evaporating end of the heat pipe, and so on, the heat generated by the circuit board is evenly distributed on the surface of the heat pipe heat exchanger, thereby accelerating the heat exchange between the heat pipe heat exchanger and the semiconductor cooling fin. Heat transfer between cold ends. The cold end of the semiconductor cooling fin absorbs the heat on the surface of the heat pipe heat exchanger, and releases the heat at the hot end of the semiconductor cooling fin, and the released heat is transferred to the outside air through the fin heat exchanger .

Through the triple heat conduction of the heat pipe heat exchanger, the semiconductor refrigeration sheet and the fin heat exchanger, the heat generated by the circuit board is effectively released to the outside air, which solves the problem of the air conditioner outdoor unit circuit in the prior art The problem of serious heating of the circuit board is solved, the circuit board is protected, and the air conditioner can be cooled normally.

Optionally, the outdoor unit of the air conditioner further includes a fixed casing, the side walls of the fixed casing are connected to the heat pipe heat exchanger and the sides of the semiconductor cooling fins, and the top of the fixed casing is connected to the bottom of the circuit board. connected, the bottom of the fixed shell is connected to the top of the finned heat exchanger.

The heat pipe heat exchanger, the semiconductor cooling fin and the fin heat exchanger are fixedly connected through the fixed shell, and are fixedly connected to the circuit board, which can prevent the semiconductor cooling fin from being damp and reduce the The heat interference between the cold end and the hot end of the semiconductor refrigeration sheet makes the overall performance more stable.

Optionally, the side wall of the fixed housing is connected to the side of the heat pipe heat exchanger and the peltier by screws, the top of the fixed housing is connected to the bottom of the circuit board by screws, and the fixed The bottom of the shell is connected to the top of the fin heat exchanger by screws, so that the overall connection is more stable.

Optionally, the semiconductor cooling chip includes an N-type semiconductor and a P-type semiconductor, the N-type semiconductor and the P-type semiconductor are connected in series through a metal conductor to form an electric pair, and the N-type semiconductor is connected to the positive pole of the DC power supply, The P-type semiconductor is connected to the negative pole of the DC power supply; a ceramic substrate is arranged outside the metal conductor. The ceramic substrate is insulating and has good thermal conductivity.

After the semiconductor refrigerating sheet is connected to a direct current, energy transfer occurs, and the current flows from the N-type semiconductor to the joint of the P-type semiconductor to absorb heat, that is, absorb heat at the cold end of the semiconductor refrigerating sheet; The P-type semiconductor flows to the junction of the N-type semiconductor to release heat, that is, heat is released at the hot end of the semiconductor cooling plate. In this way, the heat of the cold end of the semiconductor cooling fin is transferred to the fin heat exchanger.

Optionally, there are multiple pairs of galvanic couples, so as to increase the heat absorption and heat release of the semiconductor cooling chip.

Optionally, the ripple coefficient of the direct current power supply is less than 10%, so as to make the direct current power supply more stable and make the peltier cooler work more stable.

Optionally, the exposed surfaces around the N-type semiconductor and the P-type semiconductor are coated with rubber, so that the semiconductor refrigeration sheet is completely isolated from the outside air, and plays a role of moisture-proof, which can improve the temperature of the semiconductor refrigeration sheet. lifespan.

Optionally, the rubber is 706 silicone rubber, which has better curing and sealing properties.

According to the second aspect of the embodiment of the present invention, there is provided an air conditioner, including the outdoor unit of the air conditioner. When the air conditioner works continuously for a long time or when the temperature is high in summer, the circuit board of the outdoor unit is not easy to overheat, and the air conditioner can still cool normally.

The technical solution provided by the embodiment of the utility model may include the following beneficial effects:

In the embodiment of the utility model, the heat generated by the circuit board is effectively released to the outside air through the triple heat conduction of the heat pipe heat exchanger, the semiconductor refrigeration sheet and the fin heat exchanger, which solves the problem of the circuit board of the outdoor unit of the air conditioner in the prior art. The problem of serious heat generation protects the circuit board and enables the air conditioner to cool normally.

It should be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present invention.

Description of drawings

The accompanying drawings, which are incorporated in the specification and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and are used together with the specification to explain the principle of the utility model.

Fig. 1 is a partial structural schematic diagram of an air conditioner outdoor unit according to an exemplary embodiment;

Fig. 2 is a front structural schematic diagram of a heat pipe heat exchanger shown according to an exemplary embodiment;

Fig. 3 is a schematic top view of a heat pipe heat exchanger according to an exemplary embodiment;

Explanation of reference signs: 1-circuit board; 2-heat pipe heat exchanger, 21-heat pipe, 22-evaporating end of heat pipe, 23-condensing end of heat pipe; 3-semiconductor cooling sheet, 31-cold end of semiconductor cooling sheet, 32- The hot end of the semiconductor cooling plate, 33-N-type semiconductor, 34-P-type semiconductor, 35-metal conductor, 36-ceramic substrate; 4-fin heat exchanger; 5-fixed shell.

Detailed ways

The following description and drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. Herein, relational terms such as first and second etc. are used only to distinguish one entity or structure from another without requiring or implying any actual relationship or relationship between these entities or structures. order. Various embodiments herein are described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of the various embodiments may be referred to each other.

In describing the present invention, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical" , "horizontal", "top", "bottom", "inner", "outer" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the present invention. In the description of the present utility model, unless otherwise stipulated and limited, it should be noted that the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a mechanical connection or an electrical connection, or it can be The internal communication between two elements may be direct connection or indirect connection through an intermediary. Those of ordinary skill in the art can understand the specific meanings of the above terms according to specific situations.

In addition, in the description herein, unless otherwise specified, "plurality of pairs" means two or more pairs.

Fig. 1 is a partial structural diagram of an outdoor unit of an air conditioner according to an exemplary embodiment.

Fig. 2 is a schematic front view of a heat pipe heat exchanger according to an exemplary embodiment.

Fig. 3 is a schematic top view of a heat pipe heat exchanger according to an exemplary embodiment.

As shown in Figures 1 to 3, the utility model provides an air conditioner outdoor unit, including a circuit board 1; The cold end 31 is in contact with each other, and the hot end 32 of the semiconducting cooling plate is connected to the finned heat exchanger 4; the heat pipe heat exchanger 2 is provided with a heat pipe 21, and the heat pipe 21 is filled with refrigerant, and the heat pipe 21 includes a heat pipe evaporation end 22 and a heat pipe Condensing end 23, the end of heat pipe 21 radially close to circuit board 1 is heat pipe evaporating end 22, and the end of heat pipe 21 radially close to cold end 31 of semiconductor refrigeration sheet is heat pipe condensing end 23.

When the heat pipe heat exchanger 2 is in operation, the heat pipe evaporating end 22 absorbs the heat generated by the circuit board 1 to make the refrigerant in the heat pipe 21 boil and turn into steam. The steam with heat moves from the evaporating end 22 of the heat pipe to the condensing end 23 of the heat pipe, and when the steam transfers heat to the condensing end 23 of the heat pipe, the steam condenses into a liquid. The condensed liquid returns to the heat pipe evaporating end 22, and so on, the heat generated by the circuit board 1 is evenly distributed on the surface of the heat pipe heat exchanger 2, thereby accelerating the heat transfer between the heat pipe heat exchanger 2 and the cold end 31 of the semiconductor refrigeration sheet. heat transfer. The cold end 31 of the semiconductor cooling fin absorbs the heat on the surface of the heat pipe heat exchanger 2, and releases the heat at the hot end 32 of the semiconductor cooling fin, and the released heat is transferred to the outside air through the fin heat exchanger 4.

The heat generated by the circuit board 1 is effectively released to the outside air through the triple heat conduction of the heat pipe heat exchanger 2, the semiconductor refrigerating sheet 3 and the fin heat exchanger 4, which solves the serious heating problem of the circuit board 1 of the outdoor unit of the air conditioner in the prior art The problem is to protect the circuit board 1 and enable the air conditioner to cool normally.

Optionally, the outdoor unit of the air conditioner also includes a fixed casing 5, the side walls of the fixed casing 5 are connected to the side walls of the heat pipe heat exchanger 2 and the semiconductor refrigeration sheet 3, the top of the fixed casing 5 is connected to the bottom of the circuit board 1, and the fixed The bottom of the shell 5 is connected to the top of the fin heat exchanger 4 .

The heat pipe heat exchanger 2, the semiconductor refrigerating sheet 3 and the fin heat exchanger 4 are fixedly connected through the fixed shell 5, and are fixedly connected with the circuit board 1, which can prevent the semiconductor refrigerating sheet 3 from being damp and reduce the cold end of the semiconductor refrigerating sheet 31 and the interference of hot-end heat, making the overall performance more stable.

Optionally, the side wall of the fixed shell 5 is connected with the side walls of the heat pipe heat exchanger 2 and the semiconductor cooling plate 3 by screws, the top of the fixed shell 5 is connected with the bottom of the circuit board 1 by screws, and the bottom of the fixed shell 5 is connected with the fins. The top of the heat exchanger 4 is connected by screws, so that the overall connection is more stable.

Optionally, the semiconductor cooling plate 3 includes an N-type semiconductor 33 and a P-type semiconductor 34, the N-type semiconductor 33 and the P-type semiconductor 34 are connected in series through a metal conductor 35 to form an electric pair, the N-type semiconductor 33 is connected to the positive pole of the DC power supply, and the P The type semiconductor 34 is connected to the negative pole of the DC power supply; a ceramic substrate 36 is arranged outside the metal conductor 35 . The ceramic substrate 36 is insulating and has good thermal conductivity.

After the semiconductor refrigerating sheet 3 is connected with a direct current, energy transfer occurs, and the current flows from the N-type semiconductor 33 to the joint of the P-type semiconductor 34 to absorb heat, that is, heat is absorbed at the cold end 31 of the semiconductor refrigerating sheet; the P-type semiconductor 34 flows to the N-type semiconductor. The joint of type semiconductor 33 releases heat, that is, releases heat at the hot end 32 of the semiconductor refrigerating sheet. Thereby, the heat of the cold end 31 of the semiconductor cooling fin is transferred to the fin heat exchanger 4 .

Optionally, there are multiple galvanic couple pairs, so as to increase the heat absorption and heat release of the semiconductive cooling sheet 3 .

Optionally, the ripple coefficient of the DC power supply is less than 10%, so as to make the DC power supply more stable and make the semiconductor cooling chip 3 more stable during operation.

Optionally, the exposed surfaces around the N-type semiconductor 33 and the P-type semiconductor 34 are coated with rubber, so that the semiconductor cooler 3 is completely isolated from the outside air, and plays a role of moisture resistance, which can increase the life of the semiconductor cooler 3 .

Optionally, the rubber is 706 silicone rubber, which has better curing and sealing properties.

The utility model also provides an air conditioner, including the above-mentioned outdoor unit of the air conditioner. When the continuous working time of the air conditioner is relatively long or the temperature is high in summer, the circuit board 1 of the outdoor unit is not easy to overheat, and the air conditioner can still cool normally.

The present invention is not limited to the structures which have been described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.

Claims (9)

1. An air conditioner outdoor unit, characterized in that it comprises a circuit board; the bottom of the circuit board is provided with a heat pipe heat exchanger, and the bottom of the heat pipe heat exchanger is in contact with the cold end of the semiconductor refrigerating sheet, and the semiconductor refrigerating sheet The hot end of the cooling plate is connected with a finned heat exchanger; The heat pipe heat exchanger is provided with a heat pipe, the heat pipe is filled with refrigerant, the heat pipe includes a heat pipe evaporation end and a heat pipe condensation end, and the end of the heat pipe radially close to the circuit board is the heat pipe evaporation end, The end of the heat pipe radially close to the cold end of the semiconductor cooling fin is the condensation end of the heat pipe. 2. The air conditioner outdoor unit according to claim 1, further comprising a fixed housing, the side wall of the fixed housing is connected to the side wall of the heat pipe heat exchanger and the semiconductor refrigeration sheet, and the fixed housing The top of the housing is connected to the bottom of the circuit board, and the bottom of the fixed housing is connected to the top of the finned heat exchanger. 3. The air conditioner outdoor unit according to claim 2, characterized in that, the side wall of the fixed housing is connected to the heat pipe heat exchanger and the side of the semiconductor cooling plate by screws, and the top of the fixed housing is connected to the The bottom of the circuit board is connected by screws, and the bottom of the fixed shell is connected with the top of the fin heat exchanger by screws. 4. The outdoor unit of an air conditioner according to claim 1, wherein the semiconductor refrigeration sheet includes an N-type semiconductor and a P-type semiconductor, and the N-type semiconductor and the P-type semiconductor are connected in series through a metal conductor to form an galvanic pair , the N-type semiconductor is connected to the positive pole of the DC power supply, and the P-type semiconductor is connected to the negative pole of the DC power supply; a ceramic substrate is arranged outside the metal conductor. 5. The outdoor unit of an air conditioner according to claim 4, wherein there are multiple pairs of said galvanic couples. 6. The air conditioner outdoor unit according to claim 4, wherein the ripple factor of the DC power supply is less than 10%. 7 . The air conditioner outdoor unit according to claim 4 , wherein the exposed surfaces around the N-type semiconductor and the P-type semiconductor are coated with rubber. 8. The air conditioner outdoor unit according to claim 7, wherein the rubber is 706 silicone rubber. 9. An air conditioner, characterized by comprising the air conditioner outdoor unit according to any one of claims 1 to 8.