CN103096688A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
CN103096688A
CN103096688A CN2011103495498A CN201110349549A CN103096688A CN 103096688 A CN103096688 A CN 103096688A CN 2011103495498 A CN2011103495498 A CN 2011103495498A CN 201110349549 A CN201110349549 A CN 201110349549A CN 103096688 A CN103096688 A CN 103096688A
Authority
CN
China
Prior art keywords
substrate
radiator
fin
heat abstractor
draw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011103495498A
Other languages
Chinese (zh)
Inventor
秦际云
冯锦松
严强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN2011103495498A priority Critical patent/CN103096688A/en
Priority to TW100142831A priority patent/TW201319786A/en
Priority to US13/338,252 priority patent/US20130112387A1/en
Publication of CN103096688A publication Critical patent/CN103096688A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device comprises a first heat sink and a second heat sink which is connected with the first heat sink. The first heat sink comprises a first substrate and a plurality of cooling fins installed on the first substrate, the second heat sink comprises a second substrate and a plurality of second cooling fins installed on the second substrate, the side edge of the first substrate is protruded outwards to form a rib, the side edge of the second substrate is sunken inwards to form a clamping groove, and the rib is clamped inside the clamping groove. According to the heat dissipation device, the first heat sink is connected with the second heat sink through the fact that the rib is clamped inside the clamping groove, idle spaces on the periphery of an electronic component can be utilized to enable the heat dissipation area to be enlarged, and therefore, heat dissipation efficiency of the heat dissipation device is improved.

Description

Heat abstractor
Technical field
The present invention relates to a kind of heat abstractor, refer in particular to a kind of heat abstractor for cooling electronic components.
Background technology
Along with vigorously developing rapidly of electronic industry, the large scale integrated circuit technology is constantly progressive, and computer-internal is central processing unit just not, is located at wafer caloric value on the mainboard additional card also in continuous increase.Amount of heat is as can not in time distributing, to cause the electronic component internal temperature more and more higher, have a strong impact on the stability of electronic component operation, nowadays heat dissipation problem has become a key factor that affects the computer run performance, also becomes the bottleneck of high speed processor practical application.Therefore, usually be provided with heat abstractor on the surface of electronic component, to reduce the working temperature of electronic component.
Usually, heat abstractor comprises that one adheres on the substrate on electronic component and is formed at some radiating fins on substrate.Substrate and fin are one-body molded by aluminium extruded.Yet this kind radiator is subject to the reason of aluminium extruded technique, and that usually size can't be done is larger, causes its area of dissipation limited.
Summary of the invention
In view of this, be necessary to provide a kind of larger-size heat abstractor.
A kind of heat abstractor, comprise the first radiator and the second radiator that is connected with this first radiator, described the first radiator comprises first substrate and is arranged at some the first radiating fins on first substrate, described the second radiator comprises second substrate and is arranged at some the second radiating fins on second substrate, the side edge of described first substrate outwards protrudes out and is formed with fin, the side edge of described second substrate caves inward and is formed with draw-in groove, and described fin is placed in this draw-in groove.
In heat abstractor of the present invention, described the first radiator and the second radiator are realized being connected with engaging between draw-in groove by fin, can strengthen the size of heat abstractor, and then the increase area of dissipation.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional combination figure of the heat abstractor of one embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of heat abstractor in Fig. 1.
Fig. 3 be in Fig. 1 heat abstractor from the three-dimensional exploded view of another angle.
Fig. 4 is the front view of heat abstractor in Fig. 1.
The main element symbol description
The first radiator 10
First substrate 12
Side 120、220
Fin 122
The first radiating fin 14
Gas channel 140、240
The second radiator 20
Second substrate 22
Draw-in groove 222
The second radiating fin 24
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 to Fig. 2, heat abstractor of the present invention is used for being installed on the electronic component (not shown) heat radiation on the circuit board (not shown), and it comprises one first radiator 10 and one second radiator 20 that is connected with these the first radiator 10 buckles.
Above-mentioned the first radiator 10 is made by heat conductivility good metal such as copper, aluminium etc., and it comprises a first substrate 12 and some the first radiating fins 14 that extended upward by this first substrate 12.Preferably, adopt one-body molded first radiator 10 of technique of aluminium extruded in the present embodiment, to reduce manufacturing cost.Described first substrate 12 is a rectangle plate body, its bottom surface and described electronic component phase close contact.Described the first radiating fin 14 is perpendicular to the end face setting of first substrate 12.These first radiating fins 14 are parallel to each other, are spaced.14 of adjacent 2 first radiating fins are formed with gas channel 140.Wherein side 120 place's convexes of this first substrate 12 stretch out the fin 122 of a lengthwise.Described fin 122 extends along the longitudinally of described side 120.The width of this fin 122 increases gradually along the direction away from side 120.The cross section of this fin 122 is along be the figure (referring to Fig. 4) of a flaring away from the direction of first substrate 12.In the present embodiment, the cross section of described fin 122 is trapezoidal, and understandably, described cross section also can be triangle, semicircle, fan-shaped or other shapes.
Please be simultaneously referring to Fig. 3, above-mentioned the second radiator 20 is made by heat conductivility good metal such as copper, aluminium etc., and it comprises a second substrate 22 and some the second radiating fins 24 that extended upward by this second substrate 22.Preferably, adopt one-body molded second radiator 20 of technique of aluminium extruded in the present embodiment, to reduce manufacturing cost.Described second substrate 22 is a rectangle plate body.Described the second radiating fin 24 is perpendicular to the end face setting of second substrate 22.These second radiating fins 24 are parallel to each other, are spaced.24 of adjacent 2 second radiating fins are formed with gas channel 240.This second substrate 22 caves inward towards side 220 places that described first substrate 12 arranges and forms the draw-in groove 222 of a lengthwise.Described draw-in groove 222 extends along the longitudinally of described side 220.Described draw-in groove 222 in shape with described fin 122 corresponding complementary, the cross section of this draw-in groove 222 in shape with the cross section corresponding consistent (referring to Fig. 4) of described fin 122, so that fin 122 just holding enter this draw-in groove 222, and then buckle connects the first substrate 12 of described the first radiator 10 and the second substrate 22 of the second radiator 20.
Please refer again to Fig. 1 to Fig. 4, when assembling heat abstractor of the present invention, first the side 120 of the first substrate 12 of described the first radiator 10 side 220 towards the second substrate 22 of the second radiator 20 is arranged, first substrate 12 and second substrate 22 are staggered, make an end of described fin 122 aim at an end opening place of draw-in groove 222, again with first substrate 12 and second substrate 22 relative slidings, holding enters in this draw-in groove 222 to make fin 122 slide also along draw-in groove 222, until first substrate 12 aligns with second substrate 22.At this moment, the side 120 of first substrate 12 fits with the side 220 of second substrate 22, corresponding the flushing of end face of the end face of first substrate 12 and second substrate 22, the bottom surface of first substrate 12 flushes with the bottom surface of second substrate 22 is corresponding, and described like this first radiator 10 and the second radiator 20 are realized being connected with engaging between draw-in groove 222 by fin 122.Described the first radiator 10 is with after the second radiator 20 is connected, can by welding further reinforce the connection and seal both between the gap.Preferably, adopt argon arc to weld in the present embodiment, to seal the junction of the first radiator 10 and the second radiator 20, prevent that liquid from infiltrating.
In sum, in heat abstractor of the present invention, described the first radiator 10 and the second radiator 20 are realized being connected with engaging between draw-in groove 222 by fin 122, thereby increase the area of dissipation of integral body.And the first radiator 10 and the second radiator 20 are that the mode by buckle is fixed, and process is comparatively easy, thereby simplifies processing procedure.Understandably, can be provided with each side 120 places that a plurality of fin 122(are formed at respectively first substrate 12 on described the first radiator 10), and match and combine with a plurality of the second radiators 20.In like manner, also can be formed with simultaneously draw-in groove 222 on described the first radiator 10, also can be formed with simultaneously fin 122 on described the second radiator 20, thereby realize the multiple combination of the first radiator 10 and the second radiator 20.And, coordinate firmly between the first radiator 10 of this heat abstractor and the second radiator 20, and then guarantee the heat abstractor steady operation.

Claims (10)

1. heat abstractor, comprise the first radiator and the second radiator that is connected with this first radiator, described the first radiator comprises first substrate and is arranged at the first radiating fin on first substrate, described the second radiator comprises second substrate and is arranged at the second radiating fin on second substrate, it is characterized in that: the side edge of described first substrate outwards protrudes out and is formed with fin, the side edge of described second substrate caves inward and is formed with draw-in groove, and described fin is placed in this draw-in groove.
2. heat abstractor as claimed in claim 1 is characterized in that: described fin is greater than width near the side of first substrate at the width away from the side of first substrate.
3. heat abstractor as claimed in claim 2 is characterized in that: the cross section of described fin is along the direction flaring away from the first substrate side.
4. heat abstractor as claimed in claim 3, it is characterized in that: the cross section of described fin is trapezoidal.
5. heat abstractor as described in any one in claim 1 to 4 is characterized in that: described draw-in groove in shape with described fin corresponding complementary.
6. heat abstractor as claimed in claim 5, it is characterized in that: the side of described first substrate and the side of second substrate fit.
7. heat abstractor as claimed in claim 5, it is characterized in that: the bottom surface of described first substrate flushes with the bottom surface of second substrate is corresponding.
8. heat abstractor as claimed in claim 1 is characterized in that: described fin extends along the longitudinally of described first substrate side.
9. heat abstractor as claimed in claim 1, it is characterized in that: the draw-in groove of the fin of the first radiator and the second radiator is fixed by argon arc welding.
10. heat abstractor as claimed in claim 1, it is characterized in that: the fin of the first radiator is parallel to the fin of the second radiator.
CN2011103495498A 2011-11-08 2011-11-08 Heat dissipation device Pending CN103096688A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011103495498A CN103096688A (en) 2011-11-08 2011-11-08 Heat dissipation device
TW100142831A TW201319786A (en) 2011-11-08 2011-11-23 Heat dissipation device
US13/338,252 US20130112387A1 (en) 2011-11-08 2011-12-28 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011103495498A CN103096688A (en) 2011-11-08 2011-11-08 Heat dissipation device

Publications (1)

Publication Number Publication Date
CN103096688A true CN103096688A (en) 2013-05-08

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ID=48208613

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011103495498A Pending CN103096688A (en) 2011-11-08 2011-11-08 Heat dissipation device

Country Status (3)

Country Link
US (1) US20130112387A1 (en)
CN (1) CN103096688A (en)
TW (1) TW201319786A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104066302A (en) * 2013-03-22 2014-09-24 技嘉科技股份有限公司 Heat dissipation module and manufacture method thereof
CN104168744A (en) * 2014-07-30 2014-11-26 太仓陶氏电气有限公司 Intensive radiator
CN104571398A (en) * 2013-10-15 2015-04-29 英业达科技有限公司 Server and heat-radiating component thereof
CN109168288A (en) * 2014-09-26 2019-01-08 华为技术有限公司 Radiator and electronic product
CN110007721A (en) * 2018-01-05 2019-07-12 联想企业解决方案(新加坡)有限公司 Computer server and mainboard assembly
CN112702887A (en) * 2019-10-23 2021-04-23 北京配天技术有限公司 Robot driving assembly, heat dissipation structure thereof and robot control cabinet

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1023686B1 (en) * 2015-11-12 2017-06-15 Maes Jonker Nv DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070279872A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation device
US20080302509A1 (en) * 2007-06-08 2008-12-11 Ama Precision Inc. Heat sink and modular heat sink
CN101808490A (en) * 2009-02-17 2010-08-18 富准精密工业(深圳)有限公司 Heat dissipating device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10009398C2 (en) * 2000-02-28 2002-03-14 Epcos Ag Heatsink module and arrangement of heatsink modules
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070279872A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation device
US20080302509A1 (en) * 2007-06-08 2008-12-11 Ama Precision Inc. Heat sink and modular heat sink
CN101808490A (en) * 2009-02-17 2010-08-18 富准精密工业(深圳)有限公司 Heat dissipating device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104066302A (en) * 2013-03-22 2014-09-24 技嘉科技股份有限公司 Heat dissipation module and manufacture method thereof
CN104066302B (en) * 2013-03-22 2016-12-28 技嘉科技股份有限公司 Radiating module and manufacture method thereof
CN104571398A (en) * 2013-10-15 2015-04-29 英业达科技有限公司 Server and heat-radiating component thereof
CN104571398B (en) * 2013-10-15 2018-04-13 英业达科技有限公司 Servomechanism and its radiating subassembly
CN104168744A (en) * 2014-07-30 2014-11-26 太仓陶氏电气有限公司 Intensive radiator
CN109168288A (en) * 2014-09-26 2019-01-08 华为技术有限公司 Radiator and electronic product
CN109168288B (en) * 2014-09-26 2020-07-14 华为技术有限公司 Radiator and electronic product
CN110007721A (en) * 2018-01-05 2019-07-12 联想企业解决方案(新加坡)有限公司 Computer server and mainboard assembly
CN110007721B (en) * 2018-01-05 2023-08-22 联想企业解决方案(新加坡)有限公司 Computer server and main board assembly
CN112702887A (en) * 2019-10-23 2021-04-23 北京配天技术有限公司 Robot driving assembly, heat dissipation structure thereof and robot control cabinet

Also Published As

Publication number Publication date
TW201319786A (en) 2013-05-16
US20130112387A1 (en) 2013-05-09

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Application publication date: 20130508