CN2830990Y - Refrigerator - Google Patents
Refrigerator Download PDFInfo
- Publication number
- CN2830990Y CN2830990Y CNU2005200870650U CN200520087065U CN2830990Y CN 2830990 Y CN2830990 Y CN 2830990Y CN U2005200870650 U CNU2005200870650 U CN U2005200870650U CN 200520087065 U CN200520087065 U CN 200520087065U CN 2830990 Y CN2830990 Y CN 2830990Y
- Authority
- CN
- China
- Prior art keywords
- storage box
- liquid storage
- radiating tube
- semiconductor refrigerating
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims abstract description 133
- 239000004065 semiconductor Substances 0.000 claims abstract description 77
- 239000002826 coolant Substances 0.000 claims abstract description 41
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000005484 gravity Effects 0.000 abstract description 27
- 230000005855 radiation Effects 0.000 abstract description 12
- 238000001816 cooling Methods 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000008016 vaporization Effects 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000005057 refrigeration Methods 0.000 description 4
- 238000009834 vaporization Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002510 pyrogen Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
- F25B2321/0252—Removal of heat by liquids or two-phase fluids
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a refrigerator which comprises a semiconductor refrigerating element, wherein the semiconductor refrigerating element comprises a hot end and a cold end. The hot end of the semiconductor refrigerating element is provided with a heat radiation device. A hot end of the semiconductor refrigerator is abutted with a liquid storing box communicated with heat radiation pipes. Cooling medium is respectively filled in the liquid storing box and the heat radiation pipes. The partial wall surface of the liquid storing box which is not abutted with the hot end of the semiconductor refrigerator is concave towards the inner part of the liquid storing box. The partial liquid storing box is trapezoidal. The small end surface of the trapezoidal part of the liquid storing box is abutted with the hot end of the semiconductor refrigerator. One side of the liquid storing box which is opposite to the trapezoidal small end surface is concave towards the inner part of the liquid storing box. The back upper part of the liquid storing box is provided with a box body part which is convex out of the liquid storing box. A plurality of groups of heat radiation pipes are arranged. The heat radiation pipes are respectively and singly communicated with the liquid storing box. The structure of a gravity hot pipe type radiator of the refrigerator is reasonable, the heat radiation efficiency of the heat radiation pipes is high and the refrigerating efficiency of the refrigerator is high.
Description
Technical field
The utility model relates to a kind of refrigerating plant, is specifically related to a kind of refrigerating plant that is provided with gravity assisted heat pipe type radiator.
Background technology
Semiconductor refrigerating technology possesses that volume is small and exquisite, pollution-free, noiselessness, characteristic of simple structure, therefore applicable to multiple occasion.The principle of semiconductor refrigerating technology is to produce heat absorption and exothermic phenomenon by the potential variation that electronics and hole take place in power circuit, is that the semiconductor refrigerating assembly produces cold junction and hot junction, and then realizes the function of refrigeration and pyrogenicity.The semiconductor refrigerating element will improve the refrigerating capacity of refrigeration end under thermal equilibrium state, a main link is to improve the radiating efficiency in hot junction, reduces the heat accumulation in hot junction, lowers the temperature difference at two ends to greatest extent, to obtain the more cold of cold junction.The radiating mode in semiconductor refrigerating assembly hot junction adopts mental-finned to add the fan forced heat radiation usually the earliest, or interior circulation nature water-cooled and outer circulation Forced water cooling etc., but above-mentioned radiating efficiency is lower, descends thereby lead the system refrigerating efficiency.For improving the radiating efficiency of radiator for semiconductor, Chinese patent CN2124438 discloses a kind of semiconductor gravity assisted heat pipe radiator, can be used for the heat radiation of semiconductor air conditioner and semi-conductor electricity refrigerator.It comprises gravity assisted heat pipe and energy transmission sheet, and characteristics are that the gravity assisted heat pipe top is hemispherical or circular arc, and acceleration pump is housed in the pipe, and parallel fin and flange are housed outside the pipe, and the pipe end connects the semiconductor cold-hot heap.The technical scheme that above-mentioned patent provides can make the radiating efficiency in semiconductor refrigerating element hot junction obtain certain raising, but the efficient of cooling medium absorption heat is still relatively low in the cooling system, radiating efficiency is received restriction to a certain degree, the refrigerating function of semiconductor refrigerating assembly does not become to give full play to, and has caused the waste of energy.
The utility model content
The utility model provides a kind of refrigerating plant, and this refrigerating plant is provided with gravity assisted heat pipe type radiator, and the radiating rate of gravity assisted heat pipe type radiator is fast in this refrigerating plant, the radiating efficiency height.
The utility model further provides a kind of refrigerating plant, and this refrigerating plant is provided with gravity assisted heat pipe type radiator, and this radiator can improve the refrigerating efficiency of refrigerating plant, and the energy that the semiconductor refrigerating element is produced is fully used.
For realizing foregoing invention purpose of the present utility model, the utility model has adopted following technical proposals.
The utility model discloses a kind of refrigerating plant, comprise the semiconductor refrigerating element, the semiconductor refrigerating element comprises hot junction and cold junction, the hot junction of described semiconductor refrigerating element is provided with heat abstractor, it is characterized in that described heat abstractor comprises the liquid storage box of fitting with the semiconductor cooling device hot junction, described liquid storage box is communicated with radiating tube, fill cooling medium in described liquid storage box and the described radiating tube, the part wall of the liquid storage box of fitting with the semiconductor cooling device hot junction is not recessed to liquid storage box inside.
In the technique scheme, fit in the hot junction of liquid storage box and semiconductor refrigerating element, cooling medium in the liquid storage box absorbs the heat and the vaporization of semiconductor refrigerating element, enter radiating tube afterwards, cooling medium in the radiating tube is undertaken being re-condensed into liquid is back to absorption semiconductor refrigerating element hot junction in the liquid storage box under the gravity effect heat after the heat exchange by tube wall and air, and it is cooled off.At the hot junction of semiconductor refrigerating element applying liquid storage box, liquid storage box can hold relatively large refrigerant, refrigerant is by the hot junction transmission of heat by contact of liquid storage box wall and semiconductor refrigerating element, absorb the heat in the hot junction of semiconductor refrigerating element, and the heat of this absorption enters in the radiating tube by carrying out the heat exchange cooling than large tracts of land and air by the refrigerant after vaporizing, therefore radiating rate is fast, and radiating efficiency improves.
And liquid storage box adopts further preferred structure: the part wall of the liquid storage box of fitting with semiconductor refrigerating element hot junction is not recessed to liquid storage box inside.
Adopt in the radiator structure of liquid storage box and semiconductor refrigerating element hot junction applying, because the hot junction of semiconductor cooling device and the surface area of cold junction have certain limitation, therefore the binding face to the liquid storage box of fitting with the hot junction has certain requirement, and in the entire heat dissipation system, be liquid storage box with the whole circulation system that is communicated with of radiating tube in, owing to will realize the mutual conversion of liquids and gases, should keep certain gas compartment in the circulatory system, have only the gentle body space of the liquid of adjusting suitable, just can reach the preferably coupling that gas and liquid transform, and then reach better radiating efficiency.And in the radiating mode of the above-mentioned semiconductor refrigerating element that passes through liquid storage box and radiating tube, be the pressure coupling in the realization heat circulating system and the applying in liquid storage box and semiconductor refrigerating element hot junction, the liquid level of the liquid in the liquid storage box is relatively low, be that cooling medium contacts little with the surface area in semiconductor refrigerating element hot junction in the liquid storage box, therefore the abundant heat of absorption refrigeration element hot junction generation of cooling medium, radiating efficiency is low, thereby has reduced the refrigerating efficiency of semiconductor element.In the utility model, on the basis of above-mentioned liquid storage box, change the structure of above-mentioned liquid storage box, make not the part wall of the liquid storage box of fitting recessed to liquid storage box inside with semiconductor refrigerating element hot junction, therefore improved the liquid level of the cooling medium that contacts with semiconductor refrigerating element hot junction relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium caloric receptivity increases and has improved radiating efficiency, make that under the same conditions hot-side temperature reduces relatively, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
For simplifying the liquid storage box structure, convenience is processed and in refrigerator liquid storage box is fixed, described liquid storage box part in echelon, the small end face of described liquid storage box trapezoidal portions and the applying of the hot junction of semiconductor cooling device, the side direction liquid storage box inside that described liquid storage box is relative with trapezoidal small end face is recessed.
For adjust liquid storage box and the applying in semiconductor refrigerating element hot junction and in heat dissipation circulating system the coupling of pressure, the setting of described trapezoidal liquid storage box upper back protrudes in the box portion of liquid storage box.
In the gravity assisted heat pipe type radiator, heat mainly contacts the heat that cooling medium in the heat pipe is absorbed by radiating tube and is discharged in the surrounding air with air, and then the gas cooling medium in the radiating tube is converted into liquid is back in the liquid storage box, reuptake the heat that semiconductor refrigerating element hot junction produces, for improving the radiating efficiency of radiating tube, described radiating tube is a coil pipe, and described coil pipe is obliquely installed.
Radiating tube becomes coil pipe, can increase the area of dissipation of radiating tube in limited area.The coil pipe of radiating tube is arranged on same plane usually, therefore coil pipe is obliquely installed, can make coil pipe mutual dislocation in the vertical, the heat that the heat that the bottom coil pipe discharges can or not reduce bottom coil pipe rising touches the coil pipe on top, so can improve the radiating efficiency of coil pipe.
Cooling medium in the liquid storage box has absorbed behind the heat in semiconductor refrigerating element hot junction and with after the gasification of partially liq cooling medium, fast more rising enters radiating tube and then circulates fast more, radiating efficiency is high more, and the raising circulation rate, cooled liquid medium is back in the liquid storage box fast more, can improve radiating efficiency equally, so adopt described radiating tube in the utility model, be communicated with described liquid storage box separately respectively for many groups.And organize radiating tube more and can increase heat transfer area, reduce the temperature of withdrawing fluid.
And on liquid storage box, connect a plurality of radiating tubes for further being convenient to, connect by fin or wing bar between described radiating tube.
Radiating tube can be lowered the temperature to cooling medium after the port of export enters coil pipe immediately, therefore if the coil pipe port of export touches cooled coil pipe, can be to cooled coil pipe release heat, reduce the radiating efficiency of coil pipe, contact cooled coil pipe for preventing that a plurality of coil pipe ports of export from drawing along different directions, the port of export of described radiating tube is provided with side by side in the same way.
For ease of the setting of coil pipe, described radiating tube is a coil pipe, and described coil pipe is bent into the U type.Because the semiconductor refrigerating element is generally less refrigerating plant refrigeration, for reducing the occupied area of plane of coil pipe, coil pipe can be bent into the U type.This kind design is specially adapted to the structure that a plurality of coil pipes are set up in parallel.
Be similarly in limited area more large-area coil pipe be set, improve radiating efficiency, described radiating tube side by side or front and back be provided with.
And be the radiating efficiency that further improves gravity assisted heat pipe type radiator, radiating fin or wing bar can be set on radiating tube.
Adopt the gravity assisted heat pipe radiating principle in the utility model, carry out the gas-liquid conversion between cooling medium, the cooling medium that converts liquid to flows by gravity back in the liquid storage box, and therefore for cooling medium is refluxed smoothly, the pipeline of described coil pipe coils along top-down incline direction.
The endless form of the closed circuit that cooling medium forms between liquid storage box and radiating tube is: cooling medium absorbs behind the heat that semiconductor refrigerating element hot junction produces vaporization and rises to the upper space of liquid storage box and enter in the radiating tube in liquid storage box, in radiating tube, the heat that absorbs and surrounding air carried out cooling off after the heat exchange and convert liquid again to, under the gravity effect, cooled liquid enters liquid storage box through the inlet of radiating tube, therefore enter liquid storage box for ease of the cooling medium after the liquefaction and prevent that the liquid cooling medium of backflow stops that the cooling medium of the back vaporization of being heated rises, the entrance point of described radiating tube is communicated with the bottom of described liquid storage box.
As mentioned above, rising and enter radiating tube in the cooling medium cooling back in the liquid storage box, therefore enters radiating tube for ease of cooling medium and form heat radiation circulation smoothly, and the port of export of described radiating tube is communicated with the top of described liquid storage box.
Gravity assisted heat pipe type radiator is refrigerator, air-conditioning or refrigerator etc. applicable to various refrigerating plants as refrigerating plant in the utility model.
In the utility model, the radiating mode that has adopted liquid storage box to combine with radiating tube, radiator structure with respect to the conventional semiconductor cooling module, radiating efficiency is significantly improved, and further the liquid storage box structure is improved, make not the part wall of the liquid storage box of fitting recessed to liquid storage box inside with semiconductor refrigerating element hot junction, improved the liquid level of the cooling medium that contacts with semiconductor refrigerating element hot junction relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium heat absorption efficiency improves, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
And coil pipe is obliquely installed; The coil pipe pipeline coils along top-down incline direction; Described radiating tube is many groups, is communicated with described liquid storage box separately respectively, all can improve radiating tube radiating efficiency in the radiator, has improved the refrigerating efficiency of semiconductor refrigerating element equally.
Description of drawings
Fig. 1 is the liquid storage box specific embodiment structure side view that is provided with the refrigerating plant of gravity assisted heat pipe type radiator.
Fig. 2 be among Fig. 1 A-A to cutaway view.
Fig. 3 is the right view of Fig. 1 liquid storage box.
Fig. 4 is the vertical view of Fig. 1 liquid storage box.
Fig. 5 is the gravity heat pipe radiator specific embodiment 1 a structure front view.
Fig. 6 is a radiator deployed configuration schematic diagram among Fig. 5.
Fig. 7 is the structure front view of the gravity heat pipe radiator specific embodiment 2
Fig. 8 is the vertical view of Fig. 7.
Fig. 9 is provided with the refrigerator of gravity assisted heat pipe type radiator or the structural representation of refrigerator-freezer.
Figure 10 be among Fig. 9 B-B to cutaway view.
The specific embodiment
As Fig. 9, a kind of refrigerator or ice box 6 that is provided with gravity assisted heat pipe type radiator shown in Figure 10, this refrigerator or ice box are single body structure, structure for explanation semiconductor refrigerating element and gravity assisted heat pipe type radiator, refrigerator or refrigerator-freezer can adopt other versions, for saying something conveniently, saved the door body of refrigerator or refrigerator-freezer in the diagram among Fig. 9, Figure 10;
Refrigerator or refrigerator-freezer 6 include casing 61, perforate 7 on the rear wall 62 of casing 61, the inside of hole 7 corresponding refrigerator bodies is provided with semiconductor refrigerating element 4, the side of semiconductor refrigerating element 4 towards the refrigerator body inboard is cold junction, and the side towards the refrigerator body outside is the hot junction, be fitted with the liquid storage box 1 of gravity assisted heat pipe type heat abstractor in the hot junction of semiconductor refrigerating element, liquid storage box 1 is fixed in the perforate 7, is provided with sealing insulation material 8 between hole 7 and the liquid storage box 1.
As Fig. 5, Fig. 7, gravity assisted heat pipe type radiator shown in Figure 8, the liquid storage box 1 that this radiator comprises and fit in semiconductor refrigerating element hot junction, liquid storage box 1 is communicated with radiating tube 2, filling cooling medium 3 in liquid storage box 1 and the radiating tube 2.
Shown in Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 1 O, the front portion 31 of liquid storage box 3 in echelon, the small end face of liquid storage box trapezoidal portions 32 is fitted with the hot junction of semiconductor refrigerating element 4, the rear wall 33 that liquid storage box is relative with trapezoidal small end face is recessed to liquid storage box inside.Certainly, liquid storage box 1 can be made into simple box body, and this box body directly is connected with radiating tube, can realize improving the function of radiating efficiency equally, and this box body can be arranged to trapezoidal.The rear wall 33 that liquid storage box is relative with trapezoidal small end face is recessed to liquid storage box inside, with respect to simple liquid storage box box body, can improve the height of cooling medium liquid level in the liquid storage box, the contact-making surface knot in cooling medium and semiconductor hot junction further improves the radiating efficiency to the semiconductor hot junction in the increase liquid storage box.
The upper back of trapezoidal liquid storage box part is provided with the box portion 34 that protrudes in liquid storage box.
As Fig. 5, Fig. 6, Fig. 7, shown in Figure 8, radiating tube 2 is a coil pipe;
As shown in Figure 9, coil pipe 2 is divided into two parts 21 and 22, coil pipe 21 parts vertically are provided with, and coil pipe 22 parts are obliquely installed, coil portions 22 is obliquely installed, can make coil pipe mutual dislocation in the vertical, reduce or the heat of avoiding the bottom coil pipe to rise touches the coil pipe on top, therefore can improve the radiating efficiency of coil pipe.
The port of export 23 of radiating tube is communicated with the box portion 34 that give prominence on the top of liquid storage box.
The entrance point 24 of radiating tube is communicated with the bottom of liquid storage box 1.
After carrying out the gas-liquid conversion between cooling medium, reflux smoothly for the cooling medium that converts liquid to is flowed by gravity back in the liquid storage box, the pipeline 25 of coil pipe 2 coils along top-down incline direction.
The heat gasification back circulation that cooling medium in the liquid storage box 1 has absorbed semiconductor refrigerating element hot junction is fast more, and radiating efficiency is high more, so the radiating tube 2 that adopts among the present invention is two groups, is communicated with liquid storage box 1 separately respectively.
And be the radiating efficiency that further improves radiating tube, heat radiation wing bar 5 is set on the radiating tube 2.
As Fig. 7, shown in Figure 8,2 fens front and back of two groups of gravity-type radiating tube coil pipes are communicated with liquid storage box 1, and when radiating tube divided two groups to be provided with, for ease of interfixing between radiating tube and installing, 2 in coil pipe passed through wing bar 5 and connects.
Radiating tube can be lowered the temperature to cooling medium after the port of export 23 enters coil pipe 2 immediately, therefore if the coil pipe port of export touches cooled coil pipe, can be to cooled coil pipe release heat, reduce the radiating efficiency of coil pipe, contact cooled coil pipe for preventing that a plurality of coil pipe ports of export from drawing along different directions, as shown in Figure 7, the port of export 23 of radiating tube is along being provided with in the same way side by side.
As Fig. 5, shown in Figure 6, when being communicated with liquid storage box 1 respectively side by side about two coil pipes divide, for ease of the setting of coil pipe, coil pipe is bent into the U type by pipeline 26 places.
In the above-mentioned specific embodiment, cooling medium 3 in the endless form of the closed circuit of liquid storage box 1 and 2 formation of radiating tube is: cooling medium 3 absorbs behind the heat that semiconductor refrigerating element 4 hot junctions produce vaporization and rises to the upper space of liquid storage box and enter in the radiating tube 2 in liquid storage box, in radiating tube 2, the heat that absorbs and surrounding air carried out cooling off after the heat exchange and convert liquid again to, under the gravity effect, cooled liquid enters liquid storage box 1 through the inlet of radiating tube, and circulation is the hot junction cooling of semiconductor refrigerating element so repeatedly.
In the above-mentioned specific embodiment, by the rear wall of liquid storage box is recessed to the inside of liquid storage box 1, improved the liquid level that cooling medium contacts with semiconductor refrigerating element hot junction in the liquid storage box relatively, and then improved the contact area in cooling medium and semiconductor refrigerating element hot junction, the cooling medium heat absorption efficiency improves, according to heat balance principle, improved the refrigerating efficiency of semiconductor refrigerating element accordingly.
And radiating tube 2 is provided with two groups, be communicated with described liquid storage box separately respectively; Coil pipe 2 is obliquely installed; Coil pipe pipeline 25 coils along top-down incline direction, all can improve radiating tube radiating efficiency in the radiator, has improved the refrigerating efficiency of semiconductor refrigerating element equally.
In the utility model, be readily appreciated that, this gravity assisted heat pipe type radiator is applicable to the heat radiation of various semiconductor refrigerating elements, as long as gravity assisted heat pipe type radiator is fitted to the hot junction of semiconductor refrigerating element, all can realize improving the function of radiating efficiency, the refrigerating efficiency of corresponding raising semiconductor refrigerating element.
Claims (10)
1, a kind of refrigerating plant, comprise the semiconductor refrigerating element, the semiconductor refrigerating element comprises hot junction and cold junction, the hot junction of described semiconductor refrigerating element is provided with heat abstractor, it is characterized in that described heat abstractor comprises the liquid storage box of fitting with semiconductor refrigerating element hot junction, described liquid storage box is communicated with radiating tube, fill cooling medium in described liquid storage box and the described radiating tube, the part wall of the liquid storage box of fitting with semiconductor refrigerating element hot junction is not recessed to liquid storage box inside.
2, refrigerating plant according to claim 1, it is characterized in that, described liquid storage box part in echelon, the applying of the hot junction of the small end face of described liquid storage box trapezoidal portions and semiconductor refrigerating element, the side direction liquid storage box inside that described liquid storage box is relative with trapezoidal small end face is recessed.
3, refrigerating plant according to claim 1 is characterized in that, described liquid storage box upper back is provided with the box portion that protrudes in liquid storage box.
4, refrigerating plant according to claim 1 is characterized in that, described radiating tube is a coil pipe, and described coil pipe is obliquely installed.
According to claim 1 or 4 described refrigerating plants, it is characterized in that 5, described radiating tube is many groups, is communicated with described liquid storage box separately respectively.
6, refrigerating plant according to claim 5 is characterized in that, the port of export of described radiating tube is provided with side by side in the same way.
7, refrigerating plant according to claim 5 is characterized in that, described radiating tube side by side or front and back be provided with.
8, refrigerating plant according to claim 5 is characterized in that, described radiating tube is a coil pipe, and described coil pipe is bent into the U type.
9, refrigerating plant according to claim 5 is characterized in that, connects by fin or wing bar between described radiating tube.
According to the described refrigerating plant of arbitrary right in the claim 1 to 9, it is characterized in that 10, described refrigerating plant is refrigerator, air-conditioning or refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200870650U CN2830990Y (en) | 2005-09-10 | 2005-09-10 | Refrigerator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200870650U CN2830990Y (en) | 2005-09-10 | 2005-09-10 | Refrigerator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2830990Y true CN2830990Y (en) | 2006-10-25 |
Family
ID=37135917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200870650U Expired - Lifetime CN2830990Y (en) | 2005-09-10 | 2005-09-10 | Refrigerator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2830990Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigerating chip heat dissipation assembly for refrigerator |
| CN102445091A (en) * | 2010-09-29 | 2012-05-09 | 三花丹佛斯（杭州）微通道换热器有限公司 | Heat exchanger |
| CN102563955A (en) * | 2012-03-14 | 2012-07-11 | 浙江大学 | Solar energy driven semiconductor quick refrigerating device and water dispenser containing same |
| CN106969533A (en) * | 2017-05-25 | 2017-07-21 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box and heat dissipation device thereof |
| CN107504714A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN110431288A (en) * | 2017-03-15 | 2019-11-08 | 爱尔铃克铃尔股份公司 | Oil sump |
-
2005
- 2005-09-10 CN CNU2005200870650U patent/CN2830990Y/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102445091A (en) * | 2010-09-29 | 2012-05-09 | 三花丹佛斯（杭州）微通道换热器有限公司 | Heat exchanger |
| CN102445091B (en) * | 2010-09-29 | 2013-11-06 | 三花控股集团有限公司 | Heat exchanger |
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigerating chip heat dissipation assembly for refrigerator |
| CN102563955A (en) * | 2012-03-14 | 2012-07-11 | 浙江大学 | Solar energy driven semiconductor quick refrigerating device and water dispenser containing same |
| CN107504714A (en) * | 2012-05-07 | 2017-12-22 | 弗诺尼克设备公司 | It is related to the system and method for thermoelectric heat exchange system |
| US10458683B2 (en) | 2014-07-21 | 2019-10-29 | Phononic, Inc. | Systems and methods for mitigating heat rejection limitations of a thermoelectric module |
| CN110431288A (en) * | 2017-03-15 | 2019-11-08 | 爱尔铃克铃尔股份公司 | Oil sump |
| CN106969533A (en) * | 2017-05-25 | 2017-07-21 | 珠海格力电器股份有限公司 | Semiconductor refrigeration box and heat dissipation device thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Effective date of abandoning: 20091209 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |