JP2010263118A - Heat dissipation device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation device that can be provided on a plurality of electronic components at the same time to save the occupation space. <P>SOLUTION: The heat dissipation device includes: a first radiator comprising a base stuck to one electronic component and radiation fins provided to the surface of the base; a second radiator comprising a base stuck to another electronic component and radiation fins provided to the surface of the base, and having a first opening formed at a position adjoining the first radiator; and a plurality of fixed elements for fixing the radiators to a circuit board, each of the fixed element including an engagement member having a head portion. One of engagement members covers a two-layer spring, and penetrates the first opening of the second radiator and the base of the first radiator, and the two-layer spring comprises an outer spring sandwiched between the head of the engagement member and the first opening of the second radiator, and an inner spring connected to the peak end of the outer spring and sandwiched between the head of the engagement member and the base of the first radiator. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat radiating device, and more particularly to a heat radiating device for cooling a heat generating component.

  With the rapid development of electronic technology, integrated circuits of electronic components (especially central processing units) are becoming more and more complex, and the amount of heat generated is also increasing. For this reason, in the industry, it is necessary to mount a heat dissipation device on an electronic component to cool the electronic component.

  A conventional heat dissipating device includes a heat sink attached on an electronic component, and the heat dissipator includes a base in close contact with the electronic component, a plurality of heat dissipating fins installed on a top surface of the base, Is provided. Along with the rapid development of digital technology, the manufacturing technology of electronic components has also progressed toward high-density mounting and multi-functional direction, and the distance between each electronic component (especially chip) becomes smaller and the amount of generated heat is reduced. It is getting bigger. In actual applications, when the height of each electronic component is not the same, a plurality of mounting holes must be opened in the circuit board in order to mount a single heat dissipation device on each electronic component, thus space As well as the size of each heat dissipating device is limited, which adversely affects the heat dissipating effect.

  In view of the above problems, an object of the present invention is to provide a heat dissipation device that can be provided on a plurality of electronic components at the same time and can reduce the occupied space.

  A first radiator including a base used to cool two electronic components on the circuit board and bonded to the one electronic component on the circuit board, and a plurality of radiation fins provided on a surface of the base; A second base including a base bonded to another electronic component on the circuit board and a heat dissipating fin provided on a surface of the base, and a first opening formed at a position adjacent to the first heat radiator A radiator, and a plurality of fixing elements that fix the first radiator and the second radiator to the circuit board, and each of the fixing elements includes an engaging member having a head. One of the engaging members is covered with a two-layer spring and passes through the first opening of the second radiator and the base of the first radiator, and the two-layer spring is: The head of the engaging member and the first opening of the second radiator An external spring held between the, including the internal spring is sandwiched between the base of the head and the first radiator of the concatenated with the top end of the outer spring and the engaging member.

  Compared with the prior art, the outer spring and the inner spring of the two-layer spring are between the head of the engaging member and the first opening of the second radiator, and between the head and the first spring. It is sandwiched separately between the base of one radiator and acts independently on the first radiator and the second radiator. The first radiator and the second radiator share the mounting hole of the circuit board, and the number of mounting holes opened in the circuit board can be reduced. Moreover, the space | interval of said 1st radiator and said 2nd radiator can be utilized effectively, and the thermal radiation area of said 1st and 2nd radiator can be increased. Further, since the external spring and the internal spring are integrally formed and do not interfere with each other, the assembling operation is facilitated.

It is an assembly drawing of the heat radiating device by this invention. FIG. 2 is an exploded view of the heat dissipation device shown in FIG. 1. FIG. 3 is an enlarged view of the fixing element shown in FIG. 2. It is sectional drawing which follows the IV-IV line | wire shown in FIG.

  Hereinafter, the configuration of a specific embodiment according to the present invention will be described in detail with reference to the drawings.

  As shown in FIGS. 1, 2, and 4, the heat dissipation device according to the embodiment of the present invention is used to dissipate heat generated from the two electronic components 42 and 44 on the circuit board 40. The heat radiator includes a first heat radiator 10, a second heat radiator 20 connected to the first heat radiator 10, and a plurality of first heat radiators 10 and second heat radiators 20 fixed to the circuit board 40. A fixing element.

  The electronic component 42 is a main heat generating component, and all the dimensions and power thereof are larger than the electronic component 44, and the top surface of the electronic component 42 is higher than the top surface of the electronic component 44. The circuit board 40 is provided with four mounting holes 43 surrounding the electronic component 42 and one engagement hole 45 located at a position adjacent to one corner of the electronic component 44.

  The first radiator 10 includes a base 12 having a substantially rectangular shape and a bottom surface that is in close contact with the electronic component 42, and a plurality of radiating fins 14 installed so as to rise vertically from the base 12. Prepare. Four attachment portions 120 are formed in the squares of the base 12, and through holes 122 are formed in the attachment portions 120.

  The second radiator 20 is integrally formed from a metal having excellent heat transfer performance such as aluminum and copper, and the size thereof is smaller than that of the first radiator 10. The second heat radiator 20 has a substantially rectangular shape and a bottom surface of the second heat radiator 20 that is in close contact with the electronic component 44, a plurality of heat radiation fins 24 installed so as to rise vertically from the base 22, A first opening 26 extending in the horizontal direction from the bottom end of the radiation fin 24 on the side adjacent to the first radiator 10 of the second radiator 20, and the first radiator 10 of the second radiator 20. And a second opening 28 extending in the horizontal direction from the bottom end of the radiating fin 24 on the side away from the first. The first opening 26 and the second opening 28 are located at both ends of one diagonal line, and the bottom surfaces of the first opening 26 and the second opening 28 are slightly more than the top surface of the base 22. high.

  The first opening 26 is placed on the mounting portion 120 of the base 12 of the first radiator 10, and the first opening 26 corresponds to the through hole 122 of the mounting portion 120. An opening 260 is formed, and the inner diameter of the opening 260 is larger than the inner diameter of the through hole 122. A through hole 280 is also formed in the second opening 28.

  Please refer to FIG. 2 and FIG. The fixing element that fixes the first radiator 10 and the second radiator 20 to the circuit board 40 includes four engaging members 32 and two layers of springs that surround one of the engaging members 32. 34, three first springs 36 provided surrounding the other three engaging members 32, one fixing member 38, and four engaging rings 39.

  The engagement member 32 covered by the two-layer spring 34 includes the first opening 26 of the second radiator 20 and the first radiator under the first opening 26 of the second radiator 20. It is used for penetrating ten mounting portions 120. The fixing member 38 is used to penetrate the second opening 28 of the second radiator 20.

  The engaging member 32 is connected to a flat columnar head 320, a columnar bar 322 extending vertically downward from the bottom of the head 320, and a bottom end of the bar 322. A threaded portion 324 to be provided. The top surface of the head 320 is provided with a cross-shaped recess 3200 that fits an operating tool such as a screwdriver. The rod body 322 has an outer diameter smaller than that of the head 320. An engagement recess 3220 for engaging the engagement ring 39 is provided at a position adjacent to the threaded portion 324 of the rod body 322.

  The two-layer spring 34 includes an external spring 340 and an internal spring 342 that is installed inside the external spring 340 and whose top end is connected to the top end of the external spring. The outer diameter of the external spring 340 is smaller than the outer diameter of the head 320, the inner diameter of the outer spring 340 is larger than the outer diameter of the inner spring 342, and the length of the outer spring 340 is the length of the inner spring 342. Shorter than that. The inner spring 342 has an inner diameter larger than the diameter of the through hole 122 of the mounting portion 120 of the first radiator 10. The lower end of the internal spring 342 extends from the lower end of the external spring 340 and passes through the opening 260 of the first opening 26 of the second radiator 20 to attach the base 12 of the first radiator 10. It is press-contacted to the part 120.

  The size and length of the first spring 36 are substantially the same as the internal spring 342. The fixing member 38 includes a fixing bar 380 and a second spring 382 that covers the fixing bar 380. The fixing member 38 includes a head (not shown) and a reverse (not shown) formed at the bottom end of the fixing member 38. A hole 390 is provided at the center of the engagement ring 39. An elongated notch extending in the radial direction is provided at the peripheral edge of the hole 390, and the hole 390 is enlarged when the notch is pressed and deformed.

  When the heat radiating device is assembled, the engaging member 32 covered by the two-layer spring 34 is placed on the mounting portion 120 of the base 12 of the first heat radiating device 10, and the first opening of the second heat radiating device 20. It penetrates the opening 260 of the portion 26 and the through hole 122 of the mounting portion 120 located below the opening 260. The other engaging members 32 placed on the first spring 36 respectively penetrate the through holes 122 of the other three attachment portions 120. The fixing member 38 covered by the second spring 382 passes through the through hole 280 of the second opening 28 of the second radiator 20 and is engaged below the second opening 28 by the reverse turn. Thus, the fixing member 38 is attached to the second opening 28 in advance.

  When the engagement recess 3220 of the engagement member 32 is positioned below the base 12 through the through-hole 122, the engagement ring 39 is engaged with the engagement recess 3220, and the first The engaging member 32 that covers the spring 36 and the two-layered spring 34 is assembled to the first radiator 10 and the second radiator 20 in advance. Finally, a pre-assembled heat dissipation device is placed on the electronic components 42 and 44 of the circuit board 40, and the engagement member 32 is rotated downward to engage with the mounting hole 43 of the circuit board 40, or The circuit board 40 is engaged with a board 50 (shown in FIG. 4) placed under the circuit board 40. Subsequently, when the fixing member 38 is pushed downward, the reverse strip passes through the engagement hole 45 of the circuit board 40 and comes into contact with the lower side of the circuit board 40.

  When using the heat dissipation device, the external spring 340 and the internal spring 342 of the two-layer spring 34 are between the head 320 of the engagement member 32 and the first opening 26 of the second radiator 20 and It is sandwiched between the head 320 and the mounting portion 120 of the first radiator 10 and acts independently on the first radiator 10 and the second radiator 20. The first radiator 10 and the second radiator 20 share the mounting hole 43 of the circuit board 40, and the number of mounting holes opened in the circuit board 40 can be reduced. In addition, the space between the first radiator 10 and the second radiator 20 can be effectively used to increase the heat radiation area of the radiators 10 and 20. Since the external spring 340 and the internal spring 342 are integrally formed and do not interfere with each other, an assembling operation is facilitated.

DESCRIPTION OF SYMBOLS 10 1st heat radiator 12, 22 Base 120 Attachment part 122 Through-hole 14, 24 Radiation fin 20 2nd heat radiator 26 1st opening part 260 opening 28 2nd opening part 280 Through-hole 32 Engagement member 320 Head 3200 Recessed part 322 Rod body 3220 Engaging recess 324 Screw thread 34 Two layers of spring 340 External spring 342 Internal spring 36 First spring 38 Fixing member 380 Fixing rod 382 Second spring 39 Engagement ring 390 Hole 40 Circuit board 42, 44 Electron Component 43 Mounting hole 45 Engagement hole 50 Board

Claims (7)

Used to cool two electronic components on a circuit board,
A first radiator comprising a base bonded to one of the electronic components on the circuit board and a plurality of radiation fins provided on a surface of the base;
A second heat dissipation device including a base bonded to another electronic component on the circuit board and a heat dissipating fin provided on the surface of the base and having a first opening formed at a position adjacent to the first heat dissipator. And
A plurality of fixing elements for fixing the first radiator and the second radiator to the circuit board;
Each fixing element is a heat dissipating device including an engaging member having a head and a rod-shaped portion,
The rod-shaped portion of the engaging member is covered with two layers of springs, and penetrates the first opening of the second radiator and the base of the first radiator,
The two-layer spring includes an external spring and an internal spring installed inside the external spring and having a top end connected to a top end of the external spring. The external spring includes the head of the engaging member and the head. A heat dissipation device sandwiched between a first opening of a second radiator and the internal spring is sandwiched between a head of the engaging member and a base of the first radiator. .   The heat dissipation device according to claim 1, wherein a length of the internal spring is longer than that of the external spring.   The base of the first radiator is provided with a through hole through which the rod-like portion of the engaging member of the fixing element passes, and the internal spring penetrates the first opening of the second radiator and the through hole The heat dissipating device according to claim 1, wherein the heat dissipating device is in contact with the periphery of the heat dissipating device.   A second opening is formed at a position away from the first radiator of the second radiator, and the first opening and the second opening are respectively located at both ends of one diagonal line. The heat radiating device according to any one of claims 1 to 3.   5. The heat dissipation device according to claim 1, wherein a height of the first opening is higher than a base of the second radiator.   The threaded portion engaged with the circuit board and an annular engaging recess adjacent to the threaded portion are formed in the rod-shaped portion of the engaging member. The heat radiating device according to any one of the above.   The fixing element further includes an engagement ring, and by engaging the engagement ring with an engagement recess of an engagement member placed below the base of the first radiator, the spring or the two layers The heat dissipating device according to claim 6, wherein an engaging member that covers the spring is attached to the first heat radiator in advance.

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