CN209801860U - Circulating liquid refrigeration system and refrigeration equipment - Google Patents

Abstract

The utility model relates to the field of refrigeration equipment, and discloses a circulating liquid refrigeration system, comprising a heat dissipation module (1) connected in sequence with the hot end of a semiconductor refrigeration chip (2), a semiconductor refrigeration chip (2), and a semiconductor refrigeration chip ( 2) The liquid-cooled heat exchange unit (3) and the storage container (4) in contact with the cold end surface; the liquid-cooled heat exchange unit (3) includes integrated heat exchange fins (31), housing (32) . A pumping device (33) and a front shell (34), the storage container (4) is connected with the liquid-cooled heat exchange unit (3) to form a closed-loop circulating liquid circuit (5). The circulating liquid refrigeration system of the utility model can not only effectively improve refrigeration efficiency and refrigeration capacity, but also have modular components, save installation space, and provide good user experience. The utility model also discloses a refrigeration device with a circulating liquid refrigeration system.

Description

Circulating liquid refrigeration system and refrigeration equipment

technical field

The utility model relates to the field of refrigeration equipment, in particular to a circulating liquid refrigeration system and refrigeration equipment.

Background technique

In existing drink supply devices, most of them adopt semiconductor chip refrigeration technology to provide cold water or cold drinks. The semiconductor refrigeration chip is mainly a thermocouple pair connected by an N-type semiconductor material and a P-type semiconductor material. When the thermocouple pair has a current passing through it, energy transfer can occur, and the current flows from the N-type element to the P-type element. The joint absorbs heat and becomes the cold end; the joint from the P-type element to the N-type element releases heat and becomes the hot end. In addition to being affected by the characteristics of the semiconductor chip itself, the cooling capacity of the semiconductor chip is also seriously affected by the heat transfer performance of the cold end and the heat dissipation performance of the hot end. A more prominent problem is that when users need cold water or cold drinks, they often cannot be cooled quickly, and users need to wait for a long time.

The portable semi-conductor self-circulating cold drink machine in the prior art, in order to improve the refrigeration efficiency, makes the cold drink pass through a cold room inside the liquid storage tank, wherein the turbine of the cold pump is installed at the bottom of the liquid storage tank, and the outlet of the cold room is also located at the bottom of the liquid storage tank. The technical improvement at the bottom of the liquid storage tank should be said to be relatively large. It has been proved by actual use that the refrigeration efficiency of this cold drink machine is still not ideal. When users take cold drinks, sometimes they only take part of the cold drinks, and the rest They are all normal temperature or warm drinking liquids, and it is difficult to achieve a relatively good user experience.

Utility model content

The technical problem to be solved in the first aspect of the utility model is to provide a circulating liquid refrigeration system and refrigeration equipment. The circulating liquid refrigeration system can not only effectively improve the refrigeration efficiency and refrigeration capacity, but also modularize the components, save installation space, and provide Good user experience.

The technical problem to be solved in the second aspect of the utility model is to provide a refrigeration equipment, which can not only effectively improve the refrigeration efficiency and refrigeration capacity, but also facilitate the miniaturization of the refrigeration equipment and facilitate disassembly and maintenance.

In order to achieve the above object, the first aspect of the utility model provides a circulating liquid refrigeration system, which includes a heat dissipation module that is in contact with the hot end of the semiconductor refrigeration chip, a semiconductor refrigeration chip, and a liquid cooling unit that is in contact with the cold end of the semiconductor refrigeration chip. A heat unit and a storage container; the liquid-cooled heat exchange unit includes integrated heat exchange fins, a casing, a pumping device and a front shell, and the storage container is connected with the liquid-cooled heat exchange unit to form a closed-loop circulating liquid road.

Preferably, the liquid movement track formed by the circulating liquid path is suitable for guiding the thermal convective movement of the liquid, and the liquid is suitable for forming local turbulence in a part of the liquid movement track.

Preferably, the heat dissipation module includes a heat sink and a cooling wind drive device for cooling the heat sink; a plurality of fins are provided on one side of the heat sink, and the heat sink is connected to the cooling wind drive device , and a cooling air path is formed between the adjacent heat sinks; a heat-absorbing liquid mist spreading device suitable for spraying a liquid mist that absorbs heat and vaporizes is arranged on the cooling air path.

Preferably, the heat dissipation module includes a heat pipe unit, a heat dissipation element, and a cooling wind driving device for cooling the heat dissipation element connected in sequence; the heat dissipation element includes a plurality of heat dissipation fins and a heat shield, A cooling air channel is formed between the fins, and the cooling air driving device is connected to the heat sink.

Further preferably, the heat pipe unit includes a heat pipe and a substrate, the heat pipe has a heat pipe evaporation part and a heat pipe condensation part, the heat pipe evaporation part is embedded in the substrate, and its tube wall is flush with the surface of the substrate, suitable for The hot end of the semiconductor cooling chip is in contact; the two ends of the heat pipe are partially bent so that the condensing part of the heat pipe is inserted into the heat sink.

Preferably, the heat dissipation module includes a cooling water tank, a cooling water pump, a radiator, and a cooling wind driving device for cooling the radiator connected in sequence; the cooling water tank includes a body and a cover plate, and the body is provided with A plurality of first installation holes, a plurality of second installation holes are provided on the cover plate, and the body is connected to the cover plate through the first installation holes and the second installation holes.

Further preferably, the inside of the body is provided with a first water channel and a second water channel which are independent of each other, and the inside of the first water channel and the second water channel are both provided with staggered partitions, and the first water channel and the second water channel The water channel is connected as a liquid channel capable of switching between series mode and parallel mode through a reversing valve, the first water channel is connected with a first water inlet and a first water outlet that communicate with each other, and the second water channel is connected with a first water channel that communicates with each other. The second water inlet and the second water outlet.

Further preferably, a plurality of cooling fins are provided on one end surface of the heat sink, and cooling air ducts are formed between adjacent cooling fins; the liquid pipe connected to the cooling water tank is repeatedly bent and passed through the cooling fins multiple times , and communicate with the cooling water pump, the liquid pipe, the cooling water pump and the cooling water tank form a closed liquid path.

Preferably, one side of the housing is provided with a heat exchange chamber, the other side of the housing is provided with a pumping device accommodation chamber, and the upper and lower parts of the housing are respectively provided with interconnected heat exchanger inlets and the outlet of the heat exchanger, the inlet of the heat exchanger communicates with the heat exchange chamber, and the outlet of the heat exchanger communicates with the base; one side of the heat exchange sheet is provided with a chip contact area, and the heat exchanger The other side of the heat fin is provided with a plurality of turbulence fins for forming local turbulence, the heat exchange fin is sealed and fixed with the housing, and the turbulence fin extends into the heat exchange chamber Inside; the pumping device housing cavity is provided with a base for installing the pumping device, and the front cover is mounted on the pumping device housing cavity; the chip contact area is in contact with the semiconductor refrigeration chip The cold end face connection.

Preferably, the heat exchange chamber communicates with the pumping device accommodation chamber through a fluid hole, and the fluid hole is located inside the base.

Preferably, an inlet baffle is provided in the heat exchange chamber near the inlet of the heat exchanger.

Preferably, the upper and lower parts of the storage container are respectively provided with a storage container inlet and a storage container outlet communicating with each other, and the local turbulent flow is formed by the impact of liquid generated by the height difference between the storage container inlet and the storage container outlet.

The second aspect of the utility model provides a refrigeration device, wherein the refrigeration device includes the circulating liquid refrigeration system described in any one of the technical solutions of the first aspect of the utility model.

Through above-mentioned technical scheme, the technical effect of the present utility model is as follows:

The circulating liquid refrigeration system of the utility model utilizes the principle and characteristics of the semiconductor refrigeration chip to carry out liquid refrigeration; the cold end and the hot end of the semiconductor refrigeration chip are respectively connected with the liquid cooling heat exchange unit and the heat dissipation module, and the heat dissipation module can timely control the semiconductor refrigeration chip. The hot end dissipates heat to avoid the waste of the semiconductor refrigeration chip due to the high temperature of the hot end. The liquid-cooled heat exchange unit is integrated with heat exchanger fins and pumping devices, which makes the liquid-cooled heat exchange unit modular and miniaturized, and is suitable for various drinking equipment, and the liquid-cooled heat exchange unit is connected to the storage container to form a closed-loop circulating liquid circuit for circulating refrigeration.

The spoiler fins on the heat exchange fins are in direct contact with the liquid, which can form local turbulence. The inlet baffle inside the shell of the liquid-cooled heat exchange unit also assists in the formation of local turbulence, and can enter the shell from the heat exchanger inlet. The liquid flows in evenly, fully contacts with the spoiler fins, and improves the refrigeration capacity. The pumping device can make the liquid circulate in the circulating liquid path in a controlled manner, strengthen the heat convection movement of the liquid, and convert the natural convection heat transfer mode of the liquid into forced cooling. The convective heat transfer method increases the convective heat transfer coefficient. The heat transfer coefficient of the natural convection method is: 200～1000W/(m ² °C), and the heat transfer coefficient of the forced convection method is: 1000～15000W/(m ² °C), the refrigeration efficiency is significantly improved, and the refrigeration is rapid; the upper and lower parts of the storage container are respectively provided with an interconnected storage container inlet and a storage container outlet, and the liquid impact generated by the height difference between the storage container inlet and the storage container outlet forms another A local turbulence, the turbulence can cause energy consumption through the additional shear stress generated by the turbulence, and can also through the mass transfer, heat transfer and momentum transfer caused by the particle turbulence, thereby strengthening the heat convection movement of the liquid and improving the refrigeration efficiency;

The circulating liquid refrigeration system of the present invention is applied to drinking equipment, such as water dispensers, cold drink machines, fruit juice machines, etc.; the heat dissipation module can promote the heat dissipation of the hot end of the semiconductor refrigeration chip, and the liquid cooling heat exchange unit simultaneously improves the cooling of the semiconductor refrigeration chip. The refrigeration efficiency of the utility model is significantly improved, which not only makes the refrigeration fast, but also makes the temperature of the liquid uniform, bringing users a better experience.

Other advantages of the present utility model and technical effects of preferred embodiments will be further described in the specific embodiments below.

Description of drawings

Fig. 1 is the schematic diagram of an embodiment of the utility model;

Fig. 2 is the schematic diagram of another embodiment of the utility model;

Fig. 3 is a schematic diagram of the connection form of the heat pipe unit and the radiator in the embodiment of Fig. 2;

Fig. 4 is the schematic diagram of another embodiment of the utility model;

Fig. 5 is a schematic structural view of the cooling water tank in the embodiment of Fig. 4;

Fig. 6 is a schematic diagram of the connection form of the liquid pipe and the cooling fin in the embodiment of Fig. 4;

Fig. 7 is a schematic diagram of a liquid-cooled heat exchange unit in an embodiment of the present invention.

Explanation of reference signs

1 Cooling Module

11 Heat sink 111 Heat sink

112 heat shield

12 Cooling air drive device 13 Heat absorbing liquid mist distribution device

14 heat pipe unit

141 heat pipe 142 substrate

1411 Heat pipe evaporator 1412 Heat pipe evaporator

15 cooling water tank

151 Body 152 Cover

153 First Waterway 154 Second Waterway

155 Partition 156 First water inlet

157 First water outlet 158 Second water inlet

159 Second water outlet 16 Cooling water pump

2 semiconductor cooling chip

3 liquid cooling heat exchange unit

31 Heat Exchanger

311 Chip contact area 312 Spoiler fins

32 housing

321 Heat exchange chamber 322 Pumping device accommodation chamber

323 Base 324 Orifice

33 Pumping unit 34 Front housing

35 Heat exchanger inlet 36 Heat exchanger outlet

37 Inlet baffle

4 storage containers

41 Storage Container Inlet 42 Storage Container Outlet

5 Circulating fluid circuit

Detailed ways

The specific embodiment of the utility model will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the utility model, and are not intended to limit the utility model.

In describing the present utility model, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "inner", "outer", "top", The orientation or positional relationship indicated by "bottom" is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation , are constructed and operated in a specific orientation and therefore cannot be construed as limiting the invention.

In the description of the present utility model, it should be noted that unless otherwise specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection, or It is an integral connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model according to specific situations.

As shown in Fig. 1, Fig. 2, Fig. 4 and Fig. 7, the circulating liquid refrigeration system in one embodiment of the present invention includes a heat dissipation module 1, a semiconductor refrigeration chip 2, a liquid cooling heat exchange unit 3 and a storage The container 4, the heat dissipation module 1 is in contact with the hot end of the semiconductor refrigeration chip 2, and the liquid cooling heat exchange unit 3 is in contact with the cold end of the semiconductor refrigeration chip 2; the liquid cooling heat exchange unit 3 includes integrated heat exchange fins 31, The casing 32, the pumping device 33 and the front casing 34, the heat exchange fins 31, the casing 32, and the pumping device 33 are connected in sequence, the front casing 34 is covered on the casing 32, and the pumping device 33 is packaged in the casing 32 , the storage container 4 is connected with the liquid-cooled heat exchange unit 3 to form a closed-loop circulating liquid path 5 . Wherein, the pumping device 33 can adopt water pumps such as centrifugal pumps, reciprocating pumps and mixed flow pumps.

When working, the pumping device 33 of the liquid-cooled heat exchange unit 3 drives the liquid to flow out from the storage container 4, and flows into the housing 32, and contacts the heat exchange fins 31. At the same time, the semiconductor refrigeration chip 2 starts to work, and the cooling of the semiconductor refrigeration chip 2 end is in contact with the heat exchange fin 31, through which the heat exchange fin 31 exchanges heat with the liquid in the shell 32, and the liquid in the shell 32 is refrigerated. As the liquid flows back from the shell 32 to the storage container 4, the returned The liquid and the liquid in the storage container 4 carry out heat convection, and under the action of the pumping device 33, the circulation refrigeration strengthens the heat convection movement of the liquid, and converts the natural convection heat transfer mode of the liquid into a forced convection heat transfer mode, which increases the convection The heat transfer coefficient, the refrigeration efficiency is significantly improved, and the cooling is rapid; moreover, the heat dissipation module 1 that is in contact with the hot end of the semiconductor refrigeration chip 2 continuously dissipates heat to the semiconductor refrigeration chip 2, which not only prevents the semiconductor refrigeration chip 2 from being burned out, but also makes the semiconductor refrigeration chip 2 The cooling chip 2 is in a better cooling working state.

Wherein, the liquid movement track formed by the circulating liquid path 5 is suitable for guiding the thermal convective movement of the liquid, and the liquid is suitable for forming local turbulent flow in a part of the liquid movement track.

Referring to Fig. 1, in one embodiment of the present utility model, the cooling module 1 includes a heat sink 11 and a cooling wind drive device 12, the cooling wind drive device 12 can cool and dissipate the heat sink 11, and one side of the heat sink 11 is provided with There are a plurality of heat sinks 111, and the other end surface is directly in contact with the hot end of the semiconductor cooling chip 2, and the contact surface between the heat sink 11 and the hot end of the semiconductor cooling chip 2 is coated with thermal conductive silicone grease to reduce the contact between the heat dissipation module 1 and the semiconductor cooling chip. The thermal resistance of the hot end of the cooling chip 2, the cooling fins 111 are connected to the cooling wind driving device 12 and a cooling wind path is formed between adjacent cooling fins 111, the cooling wind driving device 12 can use a fan, and further, along the cooling wind path in cooling The upper or lower end of the wind path can be provided with a heat-absorbing liquid mist spreading device 13, which can spray the liquid mist vaporized after absorbing heat, and the heat-absorbing liquid mist spreading device 13 can adopt similar devices such as a humidifier or a spray nozzle. , connected with the storage container 4 can provide the liquid mist required by the heat-absorbing liquid mist dispersing device 13; the cooling wind driving device 12 can be installed on the cooling fin 111 vertically to the cooling air path, or can be installed on the upper or lower end of the cooling air path, Moreover, the cooling wind driving device 12 and the heat-absorbing liquid mist distributing device 13 can be installed on the cooling fin 111 together in a vertical cooling air path, and the cooling wind driving device 12 and the heat-absorbing liquid mist distributing device 13 can also be installed in a vertical cooling air path. The other is installed at the upper or lower end of the cooling air path.

Referring to Fig. 2 and Fig. 3, in another embodiment of the present invention, the heat dissipation module 1 includes a heat pipe unit 14, a heat sink 11 and a cooling wind driving device 12 connected in sequence, and the cooling wind driving device 12 can control the The heat sink 11 cools and dissipates heat; the heat sink 11 includes a plurality of heat sinks 111 and a heat shield 112, the heat sink 111 is installed on the heat shield 112, and a cooling air duct is formed between adjacent heat sinks 111, and the cooling air The driving device 12 is connected with the cooling fins 111, so that the cooling air can flow along the cooling air duct to cool the heat sink 11; wherein, the cooling wind driving device 12 can adopt a fan or other similar equipment, and the cooling wind driving device can 12 can be installed vertically on the cooling air duct, and can also be installed on the upper or lower end of the cooling air duct.

Referring to Fig. 3, in another preferred embodiment of the utility model, the heat pipe unit 14 includes a heat pipe 141 and a base plate 142, the base plate 142 is arranged on the heat shield 112, and the heat pipe 141 has a heat pipe evaporator 1411 and a heat pipe condensation part 1412, the heat pipe evaporation part 1411 is embedded in the substrate 142, and its tube wall is flush with the surface of the substrate 142, so that the contact area with the hot end of the semiconductor cooling chip 2 is as large as possible, and the substrate 142 and the semiconductor cooling chip 2 The contact surface of the hot end of the heat pipe is coated with thermal conductive silicone grease to reduce the thermal resistance between the heat dissipation module 1 and the hot end of the semiconductor cooling chip 2. The heat pipe evaporation part 1411 is located in the middle of the heat pipe 141, and the heat pipe condensation part 1412 is located at both ends of the heat pipe 141. The heat pipe condenses The part 1412 bypasses the heat shield 112 through the local bending of the heat pipe 141, and is inserted into the inside of the heat sink 111; the heat dissipation module 1 connected to the hot end of the semiconductor refrigeration chip 2 mainly uses the principle of heat dissipation of the heat pipe, and relies on the vapor-liquid phase change of the working liquid inside the heat pipe 141 Heat transfer, and the thermal resistance is very small, quickly transfer the heat generated by the hot end of the semiconductor refrigeration chip 2; moreover, the heat pipe unit 14 in the heat dissipation module 1 is integrated with the heat sink 11, and the integrated heat pipe unit 14 is integrated with the heat sink 11 module Small in size, it is suitable for installation environments with limited space; the shape of the heat exchange fins 111 is not limited to the elongated shape, and can also be S-shaped, grid-shaped, etc., and the shape can also be adaptively changed according to the installation environment.

Referring to Fig. 4 and Fig. 5, in another embodiment of the present utility model, the heat dissipation module 1 includes a cooling water tank 15, a cooling water pump 16, a cooling element 11 and a cooling wind driving device 12 connected in sequence, and the cooling wind driving device 12 It is used to cool and dissipate the heat sink 11; the cooling water tank 15 includes a body 151 and a cover plate 152, each of the four corners of the body 151 is provided with a first mounting hole, and each of the four corners of the cover plate 152 is provided with a second mounting hole. The body 151 can be threadedly connected to the cover plate 152 through the one-to-one correspondence between the first installation hole and the second installation hole. The cooling water pump 16 can promote the continuous circulation of water in the circulating water circuit formed by the cooling water tank 15, the cooling water pump 16, the heat sink 11 and the cooling wind driving device 12, and carry out heat exchange with the hot end of the semiconductor refrigeration chip 2 in the cooling water tank 15. Take the heat from the hot end of the semiconductor refrigeration chip 2, and then when it flows through the heat sink 11, the heat is transferred to the heat sink 11, and the cooling wind driving device 12 then cools and dissipates the heat from the heat sink 11, and uses water to heat the semiconductor refrigeration chip 2. End heat dissipation to ensure the cooling effect of the semiconductor cooling chip 2.

Referring to Fig. 5, in another preferred embodiment of the present utility model, a first water channel 153 and a second water channel 154 which are independent of each other are provided inside the body 151, and the inside of the first water channel 153 and the second water channel 154 are both provided with There are staggered partitions 155, the first water channel 153 is connected with the first water inlet 156 and the first water outlet 157 which are connected with each other, and the second water channel 154 is connected with the second water inlet 158 and the first water outlet 158 which are connected with each other. Two water outlets 159; the end surface of the bottom of the body 151 is in direct contact with the hot end of the semiconductor refrigeration chip 2, and the heat is taken away from the hot end of the semiconductor refrigeration chip 2 by the circulating liquid in the cooling water tank 15 to achieve the purpose of heat dissipation. The plate 155 can cause the liquid to generate local turbulence at a local position of the movement track, promote the thermal convection movement of the circulating liquid in the cooling water tank 15, improve the heat absorption effect and utilization rate of the circulating liquid, and then improve the heat dissipation of the hot end of the semiconductor refrigeration chip 2 Efficiency; a reversing valve is connected between the first water channel 153 and the second water channel 154, and the reversing valve can make the first water channel 153 and the second water channel 154 switch between the series mode liquid circuit and the parallel mode liquid circuit. When the first water channel 153 and the second water channel 154 are used in series, the first water outlet 157 is connected with the second water inlet 158, so that the water body flows in from the first water inlet 156, and flows through the first water channel 153 and the second water channel 154 successively. Then flow out from the second water outlet 159. When the first water channel 153 and the second water channel 154 were used in parallel, the water flow entered from the first water inlet 156 and the second water inlet 158 simultaneously, and the first water outlet 157 and the second water outlet 159 At the same time, the water flow is output, the liquid flow rate is large, and the cooling effect is better, and, referring to Fig. 6, the liquid pipe on the cooling fin 111 needs to be changed adaptively, and the liquid pipe is changed from one to two parallel forms, which are respectively connected to the first The water channel 153 communicates with the second water channel 154 .

Referring to Figures 4-6, in another preferred embodiment of the present invention, a plurality of cooling fins 111 are provided on one side of the heat sink 11, and cooling air ducts are formed between adjacent cooling fins 111; The liquid pipe connected to the cooling water tank 15 is repeatedly bent and passes through the heat sink 111 for many times, and the liquid pipe is also connected to the cooling water pump 16, and the liquid pipe, the cooling water pump 16 and the cooling water tank 15 form a closed liquid circuit. The cooling water pump 16 promotes the heat convection movement of the circulating water in the closed liquid path, improves the heat absorption effect and utilization rate of the circulating water, and then improves the heat dissipation efficiency of the hot end of the semiconductor refrigeration chip 2 . It can be understood that the circulating water used for cooling and heat dissipation in the closed liquid circuit is not limited to water as a cooling medium, and a solvent or an existing coolant formed by mixing water with an existing coolant can also be used; the shape of the heat sink 111 It is not limited to the shape of a strip, but can also be in a wave shape, a grid shape, etc., and the cooling air driving device 12 is installed on the upper port or the lower port of the cooling air duct, or is perpendicular to the cooling air duct and connected to the heat sink 111, The cooling air can be made to flow along the cooling air duct to cool the heat sink 11 , and the cooling air driving device 12 can use a fan or other similar devices.

Referring to Fig. 7, in some specific embodiments of the present utility model, the heat exchange fin 31, the housing 32, and the pumping device 33 are connected sequentially, and the heat exchange fin 31 and the pumping device 33 are installed on opposite sides of the housing 32 respectively. , the front shell 34 is covered on the shell 32, the pumping device 33 is packaged in the space formed by the front shell 34 and the shell 32, the heat exchange fin 31, the shell 32, the pumping device 33 and the front shell 34 are integrated into a In the liquid-cooled heat exchange unit 3, a heat exchange chamber 321 is provided on one end surface of the housing 32, and a pumping device accommodation chamber 322 is provided on the other end surface of the housing 32. The upper and lower parts of the housing 32 are respectively provided with The heat exchanger inlet 35 and the heat exchanger outlet 36, the heat exchanger inlet 35 and the heat exchanger outlet 36 can be communicated, specifically, the heat exchanger inlet 35 communicates with the heat exchange cavity 321, and the heat exchange The outlet 36 of the device communicates with the base 323, the base 323 is installed in the pumping device accommodating cavity 322, and the base 323 is used to install the pumping device 33; preferably, one side of the heat exchange fin 31 is provided with a chip contact area 311, the other side of the heat exchange fin 31 is provided with a plurality of spoiler fins 312 for forming local turbulent flow, further, the chip contact area 311 and the spoiler fins 312 are arranged symmetrically, the heat exchange fin 31 It can be sealed and fixed with the housing 32, and the spoiler fins 312 protrude into the heat exchange chamber 321, and the shape of the spoiler fins 312 can be round, square, sheet-shaped, corrugated, etc.; The chip contact area 311 is connected to the cold end face of the semiconductor refrigeration chip 2, and the contact surface of the two can be coated with heat-conducting silicone grease to ensure good contact and thermal conductivity between the chip contact area 311 and the semiconductor refrigeration chip 2; the front shell 34 The cover can be mounted on the pumping device housing cavity 322, and the pumping device 33 is packaged in the pumping device housing cavity 322; it is convenient for the liquid cooling heat exchange unit 3 to be modularized and miniaturized, and can be better installed in various Inside drinking facilities. Referring to FIG. 7 , in a preferred embodiment of the present invention, the heat exchange chamber 321 and the pumping device accommodation chamber 322 communicate through a fluid hole 324 , the fluid hole 324 is located inside the base 323 , and the heat exchanger inlet 35 passes through the The heat chamber 321 , the liquid flow hole 324 and the pumping device accommodation chamber 322 communicate with the outlet 36 of the heat exchanger. It can be understood that it is a preferred embodiment to use the flow hole 324 to connect the heat exchange chamber 321 and the pumping device accommodation chamber 322. The heat exchange chamber 321 and the pumping device accommodation chamber 322 can also be communicated through pipelines, and the pipelines Extend into the base 323 inside.

Referring to Fig. 7, in a further preferred embodiment of the present utility model, an inlet baffle 37 is provided in the heat exchange cavity 321, and the inlet baffle 37 is close to the inlet 35 of the heat exchanger, so that the inlet 35 of the heat exchanger can flow into The liquid forms a local turbulent flow, which improves the cooling capacity.

Referring to Fig. 1, Fig. 2, Fig. 4 and Fig. 7, in some embodiments of the present utility model, storage container 4 upper and lower parts are provided with storage container inlet 41 and storage container outlet 42 respectively, storage container inlet 41 and storage container outlet 42 is connected through the storage container 4, and a height difference is formed between the storage container inlet 41 and the storage container outlet 42, and the liquid flowing in from the storage container inlet 41 can impact the liquid surface in the storage container 4 to form a local turbulent flow; in conjunction with Fig. 7, The storage container inlet 41 communicates with the heat exchanger outlet 36 of the liquid-cooled heat exchange unit 3, and the storage container outlet 42 communicates with the heat exchanger inlet 35 of the liquid-cooled heat exchange unit 3, so that the storage container 4 is connected with the liquid-cooled heat exchange unit 3 A closed-loop liquid circulation path 5 is formed, and the liquid movement track formed by the circulation liquid path 5 can guide the thermal convection movement of the liquid, and can form local turbulent flow in a local area of the liquid movement path.

With reference to Fig. 1-Fig. 7, the circulating liquid refrigeration system of a preferred embodiment of the present utility model, comprises the heat dissipation module 1, semiconductor refrigeration chip 2, liquid cooling heat exchange unit 3 and storage container 4 that are connected in sequence, heat dissipation module 1 and semiconductor The hot end of the refrigeration chip 2 is in contact, and the liquid-cooled heat exchange unit 3 is in contact with the cold end of the semiconductor refrigeration chip 2; It is connected with the front shell 34, the heat exchange fin 31, the housing 32, and the pumping device 33 in sequence. The heat exchange fin 31 and the pumping device 33 are respectively installed on opposite sides of the shell 32, and the front shell 34 is covered by the shell 32. The pumping device 33 is packaged in the casing 32; the two sides of the casing 32 are respectively provided with a heat exchange chamber 321 and a pumping device accommodation chamber 322, and the heat exchange chamber 321 is connected with a heat exchanger inlet 35, and the heat exchange chamber 321 is provided with an inlet baffle 37, and the inlet baffle 37 is arranged close to the heat exchanger inlet 35, and a base 323 is provided in the pumping device accommodation cavity 322, and the heat exchanger outlet 36 is communicated with the base 323, and the pumping device 33 Installed on the base 323, there is a flow hole 324 in the base 323; the two end faces of the heat exchange fin 31 are symmetrically provided with a chip contact area 311 and a plurality of spoiler fins 312 for forming local turbulent flow. The heat plate 31 can be sealed and fixed with the housing 32, the spoiler fin 312 extends into the heat exchange chamber 321, the chip contact area 311 is connected with the cold end surface of the semiconductor refrigeration chip 2, and the contact surface of the two can be coated with heat-conducting silicon Grease to ensure good contact and thermal conductivity between the chip contact area 311 and the semiconductor refrigeration chip 2; the front shell 34 cover is installed on the pumping device accommodation chamber 322, and the pumping device 33 is packaged in the pumping device accommodation chamber 322; The liquid cooling heat exchange unit 3 is modularized and miniaturized, and can be better installed in various drinking equipment; the upper and lower parts of the storage container 4 are respectively provided with a storage container inlet 41 and a storage container outlet 42, and the storage container inlet 41 and the storage container The container outlet 42 is connected through the storage container 4, and a height difference is formed between the storage container inlet 41 and the storage container outlet 42, and the liquid flowing in from the storage container inlet 41 can impact the liquid surface in the storage container 4 to form a local turbulent flow; 7. The inlet 41 of the storage container is connected with the outlet 36 of the heat exchanger, and the outlet 42 of the storage container is connected with the inlet 35 of the heat exchanger, so that the storage container 4 is connected with the liquid-cooled heat exchange unit 3 to form a closed-loop circulating liquid path 5, and the circulating liquid path 5 The formed liquid motion track can guide the thermal convective motion of the liquid, and can form local turbulence in the local area of the liquid motion track; the heat dissipation module 1 can adopt various heat dissipation methods such as air cooling, heat pipe heat dissipation, and water cooling heat dissipation; refer to Fig. 1 , during air-cooled heat dissipation, the heat dissipation module 1 includes a heat dissipation element 11 and a cooling wind drive device 12, one side of the heat dissipation element 11 is provided with a plurality of heat dissipation fins 111, and the end surface on the other side is directly in contact with the hot end of the semiconductor refrigeration chip 2, The contact surface of the heat sink 11 and the hot end of the semiconductor cooling chip 2 is coated with thermal conductive silicone grease to reduce the thermal resistance of the heat dissipation module 1 and the hot end of the semiconductor cooling chip 2, and to dissipate heat. The fins 111 are respectively connected to the cooling wind driving device 12 and the heat-absorbing liquid mist spreading device 13, and a cooling air path is formed between adjacent cooling fins 111; referring to Fig. 2 and Fig. 3 , when the heat pipe dissipates heat, the heat dissipation module 1 includes sequentially connected Heat pipe unit 14, heat sink 11 and cooling wind driving device 12; said heat sink 11 includes a plurality of heat sinks 111 and heat insulation boards 112, and heat sinks 111 are installed on heat insulation boards 112, adjacent to said heat sinks 111 A cooling air duct is formed between them, the cooling wind driving device 12 is connected to the heat sink 111, the heat pipe unit 14 includes a heat pipe 141 and a base plate 142, the base plate 142 is arranged on the heat insulation board 112, the heat pipe 141 has a heat pipe evaporation part 1411 and a heat pipe condensation part 1412, The heat pipe evaporator 1411 is embedded in the substrate 142, and its tube wall is flush with the surface of the substrate 142, so that the contact area with the hot end of the semiconductor cooling chip 2 is as large as possible, and the contact surface of the substrate 142 and the hot end of the semiconductor cooling chip 2 is coated with There is thermal conductive silicone grease to reduce the thermal resistance between the heat dissipation module 1 and the hot end of the semiconductor cooling chip 2. The heat pipe evaporating part 1411 is located in the middle of the heat pipe 141, and the heat pipe condensing part 1412 is located at both ends of the heat pipe 141. The heat pipe condensing part 1412 is partially bent by the heat pipe 141 Bypass the heat shield 112, insert it into the heat sink 111, and use the heat pipe heat dissipation principle to improve the heat dissipation effect on the hot end of the semiconductor refrigeration chip 2; referring to Figures 4-6, when water cooling is used for heat dissipation, the end surface of the heat sink 11 is provided with a A plurality of cooling fins 111, cooling air passages are formed between adjacent cooling fins 111; the liquid pipe connected to the cooling water tank 15 repeatedly bends through the cooling fins 111 for many times, and the liquid pipe is also connected to the cooling water pump 16 are connected, the liquid pipe, the cooling water pump 16 and the cooling water tank 15 form a closed circulating liquid circuit, the cooling water pump 16 promotes the thermal convection movement of the circulating water in the circulating liquid circuit, improves the heat absorption effect and utilization rate of the circulating water, and then Improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration chip 2, wherein the cooling water tank 15 is provided with a first water channel 153 and a second water channel 154 that are independent of each other, and the first water channel 153 is connected with a first water inlet 156 and a first water channel that communicate with each other. The water outlet 157, the second water channel 154 is connected with the second water inlet 158 and the second water outlet 159 that communicate with each other, and a reversing valve is connected between the first water channel 153 and the second water channel 154, and the reversing valve can make the first water channel 153 and the second water channel 154 are switched between two liquid connection modes, such as series mode and parallel mode, to achieve different heat dissipation effects. Use the principle and characteristics of the semiconductor refrigeration chip 2 to carry out liquid refrigeration; the hot end and the cold end of the semiconductor refrigeration chip 2 are connected to the heat dissipation module 1 and the liquid cooling heat exchange unit 3 respectively, and the heat dissipation module 1 adopts multiple heat dissipation methods to cool the semiconductor refrigeration chip. 2. The heat is dissipated at the hot end to prevent the semiconductor refrigeration chip 2 from being scrapped due to the high temperature of the hot end; the liquid-cooled heat exchange unit 3 is integrated with a heat exchange fin 31, a shell 32, and a pumping device 33, so that the liquid-cooled heat exchange unit module Miniaturization and miniaturization, suitable for various drinking equipment, and the liquid cooling heat exchange unit 3 is connected with the storage container 4 to form a closed-loop circulating liquid path 5, and the liquid movement track formed by the circulating liquid path 5 can guide the thermal convective movement of the liquid, and Local turbulence can be formed at the local position of the liquid movement track, and the local turbulence can strengthen the heat convection movement of the liquid, make the liquid fully mixed, and promote heat exchange. Generally, the upper part of the liquid in the container due to the natural heat convection movement has a higher temperature and the lower part The temperature is low, and the structural characteristics of the utility model make the liquid that has been cooled be continuously input into the upper part of the storage container 4, and at the same time, the liquid is continuously extracted from the lower part of the storage container 4 for cooling, so that the upper part of the storage container 4 is continuously Fill in the latest cooled liquid, the lower part is continuously pumped out of the previously cooled liquid, artificially forming a forced convection movement different from natural heat convection, and the pumping device 33 can make the liquid circulate in the circulating liquid circuit in a controlled manner , to strengthen the thermal ^convection movement of the liquid, and convert the natural convection heat transfer mode of the liquid into a forced convection heat transfer mode. The heat transfer coefficient is: 1000～15000W/(m ² ·℃), the cooling efficiency is significantly improved, not only makes the cooling fast, but also makes the liquid temperature uniform, bringing users a better experience.

The circulating liquid refrigeration system of the utility model can be pasted with thermal insulation materials, such as plastic foam, on the outer surface to reduce the heat exchange between the circulating liquid refrigeration system and the outside during the refrigeration process, so that the refrigeration efficiency and effect are better.

The embodiment of the refrigeration equipment of the present utility model can have the circulating liquid refrigeration system described in any one of the above-mentioned embodiments; that is, all the technical solutions of the above-mentioned embodiments of the circulating liquid refrigeration system have been adopted, so at least the above-mentioned circulating liquid refrigeration system embodiment All the beneficial effects brought by the technical solution will not be repeated here.

The circulating liquid refrigeration system in some embodiments of the present invention can be applied to various refrigeration equipment that needs to cool down the liquid, such as a water dispenser, or a fruit juice dispenser or beverage dispenser.

Referring to Fig. 1-Fig. 7, the working process of some embodiments of the circulating liquid refrigeration system of the present invention is described.

The circulating liquid refrigeration system of the utility model utilizes the principle and characteristics of semiconductor chip refrigeration to carry out liquid circulation refrigeration; the cold end of the semiconductor refrigeration chip 2 is in contact with the chip contact area 311 on the heat exchange sheet 31 of the liquid cooling heat exchange unit 3, and the semiconductor chip The hot end of the cooling chip 2 is connected to the heat dissipation module 1; wherein, there are at least three ways to dissipate heat to the hot end of the semiconductor cooling chip 2; Contact connection, when the semiconductor cooling chip 2 is connected to the direct current, the hot end of the semiconductor cooling chip 2 will continuously transfer heat to the heat sink 11, and the temperature of the heat sink 111 will also continue to rise, and the cooling wind drive device 12 will continue to flow to the heat sink. 11 blowing cooling air, and the cooling air flows along the cooling air path formed by the cooling fins 111, the heat-absorbing liquid mist spreading device 13 sprays the liquid mist on the cooling fins 111, and the liquid mist will take away the heat on the cooling fins 111 when it is vaporized by heat temperature, the cooling wind driving device 12 can promote the process of vaporization of the liquid mist when it is heated, and the addition of the heat-absorbing liquid mist spreading device 13 and the cooling wind driving device 12 can achieve the effect that one plus one is greater than two, so that the heat of the semiconductor refrigeration chip 2 The heat energy generated at the terminal is conducted faster and more efficient, thereby increasing the heat dissipation efficiency of the semiconductor cooling chip 2; two, the hot end of the semiconductor cooling chip 2 is in contact with the heat pipe evaporation part 1411 of the heat pipe 141 of the heat pipe unit 14 of the heat dissipation module 1 connection, when the semiconductor cooling chip 2 is connected to direct current, the hot end of the semiconductor cooling chip 2 continuously transfers heat to the heat pipe evaporator 1411, the working liquid in the capillary in the heat pipe 141 quickly evaporates, and the steam is released by the heat pipe under a small pressure difference. The evaporating part 1411 flows to the heat pipe condensing part 1412, and the cooling air drive device 12 continuously blows cooling air to the heat sink 11. The cooling air flows along the cooling air duct formed by the heat sink 111, and then cools the heat pipe condensing part 1412, and flows to the heat pipe for condensation. The vapor at the position of part 1412 releases heat and condenses into liquid again, and the liquid flows back to the heat pipe evaporating part 1411 along the capillary by capillary force, so that the cycle is endless, and the heat of the hot end of the semiconductor refrigeration chip 2 is quickly transferred to the heat sink 11, and then Under the action of the cooling wind driving device 12, the heat is continuously transferred from the heat sink 11 to the outside air, so that the heat energy generated by the hot end of the semiconductor cooling chip 2 is conducted faster and more efficiently, so that the semiconductor cooling chip 2 Three, the hot end of the semiconductor refrigeration chip 2 is in contact with the bottom end surface of the body 151 of the cooling water tank 15 of the water-cooled radiator 1, and when the semiconductor refrigeration chip 2 is connected to direct current, the heat of the hot end of the semiconductor refrigeration chip 2 is constantly The cooling water tank 15 is transferred to the cooling element 11, and the cooling air driving device 12 continuously blows cooling air to the cooling element 11. The cooling air flows along the cooling air channel formed by the cooling fins 111. The heat is transferred from the heat sink 11 to the outside air, so that the heat generated by the hot end of the semiconductor cooling chip 2 can be conducted faster and more efficiently. Thereby, the heat dissipation efficiency of the semiconductor refrigeration chip 2 is increased, wherein, the cooling water tank 15, the liquid pipe and the cooling water pump 16 form a closed circulation liquid path, which cyclically dissipates heat to the hot end of the semiconductor refrigeration chip 2, and the liquid pipe repeatedly Bending through the cooling fins 111 increases the path of the cooling liquid flow and improves the heat dissipation effect. In particular, a plurality of staggered partitions 155 are arranged inside the first water channel 153 and the second water channel 154. The partitions 155 It can make the liquid generate local turbulent flow at the local position of the movement track, promote the heat convection movement of the circulating liquid in the cooling water tank 15, improve the heat absorption effect and utilization rate of the circulating liquid, and then improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration chip 2; The cold end of the semiconductor refrigeration chip 2 will constantly absorb heat from the chip contact area 311 of the heat exchange sheet 31, and conduct the heat to the hot end of the semiconductor refrigeration chip 2, and the liquid in the storage container 4 flows out from the storage container outlet 42, and Flowing into the heat exchange chamber 321 from the heat exchanger inlet 35 of the liquid-cooled heat exchange unit 3 is first intercepted by the inlet baffle 37, so that the liquid movement trajectory forms a local turbulent flow, and the heat exchange flow from the heat exchanger inlet 35 can also be made The liquid in the cavity 321 is dispersed to make the liquid contact with the spoiler fins 312 more fully and improve the cooling capacity. The inflowing liquid contacts with the spoiler fins 312 to form another local turbulent flow, and the liquid fully conducts heat exchange. The temperature of the liquid is lowered to improve the heat exchange efficiency. The liquid flows into the base 323 in the chamber 322 of the pumping device through the liquid flow hole 324, and then, under the action of the pumping device 33, it accelerates from the outlet of the heat exchanger connected to each other. 36 and the storage container inlet 41 flow back to the storage container 4, because there is a height difference between the storage container inlet 41 and the storage container outlet 42, the liquid flowing back into the storage container 4 will impact the liquid level in the storage container 4 to form a local turbulent flow; Among them, the storage container 4 is connected with the liquid-cooled heat exchange unit 3 to form a closed-loop circulating liquid path 5. The liquid movement track formed by the circulating liquid path 5 can guide the thermal convective movement of the liquid, and can form local turbulence at the local position of the liquid movement track. Flow, local turbulent flow can strengthen the heat convection movement of the liquid, make the liquid fully mixed, and promote heat exchange. Generally, the liquid in the container naturally has a high temperature in the upper part and a lower temperature in the lower part due to the natural heat convection movement. The structural characteristics of the utility model make it possible to The cooled liquid is continuously input into the upper part of the storage container 4, and the liquid is continuously extracted from the lower part of the storage container 4 for cooling, and the cycle is like this, so that the upper part of the storage container 4 is constantly filled with the latest cooled liquid, and the lower part is constantly being cooled. The liquid that was cooled before being drawn out artificially forms a forced convection movement different from natural heat convection. The pumping device 33 can make the liquid flow in a controlled circulation in the circulating liquid path, strengthen the heat convection movement of the liquid, and transfer the liquid The natural convection heat transfer method is transformed into the forced convection heat transfer method, in which the heat transfer coefficient of the natural convection method is: 200～1000W/(m ² °C), and the heat transfer coefficient of the forced convection method is: 1000～15000W/(m ² °C), refrigeration efficiency Significantly improved, not only makes cooling fast, but also makes the liquid temperature uniform, bringing users a better experience.

In the circulating liquid refrigeration system of the present invention, the heat dissipation end can be simply deformed, and at least two heat dissipation modules 1 are used, and semiconductor refrigeration chips 2 are arranged correspondingly, so that the refrigeration efficiency can be further improved.

The preferred implementation of the present utility model has been described in detail above in conjunction with the accompanying drawings, however, the present utility model is not limited thereto. Within the scope of the technical concept of the utility model, various simple modifications can be made to the technical solution of the utility model. In order to avoid unnecessary repetition, the utility model will not further explain various possible combinations. However, these simple modifications and combinations should also be regarded as the content disclosed by the utility model, and all belong to the protection scope of the utility model.

Claims (13)

1. A circulating liquid refrigeration system is characterized in that it comprises a cooling module (1) connected in sequence with a semiconductor refrigeration chip (2) hot end, a semiconductor refrigeration chip (2), and a cooling module with the semiconductor refrigeration chip (2). A liquid-cooled heat exchange unit (3) and a storage container (4) in contact with each other; the liquid-cooled heat exchange unit (3) includes an integrated heat exchange fin (31), a housing (32), a pumping device ( 33) and the front shell (34), the storage container (4) is connected with the liquid-cooled heat exchange unit (3) to form a closed-loop circulating liquid circuit (5). 2. The circulating liquid refrigeration system according to claim 1, characterized in that, the liquid movement track formed by the circulating liquid path (5) is suitable for guiding the thermal convective movement of the liquid, and the liquid is suitable for moving in the liquid movement track Local turbulence is formed locally. 3. The circulating liquid refrigeration system according to claim 2, characterized in that, the heat dissipation module (1) comprises a heat dissipation element (11) and a cooling wind driving device (12) for cooling the heat dissipation element (11) A plurality of cooling fins (111) are provided on one side of the cooling element (11), and the cooling fins (111) are connected to the cooling wind driving device (12) and adjacent to the cooling fins (111) A cooling air path is formed between them; a heat-absorbing liquid mist spreading device (13) suitable for spraying liquid mist vaporized after absorbing heat is arranged on the cooling air path. 4. The circulating liquid refrigeration system according to claim 2, characterized in that, the heat dissipation module (1) comprises a heat pipe unit (14), a heat dissipation element (11) and a heat dissipation element (11) connected in sequence ) cooled cooling wind driving device (12); the heat sink (11) includes a plurality of heat sinks (111) and heat shields (112), and a cooling air duct is formed between adjacent heat sinks (111), The cooling wind driving device (12) is connected to the cooling fin (111). 5. The circulating liquid refrigeration system according to claim 4, characterized in that, the heat pipe unit (14) comprises a heat pipe (141) and a substrate (142), and the heat pipe (141) has a heat pipe evaporator (1411) and The heat pipe condensing part (1412), the heat pipe evaporating part (1411) is embedded in the substrate (142), and its tube wall is flush with the surface of the substrate (142), suitable for being connected with the semiconductor refrigeration chip (2) The hot ends are in contact; both ends of the heat pipe (141) are partially bent so that the heat pipe condensation part (1412) is inserted into the heat sink (111). 6. The circulating liquid refrigeration system according to claim 2, characterized in that, the heat dissipation module (1) comprises a cooling water tank (15), a cooling water pump (16), a radiator (11) and a cooling water tank (11) connected in sequence The cooling wind driving device (12) cooled by the heat sink (11); the cooling water tank (15) includes a body (151) and a cover plate (152), and the body (151) is provided with a plurality of first installations The cover plate (152) is provided with a plurality of second mounting holes, and the body (151) is connected to the cover plate (152) through the first mounting holes and the second mounting holes. 7. The circulating liquid refrigeration system according to claim 6, characterized in that, the inside of the body (151) is provided with a first water channel (153) and a second water channel (154) which are independent of each other, and the first water channel ( 153) and the second water channel (154) are all provided with staggered partitions (155), and the first water channel (153) and the second water channel (154) are connected by a reversing valve so as to be able to operate in series mode and The fluid circuit for switching between parallel modes, the first water channel (153) is connected with the first water inlet (156) and the first water outlet (157) which communicate with each other, and the second water channel (154) is connected with the first water channel (154) which communicates with each other The second water inlet (158) and the second water outlet (159). 8. The circulating liquid refrigeration system according to claim 7, characterized in that, a plurality of cooling fins (111) are provided on one end surface of the cooling element (11), and a plurality of cooling fins (111) are formed between adjacent cooling fins (111). Cooling air passage; the liquid pipe connected to the cooling water tank (15) repeatedly bends through the heat sink (111) multiple times, and communicates with the cooling water pump (16). The liquid pipe, cooling water pump ( 16) and the cooling water tank (15) form a closed fluid circuit. 9. The circulating liquid refrigeration system according to claim 2, characterized in that, one side of the housing (32) is provided with a heat exchange chamber (321), and the other side of the housing (32) is provided with The pumping device accommodation chamber (322), the upper and lower parts of the housing (32) are also respectively provided with a heat exchanger inlet (35) and a heat exchanger outlet (36) that communicate with each other, and the heat exchanger inlet (35 ) communicates with the heat exchange cavity (321), the pumping device housing cavity (322) is provided with a base (323) for installing the pumping device (33), and the heat exchanger outlet (36 ) communicates with the base (323); one side of the heat exchange sheet (31) is provided with a chip contact area (311), and the other side of the heat exchange sheet (31) is provided with a plurality of Locally turbulent spoiler fins (312), the heat exchange fins (31) are sealed and fixed to the housing (32), and the spoiler fins (312) extend into the heat exchange chamber ( 321); the front shell (34) cover is mounted on the pumping device accommodating cavity (322); the chip contact area (311) is connected to the cold end surface of the semiconductor refrigeration chip (2). 10. The circulating liquid refrigeration system according to claim 9, characterized in that, the heat exchange chamber (321) communicates with the pumping device accommodation chamber (322) through a liquid flow hole (324), and the liquid flow hole ( 324) located inside said base (323). 11. The circulating liquid refrigeration system according to claim 10, characterized in that, an inlet baffle (37) is provided in the heat exchange chamber (321) close to the inlet (35) of the heat exchanger. 12. The circulating liquid refrigeration system according to any one of claims 2 to 11, characterized in that, the upper and lower parts of the storage container (4) are respectively provided with a storage container inlet (41) and a storage container outlet connected to each other (42), the local turbulent flow is formed by the impact of liquid generated by the height difference between the storage container inlet (41) and the storage container outlet (42). 13. A refrigerating device, characterized by comprising the circulating liquid refrigerating system according to any one of claims 1 to 12.