CN100567855C - Refrigerating plant - Google Patents
Refrigerating plant Download PDFInfo
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- CN100567855C CN100567855C CNB2005100446935A CN200510044693A CN100567855C CN 100567855 C CN100567855 C CN 100567855C CN B2005100446935 A CNB2005100446935 A CN B2005100446935A CN 200510044693 A CN200510044693 A CN 200510044693A CN 100567855 C CN100567855 C CN 100567855C
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- storage box
- liquid storage
- radiating tube
- hot junction
- semiconductor refrigerating
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- 239000007788 liquid Substances 0.000 claims abstract description 132
- 239000004065 semiconductor Substances 0.000 claims abstract description 76
- 239000002826 coolant Substances 0.000 claims abstract description 41
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000005484 gravity Effects 0.000 abstract description 26
- 238000001816 cooling Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000005855 radiation Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 230000008016 vaporization Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000002309 gasification Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000009834 vaporization Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002510 pyrogen Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides a kind of refrigerating plant, comprise the semiconductor refrigerating element, the semiconductor refrigerating element comprises hot junction and cold junction, the hot junction of described semiconductor refrigerating element is provided with radiator, described radiator comprises the liquid storage box of fitting with semiconductor refrigerating element hot junction, described liquid storage box is communicated with radiating tube, fills cooling medium in described liquid storage box and the described radiating tube.The part wall of the liquid storage box of fitting with semiconductor refrigerating element hot junction is not recessed to liquid storage box inside; It is trapezoidal that described liquid storage box partly is; Fit in the hot junction of the small end face of described liquid storage box trapezoidal portions and semiconductor refrigerating element; The side direction liquid storage box inside that described liquid storage box is relative with trapezoidal small end face is recessed; Described liquid storage box upper back is provided with the box portion that protrudes in liquid storage box; Described radiating tube is many groups, is communicated with described liquid storage box separately respectively.In this refrigerating plant, gravity assisted heat pipe type heat spreader structures is reasonable, radiating tube radiating efficiency height, refrigerating plant refrigerating efficiency height.
Description
Technical field
The present invention relates to a kind of refrigerating plant, be specifically related to a kind of refrigerating plant that is provided with gravity assisted heat pipe type radiator.
Background technology
Semiconductor refrigerating technology possesses that volume is small and exquisite, pollution-free, noiselessness, characteristic of simple structure, therefore applicable to multiple occasion.The principle of semiconductor refrigerating technology is to produce heat absorption and exothermic phenomenon by the potential variation that electronics and hole take place in power circuit, is that the semiconductor refrigerating assembly produces cold junction and hot junction, and then realizes the function of refrigeration and pyrogenicity.The semiconductor refrigerating element will improve the refrigerating capacity of refrigeration end under thermal equilibrium state, a main link is to improve the radiating efficiency in hot junction, reduces the heat accumulation in hot junction, lowers the temperature difference at two ends to greatest extent, to obtain the more cold of cold junction.The radiating mode in semiconductor refrigerating assembly hot junction adopts mental-finned to add the fan forced heat radiation usually the earliest, or interior circulation nature water-cooled and outer circulation Forced water cooling etc., but above-mentioned radiating efficiency is lower, descends thereby lead the system refrigerating efficiency.For improving the radiating efficiency of radiator for semiconductor, Chinese patent CN2124438 discloses a kind of semiconductor gravity assisted heat pipe radiator, can be used for the heat radiation of semiconductor air conditioner and semi-conductor electricity refrigerator.It comprises gravity assisted heat pipe and energy transmission sheet, and characteristics are that the gravity assisted heat pipe top is hemispherical or circular arc, and acceleration pump is housed in the pipe, and parallel fin and flange are housed outside the pipe, and the pipe end connects the semiconductor cold-hot heap.The technical scheme that above-mentioned patent provides can make the radiating efficiency in semiconductor refrigerating element hot junction obtain certain raising, but the efficient of cooling medium absorption heat is still relatively low in the cooling system, radiating efficiency is received restriction to a certain degree, the refrigerating function of semiconductor refrigerating assembly does not become to give full play to, and has caused the waste of energy.
Summary of the invention
The invention provides a kind of refrigerating plant, this refrigerating plant is provided with gravity assisted heat pipe type radiator, and the radiating rate of gravity assisted heat pipe type radiator is fast in this refrigerating plant, the radiating efficiency height.
The present invention further provides a kind of refrigerating plant, this refrigerating plant is provided with gravity assisted heat pipe type radiator, and this radiator can improve the refrigerating efficiency of refrigerating plant, and the energy that the semiconductor refrigerating element is produced is fully used.
For realizing foregoing invention purpose of the present invention, the present invention has adopted following technical proposals.
The invention discloses a kind of refrigerating plant, comprise the semiconductor refrigerating element, the semiconductor refrigerating element comprises hot junction and cold junction, the hot junction of described semiconductor refrigerating element is provided with radiator, described radiator comprises the liquid storage box of fitting with semiconductor refrigerating element hot junction, described liquid storage box is communicated with radiating tube, fills cooling medium in described liquid storage box and the described radiating tube.
In the technique scheme, fit in the hot junction of liquid storage box and semiconductor refrigerating element, cooling medium in the liquid storage box absorbs the heat and the vaporization of semiconductor refrigerating element, enter radiating tube afterwards, cooling medium in the radiating tube is undertaken being re-condensed into liquid is back to absorption semiconductor refrigerating element hot junction in the liquid storage box under the gravity effect heat after the heat exchange by tube wall and air, and it is cooled off.At the hot junction of semiconductor refrigerating element applying liquid storage box, liquid storage box can hold relatively large refrigerant, refrigerant is by the hot junction transmission of heat by contact of liquid storage box wall and semiconductor refrigerating element, absorb the heat in the hot junction of semiconductor refrigerating element, and the heat of this absorption enters in the radiating tube by carrying out the heat exchange cooling than large tracts of land and air by the refrigerant after vaporizing, therefore radiating rate is fast, and radiating efficiency improves.
Further the structure of preferred liquid storage box is: the part wall of the liquid storage box of fitting with semiconductor refrigerating element hot junction is not recessed to liquid storage box inside.
Adopt in the radiator structure of liquid storage box and semiconductor refrigerating element hot junction applying, because the hot junction of semiconductor cooling device and the surface area of cold junction have certain limitation, therefore the binding face to the liquid storage box of fitting with the hot junction has certain requirement, and in the entire heat dissipation system, be liquid storage box with the whole circulation system that is communicated with of radiating tube in, owing to will realize the mutual conversion of liquids and gases, should keep certain gas compartment in the circulatory system, have only and regulate the suitable of the gentle body space of liquid, just can reach the preferably coupling that gas and liquid transform, and then reach better radiating efficiency.And in the radiating mode of the above-mentioned semiconductor refrigerating element that passes through liquid storage box and radiating tube, be the pressure coupling in the realization heat circulating system and the applying in liquid storage box and semiconductor refrigerating element hot junction, the liquid level of the liquid in the liquid storage box is relatively low, be that cooling medium contacts little with the surface area in semiconductor refrigerating element hot junction in the liquid storage box, therefore the abundant heat of absorption refrigeration element hot junction generation of cooling medium, radiating efficiency is low, thereby has reduced the refrigerating efficiency of semiconductor element.Among the present invention, on the basis of above-mentioned liquid storage box, change the structure of above-mentioned liquid storage box, make not the part wall of the liquid storage box of fitting recessed to liquid storage box inside with semiconductor refrigerating element hot junction, therefore improved the liquid level of the cooling medium that contacts with semiconductor refrigerating element hot junction relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium caloric receptivity increases and has improved radiating efficiency, make that under the same conditions hot-side temperature reduces relatively, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
For simplifying the liquid storage box structure, convenience is processed and in refrigerator liquid storage box is fixed, described liquid storage box part in echelon, the applying of the hot junction of the small end face of described liquid storage box trapezoidal portions and semiconductor refrigerating element, the side direction liquid storage box inside that described liquid storage box is relative with trapezoidal small end face is recessed.
For adjust liquid storage box and the applying in semiconductor refrigerating element hot junction and in heat dissipation circulating system the coupling of pressure, the setting of described trapezoidal liquid storage box upper back protrudes in the box portion of liquid storage box.
In the gravity assisted heat pipe type radiator, heat mainly contacts the heat that cooling medium in the heat pipe is absorbed by radiating tube and is discharged in the surrounding air with air, and then the gas cooling medium in the radiating tube is converted into liquid is back in the liquid storage box, reuptake the heat that semiconductor refrigerating element hot junction produces, for improving the radiating efficiency of radiating tube, described radiating tube is a coil pipe, and described coil pipe is obliquely installed.
Radiating tube becomes coil pipe, can increase the area of dissipation of radiating tube in limited area.The coil pipe of radiating tube is arranged on same plane usually, therefore coil pipe is obliquely installed, can make coil pipe mutual dislocation in the vertical, the heat that the heat that the bottom coil pipe discharges can or not reduce bottom coil pipe rising touches the coil pipe on top, so can improve the radiating efficiency of coil pipe.
Cooling medium in the liquid storage box has absorbed behind the heat in semiconductor refrigerating element hot junction and with after the gasification of partially liq cooling medium, fast more rising enters radiating tube and then circulates fast more, radiating efficiency is high more, and the raising circulation rate, cooled liquid medium is back in the liquid storage box fast more, can improve radiating efficiency equally, so adopt described radiating tube among the present invention, be communicated with described liquid storage box separately respectively for many groups.And organize radiating tube more and can increase heat transfer area, reduce the temperature of withdrawing fluid.
And on liquid storage box, connect a plurality of radiating tubes for further being convenient to, connect by fin or wing bar between described radiator.
Radiating tube can be lowered the temperature to cooling medium after the port of export enters radiating tube immediately, therefore if the radiating tube port of export touches cooled radiating tube, can be to cooled radiating tube release heat, reduce the radiating efficiency of radiating tube, contact cooled radiating tube for preventing that a plurality of radiating tube ports of export from drawing along different directions, the port of export of described radiating tube is along being provided with in the same way side by side.
For ease of the setting of radiating tube, described radiating tube is a coil pipe, and described coil pipe is bent into the U type.Because the semiconductor refrigerating element is generally less refrigerating plant refrigeration, for reducing the occupied area of plane of coil pipe, coil pipe can be bent into the U type.
Be similarly in limited area more large-area radiating tube be set, improve radiating efficiency, described radiating tube side by side or front and back be provided with.
The endless form of the closed circuit that cooling medium forms between liquid storage box and radiating tube is: cooling medium absorbs behind the heat that semiconductor refrigerating element hot junction produces vaporization and rises to the upper space of liquid storage box and enter in the radiating tube in liquid storage box, in radiating tube, the heat that absorbs and surrounding air carried out cooling off after the heat exchange and convert liquid again to, under the gravity effect, cooled liquid enters liquid storage box through the inlet of radiating tube, therefore enter liquid storage box for ease of the cooling medium after the liquefaction and prevent that the liquid cooling medium of backflow stops that the cooling medium of the back vaporization of being heated rises, the entrance point of described radiating tube is communicated with the bottom of described liquid storage box.
As mentioned above, rising and enter radiating tube in the cooling medium cooling back in the liquid storage box, therefore enters radiating tube for ease of cooling medium and form heat radiation circulation smoothly, and the port of export of described radiating tube is communicated with the top of described liquid storage box.
Adopt the gravity assisted heat pipe radiating principle among the present invention, carry out the gas-liquid conversion between cooling medium, the cooling medium that converts liquid to flows by gravity back in the liquid storage box, and therefore for cooling medium is refluxed smoothly, the pipeline of described radiating tube coils along top-down incline direction.
And be the radiating efficiency that further improves gravity assisted heat pipe type radiator, radiating fin or wing bar are set on the described radiating tube.
Gravity assisted heat pipe type radiator is refrigerator, air-conditioning or refrigerator etc. applicable to various refrigerating plants as refrigerating plant among the present invention.
Among the present invention, the radiating mode that has adopted liquid storage box to combine with radiating tube, radiator structure with respect to the conventional semiconductor cooling module, radiating efficiency is significantly improved, and further the liquid storage box structure is improved, make not the part wall of the liquid storage box of fitting recessed to liquid storage box inside with semiconductor refrigerating element hot junction, improved the liquid level of the cooling medium that contacts with semiconductor refrigerating element hot junction relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium heat absorption efficiency improves, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
And coil pipe is obliquely installed; The radiating tube pipeline coils along top-down incline direction; Described radiating tube is many groups, is communicated with described liquid storage box separately respectively, all can improve radiating tube radiating efficiency in the radiator, has improved the refrigerating efficiency of semiconductor refrigerating element equally.
Description of drawings
Fig. 1 is the liquid storage box specific embodiment structure side view that is provided with the refrigerating plant of gravity assisted heat pipe type radiator.
Fig. 2 be among Fig. 1 A-A to cutaway view.
Fig. 3 is the right view of Fig. 1 liquid storage box.
Fig. 4 is the vertical view of Fig. 1 liquid storage box.
Fig. 5 is the gravity heat pipe radiator specific embodiment 1 a structure front view.
Fig. 6 is a radiator deployed configuration schematic diagram among Fig. 5.
Fig. 7 is the structure front view of the concrete embodiment 2 of radiator
Fig. 8 is the vertical view of Fig. 7.
Fig. 9 is provided with the refrigerator of gravity assisted heat pipe type radiator or the structural representation of refrigerator-freezer.
Figure 10 be among Fig. 9 B-B to cutaway view.
The specific embodiment
As Fig. 9, a kind of refrigerator or ice box 6 that is provided with gravity assisted heat pipe type radiator shown in Figure 10, this refrigerator or ice box are single body structure, structure for explanation semiconductor refrigerating element and gravity assisted heat pipe type radiator, refrigerator or refrigerator-freezer can adopt other versions, for saying something conveniently, saved the door body of refrigerator or refrigerator-freezer in the diagram among Fig. 9, Figure 10;
Refrigerator or refrigerator-freezer 6 include casing 61, perforate 7 on the rear wall 62 of casing 61, the inside of hole 7 corresponding refrigerator bodies is provided with semiconductor refrigerating element 4, the side of semiconductor refrigerating element 4 towards the refrigerator body inboard is cold junction, and the side towards the refrigerator body outside is the hot junction, be fitted with the liquid storage box 1 of gravity assisted heat pipe type heat abstractor in the hot junction of semiconductor refrigerating element, liquid storage box 1 is fixed in the perforate 7, is provided with sealing insulation material 8 between hole 7 and the liquid storage box 1.
As Fig. 5, Fig. 7, gravity assisted heat pipe type radiator shown in Figure 8, the liquid storage box 1 that this radiator comprises and fit in semiconductor refrigerating element hot junction, liquid storage box 1 is communicated with radiating tube 2, filling cooling medium 3 in liquid storage box 1 and the radiating tube 2.
As Fig. 1, Fig. 2, Fig. 3, Fig. 4, shown in Figure 10, the front portion 31 of liquid storage box 3 in echelon, the small end face of liquid storage box trapezoidal portions 32 is fitted with the hot junction of semiconductor refrigerating element 4, the rear wall 33 that liquid storage box is relative with trapezoidal small end face is recessed to liquid storage box inside.Certainly, liquid storage box 1 can be made into simple box body, and this box body directly is connected with radiating tube, can realize improving the function of radiating efficiency equally, and this box body can be arranged to trapezoidal.The rear wall 33 that liquid storage box is relative with trapezoidal small end face is recessed to liquid storage box inside, with respect to simple liquid storage box box body, can improve the height of cooling medium liquid level in the liquid storage box, the contact-making surface knot in cooling medium and semiconductor hot junction further improves the radiating efficiency to the semiconductor hot junction in the increase liquid storage box.
The upper back of trapezoidal liquid storage box part is provided with the box portion 34 that protrudes in liquid storage box.
As Fig. 5, Fig. 6, Fig. 7, shown in Figure 8, radiating tube 2 is a coil pipe;
As shown in Figure 9, coil pipe 2 is divided into two parts 21 and 22, coil pipe 21 parts vertically are provided with, and coil pipe 22 parts are obliquely installed, coil portions 22 is obliquely installed, can make coil pipe mutual dislocation in the vertical, reduce or the heat of avoiding the bottom coil pipe to rise touches the coil pipe on top, therefore can improve the radiating efficiency of coil pipe.
The port of export 23 of radiating tube is communicated with the box portion 34 that give prominence on the top of liquid storage box.
The entrance point 24 of radiating tube is communicated with the bottom of liquid storage box 1.
After carrying out the gas-liquid conversion between cooling medium, reflux smoothly for the cooling medium that converts liquid to is flowed by gravity back in the liquid storage box, the pipeline 25 of coil pipe 2 coils along top-down incline direction.
The heat gasification back circulation that cooling medium in the liquid storage box 1 has absorbed semiconductor refrigerating element hot junction is fast more, and radiating efficiency is high more, so the radiating tube 2 that adopts among the present invention is two groups, is communicated with liquid storage box 1 separately respectively.
And be the radiating efficiency that further improves radiating tube, heat radiation wing bar 5 is set on the radiating tube 2.
As Fig. 7, shown in Figure 8,2 fens front and back of two groups of gravity-type radiating tube coil pipes are communicated with liquid storage box 1, and when radiating tube divided two groups to be provided with, for ease of interfixing between radiating tube and installing, 2 in coil pipe passed through wing bar 5 and connects.
Radiating tube can be lowered the temperature to cooling medium after the port of export 23 enters coil pipe 2 immediately, therefore if the coil pipe port of export touches cooled coil pipe, can be to cooled coil pipe release heat, reduce the radiating efficiency of coil pipe, contact cooled coil pipe for preventing that a plurality of coil pipe ports of export from drawing along different directions, as shown in Figure 7, the port of export 23 of radiating tube is along being provided with in the same way side by side.
As Fig. 5, shown in Figure 6, when being communicated with liquid storage box 1 respectively side by side about two coil pipes divide, for ease of the setting of coil pipe, coil pipe is bent into the U type by pipeline 26 places.
In the above-mentioned specific embodiment, cooling medium 3 in the endless form of the closed circuit of liquid storage box 1 and 2 formation of radiating tube is: cooling medium 3 absorbs behind the heat that semiconductor refrigerating element 4 hot junctions produce gasification and rises to the upper space of liquid storage box and enter in the radiating tube 2 in liquid storage box, in radiating tube 2, the heat that absorbs and surrounding air carried out cooling off after the heat exchange and convert liquid again to, under the gravity effect, cooled liquid enters liquid storage box 1 through the inlet of radiating tube, and circulation is the hot junction cooling of semiconductor refrigerating element so repeatedly.
In the above-mentioned specific embodiment, by the rear wall of liquid storage box is recessed to the inside of liquid storage box 1, improved the liquid level that cooling medium contacts with semiconductor refrigerating element hot junction in the liquid storage box relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium heat absorption efficiency improves, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
And radiating tube 2 is provided with two groups, be communicated with described liquid storage box separately respectively; Coil pipe 2 is obliquely installed; Coil pipe pipeline 25 coils along top-down incline direction, all can improve radiating tube radiating efficiency in the radiator, has improved the refrigerating efficiency of semiconductor refrigerating element equally.
Among the present invention, be readily appreciated that, this gravity assisted heat pipe type radiator is applicable to the heat radiation of various semiconductor refrigerating elements, as long as gravity assisted heat pipe type radiator is fitted to the hot junction of semiconductor refrigerating element, all can realize improving the function of radiating efficiency, the refrigerating efficiency of corresponding raising semiconductor refrigerating element.
Claims (10)
1, a kind of refrigerating plant, comprise the semiconductor refrigerating element, the semiconductor refrigerating element comprises hot junction and cold junction, the hot junction of described semiconductor refrigerating element is provided with heat abstractor, described heat abstractor comprises the liquid storage box of fitting with semiconductor refrigerating element hot junction, described liquid storage box is communicated with radiating tube, fills cooling medium in described liquid storage box and the described radiating tube, and the part wall of the liquid storage box of fitting with semiconductor refrigerating element hot junction is not recessed to liquid storage box inside.
2, refrigerating plant according to claim 1, it is characterized in that, described liquid storage box part in echelon, the applying of the hot junction of the small end face of described liquid storage box trapezoidal portions and semiconductor refrigerating element, the side direction liquid storage box inside that described liquid storage box is relative with trapezoidal small end face is recessed.
3, refrigerating plant according to claim 1 is characterized in that, described liquid storage box upper back is provided with the box portion that protrudes in liquid storage box.
4, refrigerating plant according to claim 1 is characterized in that, described radiating tube is a coil pipe, and described coil pipe is obliquely installed.
5, refrigerating plant according to claim 1 is characterized in that, described radiating tube is many groups, is communicated with described liquid storage box separately respectively.
6, refrigerating plant according to claim 5 is characterized in that, connects by fin or wing bar between described radiating tube.
7, refrigerating plant according to claim 5 is characterized in that, the port of export of described radiating tube is along being provided with in the same way side by side.
8, refrigerating plant according to claim 5 is characterized in that, described radiating tube side by side or front and back be provided with.
9, refrigerating plant according to claim 5 is characterized in that, described radiating tube is a coil pipe, and described coil pipe is bent into the U type.
According to the described refrigerating plant of the arbitrary claim of claim 1 to 9, it is characterized in that 10, described refrigerating plant is refrigerator, air-conditioning or refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100446935A CN100567855C (en) | 2005-09-10 | 2005-09-10 | Refrigerating plant |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100446935A CN100567855C (en) | 2005-09-10 | 2005-09-10 | Refrigerating plant |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1928464A CN1928464A (en) | 2007-03-14 |
| CN100567855C true CN100567855C (en) | 2009-12-09 |
Family
ID=37858535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100446935A Active CN100567855C (en) | 2005-09-10 | 2005-09-10 | Refrigerating plant |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100567855C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329868B (en) * | 2014-03-28 | 2017-01-18 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
| CN104329829B (en) * | 2014-03-28 | 2017-04-26 | 海尔集团公司 | Semiconductor refrigeration refrigerator and hot-end heat exchange device thereof |
| CN104329866B (en) * | 2014-03-28 | 2017-02-15 | 海尔集团公司 | Semiconductor refrigeration refrigerator and cold end heat exchange device thereof |
| CN105431005A (en) * | 2015-11-19 | 2016-03-23 | 南车株洲电力机车研究所有限公司 | Heat exchange apparatus |
| CN106969533A (en) * | 2017-05-25 | 2017-07-21 | 珠海格力电器股份有限公司 | Semiconductor refrigerating box and its heat abstractor |
-
2005
- 2005-09-10 CN CNB2005100446935A patent/CN100567855C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1928464A (en) | 2007-03-14 |
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Effective date of registration: 20091120 Address after: Haier Industrial Park, 1 Haier Road, Shandong, Qingdao Province, China: 266101 Co-patentee after: Haier Medical and Laboratory Products Co., Ltd. Patentee after: haier group corporation Address before: Haier Industrial Park, 1 Haier Road, Shandong, Qingdao Province, China: 266101 Co-patentee before: Qingdao Haier Science and Technology Co., Ltd. Patentee before: haier group corporation |
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Address after: 266101 Haier Industrial Park, 1 Haier Road, Shandong, Qingdao Co-patentee after: Qingdao Haier Bio Medical Limited by Share Ltd Patentee after: haier group corporation Address before: 266101 Haier Industrial Park, 1 Haier Road, Shandong, Qingdao Co-patentee before: Haier Medical and Laboratory Products Co., Ltd. Patentee before: haier group corporation |
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Effective date of registration: 20190122 Address after: 266555 Haier Industrial Park, Qingdao Economic Development Zone, Shandong Province Patentee after: Qingdao Haier Bio Medical Limited by Share Ltd Address before: 266101 Haier Industrial Park, 1 Haier Road, Shandong, Qingdao Co-patentee before: Qingdao Haier Bio Medical Limited by Share Ltd Patentee before: haier group corporation |