CN106969533A - Semiconductor refrigerating box and its heat abstractor - Google Patents
Semiconductor refrigerating box and its heat abstractor Download PDFInfo
- Publication number
- CN106969533A CN106969533A CN201710379052.8A CN201710379052A CN106969533A CN 106969533 A CN106969533 A CN 106969533A CN 201710379052 A CN201710379052 A CN 201710379052A CN 106969533 A CN106969533 A CN 106969533A
- Authority
- CN
- China
- Prior art keywords
- reserve tank
- liquid reserve
- heat spreader
- working medium
- integrated heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
Abstract
The invention discloses a kind of semiconductor refrigerating box and its heat abstractor, heat abstractor includes：Liquid reserve tank for storing working medium, and the working medium can absorb heat after evaporate；Inside has the integrated heat spreader of a plurality of stream, can enter the integrated heat spreader through the escape pipe after the working medium evaporation being connected between the integrated heat spreader and the liquid reserve tank in escape pipe and liquid back pipe, the liquid reserve tank.The heat abstractor that the present invention is provided realizes the purpose of radiating by the phase transformation of working medium, and without noise pollution, radiating effect is preferable.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, filled more specifically to a kind of semiconductor refrigerating box and its radiating
Put.
Background technology
Semiconductor refrigerating box possesses compact, it is pollution-free, noiseless, simple in construction the characteristics of, it is adaptable to a variety of occasions.
The principle of semiconductor refrigerating box is that heat absorption and heat release are produced by the potential variation that electronics and hole occur in power circuit
Phenomenon, makes semiconductor refrigerating component produce cold end and hot junction.The radiating in hot junction adds fan forced convection usually using mental-finned
Radiating, but the rotation of fan has noise with can not avoiding.If without using fan, then being radiated using the radiating mode of free convection
Efficiency is not good.
In summary, the problem of semiconductor case hot-side heat dissipation has noise and not good radiating effect how is efficiently solved,
It is current those skilled in the art's urgent problem.
The content of the invention
In view of this, the invention provides a kind of heat abstractor and the semiconductor refrigerating box of above-mentioned heat abstractor is included, with
Solve the problem of semiconductor case hot-side heat dissipation has noise and not good radiating effect.
In order to reach above-mentioned first purpose, the present invention provides following technical scheme：
A kind of heat abstractor, including：
Liquid reserve tank for storing working medium, and the working medium can absorb heat after evaporate；
Inside has the integrated heat spreader of a plurality of stream, and outlet is connected between the integrated heat spreader and the liquid reserve tank
It can enter the integrated heat spreader, gaseous state work through the escape pipe after working medium evaporation in pipe and liquid back pipe, the liquid reserve tank
Matter can be through the return line flow into the liquid reserve tank after being condensed in the integrated heat spreader.
Preferably, in above-mentioned heat abstractor, the integrated heat spreader is press-fited by relative two panels flat board to be formed, the flat board
Upper have a groove, and the grooves of two flat boards is relative to form the stream.
Preferably, in above-mentioned heat abstractor, the side for the welding that the liquid back pipe and escape pipe pass through with the liquid reserve tank
Formula is connected, the liquid back pipe and escape pipe and the integrated heat spreader welding by way of be connected.
A kind of semiconductor refrigerating box, including casing, semiconductor chilling plate, be connected with the cold end of the semiconductor chilling plate
Cooler, in addition to the heat abstractor being connected with the hot junction of the semiconductor chilling plate, the heat abstractor is appoints in as described above
Heat abstractor described in one.
Preferably, in above-mentioned semiconductor refrigerating box, a part of outer surface and the semiconductor chilling plate of the liquid reserve tank
Hot junction contact, another part is laid with heat-insulation layer on outer surface.
Preferably, in above-mentioned semiconductor refrigerating box, the integrated heat spreader is specially the backboard of the casing, the liquid storage
Case is located at the box house.
Preferably, in above-mentioned semiconductor refrigerating box, the integrated heat spreader and liquid reserve tank are metal material.
Preferably, in above-mentioned semiconductor refrigerating box, the escape pipe and liquid back pipe are metal tube.
The heat abstractor that the present invention is provided includes liquid reserve tank, integrated heat spreader, escape pipe and liquid back pipe.Wherein, liquid storage
Case is used to evaporate after storing working medium, and working medium heat absorption.Escape pipe is connected between integrated heat spreader and liquid reserve tank and liquid is returned
Pipe, i.e., the gas outlet of liquid reserve tank is connected with the air inlet of integrated heat spreader by escape pipe, the liquid outlet of integrated heat spreader and storage
The inlet of liquid case is connected by liquid back pipe.Integrated heat spreader is internally provided with a plurality of stream, and gaseous working medium is in a plurality of stream
Middle flowing is simultaneously condensed, i.e., can enter integrated heat spreader through escape pipe after the working medium heat absorption evaporation in liquid reserve tank, gaseous working medium exists
Can be through return line flow into liquid reserve tank after exothermic condensation in integrated heat spreader.
When the heat abstractor provided using the present invention radiates to semiconductor refrigerating box, by liquid reserve tank close to semiconductor system
The hot junction of cold is placed or liquid reserve tank is contacted with the hot junction of semiconductor chilling plate, and the working medium inside such liquid reserve tank, which absorbs, partly to be led
The heat that the hot junction of body cooling piece is produced, so that the working medium heat absorption evaporation inside liquid reserve tank becomes gaseous working medium, gaseous working medium warp
Escape pipe enter integrated heat spreader inside, gaseous working medium enter integrated heat spreader multiple streams in and exothermic condensation formation liquid
Working medium, liquid refrigerant is back in liquid reserve tank through liquid back pipe again, and so circulation constantly produces the hot junction of semiconductor chilling plate
Heat distribute to outside air.From the foregoing, it will be observed that the heat abstractor that the present invention is provided realizes the mesh of radiating by the phase transformation of working medium
, and without noise pollution, radiating effect is preferable.
In order to reach above-mentioned second purpose, present invention also offers a kind of semiconductor refrigerating box, the semiconductor refrigerating box
The cooler being connected including casing, semiconductor chilling plate, with the cold end of semiconductor chilling plate and the heat with semiconductor chilling plate
The heat abstractor of connection is held, wherein heat abstractor is any of the above-described kind of heat abstractor.Due to above-mentioned heat abstractor have it is above-mentioned
Technique effect, the semiconductor refrigerating box with the heat abstractor should also have corresponding technique effect.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of semiconductor refrigerating box provided in an embodiment of the present invention.
In Fig. 1：
1- casings, 2- integrated heat spreaders, 3- return ducts, 4- escape pipes.
Embodiment
The present invention first purpose be to provide a kind of heat abstractor, the structure design of the heat abstractor can be effectively
The problem of semiconductor case hot-side heat dissipation has noise and not good radiating effect is solved, second object of the present invention is to provide one kind
Include the semiconductor refrigerating box of above-mentioned heat abstractor.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Referring to Fig. 1, heat abstractor provided in an embodiment of the present invention include liquid reserve tank, integrated heat spreader 2, escape pipe 4 with
And liquid back pipe.Wherein, liquid reserve tank is used to evaporate after storing working medium, and working medium heat absorption.Between integrated heat spreader 2 and liquid reserve tank
It is connected with the gas outlet of escape pipe 4 and liquid back pipe, i.e. liquid reserve tank to connect by escape pipe 4 with the air inlet of integrated heat spreader 2, collects
The inlet of liquid outlet and liquid reserve tank into radiator 2 is connected by liquid back pipe.Integrated heat spreader 2 is internally provided with a plurality of stream
Road, gaseous working medium flows and condensed in a plurality of stream, i.e., can enter after the working medium heat absorption evaporation in liquid reserve tank through escape pipe 4
Integrated heat spreader 2, gaseous working medium can be flow in liquid reserve tank in integrated heat spreader 2 after exothermic condensation through return duct 3.
When being radiated using heat abstractor provided in an embodiment of the present invention to semiconductor refrigerating box, by liquid reserve tank close to half
The hot junction of conductor cooling piece is placed or liquid reserve tank is contacted with the hot junction of semiconductor chilling plate, and the working medium inside such liquid reserve tank is inhaled
The heat that the hot junction of semiconductor chilling plate is produced is received, so that the working medium heat absorption evaporation inside liquid reserve tank becomes gaseous working medium, gaseous state
Working medium through escape pipe 4 enter integrated heat spreader 2 inside, gaseous working medium enter integrated heat spreader 2 multiple streams in and heat release it is cold
Solidifying to form liquid refrigerant, liquid refrigerant is back in liquid reserve tank through liquid back pipe again, and so circulation is constantly by semiconductor chilling plate
Hot junction produce heat distribute to outside air.From the foregoing, it will be observed that the heat abstractor that the present invention is provided is real by the phase transformation of working medium
The purpose now radiated, and without noise pollution, radiating effect is preferable.
In one embodiment, integrated heat spreader 2 can be press-fited by relative two panels flat board and be formed, and be had on flat board
Fluted, the grooves of two flat boards is relative to form stream.The groove of i.e. two flat boards is respectively with respect to formation integrated heat spreader 2
Multiple streams, into being distributed in even heat on flat board of the gaseous working medium in stream.
Preferably, liquid back pipe and escape pipe 4 and liquid reserve tank can with welding by way of be connected, and liquid back pipe and
Escape pipe 4 and integrated heat spreader 2 can also welding by way of be connected.Certainly, liquid back pipe and escape pipe 4 can also lead to
Cross other manner to be connected with liquid reserve tank or integrated heat spreader 2, such as, by clamp connection, be not limited thereto.
Based on the heat abstractor provided in above-described embodiment, present invention also offers a kind of semiconductor refrigerating box, this is partly led
System ice chest include casing 1, semiconductor chilling plate, the cooler being connected with the cold end of semiconductor chilling plate and with semiconductor system
The heat abstractor of the hot junction connection of cold, wherein semiconductor chilling plate is arranged on inside casing 1.Above-mentioned heat abstractor is above-mentioned reality
Apply the heat abstractor of any one in example.The heat abstractor in above-described embodiment is employed due to the semiconductor refrigerating box, so should
The beneficial effect of semiconductor refrigerating box refer to above-described embodiment.
Preferably, a part of outer surface of liquid reserve tank is contacted with the hot junction of semiconductor chilling plate, on another part outer surface
Heat-insulation layer is laid with, can so prevent the working medium i.e. refrigerant in liquid reserve tank from occurring heat exchange with other parts, further improve
Radiating effect.
In another embodiment, integrated heat spreader 2 can be specially the backboard of casing 1, and liquid reserve tank is located inside casing 1, such as
This be the side of integrated heat spreader 2 towards inside casing 1, opposite side is towards outside casing 1, and such integrated heat spreader 2 can be straight
The air connect with the outside of casing 1 carries out heat exchange, more saves part.
For the ease of heat transfer, integrated heat spreader 2 and liquid reserve tank are heat-conducting, specifically integrated heat spreader 2 and liquid storage
Case can be metal material.Escape pipe 4 and liquid back pipe can also be metal tube, be not limited thereto.
The embodiment of each in this specification is described by the way of progressive, and what each embodiment was stressed is and other
Between the difference of embodiment, each embodiment identical similar portion mutually referring to.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (8)
1. a kind of heat abstractor, it is characterised in that including：
Liquid reserve tank for storing working medium, and the working medium can absorb heat after evaporate；
Inside has the integrated heat spreader (2) of a plurality of stream, is connected with out between the integrated heat spreader (2) and the liquid reserve tank
The integrated heat spreader can be entered through the escape pipe (4) after working medium evaporation in tracheae (4) and liquid back pipe, the liquid reserve tank
(2), gaseous working medium can be flow in the liquid reserve tank after being condensed in the integrated heat spreader (2) through the return duct (3).
2. heat abstractor according to claim 1, it is characterised in that the integrated heat spreader (2) is put down by relative two panels
Plate press-fits to be formed, and has groove on the flat board, and the grooves of two flat boards is relative to form the stream.
3. the heat abstractor according to any one of claim 1-2, it is characterised in that the liquid back pipe and escape pipe (4)
With the liquid reserve tank welding by way of be connected, the liquid back pipe and escape pipe (4) and the integrated heat spreader (2) are
Welding by way of connect.
4. a kind of semiconductor refrigerating box, including casing (1), semiconductor chilling plate, it is connected with the cold end of the semiconductor chilling plate
Cooler, it is characterised in that the heat abstractor being also connected including the hot junction with the semiconductor chilling plate, the heat abstractor
For the heat abstractor as described in claim any one of 1-3.
5. semiconductor refrigerating box according to claim 4, it is characterised in that a part of outer surface of the liquid reserve tank and institute
The hot junction contact of semiconductor chilling plate is stated, another part is laid with heat-insulation layer on outer surface.
6. semiconductor refrigerating box according to claim 4, it is characterised in that the integrated heat spreader (2) is specially described
The backboard of casing (1), it is internal that the liquid reserve tank is located at the casing (1).
7. semiconductor refrigerating box according to claim 4, it is characterised in that the integrated heat spreader (2) and liquid reserve tank are equal
For metal material.
8. the semiconductor refrigerating box according to any one of claim 4-7, it is characterised in that the escape pipe (4) and return
Liquid pipe is metal tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710379052.8A CN106969533A (en) | 2017-05-25 | 2017-05-25 | Semiconductor refrigerating box and its heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710379052.8A CN106969533A (en) | 2017-05-25 | 2017-05-25 | Semiconductor refrigerating box and its heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106969533A true CN106969533A (en) | 2017-07-21 |
Family
ID=59327202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710379052.8A Pending CN106969533A (en) | 2017-05-25 | 2017-05-25 | Semiconductor refrigerating box and its heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106969533A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112077547A (en) * | 2020-08-03 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | Soaking plate structure without liquid absorption core and preparation method thereof |
| CN113959141A (en) * | 2021-06-16 | 2022-01-21 | 东南大学 | Solar-driven cold-storage type cold-chain express cabinet |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6502405B1 (en) * | 2001-10-19 | 2003-01-07 | John Van Winkle | Fluid heat exchanger assembly |
| CN2542999Y (en) * | 2002-04-23 | 2003-04-02 | Tcl集团有限公司 | Thermoelectric refrigerator using forced ventilation and forced circulation radiating |
| CN2830990Y (en) * | 2005-09-10 | 2006-10-25 | 海尔集团公司 | Refrigerator |
| CN1928464A (en) * | 2005-09-10 | 2007-03-14 | 海尔集团公司 | Refrigerating device |
| KR20080017674A (en) * | 2006-08-22 | 2008-02-27 | (주)거우엔지니어링 | Small refrigerator |
| CN102812321A (en) * | 2010-04-09 | 2012-12-05 | 英格索尔-兰德公司 | Formed microchannel heat exchanger |
-
2017
- 2017-05-25 CN CN201710379052.8A patent/CN106969533A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6502405B1 (en) * | 2001-10-19 | 2003-01-07 | John Van Winkle | Fluid heat exchanger assembly |
| CN2542999Y (en) * | 2002-04-23 | 2003-04-02 | Tcl集团有限公司 | Thermoelectric refrigerator using forced ventilation and forced circulation radiating |
| CN2830990Y (en) * | 2005-09-10 | 2006-10-25 | 海尔集团公司 | Refrigerator |
| CN1928464A (en) * | 2005-09-10 | 2007-03-14 | 海尔集团公司 | Refrigerating device |
| KR20080017674A (en) * | 2006-08-22 | 2008-02-27 | (주)거우엔지니어링 | Small refrigerator |
| CN102812321A (en) * | 2010-04-09 | 2012-12-05 | 英格索尔-兰德公司 | Formed microchannel heat exchanger |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112077547A (en) * | 2020-08-03 | 2020-12-15 | 东莞领杰金属精密制造科技有限公司 | Soaking plate structure without liquid absorption core and preparation method thereof |
| CN113959141A (en) * | 2021-06-16 | 2022-01-21 | 东南大学 | Solar-driven cold-storage type cold-chain express cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170721 |