JP2011198998A - Cooling device for heating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device for a heating element preventing deterioration of a sealing member and effectively preventing leakage of refrigerant.SOLUTION: The cooling device includes: a first radiator 4 having a principal plane on which the heating element 2 is arranged and another principal plane formed with a heat radiation part 41 and a first engagement part 43 surrounding a periphery of the heat radiation part 41; a second radiator 5 having a second engagement part 53 engaged with the first engagement part 43 and a receiving part 51 receiving the heat radiation part 41 by engaging the first engagement part 43 with the second engagement part 53 to be combined with the first radiator 4 thereby forming a refrigerant flow path; and an annular elastic body 7 made of metal interposed between the first engagement part 43 and the second engagement part 53, wherein the annular elastic body 7 is arranged on the opposite side from the receiving part 51 and arranged in a region outside a forming region of the heating element 2 so as to contact the second engagement part 53.

Description

  The present invention relates to a cooling device for a heating element.

  2. Description of the Related Art Conventionally, as a cooling device for cooling a heat generating element, a device in which a pair of radiators is combined with a fitting portion provided in each radiator is known. As a cooling device for such a heating element, in order to reduce the thermal resistance between the heating element and the cooling device, one of the pair of radiators constituting the cooling device is slidably formed. In addition, a cooling device for a heating element provided with a coil-shaped spring for pressing the heat radiating body toward the heating element is disclosed (Patent Document 1).

JP 2006-19477 A

  However, in the prior art, since the coiled spring is used, the stress is concentrated only on a part of the heat radiating body pressed by the coiled spring. As a result, the sealing member that seals the fitting portion deteriorates, and the refrigerant sometimes leaks from the refrigerant flow path.

  The problem to be solved by the present invention is to provide a cooling device for a heat generating element capable of suppressing deterioration of a seal member and effectively preventing leakage of a refrigerant.

  The present invention receives a first heat dissipating member having a heat dissipating part and a first fitting part surrounding the heat dissipating part, a second fitting part fitted to the first fitting part, and a heat dissipating part. And a second heat dissipating device having a receiving portion that forms a refrigerant flow path, wherein the annular elastic body is positioned opposite to the receiving portion side and outside the heat generating element forming region. The above-described problem is solved by disposing at a position in contact with the second fitting portion in the region.

  According to the present invention, the annular elastic body is disposed at a position on the opposite side to the receiving portion side and in contact with the second fitting portion in a region outside the heat generating element forming region. The stress applied to the first fitting portion and the second fitting portion can be dispersed, whereby the deterioration of the seal member can be suppressed, and as a result, leakage of the refrigerant can be effectively prevented. it can.

It is sectional drawing which shows the semiconductor device which concerns on this embodiment. It is a bottom view which shows the 1st heat radiator which concerns on this embodiment. It is a front view of the 1st heat radiator shown in FIG. It is a side view of the 1st heat radiator shown in FIG. It is a principal part enlarged view in the V section of FIG. It is a perspective view of the disc spring concerning this embodiment. It is a figure for demonstrating the force added to a 1st fitting part and a 2nd fitting part. It is sectional drawing which shows the semiconductor device which concerns on 2nd Embodiment. It is sectional drawing which shows the semiconductor device which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<< First Embodiment >>
The semiconductor device according to this embodiment includes a semiconductor element such as a switching element or a diode and a cooler for cooling the semiconductor element. Such a semiconductor device can convert a direct current from a direct current power source into a three-phase alternating current by controlling conduction / non-conduction of a switching element. For example, a hybrid vehicle or a fuel cell vehicle It can use for the inverter apparatus which supplies electric power to the drive motor for electric vehicles, such as.

  FIG. 1 is a cross-sectional view showing the semiconductor device according to the first embodiment. As shown in FIG. 1, a semiconductor device 1 according to the present embodiment includes a semiconductor element 2 and coolers 3 and 8 (first cooler 3 and second cooler 8). Is sandwiched between two coolers 3 and 8 to adopt a double-sided cooling structure for cooling the semiconductor element 2 from both sides.

  The semiconductor element 2 which is an object to be cooled by the coolers 3 and 8 includes transistors and diodes such as IGBTs (Insulated Gate Bipolar Transistors) that individually constitute a three-phase inverter bridge circuit. A pair of electrodes are connected via a solder layer formed by soldering. Further, the semiconductor element 2 constituting the semiconductor device 1 is electrically connected to the terminal electrode, and electric power can be input / output through the terminal electrode. Since the semiconductor element 2 generates heat when energized, heat removal is performed by the coolers 3 and 8 described below. Further, the semiconductor element 2 is not limited to a transistor such as an IGBT or a diode, and may be another heating element.

  The first cooler 3 and the second cooler 8 are coolers for cooling the semiconductor element 2. As shown in FIG. 1, the first cooler 3 is disposed below the semiconductor element 2. The second cooler 8 is arranged on the upper side of the semiconductor element 2.

  As shown in FIG. 1, the first cooler 3 is configured by combining the first radiator 4 and the second radiator 5 via a seal member 6 and a disc spring 7. By combining the body 4 and the second heat radiating body 5, a flow path (hereinafter referred to as a refrigerant flow path) through which the refrigerant flows is formed. Then, the refrigerant is continuously introduced from the introduction pipe (not shown) into the refrigerant flow path formed in the first cooler 3, and the introduced refrigerant passes through the refrigerant flow path along the X direction. By flowing, the heat generated by the semiconductor element 2 can be dissipated. The refrigerant introduced into the first cooler 3 is continuously discharged from a discharge pipe (not shown). The first radiator 4 and the second radiator 5 constituting the first cooler 3 are individually made by, for example, die casting or extrusion molding using aluminum or aluminum alloy having excellent thermal conductivity as a raw material. It is a molded product.

  As shown in FIG. 1, the first heat radiating body 4 has a configuration in which the semiconductor element 2 is disposed on one main surface and receives heat transferred from the semiconductor element 2. Moreover, the 1st heat radiator 4 has the thermal radiation part 41 for radiating the received heat and the 1st fitting part 43 surrounding the thermal radiation part 41 in the other main surface. In addition, the 1st fitting part 43 is a part for fitting in the 2nd fitting part 53 of the 2nd thermal radiation body 5 mentioned later.

  FIG. 2 is a bottom view of the first radiator 4 and is a view of the first radiator 4 as viewed from the second radiator 5 side (the refrigerant flow path side) along the Z direction. 3 is a front view of the first heat radiating body 4 shown in FIG. 2, and is a view of the first heat radiating body 4 viewed along the X direction. Further, FIG. 4 is a side view of the first heat radiating body 4 shown in FIG. 2, and is a view of the first heat radiating body 4 seen along the Y direction. As shown in FIG. 2, the heat radiating portion 41 is formed in a circular shape, and a plurality of heat radiating fins 42a projecting toward the second heat radiating body 5 are formed on the circular heat radiating portion 41. ~ 42g is formed. The plurality of heat radiation fins 42a to 42g are arranged at predetermined intervals in the Y direction, as shown in FIGS. Further, as shown in FIG. 2, the plurality of heat radiation fins 42 a to 42 g are formed by continuously extending along the X direction (that is, the refrigerant flow direction). In addition, the length of the X direction of each radiation fin 42a-42g is determined according to the circular shape of the thermal radiation part 41, as shown in FIG. That is, among the heat radiation fins 42a to 42g arranged in the Y direction, the heat radiation fin located at the center in the arrangement direction is formed longer, and the heat radiation fins located at both ends in the arrangement direction are formed shorter. Has been.

  Furthermore, as shown in FIG. 2, the first heat radiating body 4 is formed with a first fitting portion 43 surrounding the heat radiating portion 41. As shown in FIG. 1, the first fitting portion 43 is fitted with the second fitting portion 53 of the second radiator 5 via the seal member 6 and the disc spring 7. And the 1st heat sink 4 and the 2nd heat sink 5 are combined by the 1st fitting part 43 and the 2nd fitting part 53 being mutually fitted.

  On the other hand, as shown in FIG. 1, the second radiator 5 includes a receiving portion 51 that receives the heat radiating portion 41 of the first radiator 4 and a second fitting portion 53. As shown in FIG. 1, the second fitting portion 53 is fitted via the first fitting portion 43 of the first heat radiating body 4 via the seal member 6 and the disc spring 7. 51 receives the heat radiating part 41 (including the heat radiating fins 42 a to 42 g) of the first heat radiating body 4 and forms a refrigerant flow path together with the heat radiating part 41 of the first heat radiating body 4.

  Further, in the present embodiment, a seal member 6 for sealing the refrigerant flow path is interposed between the first fitting portion 43 and the second fitting portion 53. Here, FIG. 5 is an enlarged view of a main part in a V portion of FIG. As shown in FIG. 5, the seal member 6 is held by a circumferential groove 44 formed on the outer peripheral side surface of the heat radiating portion 41 on the inner peripheral side thereof, and is slid with the second radiator 5 on the outer peripheral side. It comes to touch. As a result, the seal member 6 is pressed from both sides by the first fitting portion 43 and the second fitting portion 53, and thereby the first fitting portion 43 and the second fitting portion 53 are in close contact with each other. The refrigerant flow path can be sealed. As such a seal member 6, a seal ring made of a rubber material such as an O-ring can be used.

  Further, as shown in FIG. 1, a disc spring 7 for biasing the first radiator 4 toward the semiconductor element 2 is further provided between the first fitting portion 43 and the second fitting portion 53. It is intervened. In the present embodiment, the disc spring 7 is the receiving portion 51 (refrigerant flow path) side of the second radiator 5 among the fitting portions formed by the first fitting portion 43 and the second fitting portion 53. And placed on the opposite side. That is, the disc spring 7 is not a portion inside the seal member 6 but a portion outside the seal member 6 in the fitting portion formed by the first fitting portion 43 and the second fitting portion 53. Has been placed. Here, FIG. 6 is a perspective view of the disc spring 7 according to the present embodiment, in which only the disc spring 7 is extracted from the first cooler 3.

  The disc spring 7 is a metal elastic body, and is formed in an annular shape as shown in FIG. Further, as shown in FIG. 6, the disc spring 7 is configured to be inclined from the inner peripheral end 71 toward the outer peripheral end 72, thereby being deformable in the thickness direction.

  And in this embodiment, as shown in FIG. 5, the disc spring 7 which has such a structure has its inner peripheral end 71 in contact with the first fitting portion 43 of the first radiator 4, and the outer peripheral end. 72 is interposed between the first fitting portion 43 and the second fitting portion 53 in a state where the second fitting portion 53 is in contact with the second fitting portion 53 of the second radiator 5.

  Specifically, as shown in FIG. 5, the inner peripheral end 71 of the disc spring 7 is first fitted at a contact point 45 located inside the formation region of the semiconductor element 2 when viewed from the Z direction. It is in contact with the portion 43. That is, the disc spring 7 is in contact with the first fitting portion 43 at a point located directly below the semiconductor element 2. Further, as shown in FIG. 5, the outer peripheral end 72 of the disc spring 7 is in contact with the second fitting portion 53 at a contact point 55 located outside the formation region of the semiconductor element 2 when viewed from the Z direction. is doing.

  In the present embodiment, the disc spring 7 can be deformed in the Z direction (thickness direction), so that the first radiator 4 positioned on the disc spring 7 is in sliding contact with the seal member 6. It is possible to move in the Z direction while maintaining the state. Therefore, the first heat radiator 4 is in close contact with the semiconductor element 2 while being pressed toward the semiconductor element 2 by the disc spring 7. In addition to being pressed by the disc spring 7, the first heat radiating body 4 receives pressure from the refrigerant flowing through the refrigerant flow path toward the semiconductor module 2 in the heat radiating portion 41. Adhesion between the radiator 4 and the semiconductor element 2 is stronger.

  The load characteristic of the disc spring 7 is a load that can absorb the thickness variation of the semiconductor element 2 by urging the first radiator 4 toward the semiconductor element 2, and It is preferable to set it so as not to exceed the load capacity. In this embodiment, as shown in FIGS. 5 and 6, a single disc spring 7 is used. For example, in order to make the load characteristics of the disc spring 7 appropriate, a plurality of disc springs 7 are used. It is good also as a structure which uses the disk spring 7 in piles.

  As described above, the first cooler 3 is configured.

  Further, as shown in FIG. 1, the semiconductor device 1 includes a second cooler 8 in addition to the first cooler 3 described above, and the second cooler 8 includes a plurality of radiating fins 81 a to 81 e. Have. In the second cooler 8, as in the first cooler 3, the refrigerant is continuously introduced from the introduction pipe (not shown) into the refrigerant flow path of the second cooler 8, and thereby the semiconductor. The element 2 is cooled.

  As described above, in the semiconductor device 1 of the present embodiment, the disc spring 7 is interposed between the first fitting portion 43 and the second fitting portion 53 as shown in FIGS. The disc spring 7 urges the first heat radiating body 4 toward the semiconductor element 2 to improve the adhesion between the first heat radiating body 4 and the semiconductor element 2, and the first cooler 3 and the semiconductor. The thermal resistance between the element 2 can be reduced. Furthermore, in the semiconductor device 1 of this embodiment, the first fitting portion 43 and the second fitting are provided by using the disc spring 7 formed in an annular shape and arranging the disc spring 7 so as to surround the heat radiating portion 41. The stress applied to the joint portion 53 can be dispersed. Thus, by dispersing the stress applied to the first heat radiating body 4 and the second heat radiating body 5, it is possible to effectively prevent stress from being concentrated on a part of the seal member 6. 6 can be effectively suppressed. As a result, in the present embodiment, it is possible to effectively prevent leakage of the refrigerant from the refrigerant flow path.

Moreover, in this embodiment, as shown in FIG. 5, the disc spring 7 is arrange | positioned so that it may contact with the 1st fitting part 43 in the contact point 45 located inside the formation area of the semiconductor element 2. As shown in FIG. Yes. Therefore, as shown in FIG. 7, the disc spring 7 from directly below the semiconductor element 2, a first heat radiating member 4 can be pressed by the pressing force F _1, thereby, the pressing force F ₁ of the disc spring 7 The first heat radiator 4 can be effectively prevented from being bent. And as a result, it can suppress effectively that the thermal resistance between the semiconductor element 2 and the 1st cooler 3 increases. Here, FIG. 7 is a diagram for explaining the force applied to the first fitting portion 43 and the second fitting portion 53. 7 shows a cross-sectional view of the semiconductor device 1 as in FIG. 1, but hatching processing and some reference numerals in the drawing are omitted for ease of explanation.

On the other hand, when the disc spring 7 is brought into contact with the first fitting portion 43 at a point located outside the region where the semiconductor element 2 is formed, the disc spring 7 is pressed by the pressing force F ₁ of the disc spring 7. The first fitting portion 43 that contacts with the semiconductor element 2 warps toward the semiconductor element 2 side (upward), which may cause the first heat radiator 4 to bend. On the other hand, in the present embodiment, the disc spring 7 is arranged so as to be in contact with the first fitting portion 43 at the contact point 45 located inside the region where the semiconductor element 2 is formed. It effectively solves the problem.

Furthermore, in the present embodiment, as shown in FIG. 5, the disc spring 7 is disposed so as to contact the second fitting portion 53 at a contact point 55 located outside the formation region of the semiconductor element 2. Yes. Therefore, as shown in FIG. 7, the disc spring 7 can press the second fitting portion 53 with the pressing force F ₂ on the base side of the portion of the second fitting portion 53 protruding in the Y direction. , thereby, the pressing force F ₂ of the disc springs 7, may be a second fitting portion 53 is effectively prevented from bending to the refrigerant flow path (downward). And as a result, it can prevent more effectively that a refrigerant leaks from a refrigerant channel.

On the other hand, when the disc spring 7 is brought into contact with the second fitting portion 53 at a point located inside the region where the semiconductor element 2 is formed, the disc spring 7 is included in the second fitting portion 53. in the distal end side of the portion projecting in the Y direction, will then push the second fitting portion 53 by the pressing force F _2, thereby, the second fitting portion 53 in contact with the disc spring 7, the refrigerant flow path (the lower Direction) and the refrigerant may leak from the refrigerant flow path. On the other hand, in the present embodiment, the disc spring 7 is arranged so as to come into contact with the second fitting portion 53 at the contact point 55 located outside the region where the semiconductor element 2 is formed. It effectively solves the problem.

  Furthermore, in this embodiment, as shown in FIG. 2, the heat radiating part 41 is formed in a circular shape, and the sealing member 6 is arranged so as to surround the outer peripheral side surface of the heat radiating part 41 formed in this circular shape. Has been. That is, in this embodiment, since the seal member 6 is arranged in a circular shape, it is possible to effectively prevent the stress applied to the seal member 6 from becoming uneven. As a result, as a result, the seal member 6 Can improve the reliability.

<< Second Embodiment >>
Subsequently, a second embodiment of the present invention will be described. FIG. 8 is a cross-sectional view of the semiconductor device 1a according to the second embodiment. The semiconductor device 1a according to the second embodiment has the same configuration and operation as those of the first embodiment described above, except that the semiconductor device 1a is different from the semiconductor device 1 of the first embodiment in the points described below. Description is omitted.

  As shown in FIG. 8, the semiconductor device 1 a according to the second embodiment includes a single semiconductor element 2 and two first coolers 3, and the semiconductor element 2 is divided into two first elements. A double-sided cooling structure is employed in which the semiconductor element 2 is cooled from both sides by being sandwiched by the cooler 3. That is, in the semiconductor device 1a according to the second embodiment, the first coolers 3 are arranged on both the upper and lower surfaces of the semiconductor element 2, and this is different from the semiconductor device 1 according to the first embodiment.

  As described above, in the semiconductor device 1a according to the present embodiment, the first cooler 3 formed by combining the first radiator 4 and the second radiator 5 via the seal member 6 and the disc spring 7 is provided. The semiconductor element 2 is arranged on both upper and lower surfaces. Here, as described above, the first cooler 3 has the disc spring 7 interposed between the first fitting portion 43 and the second fitting portion 53. 5, at the contact point 45 located inside the formation region of the semiconductor element 2, the contact point 55 is in contact with the first fitting portion 43 and located outside the formation region of the semiconductor element 2. It arrange | positions so that the 2nd fitting part 53 may be contacted. In the present embodiment, by cooling the semiconductor element 2 from the upper and lower surfaces by the first cooler 3 configured as described above, in addition to the effects of the first embodiment described above, also on the upper surface of the semiconductor element 2, Adhesiveness between the semiconductor element 2 and the first cooler 3 can be improved, and thereby the cooling performance of the semiconductor device 1a as a whole can be further improved.

«Third embodiment»
Subsequently, a third embodiment of the present invention will be described. FIG. 9 is a cross-sectional view of a semiconductor device 1b according to the third embodiment. The semiconductor device 1b according to the third embodiment has the same configuration and operation as those of the above-described first embodiment except that the semiconductor device 1b is different from the semiconductor device 1 of the first embodiment in the points described below, and overlaps. Description is omitted.

  As shown in FIG. 9, the semiconductor device 1 b according to the third embodiment includes a semiconductor module 20 on which a semiconductor element is mounted and a first cooler 3 for cooling the semiconductor module 20. By fixing the module 20 to the first cooler 3 with a fastening member 9 such as a bolt or a screw, the semiconductor module 20 is cooled by the first cooler 3 from one side. That is, the semiconductor device 1b according to the third embodiment includes the semiconductor module 20 on which the semiconductor element is mounted instead of the semiconductor element 2, and the second cooler 8 serves as a cooler for cooling the semiconductor module 20. Is different from the semiconductor device 1 according to the first embodiment in this respect.

  In the present embodiment, the disc cooler 7 is interposed between the first fitting portion 43 and the second fitting portion 53 in the first cooler 3 constituting the semiconductor device 1b as shown in FIG. Has been. The disc spring 7 is in contact with the first fitting portion 43 at a contact point located inside a formation region of a semiconductor element (not shown) mounted on the semiconductor module 20 and mounted on the semiconductor module 20. The contact point located outside the region where the semiconductor element (not shown) is formed is arranged so as to contact the second fitting portion 53.

  As described above, in the semiconductor device 1b according to the present embodiment, the semiconductor module 20 is fixed to the first cooler 3 by the fastening member 9, and the semiconductor module 20 is moved from one side by the first cooler 3. It is configured to cool. The first cooler 3 has a disc spring 7 interposed between the first fitting portion 43 and the second fitting portion 53. As shown in FIG. At a contact point located inside a formation region of a semiconductor element (not shown) mounted on the module 20, the semiconductor element (not shown) is in contact with the first fitting portion 43 and mounted on the semiconductor module 20. It arrange | positions so that the 2nd fitting part 53 may be contacted in the contact point located in the outer side of a formation area. In the present embodiment, by cooling the semiconductor element 2 from one side by the first cooler 3 configured in this way, in addition to the effects of the first embodiment described above, the semiconductor device 1b can be reduced in size and manufactured. Effects such as cost reduction can be achieved.

  The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  For example, in the present embodiment, the disc spring 7 is illustrated and described as a member for biasing the first heat radiating body 4 toward the semiconductor element 2, but as such a member, the disc spring 7 is used. It will not be limited in particular, if it is a metal cyclic | annular elastic body.

  In the above-described embodiment, the semiconductor device 1 that cools the single semiconductor element 2 with the two coolers 3 and 8 is exemplified, but the number of semiconductor elements included in the semiconductor device 1 is not particularly limited. It is good also as a structure provided with a some semiconductor element.

  The semiconductor element 2 of the above-described embodiment is a heating element of the present invention, the first radiator 4 is a first radiator of the present invention, and the first fitting portion 43 is a first fitting portion of the present invention. The second radiator 5 corresponds to the second radiator of the present invention, the second fitting portion 53 corresponds to the second fitting portion of the present invention, and the disc spring 7 corresponds to the annular elastic body and disc spring of the present invention. .

DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Semiconductor device 2 ... Semiconductor element 20 ... Semiconductor module 3 ... 1st cooler 4 ... 1st heat radiator 41 ... Radiation part
42a-42g ... Radiation fin 43 ... 1st fitting part 44 ... Circumferential groove 45 ... Contact point 5 ... 2nd thermal radiation body 51 ... Receiving part 53 ... 2nd fitting part
55 ... Contact point 6 ... Sealing member 7 ... Belleville spring 8 ... Second cooler

Claims (5)

A first heat radiating body having a main surface on which the heat generating element is disposed, and another main surface on which a first fitting portion surrounding the heat radiating portion and the heat radiating portion is formed;
It has the 2nd fitting part fitted by the 1st fitting part, and fitting the 2nd fitting part to the 1st fitting part, and combining the 1st radiator with the heat dissipation A second heat radiating body having a receiving portion that receives the portion and forms a refrigerant flow path;
A heating element cooling device comprising: a metal annular elastic body interposed between the first fitting portion and the second fitting portion,
The annular elastic body is disposed on the side opposite to the receiving portion side, and is disposed so as to contact the second fitting portion in a region outside a region where the heat generating element is formed. Heating element cooling device. It is the cooling device of the heat generating element of Claim 1, Comprising:
The annular elastic body is formed in a gradient from the inner peripheral side toward the outer peripheral side,
The annular elastic body is in contact with the first fitting portion at one end on the inner peripheral side, and is in contact with the second fitting portion at the other end on the outer peripheral side. Cooling system. A heating device cooling device according to claim 1 or 2,
The cooling device for a heating element, wherein the annular elastic body is disposed so as to be in contact with the first fitting portion in a region inside a region where the heating element is formed. A cooling device for a heating element according to any one of claims 1 to 3,
The first heat radiator has a plurality of heat radiating fins formed in the heat radiating portion,
The cooling device for a heating element, wherein the plurality of heat dissipating fins are formed in a circular region inside the annular elastic body. The heating device cooling device according to any one of claims 1 to 4,
The cooling device for a heating element, wherein the annular elastic body is a disc spring.

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