CN109168288B - Radiator and electronic product - Google Patents

Radiator and electronic product Download PDF

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Publication number
CN109168288B
CN109168288B CN201810748933.7A CN201810748933A CN109168288B CN 109168288 B CN109168288 B CN 109168288B CN 201810748933 A CN201810748933 A CN 201810748933A CN 109168288 B CN109168288 B CN 109168288B
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piece
fixing piece
elastic
heat
bottom plate
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CN109168288A (en
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冯锦松
李伟
姚勇
邝先昆
杜玮
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Abstract

The application discloses radiator, including first heat dissipation monomer and second heat dissipation monomer, first heat dissipation monomer includes first bottom plate and a plurality of first fin, a plurality of first fins are located on the first bottom plate, second heat dissipation monomer includes second bottom plate and a plurality of second fin, a plurality of second fins are located on the second bottom plate, first bottom plate includes first connecting portion, the second bottom plate includes second connecting portion, first connecting portion and second connecting portion are relative each other, and are equipped with the clearance between the two, radiator still includes the connecting piece, and the connecting piece includes stationary blade and elastic component, and the one end of stationary blade is fixed in first connecting portion, and the other end of stationary blade is fixed in second connecting portion, and the elastic component is located between stationary blade and the first connecting portion and between stationary blade and the second connecting portion. The heat sink of the present invention has the advantages of light weight and good heat dissipation effect.

Description

Radiator and electronic product
Technical Field
The invention relates to a heat radiator structure which is used in communication products or electronic products and provides heat radiation for chips.
Background
With the increase of power consumption of chips and single boards of devices such as routers and transmission networks, the space of the single boards and cabinets cannot be increased in equal proportion, so that the power density is continuously increased, and the requirement on heat dissipation is higher and higher. Meanwhile, the layout of the single-board multi-chip requires uniform temperature heat dissipation, so that the phenomenon that the chip is overheated due to poor local heat dissipation conditions is avoided.
In the prior art, a floating radiator with a support bracket is generally adopted for temperature equalization heat dissipation, the heat pipe connection between heat absorption blocks is utilized to achieve the temperature equalization effect, and meanwhile, the floating radiator structure can absorb the height tolerance of a chip and a part, so that the problems of poor contact of the chip and uneven pressure are avoided.
Fig. 1 shows a prior art heat sink structure with a supporting bracket, which includes two heat sinks 12 and a bracket 14, and the number of the heat sinks 12 may be two, but may also be multiple. Each heat sink 12 includes a base plate 121 and heat radiating fins 122 protruding from one side of the base plate 121. The heat sink 12 is fixedly connected above the bracket 14 by fixing screws 13 to form two or more heat sinks 12 into a whole, and the heat sink 12 together with the bracket 14 is fixed on a circuit board in a product by floating screws 15 to realize that the heat sink structure dissipates heat for chips on the circuit board.
The disadvantages of the prior art described above are as follows: because the heat sink 12 needs a bracket 14 for supporting, the bracket 14 needs an additional fixing screw 13 for fixing, the fixing screw 13 and the floating screw 14 need to avoid positions, and more heat dissipation fins 122 need to be cut off, thereby affecting the heat dissipation effect; and because of the support that needs, the setting of support has increased the holistic weight of product and volume.
Disclosure of Invention
The invention provides a light radiator with floatable characteristic and an electronic product using the radiator.
In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:
the invention provides a radiator, which comprises a first radiating single body and a second radiating single body, wherein the first radiating single body comprises a first bottom plate and a plurality of first fins, the plurality of first fins are arranged on the first base plate, the second heat dissipation unit comprises a second base plate and a plurality of second fins, the plurality of second fins are arranged on the second bottom plate, the first bottom plate comprises a first connecting part, the second base plate includes a second connection part, the first connection part and the second connection part being opposite to each other, and a gap is arranged between the two, the radiator also comprises a connecting piece, the connecting piece comprises a fixing piece and an elastic piece, one end of the fixing piece is fixed on the first connecting part, the other end of the fixing piece is fixed on the second connecting part, the elastic piece is located between the fixing piece and the first connecting portion and between the fixing piece and the second connecting portion.
The elastic piece is an elastic gasket which is arranged between the fixing piece and the first connecting portion and between the fixing piece and the second connecting portion in a stacked mode, and the elastic piece is fixed between the fixing piece and the first connecting portion and between the fixing piece and the second connecting portion through the matching of a pair of screws and a pair of nuts.
The elastic piece and the fixing piece are integrally formed, the elastic piece comprises a first elastic part and a second elastic part, the first elastic part is integrally formed at one end of the fixing piece connected with the first connecting part, and the second elastic part is integrally formed at one end of the fixing piece connected with the second connecting part.
The elastic piece is a metal elastic piece, the metal elastic piece is arranged between the fixing piece and the first connecting portion and the second connecting portion in a stacked mode, the metal elastic piece comprises a first bending portion and a second bending portion, the first bending portion is elastically connected between the fixing piece and the first connecting portion, and the second bending portion is connected between the fixing piece and the second connecting portion.
The elastic piece is a pair of springs, one of the springs is elastically connected between the fixing piece and the first connecting portion, and the other spring is elastically connected between the fixing piece and the second connecting portion.
The heat sink further comprises a plurality of floating screws, and the floating screws are used for connecting the first heat dissipation unit and the second heat dissipation unit to a circuit board.
One of the floating screws passes through the connecting member and the first connecting portion, and one of the floating screws passes through the connecting member and the second connecting portion.
The radiator further comprises a heat pipe, one end of the heat pipe extends into the space between the first base plate and the first fins, and the other end of the heat pipe extends into the space between the second base plate and the second fins.
Compared with the prior art, the first connecting part of the first base plate is opposite to the second connecting part of the second base plate, a gap is arranged between the first connecting part of the first base plate and the second connecting part of the second base plate, and the first heat dissipation unit and the second heat dissipation unit are connected through the fixing piece and the elastic piece of the connecting piece. The first radiating single body and the second radiating single body are combined without arranging a support at the bottom of the first radiating single body and the second radiating single body, so that the radiator is light in weight and small in size, and the first radiating single body and the second radiating single body are fixed to the support without fixing screws, so that the space for fixing the screws is not required to be reserved on radiating fins, the area of the radiating fins can be ensured, and the radiating effect of the radiator can be provided.
In addition, the embodiment of the invention also provides the following technical scheme:
in a first aspect, the present invention provides a heat sink, including a first heat dissipating unit and a second heat dissipating unit, where the first heat dissipating unit includes a first bottom plate and a plurality of first fins, the plurality of first fins are disposed on a top surface of the first bottom plate, the second heat dissipating unit includes a second bottom plate and a plurality of second fins, the plurality of second fins are disposed on a top surface of the second bottom plate, the first bottom plate and the second bottom plate are butted with each other with a gap therebetween, the heat sink further includes a connecting member, the connecting member includes a fixing plate, a pair of fastening members and an elastic member, the fixing plate is disposed at a butt joint of the first bottom plate and the second bottom plate, one of the fastening members sequentially penetrates through the first bottom plate and the fixing plate to connect the fixing plate to the first bottom plate, and the other fastening member sequentially penetrates through the second bottom plate and the fixing plate to connect the fixing plate to the second bottom plate, the elastic member is elastically connected between one of the fastening members and the top surface of the first base plate and between the other of the fastening members and the top surface of the second base plate.
In a first possible embodiment, the elastic member includes a first elastic body elastically coupled between one of the fastening members and the top surface of the first base plate, and a second elastic body elastically coupled between the other fastening member and the top surface of the second base plate.
In a second possible embodiment, the elastic member is of a one-piece structure, and is provided with two through holes, wherein one of the fasteners passes through one of the through holes, the first base plate and the fixing plate in sequence and cooperates with one of the spring washers to connect the fixing plate to the first base plate; the other fastener penetrates through the other through hole, the second bottom plate and the fixing plate in sequence and is matched with one spring washer to connect the fixing plate to the second bottom plate, and the two spring washers are positioned on one side of the fixing plate, which is far away from the first bottom plate and the second bottom plate.
In a third possible implementation manner, the fixing sheet includes a first connecting end, a second connecting end, and a connecting section connected between the first connecting end and the second connecting end, the first connecting end is connected to the first bottom plate through the fastening member, the second connecting end is connected to the second bottom plate through the fastening member, and the connecting section includes a bending portion so that a distance between the first bottom plate and the second bottom plate is adjustable.
With reference to any one of the foregoing embodiments, in a fourth possible embodiment, the heat sink further includes a heat pipe, the heat pipe spans a joint between the first base plate and the second base plate, one end of the heat pipe extends into a space between the first base plate and the first fin, and the other end of the heat pipe extends into a space between the second base plate and the second fin.
In a second aspect, the present invention further provides an electronic product, including a circuit board and a heat sink, where the circuit board is provided with two heating elements, the heat sink includes a first heat dissipating unit and a second heat dissipating unit, the first heat dissipating unit includes a first bottom plate and a plurality of first fins, the plurality of first fins are disposed on a top surface of the first bottom plate, the second heat dissipating unit includes a second bottom plate and a plurality of second fins, the plurality of second fins are disposed on a top surface of the second bottom plate, the first bottom plate and the second bottom plate are butted with each other, and a gap is disposed between the first bottom plate and the second bottom plate, the heat sink further includes a connecting piece, the connecting piece includes a fixing piece, a pair of fastening pieces and an elastic piece, and the fixing piece is disposed at a butt joint between the first bottom plate and the second bottom plate; one of the fasteners sequentially penetrates through the first base plate, the fixing piece and the circuit board so as to connect the fixing piece to the first base plate and assemble the first heat dissipation unit on the circuit board; the other fastener sequentially penetrates through the second bottom plate, the fixing piece and the circuit board so as to connect the fixing piece to the second bottom plate and assemble the second heat dissipation monomer on the circuit board; the elastic piece is elastically connected between one of the fasteners and the top surface of the first bottom plate and between the other fastener and the top surface of the second bottom plate, and a first gap exists between the first bottom plate and the circuit board; a second gap exists between the second bottom plate and the circuit board, the two heating elements are respectively accommodated in the first gap and the second gap, and the fixing piece is sleeved on the parts of the two fasteners, which are positioned in the first gap and the second gap.
In a first possible embodiment, the elastic member includes a first elastic body elastically coupled between one of the fastening members and the top surface of the first base plate, and a second elastic body elastically coupled between the other fastening member and the top surface of the second base plate.
In a second possible embodiment, the elastic member is of a one-piece structure, and is provided with two through holes, wherein one of the fasteners passes through one of the through holes, the first base plate and the fixing plate in sequence and cooperates with one of the spring washers to connect the fixing plate to the first base plate; the other fastener penetrates through the other through hole, the second bottom plate and the fixing plate in sequence and is matched with one spring washer to connect the fixing plate to the second bottom plate, and the two spring washers are positioned on one side of the fixing plate, which is far away from the first bottom plate and the second bottom plate.
In a third possible implementation manner, the fixing sheet includes a first connecting end, a second connecting end, and a connecting section connected between the first connecting end and the second connecting end, the first connecting end is connected to the first bottom plate through the fastening member, the second connecting end is connected to the second bottom plate through the fastening member, and the connecting section includes a bending portion so that a distance between the first bottom plate and the second bottom plate is adjustable.
With reference to any one of the foregoing embodiments, in a fourth possible embodiment, the heat sink further includes a heat pipe, the heat pipe spans a joint between the first base plate and the second base plate, one end of the heat pipe extends into a space between the first base plate and the first fin, and the other end of the heat pipe extends into a space between the second base plate and the second fin.
Compared with the prior art, the heat sink provided by the first aspect of the invention and the electronic product provided by the second aspect of the invention have the following beneficial effects: the first bottom plate and the second bottom plate are mutually butted, a gap is arranged between the first bottom plate and the second bottom plate, the bottom surface of the first bottom plate and the bottom surface of the second bottom plate are combined through the fixing sheet of the connecting piece, and the elastic piece provides elastic force between one fastening piece and the top surface of the first bottom plate and between the other fastening piece and the top surface of the second bottom plate. Therefore, when the radiator is not installed on the circuit board, the fixing piece becomes a bridge for connecting two independent first radiating single bodies and two independent second radiating single bodies, and the relative position of the first bottom plate and the second bottom plate can be kept unchanged under the action of the bridge played by the fixing piece in the process of carrying the radiator, namely, the radiator provided by the invention firmly integrates the first bottom plate and the second bottom plate through the fixing piece. Moreover, when the radiator is installed on the circuit board, after the fastener is combined with the circuit board, the elastic body is pressed, and meanwhile, the fixing piece is separated from the first bottom plate and the second bottom plate, so that the first radiating single body and the second radiating single body can float up and down, the radiator can absorb the height tolerance of a heating element (such as a chip) on the circuit board, and the problems of poor contact and uneven pressure are avoided.
In a third aspect, the present invention further provides a heat sink, comprising a first heat dissipating unit and a second heat dissipating unit, the first heat dissipation unit comprises a first bottom plate and a plurality of first fins, the plurality of first fins are arranged on the first bottom plate, the second heat dissipation unit comprises a second bottom plate and a plurality of second fins, the second fins are arranged on the second bottom plate, the first base plate includes a first connection portion, the second base plate includes a second connection portion, the first connection portion and the second connection portion are opposite to each other, and a gap is arranged between the two, the radiator also comprises a connecting piece, the connecting piece comprises a fixing piece and an elastic piece, one end of the fixing piece is fixed on the first connecting part, the other end of the fixing piece is fixed on the second connecting part, the elastic piece is located between the fixing piece and the first connecting portion and between the fixing piece and the second connecting portion.
In a first possible embodiment, the elastic member is an elastic pad which is stacked between the fixed piece and the first and second connection portions, and the elastic member is fixed between the fixed piece and the first connection portion and between the fixed piece and the second connection portion by engagement of a pair of screws and a pair of nuts, respectively.
In a second possible implementation manner, the elastic member is integrally formed with the fixing piece, and the elastic member includes a first elastic portion and a second elastic portion, the first elastic portion is integrally formed at one end of the fixing piece connected to the first connecting portion, and the second elastic portion is integrally formed at one end of the fixing piece connected to the second connecting portion.
In a third possible implementation manner, the elastic member is a metal elastic piece, the metal elastic piece is stacked between the fixing piece and the first and second connecting portions, the metal elastic piece includes a first bending portion and a second bending portion, the first bending portion is elastically connected between the fixing piece and the first connecting portion, and the second bending portion is connected between the fixing piece and the second connecting portion.
In a fourth possible embodiment, the elastic member is a pair of springs, one of which is elastically connected between the fixing plate and the first connecting portion, and the other of which is elastically connected between the fixing plate and the second connecting portion.
In combination with any one of the above possible implementation manners, in a fifth possible implementation manner, the heat sink further includes a plurality of floating screws, and the plurality of floating screws are used for connecting the first heat dissipating unit and the second heat dissipating unit to a circuit board.
In a sixth possible embodiment, in combination with the fifth possible embodiment, one of the floating screws passes through the connecting member and the first connecting portion, and one of the floating screws passes through the connecting member and the second connecting portion.
With reference to any one of the foregoing possible implementation manners, in a seventh possible implementation manner, the heat sink further includes a heat pipe, one end of the heat pipe extends between the first base plate and the first fin, and the other end of the heat pipe extends between the second base plate and the second fin.
Compared with the prior art, the heat sink provided by the third aspect of the invention has the following beneficial effects: the first connecting part of the first base plate is opposite to the second connecting part of the second base plate, a gap is arranged between the first connecting part of the first base plate and the second connecting part of the second base plate, and the first heat dissipation unit and the second heat dissipation unit are connected through the fixing piece and the elastic piece of the connecting piece. The first radiating single body and the second radiating single body are combined without arranging a support at the bottom of the first radiating single body and the second radiating single body, so that the radiator is light in weight and small in size, and the first radiating single body and the second radiating single body are fixed to the support without fixing screws, so that the space for fixing the screws is not required to be reserved on radiating fins, the area of the radiating fins can be ensured, and the radiating effect of the radiator can be provided.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is an exploded perspective view of a heat sink in the related art.
Fig. 2 is a perspective view of a heat sink according to a first embodiment of the present invention.
Fig. 3 is an enlarged view of a portion a in fig. 2.
Fig. 4 is a sectional view of a heat sink according to a first embodiment of the present invention.
Fig. 5 is an enlarged view of a portion B in fig. 4.
Fig. 6 is a schematic diagram of the heat sink according to the first embodiment of the present invention after being mounted on a circuit board.
Fig. 7 is a perspective view of a heat sink according to a second embodiment of the present invention.
Fig. 8 is an exploded view of a heat sink according to a second embodiment of the present invention.
Fig. 9 is a partially enlarged schematic view of a heat sink in a second embodiment of the present invention.
Fig. 10 is a partially enlarged schematic view of a heat sink in a third embodiment of the present invention.
Fig. 11 is a partially enlarged schematic view of a heat sink in a fourth embodiment of the present invention.
Fig. 12 is a partially enlarged schematic view of a radiator in a fifth embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, as well as in the drawings, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Referring to fig. 2, fig. 3, fig. 4 and fig. 5, a schematic diagram of a heat sink 100' according to a first embodiment of the invention is shown.
The heat sink 100 'includes first and second heat dissipating units 10' and 20 'and a connection member 30' (reference numerals refer to fig. 3 in detail). The first heat dissipating unit 10 'includes a first base plate 12' and a plurality of first fins 14 ', the plurality of first fins 14' are disposed on a top surface of the first base plate 12 ', and the second heat dissipating unit 20' includes a second base plate 22 'and a plurality of second fins 24', and the plurality of second fins 24 'are disposed on a top surface of the second base plate 22'. The first heat dissipating unit 10 'and the second heat dissipating unit 20' are disposed side by side, the first bottom plate 12 'and the second bottom plate 22' are butted to each other with a gap therebetween, and the size of the gap is determined according to the layout of the heat generating elements on the circuit board in the electronic product in practical use.
The connecting member 30 'includes a fixing piece 32', a pair of fastening pieces 34 'and an elastic piece 36', the fixing piece 32 'being provided at a joint between the first base plate 12' and the second base plate 22 ', one of the fastening pieces 34' sequentially passing through the first base plate 12 'and the fixing piece 32' to connect the fixing piece 32 'to the first base plate 12', the other fastening piece 34 'sequentially passing through the second base plate 22' and the fixing piece 32 'to connect the fixing piece 32' to the second base plate 22 ', and the elastic piece 36' being elastically connected between one of the fastening pieces 34 'and a top surface of the first base plate 12' and between the other fastening piece 34 'and a top surface of the second base plate 22'. The heat sink 100' of the present invention is used in an electronic product and is mounted on a circuit board of the electronic product to dissipate heat generated by a heat generating component on the circuit board. When the heat sink 100 ' is not mounted on a circuit board in an electronic product, the fixing piece 32 ' maintains a contact state with both the first base plate 12 ' and the second base plate 22 ' due to the elastic force of the elastic member 36 '. When the heat sink 100 'is mounted on the circuit board, the fastening member 34' penetrates the circuit board and is fixedly coupled to the circuit board, the fastening member 34 'compresses the elastic member 36', and at the same time, a portion of the fixing piece 32 'coupled to the fastening member 34' forms a space between the first base plate 12 'and the second base plate 22'.
Specifically, the fastener 34 ' may be a screw which passes through the elastic member 36 ', the first base plate 12 ', and the fixing plate 32 ' in sequence and engages with the spring washer 344 ' to connect the fixing plate 32 ' to the first base plate 12 ', and likewise, a screw which passes through the elastic member 36 ', the second base plate 22 ', and the fixing plate 32 ' in sequence and engages with the spring washer 344 ' to connect the fixing plate 32 ' to the second base plate 22 '. When the screw is fixed to the circuit board, the screw may be passed through the circuit board and engaged with the nut, so that the heat sink 100 'may be mounted on the circuit board, and the spring washer 344' may move with the screw toward the circuit board, so that the fixing piece 32 'moves together with the spring washer 344' under the influence of its own weight, and thus, a space is formed between the fixing piece 32 'and the first base plate 12' and between the fixing piece 32 'and the second base plate 22', so that the first heat dissipating unit 10 'and the second heat dissipating unit 20' may float up and down.
The invention has the beneficial effects that: the first base plate 12 ' and the second base plate 22 ' are butted against each other with a gap therebetween, and the bottom surface of the first base plate 12 ' and the bottom surface of the second base plate 22 ' are coupled by the fixing piece 32 ' of the coupling piece 30 ', and the elastic piece 36 ' provides an elastic force between one of the fastening pieces 34 ' and the top surface of the first base plate 12 ' and the other fastening piece 34 ' and the top surface of the second base plate 22 '. Thus, in the state that the heat sink 100 'is not mounted on the circuit board, the fixing piece 32' becomes a bridge connecting two independent first heat dissipating unit 10 'and second heat dissipating unit 20'. In the process of transporting the heat sink, the fixing pieces 32 ' play a role of a bridge to ensure that the relative positions of the first bottom plate 12 ' and the second bottom plate 22 ' are unchanged, that is, the heat sink 100 ' provided by the invention firmly integrates the first bottom plate 12 ' and the second bottom plate 22 ' through the fixing pieces 32 '. Moreover, when the heat sink 100 'is mounted on a circuit board, after the fastening member 34' is combined with the circuit board, the elastic body 36 'is compressed, and at the same time, a space is formed between the portion of the fixing piece 32' connected with the fastening member 34 'and the first bottom plate 12' and the second bottom plate 22 ', so that the first heat dissipating unit 10' and the second heat dissipating unit 20 'can float up and down, and the heat sink 100' can absorb the height tolerance of a heating element (e.g., a chip) on the circuit board, thereby avoiding the problems of poor contact and uneven pressure.
In one embodiment of the present invention, the elastic member 36 ' includes a first elastic body elastically coupled between one of the fastening members 34 ' and the top surface of the first base plate 12 ', and a second elastic body elastically coupled between the other fastening member 34 ' and the top surface of the second base plate 22 '. Specifically, the first elastic body and the second elastic body may be springs or metal elastic pieces.
In another embodiment of the present invention, the elastic member 36 'is of an integral structure, the elastic member 36' is provided with two through holes, the two fastening members 34 'respectively pass through the two through holes, one of the fastening members 34' sequentially passes through one of the through holes, the first base plate 12 'and the fixing plate 32', and cooperates with a spring washer to connect the fixing plate 32 'to the first base plate 12'; another of the fasteners 34 ' passes through another of the through holes, the second base plate 22 ' and the fixing plate 32 ' in turn, and engages with a spring washer to connect the fixing plate 32 ' to the second base plate 22 '. The elastic member 36 'may be designed as a metal elastic sheet, the elastic member 36' spans the top surfaces of the first bottom plate 12 'and the second bottom plate 22', and the elastic member 36 'and the fixing piece 32' are distributed on both sides of the first bottom plate 12 'and the second bottom plate 22' in a stacked structure, so that both sides of the top surface and the bottom surface of the joint of the first bottom plate 12 'and the second bottom plate 22' have a connection structure, which is beneficial to increase the deformation resistance of the first bottom plate 12 'and the second bottom plate 22'.
Further, the fixing sheet 32 'includes a first connection end 322', a second connection end 324 ', and a connection section 326' connected between the first connection end 322 'and the second connection end 324', the first connection end 322 'is connected to the first bottom plate 12' by the fastening member 34 ', the second connection end 324' is connected to the second bottom plate 22 'by the fastening member 34', and the connection section 326 'includes a bent portion 3262' so that a distance between the first bottom plate 12 'and the second bottom plate 22' is adjustable. The fixing plate 32 'is made of metal, in one embodiment, the connecting section 326' has an arch-shaped structure, in other embodiments, the connecting section 326 'may have other winding structures, such as an S-shape, an arc-shape, etc., as long as the connecting section 326' has a partially bent structure, and the bent portion 3262 'can adjust the distance between the first connecting end 322' and the second connecting end 324 'due to the elastic deformation of the fixing plate 32'. When the heat sink 100 ' is mounted in an electronic product, the interval between the first base plate 12 ' and the second base plate 22 ' may be adjusted as needed.
The heat sink 100 ' further includes a heat pipe 40 ' (shown in fig. 1), the heat pipe 40 ' spans the joint of the first base plate 12 ' and the second base plate 22 ', one end of the heat pipe 40 ' extends between the first base plate 12 ' and the first fin 14 ', and the other end of the heat pipe 40 ' extends between the second base plate 22 ' and the second fin 24 '. The heat pipe 40 'can improve the heat dissipation capability of the heat sink 100'. In addition, during the transportation of the heat sink 100 ', the relative positions of the first bottom plate 12 ' and the second bottom plate 22 ' can be kept unchanged by the bridging effect of the fixing pieces 32 ', so that the stability and safety of the heat pipe 40 ' can be ensured by the structure of the fixing pieces 32 ', and quality problems caused by the deformation of the heat pipe 40 ' can be prevented.
Referring to fig. 6, the present invention further provides an electronic product, which includes a circuit board 200 ' and a heat sink 100 ', wherein the circuit board 200 ' is provided with two heating elements 202 ', and the heating elements 202 ' may be chips. The first heat dissipating unit 10 ' and the second heat dissipating unit 20 ' respectively provide heat dissipation for the two heat generating elements 202 '. A first gap exists between the first base plate 12 'and the circuit board 200' when the heat sink 100 'is mounted on the circuit board 200'; a second gap exists between the second bottom plate 22 ' and the circuit board 200 ', the two heating elements 202 ' are respectively accommodated in the first gap and the second gap, and the fixing piece 32 ' is sleeved on the portions of the two fasteners 34 ' located in the first gap and the second gap. The first base plate 12 'contacts one of the heat generating elements 202', a heat conducting medium may be disposed between the first base plate 12 'and the heat generating element 202', and similarly, the second base plate 22 'contacts another heat generating element 202', although a heat conducting medium may also be disposed between the second base plate 22 'and the heat generating element 202'. Then, one end of the fastening piece 34 'close to the fixing piece 32' is fixedly connected with the circuit board 200 ', and after the fastening piece 34' is connected with the circuit board 200 ', the elastic piece 36' is compressed, and a space is formed between a part of the fixing piece 32 'connected with the two fastening pieces 34' and the first bottom plate 12 'and the second bottom plate 22', namely, the fixing piece 32 'does not contact with the first bottom plate 12' and the second bottom plate 22 ', so that the first heat dissipation unit 10' and the second heat dissipation unit 20 'are in a floating state, and the heat sink 100' can absorb the height tolerance of the heating element 202 'on the circuit board 200', and avoid the problems of poor contact and uneven pressure. Specifically, the "portion of the fixing piece 32 'connected to the two fastening pieces 34" refers to a portion of the fixing piece 32' close to the fastening piece 34 ', and in the present embodiment, both ends of the fixing piece 32' are connected to the first base plate 12 'and the second base plate 22' by the fastening pieces 34 ', respectively, so the "portion of the fixing piece 32' connected to the two fastening pieces 34" refers to a region of the fixing piece 32 'close to both ends of the fixing piece 32'.
Fig. 7, 8 and 9 are schematic views illustrating a heat sink according to a second embodiment of the present invention.
Referring to fig. 7 and 8, the heat sink 100 includes a first heat dissipating unit 20 and a second heat dissipating unit 40. The first heat dissipating unit 20 includes a first base plate 22 and a plurality of first fins 24, the plurality of first fins 24 are disposed on the first base plate 22, and in the present embodiment, the plurality of first fins 24 are integrally formed on the first base plate 22. The second heat dissipating unit 40 includes a second base plate 42 and a plurality of second fins 44, the plurality of second fins 44 are disposed on the second base plate 42, and in the present embodiment, the plurality of second fins 44 are integrally formed on the second base plate 42. The first base plate 22 includes a first connection portion 222, the second base plate 42 includes a second connection portion 422, the first connection portion 222 and the second connection portion 422 are opposite to each other with a gap therebetween, the heat sink 100 further includes a connection member 60, the connection member 60 includes a fixing piece 62 and an elastic piece 64, one end of the fixing piece 62 is fixed to the first connection portion 222, the other end of the fixing piece is fixed to the second connection portion 422, and the elastic piece 64 is located between the fixing piece 62 and the first connection portion 222 and between the fixing piece 62 and the second connection portion 422.
The first connection portion 222 of the first base plate 22 and the second connection portion 422 of the second base plate 42 are opposite to each other with a gap therebetween, and the first heat dissipating unit 20 and the second heat dissipating unit 40 are connected by the fixing piece 62 and the elastic piece 64 of the connecting piece 60. The first heat dissipation unit 20 and the second heat dissipation unit 40 are combined without arranging a support at the bottom of the two, so that the heat sink 100 is light in weight and small in size, and the first heat dissipation unit 20 and the second heat dissipation unit 40 are fixed to the supports without fixing screws, so that spaces for fixing screws do not need to be reserved on the heat dissipation fins, the area of the heat dissipation fins can be ensured, and the heat dissipation effect of the heat sink 100 is improved. And the arrangement of the elastic element 64 and the arrangement of the gap between the first connection portion 222 and the second connection portion 422 enable the first heat dissipating unit 20 and the second heat dissipating unit 40 to float up and down relatively.
The specific structure of the elastic member 64 is diversified, and four different structures of the elastic member 64 are illustrated in fig. 9 to 12, which are described in detail below.
Referring to fig. 9, fig. 9 is a partially enlarged view of a heat sink according to a second embodiment of the present invention, in which the elastic member 64 is an elastic pad that is stacked between the fixing piece 62 and the first and second connecting portions 222 and 422, and the elastic member 64 is fixed between the fixing piece 62 and the first connecting portion 222 and between the fixing piece 62 and the second connecting portion 422 by the engagement of a pair of screws 50 and a pair of nuts 70. The elastic gasket can be made of elastic materials such as silica gel and rubber.
Referring to fig. 10, fig. 10 is a partially enlarged schematic view of a heat sink according to a third embodiment of the present invention. The elastic member 64 is integrally formed with the fixing plate 62, the elastic member 64 includes a first elastic portion 642 and a second elastic portion 644, the first elastic portion 642 is integrally formed at one end of the fixing plate 62 connected to the first connecting portion 222, and the second elastic portion 644 is integrally formed at one end of the fixing plate 62 connected to the second connecting portion 422. Specifically, the two ends of one metal sheet are respectively bent toward the central region of the metal sheet to form the first elastic part 642 and the second elastic part 644, and in this embodiment, the elastic member 64 and the fixing member are integrated, and the fixing and elastic connection functions are provided, so that the structure is simplified, and the assembly speed is increased.
Referring to fig. 11, fig. 11 is a partially enlarged schematic view of a heat sink according to a fourth embodiment of the present invention. The elastic element 64 is a metal elastic sheet, the metal elastic sheet is stacked between the fixing sheet 62 and the first and second connecting portions 222 and 422, the metal elastic sheet 64 includes a first bending portion 642 and a second bending portion 644, the first bending portion is elastically connected between the fixing sheet 62 and the first connecting portion 222, and the second bending portion is connected between the fixing sheet 62 and the second connecting portion 422. In this embodiment, the number of the fixing pieces 62 is two, and the first and second connecting portions 222 and 422 and the metal spring plate 64 are interposed between the two fixing pieces 62, and the first heat dissipating unit 20 and the second heat dissipating unit 40 are connected together by the screw 50 passing through the coupling piece 60 and the nut 70.
Referring to fig. 12, fig. 12 is a partially enlarged schematic view of a heat sink according to a fifth embodiment of the present invention. The elastic member 64 is a pair of springs, one of which is elastically connected between the fixing plate 62 and the first connection portion 222, and the other of which is elastically connected between the fixing plate 62 and the second connection portion 422. In this embodiment, the connecting member 60 is connected to the first connecting portion 222 and the second connecting portion 422 by two screws and two nuts 70, and the springs are respectively sleeved on the peripheries of the screws.
As shown in fig. 7 and 8, the heat sink 100 further includes a plurality of floating screws 90, and the plurality of floating screws 90 are used to connect the first heat dissipating unit 20 and the second heat dissipating unit 40 to a circuit board. In this embodiment, as shown in fig. 9, one of the floating screws 90 passes through the connecting member 60 and the first connecting portion 222, and one of the floating screws 90 passes through the connecting member 60 and the second connecting portion 422.
Referring to fig. 8, the heat sink 100 further includes a heat pipe 95, one end of the heat pipe 95 extends between the first base plate 22 and the first fin 24, and the other end of the heat pipe 95 extends between the second base plate 42 and the second fin 44. Specifically, the first receiving groove 225 is formed on the side of the first base plate 22 to which the first fin 24 is connected, the second receiving groove 425 is formed on the side of the second base plate 42 to which the second fin 44 is connected, and the opening of the first receiving groove 225 faces the opening of the second receiving groove 425, so that both ends of the heat pipe 95 are inserted into the first receiving groove 225 and the second receiving groove 425, respectively. The heat pipe 95 is provided to enhance the heat dissipation effect of the heat sink 100.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims (5)

1. A heat radiator comprises a first heat radiating single body and a second heat radiating single body, wherein the first heat radiating single body comprises a first bottom plate and a plurality of first fins, the plurality of first fins are arranged on the first bottom plate, the second heat dissipation unit comprises a second bottom plate and a plurality of second fins, the plurality of second fins are arranged on the second bottom plate, characterized in that the first base plate comprises a first connecting portion, the second base plate comprises a second connecting portion, the first connecting portion and the second connecting portion are opposite to each other, and a gap is arranged between the two, the radiator also comprises a connecting piece, the connecting piece comprises a fixing piece and an elastic piece, one end of the fixing piece is fixed on the first connecting part, the other end of the fixing piece is fixed on the second connecting part, the elastic pieces are positioned between the fixing piece and the first connecting part and between the fixing piece and the second connecting part;
the elastic piece is an elastic gasket which is arranged between the fixing piece and the first connecting part and between the fixing piece and the second connecting part in a laminated mode, and the elastic piece is fixed between the fixing piece and the first connecting part and between the fixing piece and the second connecting part through the matching of a pair of screws and a pair of nuts;
alternatively, the first and second electrodes may be,
the elastic piece and the fixing piece are integrally formed, the elastic piece comprises a first elastic part and a second elastic part, the first elastic part is integrally formed at one end of the fixing piece connected with the first connecting part, and the second elastic part is integrally formed at one end of the fixing piece connected with the second connecting part;
alternatively, the first and second electrodes may be,
the elastic piece is a metal elastic piece, the metal elastic piece is arranged between the fixing piece and the first connecting portion and the second connecting portion in a stacked mode, the metal elastic piece comprises a first bending portion and a second bending portion, the first bending portion is elastically connected between the fixing piece and the first connecting portion, and the second bending portion is connected between the fixing piece and the second connecting portion.
2. The heat sink of claim 1, further comprising a plurality of floating screws for connecting the first heat dissipating unit and the second heat dissipating unit to a circuit board.
3. The heat sink of claim 2, wherein one of said floating screws passes through said connector and said first connector, and wherein one of said floating screws passes through said connector and said second connector.
4. The heat sink according to any one of claims 1 to 3, further comprising a heat pipe, wherein one end of the heat pipe extends between the first base plate and the first fin, and the other end of the heat pipe extends between the second base plate and the second fin.
5. An electronic product, characterized in that a heat sink is mounted on a circuit board of the electronic product, and the heat sink is used for providing heat dissipation for a heat generating component on the circuit board, wherein the heat sink is the heat sink of any one of claims 1 to 4.
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