CN206890910U - A kind of semiconductor refrigerating and pump coupled heat formula device - Google Patents
A kind of semiconductor refrigerating and pump coupled heat formula device Download PDFInfo
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- CN206890910U CN206890910U CN201720506682.2U CN201720506682U CN206890910U CN 206890910 U CN206890910 U CN 206890910U CN 201720506682 U CN201720506682 U CN 201720506682U CN 206890910 U CN206890910 U CN 206890910U
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- heat
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- bucket
- incubator
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Abstract
The utility model discloses a kind of semiconductor refrigerating and pump coupled heat formula device, including two dc sources, semiconductor cooling device, semiconductor heat pump installation, accumulation of heat bucket, incubator, packaged air conditioner, two blower fans, automatic water-exchanging system and support, described two dc sources are connected with semiconductor cooling device and thermoelectric heat pump device circuit respectively, the packaged air conditioner, semiconductor cooling device, incubator, semiconductor heat pump installation, accumulation of heat bucket in the vertical direction is sequentially connected from the bottom to top, the incubator, packaged air conditioner is provided with air outlet, two blower fans are separately positioned on the incubator, on packaged air conditioner；The automatic water-exchanging system is used for the plumbing according to temperature and liquid automatic control accumulation of heat bucket.The utility model is compact-sized, the coupling of semiconductor refrigerating and heat pump, and fully utilizing semiconductor can freeze the performance of and can heating, meanwhile, the amount of heat that is distributed from refrigerating plant of thermoelectric heat pump recovery, reach good energy-saving effect.
Description
Technical field
Refrigeration, heating and energy-saving thermal storage technology are the utility model is related to, specifically a kind of semiconductor refrigerating and heat
Pump manifold type device.
Background technology
Traditional mechanical refrigeration equipment is complicated, and be also easy to produce vibration and noise, its working medium has contaminative and destruction to environment
Property.Simple in construction, size is small, noise is low, does not need refrigerant, no as emerging refrigeration modes, having for semiconductor refrigerating
Pollute the features such as environment, reliability are high, maintenanceability is good, startup is fast, control is flexible.
Meanwhile semiconductor has higher heating efficiency, thermoelectric heat pump is highly suitable for building energy conservation and Waste Heat Recovery.
Compared with air-air total-heat exchanger, more potential energies in air draft can be reclaimed.With efficiency high under Low Temperature Difference, controllable
Property strong, simple pollution-free, flexible arrangement, it is easy to maintenance the features such as, for reclaim waste heat domestic water etc. have it is very big
Practical significance.
Utility model content
The purpose of this utility model is to design a kind of semiconductor refrigerating and pump coupled heat formula device, comprehensive utilization semiconductor
Freezed, heated, while the amount of heat that thermoelectric heat pump recovery distributes from refrigerating plant, reach good energy-conservation effect
Fruit.
Therefore, the utility model uses following technical scheme：
A kind of semiconductor refrigerating and pump coupled heat formula device, including two dc sources, semiconductor cooling device, semiconductors
Heat pump assembly, accumulation of heat bucket, incubator, packaged air conditioner, two blower fans, automatic water-exchanging system and one are used to support the accumulation of heat water
Bucket support, described two dc sources are connected with semiconductor cooling device and thermoelectric heat pump device circuit respectively, the cold wind
Case, semiconductor cooling device, incubator, semiconductor heat pump installation, accumulation of heat bucket in the vertical direction are sequentially connected from the bottom to top,
The incubator, packaged air conditioner are provided with air outlet, and two blower fans are separately positioned on the incubator, on packaged air conditioner, for promoting
Hot blast and cold wind are discharged from air outlet in inlet；The automatic water-exchanging system is used for according to temperature and liquid automatic control accumulation of heat water
The plumbing of bucket.
Further, if the semiconductor cooling device includes being in same level and cold end dry semiconductor system directed downwardly
If cold, one piece of conducting copper plate, one piece of cool guiding block, dry heat pipe, some fin, the cold end of the semiconductor chilling plate uniformly pastes
Close on cool guiding block, the conducting copper plate and the hot junction of semiconductor chilling plate upper surface are fitted and connected, the heat pipe and fin
It is placed in after composition heat-pipe radiator in incubator and is connected with conducting copper plate.
Further, if the semiconductor heat pump installation includes being in same level and the dry semiconductor of release end of heat upward
If heating elements, two pieces of conducting copper plates, dry heat pipe, some fin, the heat absorbing end and conduction copper of the semiconductor heating element
Plate is fitted and connected, and release end of heat is fitted and connected with another piece of conducting copper plate, and the heat pipe forms two groups of heat-pipe radiators with fin,
Two groups of heat-pipe radiators are respectively placed in accumulation of heat bucket and incubator and are each connected with two pieces of conducting copper plates.
Further, the packaged air conditioner is wrapped in the cold end of semiconductor cooling device, and packaged air conditioner one end is equipped with blower fan, another
End is connected to export the pipe joint of cold wind.
Further, the incubator is wrapped in the heat absorbing end of semiconductor cooling device hot junction and semiconductor heat pump installation,
Space in case is divided into two parts up and down by the incubator built with one piece of dividing plate, and described dividing plate one end, which is provided with, to be made in casing
The breach that lower two parts space is connected, the side of the insulation lower box part away from breach are equipped with blower fan, the insulation upper box part
Ventilating opening is provided with away from breach side.
Further, the accumulation of heat bucket includes small accumulation of heat bucket and big accumulation of heat bucket, and the small accumulation of heat bucket is placed on
On the support and the semiconductor heat pump installation release end of heat is wrapped up, the small accumulation of heat bucket is connected by pipeline and big accumulation of heat bucket
Connect.
Further, the automatic water-exchanging system is connected with the accumulation of heat bucket, including water pump, electric gate valve, it is small-sized after
Electrical equipment, the liquid level sensor and temperature sensor being arranged in the accumulation of heat bucket, for according to the temperature in accumulation of heat bucket and
Water level carries out automatic control of water supply and drainage to accumulation of heat bucket automatically.
Further, the conducting copper plate and accumulation of heat bucket for connecting the release end of heat of the semiconductor heat pump installation are welded, and are turned into
The part at bucket bottom, the conducting copper plate for connecting the heat absorbing end of the semiconductor heat pump installation are embedded in incubator case top, turn into case top
A part；Four walls that the semiconductor chilling plate is extended out downwards by incubator are wrapped up.
Further, described accumulation of heat bucket, incubator, the outer surface of packaged air conditioner are enclosed with insulating.
Further, described insulating uses certain thickness polystyrene material.
The utility model compared with prior art, has advantages below and effect：
1st, this semiconductor refrigerating and pump coupled heat formula device, including semiconductor cooling device, semiconductor heat pump installation, accumulation of heat
Bucket, blower fan, fully utilize semiconductor and freezed, heated, meanwhile, thermoelectric heat pump recovery distributes from refrigerating plant
Amount of heat, reach energy-saving effect.
2nd, this semiconductor refrigerating and pump coupled heat formula device, strong convection radiating is carried out to refrigerating plant hot junction using blower fan,
Refrigerating plant hot and cold side temperature difference is preferably reduced, ensure that refrigerating efficiency, meanwhile, hot blast enters insulation upper box part from breach
Heat transfer is carried out with semiconductor heat pump installation heat absorbing end fin, reduces heat loss.
3rd, this semiconductor refrigerating and pump coupled heat formula device, can be returned by connecting insulation upper box part and other heating equipments
Receive from other local waste heats, energy-saving thermal storage.
4th, this semiconductor refrigerating and pump coupled heat formula device, automatic water-exchanging system can be used to carry out intelligence to device plumbing
Control, reduce course of work labour input.
Brief description of the drawings
Fig. 1 is the semiconductor refrigerating and pump coupled heat device dimensional structure diagram of the utility model embodiment.
Fig. 2 is the principle sketch of the semiconductor refrigerating with pump coupled heat device of the utility model embodiment.
Fig. 3 is the internal structure schematic diagram of the semiconductor refrigerating with pump coupled heat device of the example of the utility model.
Fig. 4 is the semiconductor refrigerating and pump coupled heat device schematic front view of the utility model embodiment.
Fig. 5 is the semiconductor refrigerating and pump coupled heat device schematic rear view of the utility model embodiment.
In figure：1- packaged air conditioners；101- pipe joints；2- semiconductor cooling devices；201- semiconductor chilling plates；202- first
Conducting copper plate；203- cool guiding blocks；The heat pipes of 204- first；The fin of 205- first；3- incubators；301- dividing plates；302- divulges information
Mouthful；303- breach；4- semiconductor heat pump installations；401- semiconductor heating elements；The conducting copper plates of 402- second；The heat of 403- second
Pipe；The fin of 404- second；The conducting copper plates of 405- the 3rd；5- accumulation of heat buckets；The small accumulation of heat buckets of 501-；The big accumulation of heat buckets of 502-；
6- blower fans；The blower fans of 601- first；The blower fans of 602- second；7- supports.
Embodiment
For ease of it will be appreciated by those skilled in the art that below in conjunction with the accompanying drawings and embodiment the utility model is done further in detail
Explanation.
As depicted in figs. 1 and 2, a kind of semiconductor refrigerating and pump coupled heat formula device, including two dc sources, semiconductors
Refrigerating plant 2, semiconductor heat pump installation 4, accumulation of heat bucket 5, incubator 3,1, two blower fan 6 of packaged air conditioner, automatic water-exchanging system and
One is used to supporting the support 7 of the accumulation of heat bucket 5, two dc sources respectively with semiconductor cooling device 2 and semiconductor heat
The circuit of pump installation 4 connects, the packaged air conditioner 1, semiconductor cooling device 2, incubator 3, semiconductor heat pump installation 4, accumulation of heat bucket 5
In the vertical direction is sequentially connected from the bottom to top, and the incubator 3, packaged air conditioner 1 are provided with air outlet, and two blower fans are set respectively
Put on the incubator 3, packaged air conditioner 1, for promoting hot blast and cold wind in case to be discharged from air outlet；The automatic water-exchanging system
For the plumbing according to temperature and liquid automatic control accumulation of heat bucket 5.
Specifically, if the semiconductor cooling device 2 includes being in same level and cold end dry semiconductor directed downwardly
201, one piece first of cooling piece, 201, one pieces of conducting copper plate cool guiding block 203, some first heat pipes 204, some first fin
205, the cold end of the semiconductor chilling plate 201 is uniformly fitted on cool guiding block 203, and first conducting copper plate 201 is with partly leading
The hot junction of the upper surface of body cooling piece 201 is fitted and connected, and is more preferable heat conduction, and binding face is equipped with heat-conducting glue；First heat pipe 204
It is placed in after forming heat-pipe radiator with the first fin 205 in incubator 3 and is connected with the first conducting copper plate 201.
The semiconductor heat pump installation 4 includes being in same level and some semiconductor heating elements of release end of heat upward
401st, the second conducting copper plate 402, the 3rd conducting copper plate 405, some second heat pipes 403, some second fin 404, described half
The heat absorbing end of conductor heating elements 401 is fitted and connected with the 3rd conducting copper plate 405, and release end of heat is bonded with the second conducting copper plate 402
Connection, is more preferable heat conduction, binding face is equipped with heat-conducting glue；Some second heat pipes 403, some second fin 404 form two groups
Heat-pipe radiator, two groups of heat-pipe radiators be respectively placed in accumulation of heat bucket 5 and incubator and each with the second conducting copper plate 402,
3rd conducting copper plate 405 is connected.
The rated power of described two dc sources is 800W, one of dc source and semiconductor cooling device 2
Connection, 9.3V voltages are provided for semiconductor chilling plate 201, each semiconductor chilling plate 201 is sequentially connected；Another dc source with
Semiconductor heat pump installation 4 connects, and provides 8.9V voltages for semiconductor heating element 401, each semiconductor heating element 401 is successively
Connection.Semiconductor chilling plate 201 and the single rated power of semiconductor heating element 401 are 93W.
In the present embodiment, as shown in 3 and Fig. 5, the packaged air conditioner 1 is wrapped in the cold end of semiconductor cooling device 2, packaged air conditioner
1 one end is equipped with the second blower fan 602, and the other end is connected to export the pipe joint 101 of cold wind.When device works, semiconductor system
The cold end of device for cooling 2 absorbs heat, is acted on by the second blower fan 602, discharges cold wind from pipe joint 101, is connected by pipeline,
Cold wind can be led to the space of needs.
The incubator 3 is wrapped in the heat absorbing end of the hot junction of semiconductor cooling device 2 and semiconductor heat pump installation 4, the guarantor
Space in case is divided into two parts up and down by incubator 3 built with one piece of dividing plate 301, and described one end of dividing plate 301, which is provided with, to be made in casing
The breach 303 that upper and lower two parts space is connected, the side of the bottom of incubator 3 away from breach 303 is equipped with the first blower fan
601, the top of incubator 3 is provided with ventilating opening 302 away from the side of breach 303.By setting dividing plate 301 and breach 303, make heat
Wind energy fully carries out heat exchange with the heat absorbing end of semiconductor heat pump installation 4 as far as possible.
When device works, the hot junction of semiconductor cooling device 2 produces amount of heat, and it is strong right to be carried out by the first blower fan 601
Flow heat dissipation cools, while breach 303 enters the top of incubator 3 from the bottom of incubator 3 in the warm case 3 of hot blast, and hot blast is with partly leading
After the heat absorbing end of body heat pump installation 4 carries out heat exchange cooling, discharged from ventilating opening 302.
As shown in figure 4, the accumulation of heat bucket includes small accumulation of heat bucket 501 and big accumulation of heat bucket 502, the small accumulation of heat bucket
501 are placed on the support 7 and wrap up the release end of heat of the semiconductor heat pump installation 4, and the small accumulation of heat bucket 501 passes through pipe
Road is connected with big accumulation of heat bucket 502.The automatic water-exchanging system is connected with the accumulation of heat bucket, including water pump, electric gate valve, small
Type relay, the liquid level sensor and temperature sensor being arranged in the accumulation of heat bucket, for according to the temperature in accumulation of heat bucket
Degree and water level carry out automatic control of water supply and drainage to accumulation of heat bucket automatically.The small volume of accumulation of heat bucket 501 of the present apparatus is 15L, big accumulation of heat
The volume of bucket 502 needs to set according to life production.Running water, semiconductor heat pump installation 4 are filled in the small accumulation of heat bucket 501
Hot junction is heated to running water, and when temperature reaches demand, automatic water-exchanging system can be automatically drained out hot water to big accumulation of heat bucket 502
Store stand-by, when water level is reduced to lowest water level preset value, automatic water-exchanging system feeds water to small accumulation of heat bucket 501,
Until water level rises to maximum stage preset value.
As shown in figure 3, connect the second conducting copper plate 402 of the release end of heat of the semiconductor heat pump installation 4 and small accumulation of heat water
Bucket 501 welds, and turns into the part at barrel bottom, and the 3rd conducting copper plate 405 for connecting the heat absorbing end of the semiconductor heat pump installation 4 is embedding
On 3 casees tops of incubator, turn into the part on case top；The semiconductor chilling plate 201 extends downwards four out by incubator 3
Wall is wrapped up.
Described accumulation of heat bucket, incubator, the outer surface of packaged air conditioner are enclosed with the polystyrene material that thickness is 60mm
Insulating, play insulation effect, reduce and waste.
The present embodiment is compact-sized, the coupling of semiconductor refrigerating and heat pump, and fully utilizing semiconductor can freeze and can
The performance of heating, meanwhile, the amount of heat that thermoelectric heat pump recovery distributes from refrigerating plant, reach good energy-saving effect.
Above-described embodiment of the present utility model is only intended to clearly illustrate the utility model example, and is not
Restriction to embodiment of the present utility model.For those of ordinary skill in the field, on the basis of described above
On can also make other changes in different forms.There is no necessity and possibility to exhaust all the enbodiments.
All made within spirit of the present utility model and principle all any modification, equivalent and improvement etc., should be included in this reality
Within new scope of the claims.
Claims (10)
1. a kind of semiconductor refrigerating and pump coupled heat formula device, it is characterised in that：Filled including two dc sources, semiconductor refrigerating
Put, semiconductor heat pump installation, accumulation of heat bucket, incubator, packaged air conditioner, two blower fans, automatic water-exchanging system and one are used to support
The accumulation of heat bucket bracket, described two dc sources connect with semiconductor cooling device and thermoelectric heat pump device circuit respectively
Connect, the packaged air conditioner, semiconductor cooling device, incubator, semiconductor heat pump installation, accumulation of heat bucket in the vertical direction by it is lower extremely
On be sequentially connected, the incubator, packaged air conditioner are provided with air outlet, and two blower fans are separately positioned on the incubator, cold wind
On case, for promoting hot blast and cold wind in case to be discharged from air outlet；The automatic water-exchanging system be used for according to temperature and liquid level from
The plumbing of dynamic control accumulation of heat bucket.
2. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The semiconductor
Refrigerating plant includes being in same level and cold end some semiconductor chilling plates directed downwardly, one piece of conducting copper plate, one piece of conduction cooling
If block, dry heat pipe, some fin, the cold end of the semiconductor chilling plate are uniformly fitted on cool guiding block, the conducting copper plate
It is fitted and connected with the hot junction of semiconductor chilling plate upper surface, the heat pipe after groups of fins integrated heat-pipe radiator with being placed in incubator
It is interior and be connected with conducting copper plate.
3. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The semiconductor
Heat pump assembly is included in same level and release end of heat some semiconductor heating elements upward, two pieces of conducting copper plates, some
Heat pipe, some fin, the heat absorbing end of the semiconductor heating element are fitted and connected with conducting copper plate, and release end of heat is led with another piece
Hot copper coin is fitted and connected, and the heat pipe forms two groups of heat-pipe radiators with fin, and two groups of heat-pipe radiators are respectively placed in accumulation of heat
Each it is connected in bucket and incubator and with two pieces of conducting copper plates.
4. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The packaged air conditioner
The cold end of semiconductor cooling device is wrapped in, packaged air conditioner one end is equipped with blower fan, and the pipeline that the other end is connected to export cold wind connects
Mouthful.
5. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The incubator
It is wrapped in the heat absorbing end of semiconductor cooling device hot junction and semiconductor heat pump installation, the incubator is built with one piece of dividing plate by case
Interior space is divided into two parts up and down, and described dividing plate one end is provided with the breach for making that two parts space is connected up and down in casing, institute
State side of the insulation lower box part away from breach and blower fan is housed, the insulation upper box part is provided with ventilating opening away from breach side.
6. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The accumulation of heat water
Bucket includes small accumulation of heat bucket and big accumulation of heat bucket, and the small accumulation of heat bucket is placed on the bracket and wraps up the semiconductor heat
Pump installation release end of heat, the small accumulation of heat bucket are connected by pipeline with big accumulation of heat bucket.
7. semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：The automatic water-replacing system
System is connected with the accumulation of heat bucket, including water pump, electric gate valve, miniature relay, the liquid level being arranged in the accumulation of heat bucket
Sensor and temperature sensor, for carrying out automatic plumbing to accumulation of heat bucket automatically according to the temperature in accumulation of heat bucket and water level
Control.
8. semiconductor refrigerating according to claim 3 and pump coupled heat formula device, it is characterised in that：Connect the semiconductor
The conducting copper plate of the release end of heat of heat pump assembly is welded with accumulation of heat bucket, is turned into the part at barrel bottom, is connected the thermoelectric heat pump
The conducting copper plate of the heat absorbing end of device is embedded in incubator case top, turns into the part on case top；The semiconductor chilling plate is by being incubated
Case extends downwards four walls out and wrapped up.
9. a kind of semiconductor refrigerating according to claim 1 and pump coupled heat formula device, it is characterised in that：Described accumulation of heat
Bucket, incubator, the outer surface of packaged air conditioner are enclosed with insulating.
10. a kind of semiconductor refrigerating according to claim 9 and pump coupled heat formula device, it is characterised in that：It is described every
Hot heat-insulation layer uses certain thickness polystyrene material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720506682.2U CN206890910U (en) | 2017-05-09 | 2017-05-09 | A kind of semiconductor refrigerating and pump coupled heat formula device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720506682.2U CN206890910U (en) | 2017-05-09 | 2017-05-09 | A kind of semiconductor refrigerating and pump coupled heat formula device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206890910U true CN206890910U (en) | 2018-01-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720506682.2U Expired - Fee Related CN206890910U (en) | 2017-05-09 | 2017-05-09 | A kind of semiconductor refrigerating and pump coupled heat formula device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206890910U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131676A (en) * | 2017-05-09 | 2017-09-05 | 华南理工大学 | A kind of semiconductor refrigerating and pump coupled heat formula device |
| CN111520580A (en) * | 2020-04-30 | 2020-08-11 | 杭州市土地勘测设计规划院有限公司 | Land surveying instrument for special terrain |
-
2017
- 2017-05-09 CN CN201720506682.2U patent/CN206890910U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107131676A (en) * | 2017-05-09 | 2017-09-05 | 华南理工大学 | A kind of semiconductor refrigerating and pump coupled heat formula device |
| CN107131676B (en) * | 2017-05-09 | 2023-07-18 | 华南理工大学 | Semiconductor refrigeration and heat pump coupling type device |
| CN111520580A (en) * | 2020-04-30 | 2020-08-11 | 杭州市土地勘测设计规划院有限公司 | Land surveying instrument for special terrain |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180116 Termination date: 20190509 |