CN201266038Y - Comprehensive heat pipe heat collector for semiconductor heat pump water heater - Google Patents
Comprehensive heat pipe heat collector for semiconductor heat pump water heater Download PDFInfo
- Publication number
- CN201266038Y CN201266038Y CNU200820042141XU CN200820042141U CN201266038Y CN 201266038 Y CN201266038 Y CN 201266038Y CN U200820042141X U CNU200820042141X U CN U200820042141XU CN 200820042141 U CN200820042141 U CN 200820042141U CN 201266038 Y CN201266038 Y CN 201266038Y
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- China
- Prior art keywords
- heat
- heat pipe
- radiator
- cold
- semiconductor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 230000005494 condensation Effects 0.000 claims abstract description 15
- 238000009833 condensation Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000005213 imbibition Methods 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 7
- 230000008020 evaporation Effects 0.000 abstract description 2
- 238000001704 evaporation Methods 0.000 abstract description 2
- 239000012530 fluid Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 235000012149 noodles Nutrition 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model discloses a synthesize heat pipe heat collector for semiconductor heat pump water heater. The heat pipe cold storage device comprises a condensation section copper plate (1), heat pipes (2), a radiator (5), a cold storage box (11) and a semiconductor refrigeration piece (12), and is characterized in that branch circuits of the cold storage box (11) and/or the radiator (5) are connected with the heat pipes (2) as branch circuits of the heat pipes (2). The upper and lower end openings of the condensation section copper plate (1) are respectively connected with the two ends of the heat pipe (2) to form a loop heat pipe. One branch of the evaporation section is connected with a cold storage tank (11), and a cold storage tank valve (3) is arranged in front of the cold storage tank; the other branch is connected with a radiator (5), and a radiator valve (4) is arranged in front of the radiator. The utility model discloses simple structure is compact, and is small, and moving part is few, and vibrations are little, and is small in noise, and is longe-lived, and coefficient of heat conductivity is high. Furthermore, the utility model discloses can conveniently utilize cold volume, can redistribute refrigeration places such as refrigerator or air conditioner after leading-in cold-storage device with cold volume.
Description
Technical field
The utility model relates to a kind of integrated thermal heat collector that is used for the semiconductor heat pump water heater, is a kind of heat pipe heat collector that makes full use of the cold that the semiconductor chilling plate heat-obtaining produced.
Background technology
Semiconductor refrigerating technology utilizes the significant peltier effect of semi-conductor electricity couple to realize freezing, it has that volume is little, in light weight, the temperature difference is big, efficient is high, characteristics such as reliable easy to use, nuisanceless, durable, now is widely used in the smaller place of refrigerating capacity.
The semiconductor heat pump water heater utilizes the characteristic of semiconductor refrigerating to add hot water from external world's absorption heat, and the electric energy that is consumed simultaneously also is converted into heat energy and is used to add hot water, and its usefulness coefficient is greater than 1, with respect to the efficient high characteristics of the electric water heater of routine; In addition, the semiconductor heat pump water heater does not have moving component unlike the compression type heat pump water heater, friction, long service life.
Heat pipe is known one of the most effective heat transfer element, and it can transmit a large amount of heats at a distance by very little sectional area and need not additionaling power.Heat pipe is to rely on the hydraulic fluid phase transformation of self inside to realize the heat transfer element that conducts heat, and has high-termal conductivity, an advantage such as good isothermal, heat flow density is variable, direction of heat flow is reversible, environmental suitability is strong.
The semiconductor refrigeration heat converter that once occurred, its heat collector heat exchange body is provided with the fluid circulation passage, and semiconductor is built in the heat exchange body.The cold that cooling piece produces is derived by the hydraulic fluid in the circulation channel, and hydraulic fluid carries out forced circulation by circulating pump and flows.There is following shortcoming in this heat exchanger: semiconductor directly contacts with heat-conducting work medium, thereby needs to handle the sealing problem of semiconductor and heat exchange body junction, occurs leakage phenomenon easily; Heat-conducting work medium comes forced flow by circulating pump, has consumed extra electric energy, and the heat exchanger whole efficiency is reduced, and simultaneously the complexity of heat exchanger is increased greatly; Heat and cold can not long-distance transmissions.
In addition, if directly come heat-obtaining with metal fin, the cold that semiconductor chilling plate produced just can not obtain utilizing, thereby has reduced rate of energy, and the overall efficiency of equipment has been reduced; If wanting increases the size that heat transfer intensity just must increase the quantity of fin or increase fin, so not only increased material cost, the efficient of fin (fin efficiency) has also reduced, and does not reach desirable effect.
Summary of the invention
The utility model provides a kind of structure simple more compact, but cold long-distance transmissions and easily distribution, the integrated thermal heat collector that heat transfer efficiency is higher.Simultaneously, the cold that is produced when making full use of the thermoelectric heat pump heat-obtaining is used for cold the refrigeration of refrigerator refrigeration or domestic air conditioning.
The novel purpose of this use can reach by following measure:
A kind of integrated thermal heat collector that is used for the semiconductor heat pump water heater, comprise condensation segment copper coin 1, heat pipe 2, radiator 5, cold-accumulating box 11 and semiconductor chilling plate 12, it is characterized in that cold-accumulating box 11 branch roads and/or radiator 5 branch roads link to each other with heat pipe 2 as the branch road of heat pipe 2.
Described cold-accumulating box valve 3 is opened, and radiator valve 4 is closed, and cold-accumulating box 11 branch roads link to each other with heat pipe 2 as the branch road of heat pipe 2.
Described cold-accumulating box valve 3 is closed, and radiator valve 4 is opened, and radiator 5 branch roads link to each other with heat pipe 2 as the branch road of heat pipe 2.
Described cold-accumulating box valve 3 is opened, and radiator valve 4 is opened, and radiator 5 branch roads and cold-accumulating box 11 branch roads while are as the branch road of heat pipe 2.
The prepared cold of the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate 12 is used for the refrigeration of refrigerator refrigeration or domestic air conditioning.
Install radiating fin 7 on the radiator heat pipe evaporator section 6 of described radiator 5 additional and realize heat convection.
Described radiator 5 carries out forced-convection heat transfer by radiator fan 8.
Described radiator 5 is by heat transfer free convection; Simultaneously, increase the bifurcated quantity of radiator heat pipe evaporator section 6, to increase heat exchange area.
Working medium in the described heat pipe 2 is water or freon.
Described heat pipe 2 is the heat pipe of separate heat pipe, gravity type heat pipe or band imbibition core.
Advantage of the present utility model:
1, simple and compact for structure, volume is little, is convenient to install;
2, moving component is few, shakes for a short time, and noise is little, and the life-span is long;
But the multipurpose utilization is convenient in 3, cold long-distance transmissions and distribution;
4, the structurally variable of heat pipe has improved the flexibility and the compactedness of the integral layout of product;
5, have only semiconductor chilling plate and cooling fan to need the input of electric energy, do not have additional source of energy consumption, energy savings and operating cost are low.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the utility model technical schematic diagram, indicates being described as follows of parts among the figure:
1, condensation segment copper coin, 2, heat pipe, 3, the cold-accumulating box valve, 4, radiator valve, 5, radiator, 6, radiator heat pipe evaporator section, 7, radiating fin, 8, radiator fan, 9, cold-accumulating box heat pipe evaporator section, 10, agent for storage of coldness, 11, cold-accumulating box, 12, semiconductor chilling plate, 13, semiconductor heat pump water heater miscellaneous part.
The specific embodiment
A kind of integrated thermal heat collector that is used for the semiconductor heat pump water heater, heat pipe 2 is connected with semiconductor chilling plate 12 by condensation segment copper coin 1.Condensation segment copper coin 1 bonds together with heat conductive silica gel with the hot side of semiconductor chilling plate 12, and four jiaos of condensation segment copper coin 1 are provided with four through holes, by being bolted to a side of water heater, between the gap seal with glue; Condensation segment copper coin 1 makes the certain cavity volume of its inner formation by boring, so as working medium and semiconductor chilling plate 12 abundant heat exchange, the condensation segment of formation heat pipe.The both ends open up and down of condensation segment copper coin 1 is connected with the two ends of heat pipe 2 respectively, constitutes loop heat pipe.A branch road of evaporator section is connected with cold-accumulating box 11, and cold-accumulating box valve 3 is installed before the cold-accumulating box 11, whether enters cold-accumulating box 11 in order to working medium in the control heat pipe 2; Another branch road is connected with radiator 5, before the radiator radiator valve 4 is installed also, is used for controlling whether working medium enters radiator 5 in the heat pipe 2.Install radiating fin 7 on the radiator heat pipe evaporator section 6 additional and realize heat convection, radiator 5 also can carry out forced-convection heat transfer by radiator fan 8.
The loop quantity of heat pipe 2 determines that by the load of semiconductor heat pump water heater the form of heat pipe also can be made corresponding variation according to different job requirements, can be the heat pipe of separate heat pipe, gravity type heat pipe or band imbibition core etc.
The variable principle of cryogenic energy utilization end form of the present utility model, cold utilizes after entering cold-accumulating box 11 again, as is used for refrigerator and air conditioner refrigerating, and this all is by the decision of the heat-transfer character of heat pipe 2.
The utility model moves in the following manner: the cold that the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 12 produces passes to by heat conductive silica gel and condensation segment copper coin 1 in the working medium of heat pipe 2 and makes the working substance steam condensation, and condensed working medium enters heat pipe 2 downwards.When cold-accumulating box valve 3 is opened and radiator valve 4 when closing, liquid refrigerant enters the heat that the cold-accumulating box heat pipe evaporator sections 9 in the cold-accumulating box 11 absorb the agent for storage of coldness 10 in the cold-accumulating box 11 and evaporates; Close and radiator valve 4 when opening when cold-accumulating box valve 3, the heat that liquid refrigerant enters in radiator heat pipe evaporator section 6 absorbing environmentals evaporates.The working substance steam that liquid refrigerant evaporation back forms converges gets back to condensation segment copper coin 1 condensation again, so periodic duty.Semiconductor heat pump water heater miscellaneous part 13 is connected with semiconductor chilling plate 12.
Two heat pipe circuit in the utility model can reasonably be allocated by suitable control system as not working simultaneously because of pressure is different, make the utilization of cold reach optimum state.
The heat pipe 2 that the utility model now adopts is separate heat pipes, and when heat pipe form in the structure changed, as adopting the single heat pipe of band imbibition core, its concrete structure also will be done corresponding variation.
Above-mentioned variation and corresponding adjustment thereof all fall within the protection domain of the present utility model.
Claims (8)
1, a kind of integrated thermal heat collector that is used for the semiconductor heat pump water heater, comprise condensation segment copper coin (1), heat pipe (2), radiator (5), cold-accumulating box (11) and semiconductor chilling plate (12), it is characterized in that cold-accumulating box (11) branch road and/or radiator (5) branch road link to each other with heat pipe (2) as the branch road of heat pipe (2).
2, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1 is characterized in that described cold-accumulating box valve (3) unlatching, and radiator valve (4) is closed, and cold-accumulating box (11) branch road links to each other with heat pipe (2) as the branch road of heat pipe (2).
3, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1 is characterized in that described cold-accumulating box valve (3) closes, and radiator valve (4) is opened, and radiator (5) branch road links to each other with heat pipe (2) as the branch road of heat pipe (2).
4, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1, it is characterized in that described cold-accumulating box valve (3) unlatching, radiator valve (4) is opened, and radiator (5) branch road and cold-accumulating box (11) branch road while are as the branch road of heat pipe (2).
5, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1 is characterized in that installing additional on the radiator heat pipe evaporator section (6) of described radiator (5) radiating fin (7) and realizes heat convection.
6, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 5 is characterized in that described radiator (5) carries out forced-convection heat transfer by radiator fan (8).
7, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1 is characterized in that the working medium in the described heat pipe (2) is water or freon.
8, the integrated thermal heat collector that is used for the semiconductor heat pump water heater according to claim 1 is characterized in that the heat pipe of described heat pipe (2) for separate heat pipe, gravity type heat pipe or band imbibition core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820042141XU CN201266038Y (en) | 2008-08-11 | 2008-08-11 | Comprehensive heat pipe heat collector for semiconductor heat pump water heater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU200820042141XU CN201266038Y (en) | 2008-08-11 | 2008-08-11 | Comprehensive heat pipe heat collector for semiconductor heat pump water heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201266038Y true CN201266038Y (en) | 2009-07-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU200820042141XU Expired - Fee Related CN201266038Y (en) | 2008-08-11 | 2008-08-11 | Comprehensive heat pipe heat collector for semiconductor heat pump water heater |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201266038Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313473A (en) * | 2011-07-06 | 2012-01-11 | 罗勰 | Middle and low temperature combined circulation based on Brown circulation |
| CN102721177A (en) * | 2012-07-06 | 2012-10-10 | 苟仲武 | Hot air source semiconductor heat pump heater and method for utilizing heater to perform heating |
| CN105650937A (en) * | 2015-12-30 | 2016-06-08 | 长沙理工大学 | Semiconductor heat pipe refrigerating system and refrigerating method thereof |
| CN109944678A (en) * | 2019-03-12 | 2019-06-28 | 杭州富阳春江汽车空调厂 | A kind of radiating subassembly of novel vehicle radiator |
| CN110806328A (en) * | 2019-11-21 | 2020-02-18 | 青岛大学 | Desktop type self-supply water heat exchanger performance testing device |
-
2008
- 2008-08-11 CN CNU200820042141XU patent/CN201266038Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313473A (en) * | 2011-07-06 | 2012-01-11 | 罗勰 | Middle and low temperature combined circulation based on Brown circulation |
| CN102721177A (en) * | 2012-07-06 | 2012-10-10 | 苟仲武 | Hot air source semiconductor heat pump heater and method for utilizing heater to perform heating |
| CN105650937A (en) * | 2015-12-30 | 2016-06-08 | 长沙理工大学 | Semiconductor heat pipe refrigerating system and refrigerating method thereof |
| CN105650937B (en) * | 2015-12-30 | 2017-11-07 | 长沙理工大学 | A kind of semiconductor and hot tube refrigeration system and its refrigerating method |
| CN109944678A (en) * | 2019-03-12 | 2019-06-28 | 杭州富阳春江汽车空调厂 | A kind of radiating subassembly of novel vehicle radiator |
| CN109944678B (en) * | 2019-03-12 | 2020-06-19 | 温州市骐邦环保科技有限公司 | Novel radiator's radiator unit |
| CN110806328A (en) * | 2019-11-21 | 2020-02-18 | 青岛大学 | Desktop type self-supply water heat exchanger performance testing device |
| CN110806328B (en) * | 2019-11-21 | 2021-04-20 | 青岛大学 | Desktop type self-supply water heat exchanger performance testing device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20110811 |