CN104329868B - Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof - Google Patents
Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof Download PDFInfo
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- CN104329868B CN104329868B CN201410123561.0A CN201410123561A CN104329868B CN 104329868 B CN104329868 B CN 104329868B CN 201410123561 A CN201410123561 A CN 201410123561A CN 104329868 B CN104329868 B CN 104329868B
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- heat
- cold
- hot junction
- exchanger rig
- heat exchange
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a semiconductor refrigeration refrigerator and a cold-end heat exchange device of the semiconductor refrigeration refrigerator. The cold-end heat exchange device comprises a cold-end heat conduction plate and a plurality of refrigeration annular heat pipes; the cold-end heat conduction plate is provided with a heat exchange face connected with a refrigeration source; the refrigeration annular heat pipes are sequentially arranged in a plane parallel to the heat exchange face at intervals in the radial direction. The upper portion of each refrigeration annular heat pipe is in contact with the cold-end heat conduction plate to carry out heat exchange, and the refrigeration annular heat pipes are arranged downwards along the plane parallel to the heat exchange face. According to the technical scheme, heat transmitted by the cold-end heat conduction plate is effectively conducted through the refrigeration annular heat pipes in the cold-end heat exchange device; the occupied space is small, and therefore the cold-end heat exchange device can be matched with a refrigerator structure well.
Description
Technical field
The present invention relates to refrigeration plant, more particularly to semiconductor freezer and its cold end heat-exchanger rig.
Background technology
Semiconductor freezer, also referred to as thermoelectric refrigerator.It utilizes semiconductor chilling plate by the double-deck heat of highly effective ring
Refrigeration is realized in pipe radiating and conduction technique and automatic pressure-transforming Variable flow control technology, without refrigeration working medium and mechanical moving element, solves
Determine the application problem of the tradition machinery refrigerator such as medium pollution and mechanical oscillation.
However, semiconductor freezer needs effectively by between the temperature conduction of semiconductor chilling plate cold end to refrigerator storing
Interior, prior art typically adopt fin forced convertion, fin by with semiconductor chilling plate cold end directly contact, and with
Storing compartment carries out heat exchange, and the heat conduction heat exchange efficiency between this solid is low, is unfavorable for the performance of semiconductor optimum performance, and
And radiating fin volume is larger, take refrigerator space, after cooperation fan, noise can be caused to increase, and fan continuously works, reliable
Property is poor.
Content of the invention
It is an object of the present invention to providing the cold end heat-exchanger rig that a kind of heat exchange efficiency is high, take up room little.
The present invention one further objective is that cold end heat-exchanger rig will be made to produce and assembly technology is simple and refrigerator this
Body cooperation is reliable and stable.
According to an aspect of the invention, it is provided a kind of cold end heat-exchanger rig for semiconductor freezer.This is cold
End heat-exchanger rig includes: cold end heat-conducting plate, it has the hot linked heat-transfer surface with refrigeration source；Many refrigeration annular heat pipes, along footpath
To being sequentially arranged at intervals in the plane parallel with heat-transfer surface, the top of wherein every refrigeration annular heat pipe is connect with cold end heat-conducting plate
Tactile heat exchange, arranges downwards along the plane parallel with heat-transfer surface.
Alternatively, every refrigeration annular heat pipe is with the axisymmetric polygon of the longitudinal centre line of cold end heat-conducting plate, its structure
Become two sides of drift angle or a part for its top margin and cold end heat-conducting plate contact heat-exchanging.
Alternatively, every refrigeration annular heat pipe is rounded square, and at least a portion of its top is contacted with cold end heat-conducting plate
Heat exchange, two side is along the straight down extension parallel with heat-transfer surface.
Alternatively, there is inside the tube chamber of refrigeration annular heat pipe the metal dust structure of sintering.
Alternatively, every refrigeration annular heat pipe is rhombus, and its first group of diagonal is vertically arranged, second group of diagonal level
Setting, constitutes first group of cornerwise top drift angle and at least a portion of adjacent side of formation top drift angle is connect with cold end heat-conducting plate
Tactile heat exchange.
Alternatively, refrigeration annular heat pipe is light pipe heat pipe.
Alternatively, the outer surface of every refrigeration annular heat pipe is flat square.
According to another aspect of the present invention, additionally provide a kind of semiconductor freezer.This semiconductor freezer bag
Include: inner bag, define storing compartment in it；Shell, is arranged at the outside of inner bag, and it includes u shell and back, the back of shell
Define installing space with the rear wall of inner bag；Semiconductor chilling plate；Alternatively, any one cold end heat-exchanger rig described above,
All it is arranged in installing space with semiconductor chilling plate, cold end heat-exchanger rig is installed into makes its heat-transfer surface and semiconductor chilling plate
Cold end thermally coupled, and make its every refrigeration annular heat pipe at least a portion recline with the outer surface of inner bag, will be derived from
The cold of cold end reaches storing compartment.
Alternatively, above-mentioned semiconductor freezer also includes: hot junction heat-exchanger rig, connects with the hot junction heat of semiconductor chilling plate
Connect, the heat for producing hot junction distributes to surrounding environment.
Alternatively, hot junction heat-exchanger rig includes: hot junction heat exchange box, defines for containing the cold-producing medium that gas-liquid two-phase coexists
Inner chamber, and be configured to allow for cold-producing medium and undergo phase transition heat exchange in it；And heat dissipation pipeline, it is configured to allow for cold-producing medium in it
Flowing and undergo phase transition heat exchange, and heat dissipation pipeline be formed as the first end of openend and the second end is all communicated to hot junction heat exchange
The top of the inner chamber of case, heat dissipation pipeline is tilted towards Shangdi bending from its first end and the second end respectively and extends to common highest order
Put.
Alternatively, hot junction heat-exchanger rig includes: hot junction heat exchange box, defines for containing the cold-producing medium that gas-liquid two-phase coexists
Inner chamber, and be configured to allow for cold-producing medium and undergo phase transition heat exchange in it；With many heat dissipation pipelines, it is configured to allow for cold-producing medium and exists
Flow in it and undergo phase transition heat exchange, and the first end being formed as openend of every heat dissipation pipeline is communicated to hot junction heat exchange box
Inner chamber top, every heat dissipation pipeline from its first end be tilted towards Shangdi bending extend, end in it and be formed as blind end
The second end.
Alternatively, hot junction heat-exchanger rig includes: hot junction heat-conducting plate, and it is thermally coupled with hot junction；With many radiating annular heat pipes,
A part for every radiating annular heat pipe and hot junction heat-conducting plate contact heat-exchanging, another part and the shell of semiconductor freezer
Contact internal walls heat exchange.
Alternatively, hot junction heat-exchanger rig includes: hot junction heat-conducting plate, and it is thermally coupled with hot junction；Many radiating heat pipes, every dissipates
One end of heat pipe and hot junction heat-conducting plate contact heat-exchanging；Radiating fin, is arranged on many radiating heat pipes；And blower fan, by tight
Gu mechanism is fixed on radiating fin, so that forced convertion radiating is carried out to the heat reaching radiating fin from many radiating heat pipes.
Alternatively, hot junction heat-exchanger rig includes: hot junction heat exchange box, defines for containing the cold-producing medium that gas-liquid two-phase coexists
Inner chamber, and be configured to allow for cold-producing medium and undergo phase transition heat exchange in it；Many heat dissipation pipelines, are configured to allow for cold-producing medium at it
Interior heat exchange of flowing and undergo phase transition, and the first end being formed as openend of every heat dissipation pipeline is communicated to hot junction heat exchange box
The top of inner chamber, every heat dissipation pipeline from its first end be tilted towards Shangdi bending extend, end in it and be formed as blind end
Second end；Radiating fin, is arranged on many heat dissipation pipelines；And blower fan, it is fixed on radiating fin by retention mechanism, with right
The heat reaching radiating fin from many heat dissipation pipelines carries out forced convertion radiating.
In the cold end heat-exchanger rig of the present invention, the many refrigeration annular heat pipe temperature that transmit cold end heat-conducting plate are effective
Carrying out conduct, take up room little, contribute to the cooperation with refrigerator structure.
Further, the semiconductor freezer of the present invention, makes at least a portion of cold end heat-exchanger rig and the outer of inner bag
Surface reclines, and carries out heat conduction using inner bag, makes full use of refrigerator structure, takes up room little.
Further, the hot junction heat-exchanger rig that the semiconductor freezer of the present invention can take various forms has in time
Effect ground distributes the heat that semiconductor chilling plate hot junction produces to surrounding enviroment, flexible configuration, ensure that the reliably working of refrigerator.
According to the detailed description to the specific embodiment of the invention below in conjunction with accompanying drawing, those skilled in the art will be brighter
The above-mentioned and other purposes of the present invention, advantages and features.
Brief description
Describe some specific embodiments of the present invention hereinafter with reference to the accompanying drawings by way of example, and not by way of limitation in detail.
In accompanying drawing, identical reference denotes same or similar part or part.It should be appreciated by those skilled in the art that these
Accompanying drawing is not necessarily drawn to scale.In accompanying drawing:
Fig. 1 is the schematic diagram of the cold end heat-exchanger rig for semiconductor freezer according to an embodiment of the invention；
Fig. 2 is another kind of system of the cold end heat-exchanger rig for semiconductor freezer according to an embodiment of the invention
The schematic diagram of cold annular heat pipe；
Fig. 3 is another kind of system of the cold end heat-exchanger rig for semiconductor freezer according to an embodiment of the invention
The schematic diagram of cold annular heat pipe；
Fig. 4 is a kind of schematic explosive view of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention；
Fig. 5 is the schematic explosive view of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention；
Fig. 6 is the schematic diagram of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention；
Fig. 7 is the schematic diagram of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention；
Fig. 8 is the schematic diagram of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention
Fig. 9 is the schematic diagram of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention；And
Figure 10 is the b of another kind of hot junction heat-exchanger rig that can be used for semiconductor freezer of the present invention to sectional view.
Specific embodiment
Embodiments of the invention are described below in detail, the example of described embodiment is shown in the drawings, below with reference to
The embodiment of Description of Drawings is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.At this
In bright description, term " on ", D score, the orientation of instruction such as "front", "rear" or position relationship be based on orientation shown in the drawings
Or position relationship, be for only for ease of description the present invention rather than require the present invention must with specific azimuth configuration and operation,
Therefore it is not considered as limiting the invention.
Fig. 1 is the signal of the cold end heat-exchanger rig 100 for semiconductor freezer according to an embodiment of the invention
Figure.This cold end heat-exchanger rig 100 may include that cold end heat-conducting plate 110 and Duo Gen refrigeration annular heat pipe 120 in general manner.Wherein,
Cold end heat-conducting plate 110 has the heat-transfer surface with refrigeration source (cold end of such as semiconductor chilling plate) heat exchange；Many refrigeration annulars
Heat pipe 120 is radially sequentially arranged at intervals in the plane parallel with heat-transfer surface, every refrigeration annular heat pipe 120 top with cold
End heat-conducting plate 110 contact heat-exchanging, arranges downwards along the plane parallel with heat-transfer surface.Many refrigeration annular heat pipe 120 radially according to
Minor tick arrange, formed the little ring of big ring sleeve structure, between be spaced a distance.
During cold end heat-exchanger rig 100 work, cold end heat-conducting plate 110 temperature drop, temperature is passed to the system being in contact with it
Cold annular heat pipe 120, refrigeration annular heat pipe 120 is when managing interior temperature drop, and in it, liquid refrigerant is caught a cold condensation, is converted into liquid
State, by the suction-operated of self gravitation and sintered powder, to lower flow, freezes what annular heat pipe 120 bottom reclined therewith
The temperature of object, thus reduce the temperature of surrounding enviroment.The cold-producing medium vaporization absorbing heat becomes gaseous state, in thermal source power
Rise to the top of refrigeration annular heat pipe 120 under promotion, reuptake the temperature of cold end heat-conducting plate 110, be condensed into liquid, thus
Circulation work.
For ensureing the heat exchanger effectiveness of cold end heat-conducting plate 110 and refrigeration source, the heat-transfer surface of cold end heat-conducting plate 110 can have leads
Thermosphere, this heat-conducting layer is formed by the heat-conducting silicone grease (graphite or other media) being coated on heat-transfer surface." heat company in the present embodiment
Connect " or " thermo-contact ", originally can be to directly abut contact, be conducted heat by the way of heat transfer.If abutting contact face coats
Heat-conducting silicone grease (graphite or other media), can be construed as the part on abutting contact face, as improve thermally coupled (or heat
Contact) heat-conducting layer.
Refrigeration annular heat pipe 120 can select annular using various shapes it is contemplated that processing technology and refrigeration, often
Root refrigeration annular heat pipe 120 is with the axisymmetric polygon of the longitudinal centre line of cold end heat-conducting plate, and it constitutes two sides of drift angle
Or a part for its top margin and cold end heat-conducting plate contact heat-exchanging.Refrigeration annular heat pipe 120 shown in Fig. 1 is hexagon, one
As condenser, with cold end heat-conducting plate 110 contact heat-exchanging, freeze the part of two adjacent sides of individual drift angle and this drift angle annular heat pipe
120 other parts are as evaporimeter.
Fig. 2 is the another of the cold end heat-exchanger rig 100 for semiconductor freezer according to an embodiment of the invention
Plant the schematic diagram of refrigeration annular heat pipe, every refrigeration annular heat pipe 120 is rounded square, at least a portion of its top and cold end
, as condenser, two side is along the straight down extension parallel with heat-transfer surface for heat-conducting plate 110 contact heat-exchanging.Refrigeration annular heat
Pipe 120 is using the heat pipe of the metal dust structure inside tube chamber with sintering.
At least a portion (such as the latter half) conduct of following and two sides of rounded square refrigeration annular heat pipe 120
Evaporimeter, when the cold-producing medium of liquid is located at the horizontal component of top, it is dirty that the cold-producing medium of liquid cannot rely solely on gravity, can
The capillary force being produced with the metal dust relying on sintering, liquid refrigerant is absorbed heat sink region.
Fig. 3 is the another of the cold end heat-exchanger rig 100 for semiconductor freezer according to an embodiment of the invention
Plant the schematic diagram of refrigeration annular heat pipe, every refrigeration annular heat pipe 120 is rhombus, and its first group of diagonal is vertically arranged, second
Group diagonal be horizontally disposed with, constitute first group of cornerwise top drift angle and formed top drift angle at least a portion of adjacent side with
Cold end heat-conducting plate 110 contact heat-exchanging, constitutes condenser.Part outside refrigeration annular heat pipe 120 is located at cold end heat-conducting plate 110 is made
For evaporimeter, because rhombus does not have horizontal component, therefore, rely on the liquid refrigerant on gravity top just can be automatically to dirty
Dynamic, heat absorption evaporation, therefore refrigeration annular heat pipe 120 can adopt light pipe heat pipe.
The refrigeration annular heat pipe 120 of any of the above shape can be directly embedded in cold end heat-conducting plate 110 or and cold end
Heat-conducting plate 110 is welded and fixed, and for convenience of being connected with miscellaneous part, refrigeration annular heat pipe 120 can be selected for flat structure, and increase connects
Contacting surface is amassed.
Embodiments of the invention additionally provide a kind of semiconductor freezer that make use of above cold end heat-exchanger rig 100,
Semiconductor freezer may include that inner bag, shell, semiconductor chilling plate and cold end heat-exchanger rig 100 in general manner.Its
The inner bag of middle refrigerator defines storing compartment, and shell generally there are two kinds of structures, and one kind is pin-connected panel, i.e. by top cover, left and right sides
Plate, postnotum, lower shoe etc. are assembled into a complete casing.Another kind is monoblock type, will top cover and left side plate press will
Ask rolling become one fall " u " font, referred to as u shell, be that postnotum, lower shoe point are welded into casing.The semiconductor of the embodiment of the present invention
Refrigerator preferably uses monoblock type shell, and that is, shell includes u shell and back, and wherein u shell is arranged at side wall and the top of inner bag
The outside of wall, the back of shell and the rear wall of inner bag define installing space.Cold end heat-exchanger rig 100 and semiconductor chilling plate can
To be installed in this installing space, concrete arrangement is the cold of heat-transfer surface and the semiconductor chilling plate of cold end heat-exchanger rig 100
End is thermally coupled, and so that at least a portion of its every refrigeration annular heat pipe 120 is reclined with the outer surface of inner bag, with self cooling in the future
The cold at end reaches storing compartment.
In the case of the refrigeration annular heat pipe 120 of rounded square, the cold end of semiconductor refrigeration chip is conducted heat with cold end
Plate 110 contact is fixed, and can smear Heat Conduction Material in contact surface for strengthening heat-transfer effect.Refrigeration annular heat pipe 120 top with cold
End heat transfer plate 110 heat transfer plate contact, refrigeration annular heat pipe 120 by be embedded in cold end heat transfer plate 110 or the two pass through weldering
The mode connecing makes it have good contact face.
The metal dust structure of sintering is had on refrigeration annular heat pipe 120 inwall, this structure produces capillarity.Refrigerating ring
It is filled with cold-producing medium working medium inside shape heat pipe 120, manage interior application of vacuum to be carried out before filling, after vacuum filling, opposite heat tube enters
Row sealing, under normality, the internal gas-liquid two-phase coexisting state for cold-producing medium of refrigeration annular heat pipe 120, most liquid due to
Lower position that self gravitation is in pipe is simultaneously attracted to inside sintered powder, on most gaseous state is located in space in pipe
Portion.When semiconductor freezer works, the heat that semiconductor refrigeration chip cold end produces passes to cold end by heat transfer and passes
Hot plate 110, cold end heat transfer plate 110 transfers heat to the refrigeration annular heat pipe 120 being in contact with it, the gaseous refrigerant in pipe again
Catch a cold condensation, be converted into liquid, the cold-producing medium of liquid is acted on due to the capillary force of the gravity heating tube of itself, flows downward,
With the part of the lumen contact of semiconductor freezer, absorb the heat of inner chamber, be heated vaporization, absorbs the refrigeration of heat
Agent vaporization becomes gaseous state, rises to the top of heat pipe under the promotion of thermal source power, again relies on the temperature of cold end heat transfer plate 110
Condensation, thus circulates work.The heat of the refrigerator inner cavity annular heat pipe 120 that freezed is taken away, thus reducing the temperature of storing compartment
Degree.When the cold-producing medium of liquid is positioned at the horizontal component of top or bottom, herein, the gravity of itself cannot cause cold-producing medium
Backflow, but refrigeration annular heat pipe 120 within sintered powder there is capillarity, capillary force can be produced, by liquid refrigerant
It is drawn onto heat affected zone.
This semiconductor freezer carries out the transmission of heat by the way of phase transformation, with respect to traditional conductive heat transfer
Efficiency high, and the annular heat pipe 120 that freezes can be made flat, convenient is coordinated with refrigerator inner cavity.Additionally do not take refrigerator empty
Between, good looking appearance.And this system need not be extra blower fan forced convertion, quiet, without friction, safe and reliable.
The refrigeration annular heat pipe 120 of rhombus is similar to the operation principle of the refrigeration annular heat pipe 120 of rounded square, only
Due to there is not horizontal component, light pipe therefore can be used.Accordingly adopting of other polygonal refrigeration annular heat pipes is similar
Operation principle is arranged.
For solving the heat dissipation problem in semiconductor chilling plate hot junction, the semiconductor freezer of the present embodiment can also include:
Hot junction heat-exchanger rig, thermally coupled with the hot junction of semiconductor chilling plate, the heat for producing hot junction distributes to surrounding environment.With
The hot junction heat-exchanger rig of the semiconductor freezer to the present embodiment for the lower combination accompanying drawing is introduced.
Fig. 4 is a kind of schematic explosive view of hot junction heat-exchanger rig 200 that can be used for semiconductor freezer of the present invention.Should
Hot junction heat-exchanger rig 200 includes: hot junction heat exchange box 210 and heat dissipation pipeline 220.Hot junction heat exchange box 210 defines for containing gas
The inner chamber of the cold-producing medium of liquid two-phase coexistent, and be configured to allow for cold-producing medium and undergo phase transition heat exchange in it.Heat dissipation pipeline 220 configures
Become and allow cold-producing medium to flow in it and undergo phase transition heat exchange, and heat dissipation pipeline 220 be formed as openend first end and
Second end is all communicated to the top of the inner chamber of hot junction heat exchange box 210, and heat dissipation pipeline 220 tilts from its first end and the second end respectively
Up bending extends to common extreme higher position.
Heat dissipation pipeline 220 can abut on the shell 230 of refrigerator, is distributed heat to surrounding enviroment using shell 230.
The internal perfusion cold-producing medium of hot junction heat exchange case 210 can be water or other cold-producing mediums, and its state is gas-liquid two-phase coexisting state, half
During conductor cooling piece energising work, its hot-side temperature raises.Hot junction face and hot junction heat exchange box 210 carry out heat exchange, hot junction heat exchange
Case 210 forms evaporimeter, becomes and turns to gaseous state, and gaseous cold-producing medium can rise along refrigerant line under thermal source pressure, by heat
Amount passes to outcase of refrigerator 230, then transfers heat to space outerpace by free convection, refrigerant line 220 forms cold
Condenser, becomes liquid after cold-producing medium condensation heat release, relies on gravity reflux to hot junction heat exchange box 210, reuptake hot junction heat and enter
Row evaporation, forms thermal cycle.
When being assembled using the cold end heat-exchanger rig 100 of this hot junction heat-exchanger rig 200 and above example introduction, its knot
Structure can be: semiconductor chilling plate is arranged in the space between the rear wall of inner container of icebox and outcase of refrigerator rear wall, cold end heat exchange
The rear wall of cold end heat exchange box 110 of device 100 is thermally coupled with the cold end of semiconductor chilling plate, and refrigerant line 120 abuts in ice
On case inner bag, for freezing to storing inner chamber.The hot junction of semiconductor chilling plate is by a heat bridge device arranging straight down
The heat in hot junction is transmitted to relatively low position, the upper end of heat bridge device is connected with the hot junction of semiconductor chilling plate, hot junction heat exchange
The lower end that the hot junction heat exchange case 210 of device 200 can pass through heat bridge device is thermally coupled with the hot junction of semiconductor chilling plate, thus
Provide bigger upwardly extending space for heat dissipation pipeline 220.
Fig. 5 is the schematic explosive view of another kind of hot junction heat-exchanger rig 300 that can be used for semiconductor freezer of the present invention.
This hot junction heat-exchanger rig 300 includes: hot junction heat exchange box 310 and Duo Gen heat dissipation pipeline 320.Hot junction heat exchange box 310 define for
Contain the inner chamber of the cold-producing medium that gas-liquid two-phase coexists, and be configured to allow for cold-producing medium and undergo phase transition heat exchange in it.Many radiatings
Pipeline 320, is configured to allow for cold-producing medium and flows in it and undergo phase transition heat exchange, and being formed as of every heat dissipation pipeline 320
The first end of openend is communicated to the top of the inner chamber of hot junction heat exchange box 310, the tilting from its first end of every heat dissipation pipeline 320
Up bending extends, and ends in it and is formed as the second end of blind end.
Hot junction heat-exchanger rig 300 shown in Fig. 5 is similar to the operation principle of the hot junction heat-exchanger rig 200 shown in Fig. 4, but
Difference is, using the heat dissipation pipeline 320 of many one end closing, and and non-formation loop heat dissipation pipeline 220.Hot junction face and heat
End heat exchange box 310 carries out heat exchange, and hot junction heat exchange box 310 forms evaporimeter, becomes and turns to gaseous state, gaseous cold-producing medium can be in thermal source
Rise along refrigerant line 320 under pressure, transfer heat to outcase of refrigerator 230, then by free convection, heat is passed
Pass space outerpace, refrigerant line 320 forms condenser, becomes liquid, rely on gravity reflux extremely after cold-producing medium condensation heat release
Hot junction heat exchange box 310, reuptakes hot junction heat and is evaporated, and forms thermal cycle.Using the heat dissipation pipeline of this disconnection, produce
Technique is relatively simple, and can preferably be assembled with the shell 230 of refrigerator.
The hot junction heat-exchanger rig 300 of the present embodiment, it would however also be possible to employ the mode being connected with heat bridge is by location arrangements in relatively low
Position, thus providing bigger upwardly extending space for heat dissipation pipeline 320, to have bigger area of dissipation.
Fig. 6 is the schematic diagram of another kind of hot junction heat-exchanger rig 400 that can be used for semiconductor freezer of the present invention.This hot junction
Heat-exchanger rig 400 includes: hot junction heat-conducting plate 410 and Duo Gen radiating annular heat pipe 420.Hot junction heat-conducting plate 410 is thermally coupled with hot junction.
A part for every radiating annular heat pipe 420 and hot junction heat-conducting plate 410 contact heat-exchanging, another part and semiconductor freezer
Outer casing inner wall contact heat-exchanging.
The contact surface that hot junction heat-conducting plate 410 is contacted with the hot junction of semiconductor chip is coated with Heat Conduction Material, to strengthen heat transfer
Effect.Many radiating annular heat pipes 420 be directly embedded in heat-conducting plate 410 or be welded and fixed with heat-conducting plate 410, for convenience of with
Miscellaneous part connects, and radiating annular heat pipe 420 can be selected for flat structure, increases contact area.
Can select on radiating annular heat pipe 420 inwall using the metal dust structure with sintering, this structure produces hair
Spy uses.Under normality, the internal gas-liquid two-phase coexisting state for cold-producing medium of radiating annular heat pipe 420, most liquid due to
Lower position that self gravitation is in pipe is simultaneously attracted to inside sintered powder, on most gaseous state is located in space in pipe
Portion.
When the system is operating, the heat that semiconductor chip hot junction produces passes to hot junction heat-conducting plate 410 by heat transfer, heat
End heat-conducting plate 410 transfers heat to the radiating annular heat pipe 420 being in contact with it again, when the annular heat pipe 420 that radiates is heated, pipe
Interior liquid refrigerant is heated vaporization, and the cold-producing medium vaporization absorbing heat becomes gaseous state, under the promotion of thermal source power
Rise to the top of heat radiating annular heat pipe 420, then heat convection is carried out by outcase of refrigerator housing and space outerpace, again cold
Coagulate back liquid, the cold-producing medium of liquid flows back to radiating annular heat pipe 4200 again because the capillary force of the gravity heating tube of itself acts on
Bottom, then proceed to absorb heat vaporization, thus circulate work.
The shape of every annular heat pipe 420 can be square or rhombus, wherein, under square heat pipe 420 middle position rests against
Horizontal part is thermally contacted with heat-conducting plate 410, and the top horizontal part in square heat pipe 420 position and vertical portion are pasted with outcase of refrigerator inwall
Close, when the cold-producing medium of liquid is located at heat pipe 420 horizontal component, herein, the gravity of itself cannot cause the backflow of cold-producing medium,
But the sintered powder within square heat pipe 420 has capillarity, can produce capillary force, liquid refrigerant is drawn onto heat affected zone
Domain.
One group of diagonal of rhombus annular heat pipe 420 is vertically arranged, and another group of diagonal is horizontally disposed with, position on the lower one
A part for group adjacent side is fixing with heat-conducting plate 410.There is no horizontal component pipeline in rhombus pipeline 420, accordingly it is also possible in managing
The sintered powder structure in portion is removed, and using common light-pipe structure, fully relies on the gravity of itself when liquid refrigerant is dirty.Should
Kind of hot end heat sink 400 need not additionally take refrigerator space, good looking appearance, and need not be extra blower fan forced convertion, quiet,
Without friction, safe and reliable.
Fig. 7 is the schematic diagram of another kind of hot junction heat-exchanger rig 500 that can be used for semiconductor freezer of the present invention.This hot junction
Heat-exchanger rig 500 includes: hot junction heat-conducting plate 510, many heat exchange heat pipes 520, radiating fin 530 and blower fan 540.Hot junction heat-conducting plate
510 is thermally coupled with hot junction.One end of every heat pipe 520 and hot junction heat-conducting plate 510 contact heat-exchanging.Radiating fin 530 is arranged at many
On root heat pipe 520.Blower fan 540 is fixed on radiating fin 530 by retention mechanism, to reach radiating to from many heat pipes 520
The heat of fin 530 carries out forced convertion radiating.For ensure each connection member of heat transfer efficiency between using heat-conducting silicone grease (graphite or its
His medium) contact.This kind of hot junction heat-exchanger rig 500, is conducted heat by heat pipe fin, carries out forced convertion by fan, dissipates
Thermal effect is fast, and structure is simple, easy to maintenance, concise production process.
Fig. 8 is the schematic diagram of another kind of hot junction heat-exchanger rig 600 that can be used for semiconductor freezer of the present invention.This hot junction
Heat-exchanger rig 600 includes: hot junction heat exchange box 610, many heat dissipation pipelines 620, radiating fin 630 and blower fan 640.Hot junction heat exchange box
610 define the inner chamber for containing the cold-producing medium that gas-liquid two-phase coexists, and are configured to allow for cold-producing medium and undergo phase transition in it
Heat exchange.Many heat dissipation pipelines 620 are configured to allow for cold-producing medium and flow in it and undergo phase transition heat exchange, and every heat dissipation pipeline
620 first end being formed as openend is communicated to the top of the inner chamber of hot junction heat exchange box 610, every heat dissipation pipeline 620 from
Its first end is tilted towards Shangdi bending and extends, and ends in it and is formed as the second end of blind end.Radiating fin 630 is arranged at many
On heat dissipation pipeline 620.Blower fan 640 is fixed on radiating fin 630 by retention mechanism, to pass to from many heat dissipation pipelines 620
Heat to radiating fin 630 carries out forced convertion radiating.
In semiconductor chilling plate energising work, hot junction face is carried out this kind of hot junction heat-exchanger rig 600 with hot junction heat exchange box 610
Heat exchange, hot junction heat exchange box 610 forms evaporimeter, becomes and turns to gaseous state, gaseous cold-producing medium can be along refrigeration under thermal source pressure
Agent pipeline 620 rises, and transfers heat to fin 630, then transfers heat to space outerpace, refrigerant line by convection current
620 formation condensers, become liquid after cold-producing medium condensation heat release, rely on gravity reflux to hot junction heat exchange box 610, reuptake heat
End heat is evaporated, and forms thermal cycle, and fin 630 and blower fan 640 improve the condensation rate of refrigerant line 620.Refrigeration
Agent pipeline 620 conducts heat on fin 630, improves the radiating efficiency of fin further by blower fan 640.
Fig. 9 is the schematic diagram of another kind of hot junction heat-exchanger rig 700 that can be used for semiconductor freezer of the present invention, Tu10Shi
The b of another kind of hot junction heat-exchanger rig 700 that can be used for semiconductor freezer of the present invention is to sectional view.This hot junction heat-exchanger rig
700 may include that hot junction heat exchange box 710, many heat dissipation pipelines 720 and multiple palisade fiber tube radiating surface 730 in general manner.Its
In, hot junction heat exchange box 710 defines the inner chamber for containing the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow for cold-producing medium and exists
Heat exchange is undergone phase transition in it；Many heat dissipation pipelines 720 are configured to allow for cold-producing medium and flow in it and undergo phase transition heat exchange, and
Every heat dissipation pipeline 720 after the roof of hot junction heat exchange box 710 extends upwardly to peak, along different perpendiculars bend to
Under extend to hot junction heat exchange box 710 side wall bottom, the inner chamber of the tube chamber of every heat dissipation pipeline 720 and hot junction heat exchange box 710
Connection, forms radiating loop；Multiple palisade fiber tube radiating surfaces 730 recline respectively and are arranged at side or the patch of heat dissipation pipeline 720
By being arranged between two adjacent heat dissipation pipelines 720.
A kind of alternative construction of hot junction heat-exchanger rig 700 is: two heat dissipation pipelines 720 are stretched from hot junction heat exchange box 710 top
Two connecting tubes going out initiate its extension upwards, and tiltedly extend to peak to an inclination after extending to certain altitude, so
Snakelike in two perpendiculars respectively afterwards extend downwardly, eventually through the connecting tube of the bottom of the side wall of hot junction heat exchange box 710
The inner chamber of connection hot junction heat exchange box 710.Palisade fiber tube radiating surface 730 has multigroup radiating fiber tube parallel interval setting to form, including
Three groups, it is affixed on respectively at side and the midfeather of two heat dissipation pipelines 720.Refrigerant heats in hot junction heat exchange box 710
After evaporation, rise along heat dissipation pipeline 720, temperature is distributed to surrounding enviroment, be then gradually condensed into liquid along snakelike pipeline,
Hot junction heat exchange box 710 is returned under Action of Gravity Field.Palisade fiber tube increases area of dissipation, improves radiating efficiency.Heat dissipation pipeline 720
On can also be provided with three-way device for irrigating cold-producing medium.
The cold end heat-exchanger rig introduced by above example is assembled with various forms of hot junctions heat-exchanger rig, constitutes
The refrigeration system of semiconductor freezer, can reliably ensure the normal work of semiconductor chilling plate, and improves heat exchange effect
Rate.
So far, although those skilled in the art will appreciate that detailed herein illustrate and describe the multiple of the present invention and show
Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure
Determine or derive other variations or modifications of many meeting the principle of the invention.Therefore, the scope of the present invention is it is understood that and recognize
It is set to and cover other variations or modifications all these.
So far, although those skilled in the art will appreciate that detailed herein illustrate and describe the multiple of the present invention and show
Example property embodiment, but, without departing from the spirit and scope of the present invention, still can be direct according to present disclosure
Determine or derive other variations or modifications of many meeting the principle of the invention.Therefore, the scope of the present invention is it is understood that and recognize
It is set to and cover other variations or modifications all these.
Claims (13)
1. a kind of cold end heat-exchanger rig for semiconductor freezer, comprising:
Cold end heat-conducting plate, it has the hot linked heat-transfer surface with refrigeration source；
Many refrigeration annular heat pipes, are radially sequentially arranged at intervals in the plane parallel with described heat-transfer surface, wherein
The top of every described refrigeration annular heat pipe and described cold end heat-conducting plate contact heat-exchanging, put down along parallel with described heat-transfer surface
Face down arrangement, wherein
Every described refrigeration annular heat pipe is the axisymmetric polygon of longitudinal centre line with described cold end heat-conducting plate, and it constitutes top
A part for two sides at angle or its top margin and described cold end heat-conducting plate contact heat-exchanging, and every refrigeration annular heat pipe is extremely
The outer surface of the inner bag of few a part of and described semiconductor freezer reclines, and the cold from described cold end is reached described
The storing compartment of semiconductor freezer.
2. cold end heat-exchanger rig according to claim 1, wherein
Every described refrigeration annular heat pipe is rounded square, and at least a portion of its top is contacted with described cold end heat-conducting plate and changes
Heat, two side is along the straight down extension parallel with described heat-transfer surface.
3. cold end heat-exchanger rig according to claim 2, wherein
There is inside the tube chamber of described refrigeration annular heat pipe the metal dust structure of sintering.
4. cold end heat-exchanger rig according to claim 1, wherein
Every described refrigeration annular heat pipe is rhombus, and its first group of diagonal is vertically arranged, and second group of diagonal is horizontally disposed with, structure
Described first group of cornerwise top drift angle and at least a portion of adjacent side of formation described top drift angle is become to lead with described cold end
Hot plate contact heat-exchanging.
5. cold end heat-exchanger rig according to claim 4, wherein
Described refrigeration annular heat pipe is light pipe heat pipe.
6. cold end heat-exchanger rig according to claim 1, wherein
The outer surface of every described refrigeration annular heat pipe is flat square.
7. a kind of semiconductor freezer, comprising:
Inner bag, defines storing compartment in it；
Shell, is arranged at the outside of described inner bag, and it includes u shell and back, after the back of described shell and described inner bag
Wall defines installing space；
Semiconductor chilling plate；
Cold end heat-exchanger rig according to any one of claim 1 to 6, it is all arranged in institute with described semiconductor chilling plate
State in installing space,
Described cold end heat-exchanger rig is installed into makes its heat-transfer surface thermally coupled with the cold end of described semiconductor chilling plate, and makes it
At least a portion of every refrigeration annular heat pipe is reclined with the outer surface of described inner bag, and the cold from described cold end is reached
Described storing compartment.
8. semiconductor freezer according to claim 7, also includes:
Hot junction heat-exchanger rig, thermally coupled with the hot junction of described semiconductor chilling plate, the heat for producing described hot junction distributes
To surrounding environment.
9. semiconductor freezer according to claim 8, wherein
Described hot junction heat-exchanger rig includes:
Hot junction heat exchange box, defines the inner chamber for containing the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow for cold-producing medium and exist
Heat exchange is undergone phase transition in it；With
Heat dissipation pipeline, is configured to allow for cold-producing medium and flows in it and undergo phase transition heat exchange, and
Described heat dissipation pipeline be formed as the first end of openend and the second end is all communicated to the inner chamber of described hot junction heat exchange box
Top,
Described heat dissipation pipeline is tilted towards Shangdi bending from its first end and the second end respectively and extends to common extreme higher position.
10. semiconductor freezer according to claim 8, wherein
Described hot junction heat-exchanger rig includes:
Hot junction heat exchange box, defines the inner chamber for containing the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow for cold-producing medium and exist
Heat exchange is undergone phase transition in it；With
Many heat dissipation pipelines, are configured to allow for cold-producing medium and flow in it and undergo phase transition heat exchange, and
The first end being formed as openend of every described heat dissipation pipeline is communicated to the top of the inner chamber of described hot junction heat exchange box,
Being tilted towards Shangdi bending from its first end and extend of every described heat dissipation pipeline, end in that it is formed as blind end second
End.
11. semiconductor freezers according to claim 8, wherein
Described hot junction heat-exchanger rig includes:
Hot junction heat-conducting plate, it is thermally coupled with described hot junction；With
Many radiating annular heat pipes, a part for every described radiating annular heat pipe and described hot junction heat-conducting plate contact heat-exchanging, separately
The contact internal walls heat exchange of a part of shell with described semiconductor freezer.
12. semiconductor freezers according to claim 8, wherein
Described hot junction heat-exchanger rig includes:
Hot junction heat-conducting plate, it is thermally coupled with described hot junction；
Many radiating heat pipes, one end of every described radiating heat pipe and described hot junction heat-conducting plate contact heat-exchanging；
Radiating fin, is arranged on described many radiating heat pipes；With
Blower fan, is fixed on described radiating fin by retention mechanism, to reach described radiating to from described many radiating heat pipes
The heat of fin carries out forced convertion radiating.
13. semiconductor freezers according to claim 8, wherein
Described hot junction heat-exchanger rig includes:
Hot junction heat exchange box, defines the inner chamber for containing the cold-producing medium that gas-liquid two-phase coexists, and is configured to allow for cold-producing medium and exist
Heat exchange is undergone phase transition in it；
Many heat dissipation pipelines, are configured to allow for cold-producing medium and flow in it and undergo phase transition heat exchange, and
The first end being formed as openend of every described heat dissipation pipeline is communicated to the top of the inner chamber of described hot junction heat exchange box,
Being tilted towards Shangdi bending from its first end and extend of every described heat dissipation pipeline, end in that it is formed as blind end second
End；
Radiating fin, is arranged on described many heat dissipation pipelines；With
Blower fan, is fixed on described radiating fin by retention mechanism, to reach described radiating to from described many heat dissipation pipelines
The heat of fin carries out forced convertion radiating.
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| CN201410123561.0A CN104329868B (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
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| CN201410123561.0A CN104329868B (en) | 2014-03-28 | 2014-03-28 | Semiconductor refrigeration refrigerator and cold-end heat exchange device thereof |
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| CN104329868B true CN104329868B (en) | 2017-01-18 |
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| CN105486131A (en) * | 2016-01-18 | 2016-04-13 | 河南鸿昌电子有限公司 | Heat dissipation pipe multi-section type heat dissipation piece |
| US9750160B2 (en) * | 2016-01-20 | 2017-08-29 | Raytheon Company | Multi-level oscillating heat pipe implementation in an electronic circuit card module |
| CN107796140A (en) * | 2016-08-31 | 2018-03-13 | 青岛海尔智能技术研发有限公司 | Hot junction heat-exchanger rig and semiconductor refrigerating equipment for semiconductor refrigerating equipment |
| CN107658682B (en) * | 2017-10-16 | 2019-11-01 | 长春理工大学 | A kind of cooling device and laser of thin-sheet laser gain media |
| CN114111097B (en) * | 2021-11-04 | 2023-03-31 | 浙江汉恒热电科技有限公司 | Energy-saving double-temperature-zone electronic refrigerator |
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