CN213419299U - Compressor heat radiation structure and compressor controller - Google Patents

Compressor heat radiation structure and compressor controller Download PDF

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Publication number
CN213419299U
CN213419299U CN202022097858.8U CN202022097858U CN213419299U CN 213419299 U CN213419299 U CN 213419299U CN 202022097858 U CN202022097858 U CN 202022097858U CN 213419299 U CN213419299 U CN 213419299U
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China
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compressor
heat
heat dissipation
dissipation structure
mounting
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CN202022097858.8U
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Chinese (zh)
Inventor
刘波
胡小华
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Chongqing Chaoli Hi Tech Co Ltd
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Chongqing Chaoli Hi Tech Co Ltd
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Abstract

The utility model relates to a technical field is made to the compressor, particularly, relates to a compressor heat radiation structure and compressor controller. A heat dissipation structure of a compressor comprises an aluminum shell and a heat pipe; the aluminum shell comprises an installation part connected with the IGBT assembly; the mounting part is provided with a mounting groove, and the mounting groove extends to the edge of the aluminum shell; the heat pipe is accommodated in the mounting groove. The compressor heat radiation structure can avoid the situation that the temperature of the IGBT in the compressor controller is too high due to poor heat radiation.

Description

Compressor heat radiation structure and compressor controller
Technical Field
The utility model relates to a technical field is made to the compressor, particularly, relates to a compressor heat radiation structure and compressor controller.
Background
In the prior art, the heat dissipation of the IGBT in the compressor controller is mainly transferred to the shell of the controller by heat conduction, but the heat dissipation effect is poor in the heat dissipation mode, and the situation that the temperature of the IGBT is too high easily occurs.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a compressor heat radiation structure and compressor controller, it can avoid the IGBT in the compressor controller because of the relatively poor condition that the high temperature appears of heat dissipation.
The embodiment of the utility model is realized like this:
in a first aspect, an embodiment of the present invention provides a heat dissipation structure for a compressor, where the heat dissipation structure for the compressor includes an aluminum casing and a heat pipe;
the aluminum shell comprises an installation part connected with the IGBT assembly; the mounting part is provided with a mounting groove, and the mounting groove extends to the edge of the aluminum shell;
the heat pipe is accommodated in the mounting groove.
In an alternative embodiment, the mounting groove comprises a first sub-groove body located outside the mounting part and a plurality of second sub-groove bodies located inside the mounting part;
along the extending direction of the mounting groove, one ends of the second sub-groove bodies facing the first sub-groove bodies are all intersected with the first sub-groove bodies.
In an alternative embodiment, the heat pipe includes a first subsection received within the first sub-tank and a second subsection received within the plurality of second sub-tanks.
In an optional embodiment, the mounting portion is provided with a plurality of mounting grooves at intervals, and the mounting grooves all extend to the edge of the aluminum shell;
the compressor heat dissipation structure comprises a plurality of heat pipes, and the heat pipes are accommodated in the mounting grooves in a one-to-one correspondence manner.
In an alternative embodiment, the heat dissipating structure of the compressor further includes a plurality of heat dissipating fins connected to the outer peripheral wall of the aluminum housing.
In an alternative embodiment, a plurality of heat radiating fins are connected to the outer circumferential wall of the mounting groove extending to the edge of the aluminum case.
In an alternative embodiment, a plurality of cooling fins are abutted against one end of the heat pipe near the edge of the aluminum housing.
In an optional embodiment, a gap between the heat pipe and the mounting groove is filled with heat-conducting silica gel.
In an optional embodiment, the compressor heat dissipation structure further includes an insulating glue layer attached to the mounting portion, and the insulating glue layer covers the heat pipe and a surface of the mounting portion for abutting against the IGBT component.
In a second aspect, an embodiment of the present invention provides a compressor controller, where the compressor controller includes an IGBT component and the above-mentioned compressor heat dissipation structure;
the IGBT assembly is connected with the mounting part.
The utility model discloses beneficial effect includes:
the heat dissipation structure of the compressor comprises an aluminum shell and a heat pipe; the installation part of the aluminum shell for installing the IGBT assembly is provided with an installation groove for accommodating the heat pipe, and the installation groove extends to the edge of the aluminum shell; from this, can be with the periphery of heat transfer to aluminium system casing that the IGBT subassembly operation in-process produced through the heat pipe to improve the heat conduction and radiating efficiency of aluminium system casing, and then avoid the IGBT subassembly because of the poor condition that appears the high temperature of radiating effect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a heat dissipation structure of a compressor according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a heat pipe according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a mounting groove in an embodiment of the present invention;
fig. 4 is a schematic structural view of a heat dissipation structure of a compressor according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a heat pipe according to another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a mounting groove in another embodiment of the present invention.
200-compressor heat dissipation structure; 210-an aluminum housing; 220-a heat pipe; 110-an IGBT assembly; 211-a mounting portion; 212-a mounting groove; 213-first sub-tank body; 214-a second sub-tank body; 221-a first subsection; 222-a second subsection; 230-heat sink fins.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the product of the present invention is used, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, fig. 1-3 respectively show the heat dissipation structure of the compressor, the heat pipe and the mounting groove in the embodiment of the present invention; the present embodiment provides a heat dissipation structure 200 of a compressor, wherein the heat dissipation structure 200 includes an aluminum housing 210 and a heat pipe 220.
Aluminum case 210 includes mounting portion 211 connected to IGBT module 110; the mounting portion 211 is opened with a mounting groove 212, and the mounting groove 212 extends to the edge of the aluminum housing 210. It should be noted that the IGBT component 110 is an IGBT (insulated Gate Bipolar transistor), and the insulated Gate Bipolar transistor is a composite fully-controlled voltage-driven power semiconductor device composed of a BJT (Bipolar transistor) and an MOS (insulated Gate field effect transistor).
The heat pipe 220 is received in the mounting groove 212. It should be noted that the heat pipe 220 is a heat transfer element, which makes full use of the heat conduction principle and the rapid heat transfer property of the phase change medium, and the heat pipe 220 rapidly transfers the heat of the heat generating object to the outside of the heat source, and the heat transfer capability thereof exceeds the heat transfer capability of any known metal. In use, heat pipe 220 has two opposite ends, which are respectively a hot end and a cold end; the hot end of the heat pipe 220 is located at the mounting portion 211 and is located below the IGBT component 110, and the cold end is located at one end of the mounting groove 212 close to the edge of the aluminum casing 210. The heat pipe 220 functions to transfer heat generated by the operation of the IGBT assembly 110 to the edge of the aluminum case 210, so as to improve heat conduction and heat dissipation efficiency.
The working principle of the heat dissipation structure 200 of the compressor is as follows:
the heat dissipation structure 200 of the compressor includes an aluminum housing 210 and a heat pipe 220; the mounting portion 211 of the aluminum housing 210 for mounting the IGBT component 110 is provided with a mounting groove 212 for accommodating the heat pipe 220, and the mounting groove 212 extends to the edge of the aluminum housing 210; therefore, heat generated in the operation process of the IGBT component 110 can be transferred to the periphery of the aluminum housing 210 through the heat pipe 220, so that the heat conduction and heat dissipation efficiency of the aluminum housing 210 is improved, and the situation that the temperature of the IGBT component 110 is too high due to poor heat dissipation effect is avoided.
Based on the above, referring to fig. 1 and fig. 2, in the present embodiment, when the installation groove 212 is disposed, the installation groove 212 includes a first sub-groove body 213 located outside the installation portion 211 and a plurality of second sub-groove bodies 214 located inside the installation portion 211; along the extending direction of the mounting groove 212, one ends of the plurality of second sub-groove bodies 214 facing the first sub-groove body 213 all meet the first sub-groove body 213.
In addition, in accordance with the installation groove 212, the heat pipe 220 includes a first part 221 and a second part 222, the first part 221 is received in the first sub-tank 213, and the second part 222 is received in the plurality of second sub-tanks 214.
The heat pipe 220 and the mounting groove 212 are arranged in such a manner that the contact area between the heat pipe 220 and the IGBT module 110 mounted on the mounting portion 211 is increased, thereby improving the efficiency of heat transfer from the IGBT module 110 to the heat pipe 220.
In other embodiments of the present invention, please refer to fig. 4-6, and fig. 4-6 respectively show the heat dissipation structure of the compressor, the heat pipe and the mounting groove in other embodiments of the present invention; different from the above-mentioned embodiments of the mounting grooves 212 and the heat pipe 220, a plurality of mounting grooves 212 may be formed on the mounting portion 211 at intervals, and the mounting grooves 212 extend to the edge of the aluminum casing 210; correspondingly, the compressor heat dissipation structure 200 includes a plurality of heat pipes 220, and the plurality of heat pipes 220 are accommodated in the plurality of mounting grooves 212 in a one-to-one correspondence manner. That is, when the contact area between the heat pipe 220 and the IGBT module 110 mounted in the mounting portion 211 is increased, a plurality of mounting grooves 212 may be provided in the mounting portion 211, the plurality of mounting grooves 212 are spaced from each other, and a corresponding heat pipe 220 is mounted in each mounting groove 212, so that the plurality of heat pipes 220 operate simultaneously during heat dissipation, and conduct heat, thereby improving heat transfer and heat dissipation efficiency.
It should be noted that, as can be seen from the above description, when the mounting groove 212 and the heat pipe 220 are disposed, the mounting groove 212 and the heat pipe 220 are in a mutually adaptive relationship, that is, the shape and size of the mounting groove 212 disposed in the aluminum housing 210 are adapted to the shape and size of the heat pipe 220, so that by such a disposition, the shape and size of the mounting groove 212 and the heat pipe 220 can be correspondingly adjusted according to the power of the IGBT component 110, and the heat dissipation structure 200 of the compressor can meet the corresponding heat dissipation requirement.
Further, referring to fig. 1 and 4, in an embodiment of the present invention, during the operation of the IGBT component 110, the heat is transferred to the aluminum housing 210, and then the heat is dissipated to the outside through the aluminum housing 210, so that during the heat dissipation process of the aluminum housing 210, in order to improve the heat dissipation efficiency of the aluminum housing 210, the heat dissipation structure 200 of the compressor further includes a plurality of heat dissipation fins 230, and the plurality of heat dissipation fins 230 are connected to the outer peripheral wall of the aluminum housing 210. It should be noted that the plurality of heat dissipation fins 230 all function to increase the heat exchange area with the outside, so that the structure in the prior art can be adopted when the heat dissipation fins 230 are arranged.
In this embodiment, under the condition that the heat dissipation structure 200 of the compressor further includes a plurality of heat dissipation fins 230, and the plurality of heat dissipation fins 230 are connected to the outer circumferential wall of the aluminum housing 210, in order to reduce the heat transmission path in the aluminum housing 210 and thus improve the heat transmission efficiency, the plurality of heat dissipation fins 230 are connected to the outer circumferential wall of the mounting groove 212 extending to the edge of the aluminum housing 210; that is, the peripheral wall of the mounting groove 212 extending to the edge of the aluminum case 210 is connected to the plurality of heat radiating fins 230, so that the end of the heat pipe 220 close to the edge of the aluminum case 210 is located at the inner and outer sides of the peripheral wall thereof opposite to the plurality of heat radiating fins 230, so that heat can enter the plurality of heat radiating fins 230 and be radiated to the outside while being transferred to the peripheral wall thereof, thereby reducing the path of heat transfer. It should be noted that, in other embodiments of the present invention, the plurality of heat dissipation fins 230 may also abut against one end of the heat pipe 220 near the edge of the aluminum casing 210, that is, the heat of the heat pipe 220 can be directly transferred to the plurality of heat dissipation fins 230.
In this embodiment, it should be noted that, during the operation of the IGBT component 110, since the IGBT component 110 is connected to the mounting portion 211 in the aluminum housing 210, the IGBT component 110 enters the mounting portion 211, and the mounting portion 211 is located at a part of the aluminum housing 210, so that the heat generated by the mounting portion 211 is transferred to the heat pipe 220 and the aluminum housing 210; therefore, in order to improve the heat transfer efficiency, the gap between the heat pipe 220 and the mounting groove 212 is filled with heat conductive silicone, so that the heat in the aluminum housing 210 can be transferred through the heat pipe 220.
Secondly, in order to enable the IGBT component 110 to transfer heat to the heating pipe 220 and the mounting portion 211 during operation, the compressor heat dissipation structure 200 further includes an insulating adhesive layer attached to the mounting portion 211, where the insulating adhesive layer covers a surface of the heating pipe 220 and the mounting portion 211, which is used for abutting against the IGBT component 110, that is, the insulating adhesive layer can improve efficiency of transferring heat from the IGBT component 110 to the heating pipe 220 and the mounting portion 211 while blocking electrical connection between the IGBT component 110 and the aluminum housing 210.
Based on the above-mentioned compressor heat radiation structure 200, the embodiment of the present invention provides a compressor controller, which includes an IGBT component 110 and the above-mentioned compressor heat radiation structure 200; the IGBT module 110 is connected to the mounting portion 211.
The above description is only an example of the present invention, and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. The utility model provides a compressor heat radiation structure which characterized in that:
the compressor heat dissipation structure comprises an aluminum shell and a heat pipe;
the aluminum shell comprises an installation part connected with the IGBT assembly; the mounting part is provided with a mounting groove, and the mounting groove extends to the edge of the aluminum shell;
the heat pipe is accommodated in the mounting groove.
2. The compressor heat dissipation structure of claim 1, wherein:
the mounting groove comprises a first sub-groove body positioned outside the mounting part and a plurality of second sub-groove bodies positioned in the mounting part;
and along the extending direction of the mounting groove, one end of each second sub-groove body facing the first sub-groove body is intersected with the first sub-groove body.
3. The compressor heat dissipation structure of claim 2, wherein:
the heat pipe comprises a first subsection and a second subsection, wherein the first subsection is accommodated in the first sub-groove body, and the second subsection is accommodated in the plurality of second sub-groove bodies.
4. The compressor heat dissipation structure of claim 1, wherein:
the mounting part is provided with a plurality of mounting grooves at intervals, and the mounting grooves extend to the edge of the aluminum shell;
the heat dissipation structure of the compressor comprises a plurality of heat pipes, and the heat pipes are accommodated in the mounting grooves in a one-to-one correspondence manner.
5. The compressor heat dissipation structure as set forth in any one of claims 1 to 4, wherein:
the compressor heat radiation structure further comprises a plurality of heat radiation fins, and the plurality of heat radiation fins are connected with the peripheral wall of the aluminum shell.
6. The compressor heat dissipation structure of claim 5, wherein:
the plurality of heat dissipation fins are connected to the outer circumferential wall at the edge of the aluminum shell to which the mounting grooves extend.
7. The compressor heat dissipation structure of claim 5, wherein:
the plurality of radiating fins are abutted with one end of the heat pipe close to the edge of the aluminum shell.
8. The compressor heat dissipation structure of claim 1, wherein:
and heat conduction silica gel is filled in the gap between the heat pipe and the mounting groove.
9. The compressor heat dissipation structure of claim 1, wherein:
compressor heat radiation structure still including adhere to in the insulating glue layer of installation department, insulating glue layer covers the heat pipe reaches the installation department be used for with the face of IGBT subassembly butt.
10. A compressor controller, characterized by:
the compressor controller includes an IGBT assembly and the compressor heat dissipation structure of any one of claims 1 to 9;
the IGBT component is connected with the mounting part.
CN202022097858.8U 2020-09-22 2020-09-22 Compressor heat radiation structure and compressor controller Active CN213419299U (en)

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Application Number Priority Date Filing Date Title
CN202022097858.8U CN213419299U (en) 2020-09-22 2020-09-22 Compressor heat radiation structure and compressor controller

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Application Number Priority Date Filing Date Title
CN202022097858.8U CN213419299U (en) 2020-09-22 2020-09-22 Compressor heat radiation structure and compressor controller

Publications (1)

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CN213419299U true CN213419299U (en) 2021-06-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116581098A (en) * 2023-07-13 2023-08-11 深圳艾为电气技术有限公司 Electric compressor controller

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116581098A (en) * 2023-07-13 2023-08-11 深圳艾为电气技术有限公司 Electric compressor controller
CN116581098B (en) * 2023-07-13 2024-02-27 深圳艾为电气技术股份有限公司 Electric compressor controller

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