CN105650937A - Semiconductor heat pipe refrigerating system and refrigerating method thereof - Google Patents

Semiconductor heat pipe refrigerating system and refrigerating method thereof Download PDF

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Publication number
CN105650937A
CN105650937A CN201610012556.1A CN201610012556A CN105650937A CN 105650937 A CN105650937 A CN 105650937A CN 201610012556 A CN201610012556 A CN 201610012556A CN 105650937 A CN105650937 A CN 105650937A
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heat exchanger
heat pipe
semiconductor
heat
evaporation ends
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CN105650937B (en
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孙小琴
张宏亮
杨艳佳
黄亮
司慧伟
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Changsha University of Science and Technology
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Changsha University of Science and Technology
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24HEATING; RANGES; VENTILATING
    • F24FAIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0042Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect

Abstract

The invention discloses a semiconductor heat pipe refrigerating system and a refrigerating method of the semiconductor heat pipe refrigerating system. The semiconductor heat pipe refrigerating system comprises a first heat pipe system, a second heat pipe system, a semiconductor refrigerating system, a controller and a temperature sensor. The semiconductor heat pipe refrigerating system is controlled to be switched in through switching, so that the semiconductor heat pipe refrigerating system is controlled to be in different working conditions, energy can be saved to the maximum degree, and the semiconductor heat pipe refrigerating system is easy to operate and efficient, and energy is saved.

Description

A kind of semiconductor and hot tube refrigeration system and refrigerating method thereof
Technical field
The invention belongs to air conditioner technology field, relate to a kind of semiconductor and hot tube refrigeration system and refrigerating method thereof.
Background technology
Along with the growing growth of information network industry, communications industry energy consumption problem progressively highlights. This industry has become global the fifth-largest power consumption industry at present, and CO2 emission accounts for whole world discharge 2.5%; Especially now communication mobile system is upgraded to the 4G stage from 3G, the third season in 2014, averaging network connection speed in the whole world was 4.5Mbps, network signal data transmission is more, faster, global information total amount is often crossed and is doubled for 2 years, 2011 annual data transmission total amounts are 1.8 trillion GB, 35,000,000,000,000 GB, the establishment of big data and generation will be risen to this numerical value of the year two thousand twenty and become inevitable. Discharging substantial amounts of heat while data signal transmission in machine room, for ensureing the properly functioning of communication quality and electronic equipment, energy consumption for cooling sharply rises.
At present, the temperature that the air conditioning system that machine room is conventional realizes in electronic equipment by controlling the ambient temperature of machine room controls, but the ambient temperature that different electronic equipments runs requires inconsistent, for ensureing the stable safe operation of all electronic equipments, the integrated environment temperature often setting machine room meets the minimum operating temperature requirement of electronic equipment, and namely machine room design temperature is lower than the operating ambient temperature requirement of major part electronic equipment. As: in machine room, the operating ambient temperature of accumulator is 15-25 DEG C, for ensureing the normal operation of accumulator, it is desirable to machine room environment temperature is lower than 25 DEG C; So general telecommunication transmission equipment operating temperature can be increased to 35 DEG C, and whole building environment temperature causes the waste of substantial amounts of cold when being set in 25 DEG C.
Refrigeration modes conventional at present meets the requirement of machine room integrated environment temperature, cause substantial amounts of energy dissipation, therefore, it is necessary that designing a kind of small semiconductor heat-pipe refrigerating system realizes the partial temperature control of accumulator, improve the set overall temperature in machine room, realize the zone temperature in machine room to control, reduce the energy consumption for cooling in machine room. But, traditional compressor cooling air-conditioning adopts alternating current to drive, it is impossible to directly utilize the electricity of accumulator, need to develop the small refrigeration systems that a kind of available DC source drives.
Therefore, it is necessary to a kind of semiconductor and hot tube refrigeration system of design and refrigerating method thereof.
Controller is the control circuit connected into by discrete analog device or digital device, it is also possible to be integrated controller, such as single-chip microcomputer, DSP or PLC etc.
Summary of the invention
The technical problem to be solved is to provide a kind of semiconductor and hot tube refrigeration system and refrigerating method thereof, and this semiconductor and hot tube refrigeration system and refrigerating method thereof utilize natural cold quantity to realize the partial temperature control in machine room, it is easy to implement, energy-conservation reliably.
The technical solution of invention is as follows:
A kind of semiconductor and hot tube refrigeration system, including the first hot-pipe system, the second hot-pipe system, semiconductor refrigeration system, controller and temperature sensor;
First hot-pipe system includes the first heat pipe evaporation ends heat exchanger (1), evaporation fan (2), the first condensation end of heat pipe heat exchanger (3); Evaporation fan is arranged on the first heat pipe evaporation ends heat exchanger place;
Second hot-pipe system includes the second heat pipe evaporation ends heat exchanger (6), the second condensation end of heat pipe heat exchanger (4), condensation fan (5); Condensation fan is arranged on the second condensation end of heat pipe heat exchanger place;
Semiconductor refrigeration system includes semiconductor cooling end (7), P-type semiconductor element, N-type semiconductor element, quasiconductor hot junction (8); [operation principle of semiconductor refrigeration system illustrates: when N-type semiconductor element and P-type semiconductor element are linked to be galvanic couple pair, connects DC current in circuit, and the transfer of energy occurs. When the sense of current is by N to P, semi-conducting material temperature reduces, and absorbs heat from the external world, becomes cold end; When the sense of current is by P to N, semi-conducting material temperature raises, and outwardly discharges heat, becomes hot junction. ] the first condensation end of heat pipe heat exchanger is connected with semiconductor cooling end, the second heat pipe evaporation ends heat exchanger is connected with semiconductor and hot tube;
Semiconductor and hot tube refrigeration system also includes 4 three-way valve: the first valve (9), the second valve (10), the 3rd valve (11) and the 4th valve (12);
Three ports of three valves (11) connect the first port of the port of export of the second condensation end of heat pipe heat exchanger, the arrival end of the second heat pipe evaporation ends heat exchanger and the 4th valve respectively;
Second port of the 4th valve (12) and the 3rd port connect the port of export of the first condensation end of heat pipe heat exchanger and the arrival end of the first heat pipe evaporation ends heat exchanger respectively;
Three ports of the second valve (10) connect the first port of the arrival end of the second condensation end of heat pipe heat exchanger, the port of export of the second heat pipe evaporation ends heat exchanger and the first valve (9) respectively;
Second port of the first valve (9) and the 3rd port connect the arrival end of the first condensation end of heat pipe heat exchanger and the port of export of the first heat pipe evaporation ends heat exchanger respectively;
Temperature sensor is for detecting the ambient temperature of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger; Temperature sensor is connected with controller; 4 three-way valve are controlled by controller. [three-way valve can also replace by one-way valve]
Evaporation ends heat exchanger and condensation end heat exchanger adopt copper pipe aluminum fin structure or concurrent flow MCA.
P-type semiconductor element and N-type semiconductor element are positioned between semiconductor cooling end (7) and quasiconductor hot junction (8).
Described evaporation fan, condensation fan are axial flow blower, perfusion blower fan or centrifugal blower. For promoting the heat exchange between air and corresponding heat exchanger.
When the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1; Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve;First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange; First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
Preferably, T is 10 DEG C.
A kind of semiconductor and hot tube refrigerating method, adopt aforesaid semiconductor and hot tube refrigeration system, it is characterized in that, when the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1; Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve; First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in this refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange; First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
Preferably, T is 10 DEG C.
Temperature sensor is internally positioned and in external environment condition, for the temperature detection of inside and outside environment;
When the operating condition that the inside and outside temperature gap recorded meets heat pipe unit requires, directly utilize outdoor cold air and drive the first heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) to run;
When the operating condition that the inside and outside temperature gap recorded is unsatisfactory for heat pipe unit requires, semiconductor refrigeration system starts, change valve passage and realize the first heat pipe evaporation ends and the connection of the first condensation end of heat pipe, second heat pipe evaporation ends and the second condensation end of heat pipe connect, the cold end of semiconductor refrigeration system takes away the heat of the first condensation end of heat pipe, second heat pipe evaporation ends takes away the heat in semiconductor refrigeration system hot junction, so that the circumstance of temperature difference of heat pipe evaporation ends and condensation end meets the operating condition requirement of heat pipe unit, it is ensured that the refrigeration of heat pipe.
Under the default conditions of small semiconductor heat-pipe refrigerating system [time initial, or time properly functioning], controller is by the on-off control to the first valve, the second valve, the 3rd valve and the 4th valve so that the first heat pipe evaporation ends and the second condensation end of heat pipe are connected.
The position [such as accumulator place in machine room] being arranged in machine room by native system to need emphasis to freeze, the local temperature controlling this place reaches the temperature requirement of this position, and all the other positions are by existing common mode refrigeration, thus reaching energy-conservation purpose.
Three-way valve can also replace by the valve group being made up of multiple check valves.
Patent of the present invention can realize the highly effective refrigeration cooling in machine room local space in annual scope, conventional refrigeration entirety is overcome to control the determination of building environment temperature, improve the environment set temperature in machine room, it is to avoid substantial amounts of cold is wasted, reduce the energy consumption of refrigeration system.The work operating mode of patent of the present invention is divided into two kinds of operating modes to run, respectively heat-pipe refrigerating operating mode and heat pipe+semiconductor refrigerating operating mode.
Heat-pipe refrigerating operating mode: winter and transition season, external air temperature is relatively low, the temperature of heat pipe evaporation ends and condensation end is detected through internal temperature sensor and external temperature sensor, when the temperature difference of heat pipe evaporation ends and condensation end meets the numerical value required for hot-pipe system runs, hot-pipe system is directly driven to run, now directly connecting the first heat pipe evaporation ends and the second condensation end of heat pipe, evaporation fan and condensation fan to start, semiconductor refrigeration system does not run.
Heat pipe+semiconductor refrigerating operating mode: when outdoor high temperature in summer or when ambient temperature is higher, the temperature difference of the first heat pipe evaporation ends and the second condensation end of heat pipe cannot meet the operation of heat pipe operating mode, open semiconductor refrigeration system, semiconductor cooling end takes away the heat of the first condensation end of heat pipe, second heat pipe evaporation ends takes away the heat in quasiconductor hot junction simultaneously, realize the temperature gap of the first heat pipe evaporation ends and the first condensation end of heat pipe, it is ensured that the operation of hot-pipe system.
Patent of the present invention adopts energy-efficient heat-pipe refrigerating system to realize the partial temperature control in machine room, improves the set overall temperature in machine room, reduces the energy consumption for cooling of air conditioning system. When ambient temperature is relatively low, has available cold, directly utilize heat-pipe refrigerating, reduce the operating ambient temperature of accumulator in machine room; When ambient temperature is higher, it is impossible to when meeting the operation of heat pipe operating mode, start semiconductor refrigeration system and reduce the ambient temperature of condensation end of heat pipe, to reach the service condition of heat pipe operating mode, it is achieved the uninterrupted operation of this refrigeration system.
Beneficial effect:
The semiconductor and hot tube refrigeration system of the present invention and refrigerating method thereof, by the operating condition under the switch-mode regulation varying environment of the first valve, the second valve, the 3rd valve and the 4th valve; The present invention utilizes the partial temperature control that outdoor natural cold quantity realizes in machine room, to improve the integrated environment design temperature in machine room, reduces the energy consumption of refrigeration system in machine room; And by the refrigerating efficiency using raising semiconductor refrigeration system flexibly of hot-pipe system. This refrigeration system is in conjunction with heat-pipe refrigerating and semiconductor refrigerating technology, it is achieved the uninterrupted refrigeration in machine room local space.
The present invention is compared with traditional Refrigeration Technique, it is ensured that refrigeration system is continual operation throughout the year, and has significant energy-saving effect, and, the process of switching is automatically obtained, it is not necessary to manual intervention, it is achieved intelligent operation.
The access of the present invention switching control semiconductor and hot tube refrigeration system by inventing, thus controlling semiconductor and hot tube refrigeration system to be in different operating modes, thus realizing energy-conservation to greatest extent, this semiconductor and hot tube refrigeration system is easy to implement, energy-efficient.
Accompanying drawing explanation
Fig. 1 is semiconductor and hot tube refrigeration system theory diagram;
Fig. 2 is semiconductor and hot tube refrigeration system heat pipe operating mode schematic diagram;
Fig. 3 is semiconductor and hot tube refrigeration system heat pipe+quasiconductor operating mode schematic diagram.
Description of reference numerals:
1-the first heat pipe evaporation ends heat exchanger, 2-evaporation fan, 3-the first condensation end of heat pipe heat exchanger, 4-youngster's condensation end of heat pipe heat exchanger, 5-condensation fan, 6-the second heat pipe evaporation ends heat exchanger, 7-semiconductor cooling end, 8-quasiconductor hot junction, 9-the first valve, 10-the second valve, 11-the 3rd valve, 12-the 4th valve.
Detailed description of the invention
Below with reference to the drawings and specific embodiments, the present invention is described in further details:
Embodiment 1:
Such as Fig. 1-3, a kind of semiconductor and hot tube refrigeration system, including the first hot-pipe system, the second hot-pipe system, semiconductor refrigeration system, controller and temperature sensor;
First hot-pipe system includes the first heat pipe evaporation ends heat exchanger (1), evaporation fan (2), the first condensation end of heat pipe heat exchanger (3); Evaporation fan is arranged on the first heat pipe evaporation ends heat exchanger place;
Second hot-pipe system includes the second heat pipe evaporation ends heat exchanger (6), the second condensation end of heat pipe heat exchanger (4), condensation fan (5); Condensation fan is arranged on the second condensation end of heat pipe heat exchanger place;
Semiconductor refrigeration system includes semiconductor cooling end (7), P-type semiconductor element, N-type semiconductor element, quasiconductor hot junction (8);
First condensation end of heat pipe heat exchanger is connected with semiconductor cooling end, and the second heat pipe evaporation ends heat exchanger is connected with semiconductor and hot tube;
Semiconductor and hot tube refrigeration system also includes 4 three-way valve: the first valve (9), the second valve (10), the 3rd valve (11) and the 4th valve (12);
Three ports of three valves (11) connect the first port of the port of export of the second condensation end of heat pipe heat exchanger, the arrival end of the second heat pipe evaporation ends heat exchanger and the 4th valve respectively;
Second port of the 4th valve (12) and the 3rd port connect the port of export of the first condensation end of heat pipe heat exchanger and the arrival end of the first heat pipe evaporation ends heat exchanger respectively;
Three ports of the second valve (10) connect the first port of the arrival end of the second condensation end of heat pipe heat exchanger, the port of export of the second heat pipe evaporation ends heat exchanger and the first valve (9) respectively;
Second port of the first valve (9) and the 3rd port connect the arrival end of the first condensation end of heat pipe heat exchanger and the port of export of the first heat pipe evaporation ends heat exchanger respectively;
Temperature sensor is for detecting the ambient temperature of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger; Temperature sensor is connected with controller; 4 three-way valve are controlled by controller. [three-way valve can also replace by multiple one-way valve]
Evaporation ends heat exchanger and condensation end heat exchanger adopt copper pipe aluminum fin structure or concurrent flow MCA.
P-type semiconductor element and N-type semiconductor element are positioned between semiconductor cooling end (7) and quasiconductor hot junction (8).
Described evaporation fan, condensation fan are axial flow blower, perfusion blower fan or centrifugal blower. For promoting the heat exchange between air and corresponding heat exchanger.
When the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1; Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve; First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange; First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
Preferably, T is 10 DEG C.
A kind of semiconductor and hot tube refrigerating method, adopt aforesaid semiconductor and hot tube refrigeration system, it is characterized in that, when the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1;Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve; First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in this refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange; First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
Preferably, T is 10 DEG C.
Controller controls the switch of valve according to the inside and outside ambient temperature that temperature sensor records: when the operating condition that the inside and outside temperature gap recorded meets heat pipe unit requires, directly utilizes outdoor cold air and drives the first heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) to run, when the operating condition that the inside and outside temperature gap recorded is unsatisfactory for heat pipe unit requires, semiconductor refrigeration system starts, change valve passage and realize the first heat pipe evaporation ends heat exchanger and the connection of the first condensation end of heat pipe heat exchanger, second heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger connect, the cold end of semiconductor refrigeration system takes away the heat of the first condensation end of heat pipe heat exchanger, second heat pipe evaporation ends takes away the heat of semiconductor refrigeration system hot end heat exchanger, so that the circumstance of temperature difference of heat pipe evaporation ends heat exchanger and condensation end heat exchanger meets the operating condition requirement of heat pipe unit, ensure the refrigeration of heat pipe, the operating condition of heat pipe unit requires that the ambient temperature differences referring to heat pipe evaporation ends heat exchanger and condensation end of heat pipe heat exchanger is more than 10 DEG C, under the default conditions of small semiconductor heat-pipe refrigerating system [time initial, or time properly functioning], controller is by the on-off control to the first valve, the second valve, the 3rd valve and the 4th valve so that the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger are connected.

Claims (7)

1. a semiconductor and hot tube refrigeration system, it is characterised in that include the first hot-pipe system, the second hot-pipe system, semiconductor refrigeration system, controller and temperature sensor;
First hot-pipe system includes the first heat pipe evaporation ends heat exchanger (1), evaporation fan (2), the first condensation end of heat pipe heat exchanger (3); Evaporation fan is arranged on the first heat pipe evaporation ends heat exchanger place;
Second hot-pipe system includes the second heat pipe evaporation ends heat exchanger (6), the second condensation end of heat pipe heat exchanger (4), condensation fan (5); Condensation fan is arranged on the second condensation end of heat pipe heat exchanger place;
Semiconductor refrigeration system includes semiconductor cooling end (7), P-type semiconductor element, N-type semiconductor element, quasiconductor hot junction (8);
First condensation end of heat pipe heat exchanger is connected with semiconductor cooling end, and the second heat pipe evaporation ends heat exchanger is connected with semiconductor and hot tube;
Semiconductor and hot tube refrigeration system also includes 4 three-way valve: the first valve (9), the second valve (10), the 3rd valve (11) and the 4th valve (12);
Three ports of three valves (11) connect the first port of the port of export of the second condensation end of heat pipe heat exchanger, the arrival end of the second heat pipe evaporation ends heat exchanger and the 4th valve respectively;
Second port of the 4th valve (12) and the 3rd port connect the port of export of the first condensation end of heat pipe heat exchanger and the arrival end of the first heat pipe evaporation ends heat exchanger respectively;
Three ports of the second valve (10) connect the first port of the arrival end of the second condensation end of heat pipe heat exchanger, the port of export of the second heat pipe evaporation ends heat exchanger and the first valve (9) respectively;
Second port of the first valve (9) and the 3rd port connect the arrival end of the first condensation end of heat pipe heat exchanger and the port of export of the first heat pipe evaporation ends heat exchanger respectively;
Temperature sensor is for detecting the ambient temperature of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger;
Temperature sensor is connected with controller; 4 three-way valve are controlled by controller.
2. semiconductor and hot tube refrigeration system according to claim 1, it is characterised in that P-type semiconductor element and N-type semiconductor element are positioned between semiconductor cooling end (7) and quasiconductor hot junction (8).
3. semiconductor and hot tube refrigeration system according to claim 1, it is characterised in that described evaporation fan, condensation fan are axial flow blower, perfusion blower fan or centrifugal blower.
4. the semiconductor and hot tube refrigeration system according to any one of claim 1-3, it is characterized in that, when the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1; Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve; First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange; First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
5. semiconductor and hot tube refrigeration system according to claim 1, it is characterised in that T is 10 DEG C.
6. a semiconductor and hot tube refrigerating method, it is characterized in that, adopt the semiconductor and hot tube refrigeration system that any one of claim 1-3 is stated, it is characterized in that, when the ambient temperature differences of the first heat pipe evaporation ends heat exchanger and the second condensation end of heat pipe heat exchanger is more than T, then controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 1; Otherwise controlled semiconductor and hot tube refrigeration system by controller and be operated in operating mode 2:
(1) operating mode 1:
First heat pipe evaporation ends heat exchanger (1) and the second condensation end of heat pipe heat exchanger (4) are linked to be refrigeration path by 4 three-way valve; First condensation end of heat pipe heat exchanger (3) and the second heat pipe evaporation ends heat exchanger (6) be not in this refrigeration path; Semiconductor refrigeration system does not work;
(2) operating mode 2:
First heat pipe evaporation ends heat exchanger (1) is connected with the first condensation end of heat pipe heat exchanger (3) and forms the first refrigeration path;
Second heat pipe evaporation ends heat exchanger (6) is connected formation the and the path that freezes with the second condensation end of heat pipe heat exchanger (4);
Second heat pipe evaporation ends heat exchanger (6) and quasiconductor hot junction (8) heat exchange;First condensation end of heat pipe heat exchanger (3) and semiconductor cooling end (7) heat exchange;
T be 8-12 DEG C in some value.
7. semiconductor and hot tube refrigerating method according to claim 1, it is characterised in that T is 10 DEG C.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08121899A (en) * 1994-10-26 1996-05-17 Tohoku Electric Power Co Inc Peltier element warm water generator
JP2005156026A (en) * 2003-11-26 2005-06-16 Matsushita Electric Ind Co Ltd Cooling device
CN101140115A (en) * 2006-09-04 2008-03-12 孟瑞 Refrigerate heat-production method and equipment thererof
CN201266038Y (en) * 2008-08-11 2009-07-01 南京工业大学 Integrated heat pipe heating device used for semiconductor heat pump water heater
CN101639300A (en) * 2009-08-21 2010-02-03 徐兴 Semiconductor refrigerator capable of interruptedly supplying power
CN103245125A (en) * 2013-04-28 2013-08-14 华为技术有限公司 Heat conversion device, system and method
CN103453701A (en) * 2013-08-29 2013-12-18 合肥天鹅制冷科技有限公司 Liquid cooler with heat tube function and overcooling function

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08121899A (en) * 1994-10-26 1996-05-17 Tohoku Electric Power Co Inc Peltier element warm water generator
JP2005156026A (en) * 2003-11-26 2005-06-16 Matsushita Electric Ind Co Ltd Cooling device
CN101140115A (en) * 2006-09-04 2008-03-12 孟瑞 Refrigerate heat-production method and equipment thererof
CN201266038Y (en) * 2008-08-11 2009-07-01 南京工业大学 Integrated heat pipe heating device used for semiconductor heat pump water heater
CN101639300A (en) * 2009-08-21 2010-02-03 徐兴 Semiconductor refrigerator capable of interruptedly supplying power
CN103245125A (en) * 2013-04-28 2013-08-14 华为技术有限公司 Heat conversion device, system and method
CN103453701A (en) * 2013-08-29 2013-12-18 合肥天鹅制冷科技有限公司 Liquid cooler with heat tube function and overcooling function

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