US20130186599A1

US20130186599A1 - Heat dissipating device and method of manufacturing the same

Info

Publication number: US20130186599A1
Application number: US13/414,730
Authority: US
Inventors: Han-Lin Chen; Hsuan-Hao Pai; Cheng-En Tsai
Original assignee: Individual
Current assignee: Cooler Master Development Corp
Priority date: 2012-01-19
Filing date: 2012-03-08
Publication date: 2013-07-25
Also published as: TW201331536A

Abstract

A heat dissipating device includes a base, a heat pipe and a fixing member. The base includes an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention
The invention relates to a heat dissipating device and a method of manufacturing the same and, more particularly, to a heat dissipating device with a base formed by a die casting process and a method of manufacturing the heat dissipating device.
2. Description of the Prior Art
Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat. Therefore, the performance of heat dissipating device is a significant issue for the electronic product.
In general, most of the heat dissipating devices are equipped with heat pipes for conducting heat from electronic components to a heat sink and then the heat is dissipated out of the electronic product by the heat sink. So far a base of the conventional heat dissipating device, which is used for carrying the heat pipe, has to be processed by several processes and it wastes much time in transporting the base to each process such that production efficiency will decrease and production cost will increase.

SUMMARY OF THE INVENTION

The invention provides a heat dissipating device with a base formed by a die casting process and a method of manufacturing the heat dissipating device so as to solve the aforesaid problems.
According to an embodiment of the invention, a heat dissipating device comprises a base, a heat pipe and a fixing member. The base comprises an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.
According to another embodiment of the invention, a method of manufacturing a heat dissipating device comprises steps of forming a base by a die casting process, wherein the base comprises an accommodating recess; disposing a first end of a heat pipe in the accommodating recess; disposing a fixing member on the base so as to fix the first end of the heat pipe in the accommodating recess; and milling a bottom surface of the base so as to form an opening at one side of the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end.
In the aforesaid embodiment, the heat pipe, which is exposed out of the opening of the accommodating recess, can be attached on an electronic component so as to dissipate heat from the electronic component.
As mentioned in the above, since the base of the heat dissipating device of the invention is formed by the die casting process and the die casting process is very simple, production efficiency can increase and production cost can decrease accordingly. Furthermore, after disposing the heat pipe in the accommodating recess of the base, the invention mills the bottom surface of the base so as to expose the heat pipe and then attaches the exposed heat pipe on an electronic component, such that the whole height of the heat dissipating device can be reduced effectively. Accordingly, the heat dissipating device of the invention can be designed as thin as possible.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flowchart illustrating a method of manufacturing a heat dissipating device according to an embodiment of the invention.

FIG. 2 is a perspective view illustrating a base.

FIG. 3 is an assembly view illustrating the base, a heat pipe and a heat sink.

FIG. 4 is an assembly view illustrating the base, the heat pipe, the heat sink and a fixing member.

FIG. 5 is a cross-sectional view illustrating the base, the heat pipe and the fixing member along line X-X shown in FIG. 4.

FIG. 6 is a cross-sectional view illustrating parts of the base shown in FIG. 5 after milling.

FIG. 7 is a rear perspective view illustrating a heat dissipating device manufactured by the method shown in FIG. 1.

FIG. 8 is a front perspective view illustrating the base shown in FIG. 7.

FIG. 9 is a perspective view illustrating a base.

FIG. 10 is an assembly view illustrating the base, a heat pipe and a heat sink.

FIG. 11 is an assembly view illustrating the base, the heat pipe, the heat sink and a fixing member.

FIG. 12 is a cross-sectional view illustrating the base, the heat pipe and the fixing member along line Y-Y shown in FIG. 11.

FIG. 13 is a cross-sectional view illustrating parts of the base shown in FIG. 12 after milling.

FIG. 14 is a rear perspective view illustrating another heat dissipating device manufactured by the method shown in FIG. 1.

FIG. 15 is a front perspective view illustrating the base shown in FIG. 14.

DETAILED DESCRIPTION

Referring to FIGS. 1 to 8, FIG. 1 is a flowchart illustrating a method of manufacturing a heat dissipating device according to an embodiment of the invention, FIG. 2 is a perspective view illustrating a base 10, FIG. 3 is an assembly view illustrating the base 10, a heat pipe 12 and a heat sink 14, FIG. 4 is an assembly view illustrating the base 10, the heat pipe 12, the heat sink 14 and a fixing member 16, FIG. 5 is a cross-sectional view illustrating the base 10, the heat pipe 12 and the fixing member 16 along line X-X shown in FIG. 4, FIG. 6 is a cross-sectional view illustrating parts of the base 10 shown in FIG. 5 being milled, FIG. 7 is a rear perspective view illustrating a heat dissipating device 1 manufactured by the method shown in FIG. 1, and FIG. 8 is a front perspective view illustrating the base 10 shown in FIG. 7, wherein FIGS. 2 to 6 are used for illustrating each step shown in FIG. 1 according to an embodiment of the invention.
First of all, step S10 is performed to form a base 10 by a die casting process, wherein the base 10 comprises an accommodating recess 100, a first half portion 102, a second half portion 104, two ribs 106 and four riveting portions 108, as shown in FIG. 2. The accommodating recess 100 is formed between the first half portion 102 and the second half portion 104. The two ribs 106 are located at opposite sides of the base 10 and connect the first half portion 102 and the second half portion 104. It should be noted that the number and the position of the ribs 106 and the riveting portions 108 can be determined based on practical applications and are not limited to the embodiment shown in FIG. 2.
Afterward, step S12 is performed to dispose a first end 120 of a heat pipe 12 in the accommodating recess 100 and dispose a heat sink 14 on a second end 122 of the heat pipe 12, as shown in FIG. 3. The first end 120 of the heat pipe 12 passes through a through hole 110 (shown in FIG. 2) on one side of the base 10 so as to be disposed in the accommodating recess 100. In this embodiment, the heat pipe 12 is a flat heat pipe. However, in another embodiment, the heat pipe 12 may be a circular heat pipe or other heat pipes and it depends on practical applications. Furthermore, the heat sink 14 may consist of, but not limited to, a plurality of heat dissipating fins.
Afterward, step S14 is performed to dispose a fixing member 16 on the base 10 so as to fix the first end 120 of the heat pipe 12 in the accommodating recess 100, as shown in FIG. 4. In practical applications, the fixing member 16 may be, but not limited to, a metal resilient plate. In this embodiment, the fixing member 16 may be riveted on the riveting portions 108 of the base 10. Furthermore, if there are no riveting portions 108 formed on the base 10 in the die casting process, the fixing member 16 may be disposed on the base 10 by screws, soldering or other fixing manners. After disposing the fixing member 16 on the base 10, the ribs 106 and the fixing member 16 are located at the same side of the base 10. As shown in FIG. 5, a thickness T1 is between a bottom surface 112 of the base 10 and a bottom surface 114 of the accommodating recess 100.
Finally, step S16 is performed to mill the bottom surface 112 of the base 10 so as to form an opening 116 at one side of the accommodating recess 100 such that a bottom surface 124 of the first end 120 of the heat pipe 12 is exposed out of the opening 116, as shown in FIG. 6. In other words, step S16 is to mill the material with the thickness T1 shown in FIG. 5 so as to expose the bottom surface 124 of the first end 120 of the heat pipe 12. At this time, two restraining portions 118 are located at opposite sides of the accommodating recess 100 respectively and the opening 116 is between the two restraining portions 118. In this embodiment, a width W1 of the opening 116 is smaller than a maximum width W2 of the first end 120 of the heat pipe 12 such that the two restraining portions 118 can support the first end 120 of the heat pipe 12 in the accommodating recess 100, so as to prevent the first end 120 of the heat pipe 12 from coming off the opening 116. In other words, the first end 120 of the heat pipe 12 is fixed between the fixing member 16 and the two restraining portions 118. Furthermore, since both sides of the first end 120 of the heat pipe 12 are arc-shaped, a surface of each of the two restraining portions 118, which contacts the first end 120 of the heat pipe 12, is an arc surface such that the first end 120 of the heat pipe 12 can be attached to the two restraining portions 118 tightly. Accordingly, the first end 120 of the heat pipe 12 can be disposed in the accommodating recess 100 stably. It should be noted that if both sides of the first end 120 of the heat pipe 12 are oblique, a surface of each of the two restraining portions 118, which contacts the first end 120 of the heat pipe 12, will be an oblique surface correspondingly.
Therefore, a heat dissipating device 1 shown in FIG. 7 can be manufactured through the aforesaid steps S10 to S16. In practical applications, the exposed bottom surface 124 of the first end 120 of the heat pipe 12 can be attached to an electronic component (not shown) and then the fixing member 16 can be fixed on a circuit board of an electronic product (not shown) so as to dissipate heat from the electronic component. As shown in FIG. 7, after manufacturing the heat dissipating device 1, the bottom surface 124 of the first end 120 of the heat pipe 12 and the bottom surface 112 of the base 10 after milling may be coplanar so as to increase heat dissipating area of the heat pipe 12 and enhance stability while the heat dissipating device 1 is attached to the electronic component. Moreover, the two ribs 106, which connect the first half portion 102 and the second half portion 104, can enhance rigidity of the base 10 so as to prevent the heat dissipating device 1 from being damaged due to over-pressure during assembly.
Referring to FIGS. 9 to 15, FIG. 9 is a perspective view illustrating a base 30, FIG. 10 is an assembly view illustrating the base 30, a heat pipe 32 and a heat sink 34, FIG. 11 is an assembly view illustrating the base 30, the heat pipe 32, the heat sink 34 and a fixing member 36, FIG. 12 is a cross-sectional view illustrating the base 30, the heat pipe 32 and the fixing member 36 along line Y-Y shown in FIG. 11, FIG. 13 is a cross-sectional view illustrating parts of the base 30 shown in FIG. 12 after milling, FIG. 14 is a rear perspective view illustrating another heat dissipating device 3 manufactured by the method shown in FIG. 1, and FIG. 15 is a front perspective view illustrating the base 30 shown in FIG. 14, wherein FIGS. 9 to 13 are used for illustrating each step shown in FIG. 1 according to another embodiment.
First of all, step S10 is performed to form a base 30 by a die casting process, wherein the base 30 comprises an accommodating recess 300, a first half portion 302, a second half portion 304, two ribs 306 and four riveting portions 308, as shown in FIG. 9. The accommodating recess 300 is formed between the first half portion 302 and the second half portion 304. The two ribs 306 are located at opposite sides of the base 30 and connect the first half portion 302 and the second half portion 304. It should be noted that the number and the position of the ribs 306 and the riveting portions 308 can be determined based on practical applications and are not limited to the embodiment shown in FIG. 9.
Afterward, step S12 is performed to dispose a first end 320 of a heat pipe 32 in the accommodating recess 300 and dispose a heat sink 34 on a second end 322 of the heat pipe 32, as shown in FIG. 10. The first end 320 of the heat pipe 32 is disposed in the accommodating recess 300 from the top of the base 30 downwardly. In this embodiment, the heat pipe 32 is a flat heat pipe. However, in another embodiment, the heat pipe 32 may be a circular heat pipe or other heat pipes and it depends on practical applications.
Afterward, step S14 is performed to dispose a fixing member 36 on the base 30 so as to fix the first end 320 of the heat pipe 32 in the accommodating recess 300, as shown in FIG. 11. In practical applications, the fixing member 36 may be, but not limited to, a metal resilient plate. In this embodiment, the fixing member 36 may be riveted on the riveting portions 308 of the base 30. Furthermore, if there are no riveting portions 308 formed on the base 30 in the die casting process, the fixing member 36 may be disposed on the base 30 by screws, soldering or other fixing manners. After disposing the fixing member 36 on the base 30, the ribs 306 and the fixing member 36 are located at opposite sides of the base 30. As shown in FIG. 12, a thickness T2 is between a bottom surface 312 of the base 30 and a bottom surface 314 of the accommodating recess 300.
Finally, step S16 is performed to mill the bottom surface 312 of the base 30 so as to form an opening 316 at one side of the accommodating recess 300 such that a bottom surface 324 of the first end 320 of the heat pipe 32 is exposed out of the opening 316, as shown in FIG. 13. In other words, step S16 is to mill the material with the thickness T2 shown in FIG. 12 so as to expose the bottom surface 324 of the first end 320 of the heat pipe 32. At this time, two restraining portions 318 are located at opposite sides of the accommodating recess 300 respectively and the opening 316 is between the two restraining portions 318. In this embodiment, a width W3 of the opening 316 is smaller than a maximum width W4 of the first end 320 of the heat pipe 32 such that the two restraining portions 318 can support the first end 320 of the heat pipe 32 in the accommodating recess 300, so as to prevent the first end 320 of the heat pipe 32 from coming off the opening 316. In other words, the first end 320 of the heat pipe 32 is fixed between the fixing member 36 and the two restraining portions 318. Furthermore, since both sides of the first end 320 of the heat pipe 32 are arc-shaped, a surface of each of the two restraining portions 318, which contacts the first end 320 of the heat pipe 32, is an arc surface such that the first end 320 of the heat pipe 32 can be attached to the two restraining portions 318 tightly. Accordingly, the first end 320 of the heat pipe 32 can be disposed in the accommodating recess 300 stably. It should be noted that if both sides of the first end 320 of the heat pipe 32 are oblique, a surface of each of the two restraining portions 318, which contacts the first end 320 of the heat pipe 32, will be an oblique surface correspondingly.
Therefore, a heat dissipating device 3 shown in FIG. 14 can be manufactured through the aforesaid steps S10 to S16. In practical applications, the exposed bottom surface 324 of the first end 320 of the heat pipe 32 can be attached to an electronic component (not shown) and then the fixing member 36 can be fixed on a circuit board of an electronic product (not shown) so as to dissipate heat from the electronic component. As shown in FIG. 14, after manufacturing the heat dissipating device 3, the bottom surface 324 of the first end 320 of the heat pipe 32 and the bottom surface 312 of the base 30 after milling may be coplanar so as to increase heat dissipating area of the heat pipe 32 and enhance stability while the heat dissipating device 3 is attached to the electronic component. Moreover, the two ribs 306, which connect the first half portion 302 and the second half portion 304, can enhance rigidity of the base 30 so as to prevent the heat dissipating device 3 from being damaged due to over-pressure during assembly.
Compared with the prior art, since the base of the heat dissipating device of the invention is formed by the die casting process and the die casting process is very simple, production efficiency can increase and production cost can decrease accordingly. Furthermore, after disposing the heat pipe in the accommodating recess of the base, the invention mills the bottom surface of the base so as to expose the heat pipe and then attaches the exposed heat pipe on an electronic component, such that the whole height of the heat dissipating device can be reduced effectively. Accordingly, the heat dissipating device of the invention can be designed as thin as possible.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.

Claims

What is claimed is:

1. A heat dissipating device comprising:

a base comprising an accommodating recess and two restraining portions, the two restraining portions being located at opposite sides of the accommodating recess, an opening being between the two restraining portions;

a heat pipe, a first end of the heat pipe being disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, a width of the opening being smaller than a maximum width of the first end; and

a fixing member disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.

2. The heat dissipating device of claim 1, wherein the bottom surface of the first end and a bottom surface of the base are coplanar.

3. The heat dissipating device of claim 1, wherein the base further comprises a first half portion, a second half portion and at least one rib, the accommodating recess is formed between the first half portion and the second half portion, and the at least one rib connects the first half portion and the second half portion.

4. The heat dissipating device of claim 3, wherein the at least one rib and the fixing member are located at one side of the base.

5. The heat dissipating device of claim 3, wherein the at least one rib and the fixing member are located at opposite sides of the base.

6. The heat dissipating device of claim 1, wherein a surface of each of the two restraining portions, which contacts the first end of the heat pipe, is an arc surface or an oblique surface.

7. The heat dissipating device of claim 1 further comprising a heat sink disposed on a second end of the heat pipe.

8. The heat dissipating device of claim 1, wherein the heat pipe is a flat heat pipe.

9. A method of manufacturing a heat dissipating device comprising:

forming a base by a die casting process, wherein the base comprises an accommodating recess;

disposing a first end of a heat pipe in the accommodating recess;

disposing a fixing member on the base so as to fix the first end of the heat pipe in the accommodating recess; and

milling a bottom surface of the base so as to form an opening at one side of the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end.

10. The method of claim 9, wherein the bottom surface of the first end and the bottom surface of the base after milling are coplanar.

11. The method of claim 9, wherein the base further comprises a first half portion, a second half portion and at least one rib, the accommodating recess is formed between the first half portion and the second half portion, and the at least one rib connects the first half portion and the second half portion.

12. The method of claim 11, wherein the at least one rib and the fixing member are located at one side of the base.

13. The method of claim 11, wherein the at least one rib and the fixing member are located at opposite sides of the base.

14. The method of claim 9, wherein the opening is between two restraining portions, and a surface of each of the two restraining portions, which contacts the first end of the heat pipe, is an arc surface or an oblique surface.

15. The method of claim 9 further comprising:

disposing a heat sink on a second end of the heat pipe.

16. The method of claim 9, wherein the heat pipe is a flat heat pipe.