US7272007B2 - Locking device for heat sink - Google Patents
Locking device for heat sink Download PDFInfo
- Publication number
- US7272007B2 US7272007B2 US11/012,423 US1242304A US7272007B2 US 7272007 B2 US7272007 B2 US 7272007B2 US 1242304 A US1242304 A US 1242304A US 7272007 B2 US7272007 B2 US 7272007B2
- Authority
- US
- United States
- Prior art keywords
- main frame
- heat sink
- locking device
- fasteners
- fastener
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates generally to a locking device, and more particularly to a locking device for securing a heat sink to an electronic device.
- FIG. 8 shows a conventional locking device for securing a heat sink 40 to a CPU 100 mounted on a printed circuit board (PCB) 10 .
- the locking device comprises a rectangular retention frame 20 , four fastening pins 30 and a wire clip 50 .
- Four retaining holes 12 are defined in the PCB 10 surrounding the CPU 100 .
- Four positioning holes 28 are defined at four corners of the retention frame 20 in alignment with the retaining holes 12 of the PCB 10 .
- a pair of ears 29 is diagonally formed from the retention frame 20 at opposite sides thereof.
- the clip 50 comprises an elongated pressing beam 52 and a pair of locking feet 54 extending from opposite ends of the pressing beam 52 .
- the fastening pins 30 respectively pass through the positioning holes 28 of the retention frame 20 and engage with the PCB 10 in the retaining holes 12 to thereby hold the retention frame 20 on the PCB 10 .
- the clip 50 is positioned on the heat sink 40 with the locking feet 54 engaging with the ears 29 and the pressing beam 52 abutting against a chassis 42 of the heat sink 40 to thereby firmly secure the heat sink 40 to the CPU 100 .
- the locking device is only applicable for attachment of the heat sink 40 to a PCB with retaining holes in alignment with the positioning holes 28 of the retention frame 20 . When a PCB having a configuration of retaining holes different from the above-mentioned is used, the locking device becomes disqualified.
- an object of the present invention is to provide a locking device which is able to secure a heat sink to PCBs with different configurations of retaining holes.
- a locking device for a heat sink in accordance with a preferred embodiment of the present invention comprises a main frame, and at least one first fastener and at least one second fastener pivotably attached to the main frame respectively.
- Each of the first and second fasteners is capable of rotating relative to the main frame from a non-stretched position to a stretched position for securing of the heat sink to the electronic device.
- FIG. 1 is an isometric view of a locking device according to a preferred embodiment of the present invention with the first and second fasteners respectively located at their stretched positions;
- FIG. 2 is an exploded, isometric view of one second fastener of the locking device of FIG. 1 ;
- FIG. 3 is an isometric view of the locking device of FIG. 1 with the second fasteners located at their non-stretched positions;
- FIG. 4 is an isometric view of the locking device of FIG. 1 with the first fasteners located at their non-stretched positions;
- FIG. 5 is an isometric view of the locking device of FIG. 3 , with a heat pipe mounted thereon;
- FIG. 6 is an isometric view of the locking device of FIG. 5 , with a plurality of cooling fins stacked along the heat pipe;
- FIG. 7 is an isometric view of the locking device of FIG. 3 , with a plurality of heat pipes mounted thereon;
- FIG. 8 is exploded, isometric view of a conventional locking device for securing a heat sink to a CPU mounted on a PCB.
- FIG. 1 illustrates a locking device 10 for a heat sink assembly which is used to dissipate heat from a heat generating component like a central processing unit (CPU) according to a preferred embodiment of the present invention.
- the locking device 10 comprises a rectangular main frame 20 with an opening 22 and a plurality of fasteners pivotably attached to the main frame 20 .
- the main frame 20 has four side edges 23 to corporatively define a periphery of the main frame 20 .
- Two pairs of connecting blocks 24 are upwardly formed from opposite side edges of the main frame 20 .
- the fasteners include four first fasteners 30 pivotably attached to respective four corners of the main frame 20 , and two second fasteners 40 pivotably attached to the respective pairs of connecting blocks 24 .
- a slot 26 is defined in the main frame 20 adjacent each first fastener 30 .
- the first and second fasteners 30 , 40 are substantially identical in structures.
- FIG. 2 shows more details of a second fastener 40 .
- the second fastener 40 includes a pair of spaced sidewalls 41 , a first pivot member 45 and a screw 47 for engaging in a corresponding retaining hole of a PCB (not shown).
- a second pivot member 43 extends outward from one side of the sidewalls 41 for being retainably attached to the corresponding pair of connecting blocks 24 of the main frame 20 .
- Each of the sidewalls 41 has a stopping wall 42 extending from a bottom edge thereof.
- a pair of abutting walls 46 is formed from the first pivot member 45 .
- the screw 47 is combined to the first pivot member 45 and further is pivotably attached to the sidewalls 41 such that the screw 47 is capable of rotating about the first pivot member 45 with respect to the sidewalls 41 from a first position at which the screw 47 is parallel to the sidewalls 41 (See FIG. 3 ) to a second position at which the screw 47 is perpendicular to the sidewalls 41 (See FIG. 4 ).
- the abutting walls 46 of the first pivot member 45 are in abutment with the stopping walls 42 of the sidewalls 41 to thereby maintain the screw 47 in position.
- the first fasteners 30 and the second fasteners 40 respectively are capable of rotating relative to the main frame 20 from a stretched position to a non-stretched position.
- the first fasteners 30 are capable of rotating along a plane parallel to the main frame 20 while the second fasteners 40 are capable of rotating along a plane perpendicular to the main frame 20 .
- all of the fasteners 30 , 40 are located at their stretched positions at which the fasteners 30 , 40 extend out of the main frame 20 .
- FIG. 3 shows the second fasteners 40 are located at their non-stretched positions at which the second fasteners 40 stand above the main frame 20 .
- FIG. 4 shows the first fasteners 30 are located at their non-stretched positions at which the first fasteners 30 are received in the slots 26 of the main frame 20 . Therefore, the locking devices 10 shown in FIG. 3 and FIG. 4 can be applied to attach a heat sink to different kinds of PCBs on which retaining holes with different layouts may define.
- FIGS. 5-6 illustrate the locking device 10 shown in FIG. 3 being applied to attach a heat sink to a PCB (not shown).
- the heat sink comprises a heat pipe 50 , a plurality of cooling fins 60 stacked along the heat pipe 50 and a cooling fan 80 for providing forced airflow toward the cooling fins 60 .
- a lower portion of the heat pipe 50 is retainably received in the opening 22 of the main frame 20 .
- the second fasteners 40 of the locking device 10 are located at their non-stretched positions and received in respective spaces (not labeled) defined at opposite sides of the cooling fins 60 such that the second fasteners 40 do not interfere with other electronic devices adjacent the main frame 20 .
- changes may be made to the heat pipe 50 , especially in size or shape, for example, a plurality of U-shaped heat pipes 70 as shown in FIG. 7 is applied.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/012,423 US7272007B2 (en) | 2004-12-14 | 2004-12-14 | Locking device for heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/012,423 US7272007B2 (en) | 2004-12-14 | 2004-12-14 | Locking device for heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
US20060126301A1 US20060126301A1 (en) | 2006-06-15 |
US7272007B2 true US7272007B2 (en) | 2007-09-18 |
Family
ID=36583561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/012,423 Expired - Fee Related US7272007B2 (en) | 2004-12-14 | 2004-12-14 | Locking device for heat sink |
Country Status (1)
Country | Link |
---|---|
US (1) | US7272007B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070103873A1 (en) * | 2005-05-11 | 2007-05-10 | Cooler Master Co., Ltd. | Heat sink module |
US20070111594A1 (en) * | 2005-11-11 | 2007-05-17 | Ama Precision Inc. | Clip assembly |
US20080121371A1 (en) * | 2006-11-29 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US20100038064A1 (en) * | 2008-08-15 | 2010-02-18 | Asia Vital Components Co., Ltd. | Reinforced Thermal Module Structure |
US20110094723A1 (en) * | 2009-10-26 | 2011-04-28 | Meyer Iv George Anthony | Combination of fastener and thermal-conducting member |
US20110149506A1 (en) * | 2009-12-23 | 2011-06-23 | Coolit Systems Inc. | Adjustable mounting bracket for a computer component |
US8009428B1 (en) * | 2010-08-09 | 2011-08-30 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Guiding apparatus |
US20130075567A1 (en) * | 2011-09-26 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device supporting apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201210787Y (en) * | 2008-06-13 | 2009-03-18 | 鸿富锦精密工业(深圳)有限公司 | Combination of radiating device |
US9414481B1 (en) * | 2015-04-02 | 2016-08-09 | Cooler Master Technology Inc. | Heat sink fastener |
US9913361B2 (en) | 2016-01-06 | 2018-03-06 | International Business Machines Corporation | Integrated circuit device assembly |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6064574A (en) * | 1998-12-18 | 2000-05-16 | Hon Hai Precision Ind. Co., Ltd. | Foldable retention mechanism |
US6160709A (en) * | 1998-12-22 | 2000-12-12 | Hon Hai Precision Ind. Co, Ltd. | Retention device for mounting heat sink to CPU socket |
TW462511U (en) | 1998-09-23 | 2001-11-01 | Wieson Electronic Co Ltd | Improved discrete type clamping seat of dual specification standalone CPU |
US6477050B1 (en) * | 2001-09-14 | 2002-11-05 | International Business Machines Corporation | Tilt-away processor retention module with hold-down screw device |
US6648664B1 (en) * | 2002-08-13 | 2003-11-18 | Hon Hai Precision Ind. Co., Ltd. | Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector |
TW586652U (en) | 2003-03-28 | 2004-05-01 | Thermaltake Technology Co Ltd | Fixing member of heat dissipation base |
US6976525B2 (en) * | 2004-02-24 | 2005-12-20 | Asia Vital Component Co., Ltd. | Fastening device for a radiator |
-
2004
- 2004-12-14 US US11/012,423 patent/US7272007B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW462511U (en) | 1998-09-23 | 2001-11-01 | Wieson Electronic Co Ltd | Improved discrete type clamping seat of dual specification standalone CPU |
US6064574A (en) * | 1998-12-18 | 2000-05-16 | Hon Hai Precision Ind. Co., Ltd. | Foldable retention mechanism |
US6160709A (en) * | 1998-12-22 | 2000-12-12 | Hon Hai Precision Ind. Co, Ltd. | Retention device for mounting heat sink to CPU socket |
US6477050B1 (en) * | 2001-09-14 | 2002-11-05 | International Business Machines Corporation | Tilt-away processor retention module with hold-down screw device |
US6648664B1 (en) * | 2002-08-13 | 2003-11-18 | Hon Hai Precision Ind. Co., Ltd. | Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector |
TW586652U (en) | 2003-03-28 | 2004-05-01 | Thermaltake Technology Co Ltd | Fixing member of heat dissipation base |
US6976525B2 (en) * | 2004-02-24 | 2005-12-20 | Asia Vital Component Co., Ltd. | Fastening device for a radiator |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070103873A1 (en) * | 2005-05-11 | 2007-05-10 | Cooler Master Co., Ltd. | Heat sink module |
US7345880B2 (en) * | 2005-05-11 | 2008-03-18 | Cooler Master Co., Ltd. | Heat sink module |
US20070111594A1 (en) * | 2005-11-11 | 2007-05-17 | Ama Precision Inc. | Clip assembly |
US20080121371A1 (en) * | 2006-11-29 | 2008-05-29 | Foxconn Technology Co., Ltd. | Heat dissipation device |
US7757751B2 (en) * | 2006-11-29 | 2010-07-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US20100038064A1 (en) * | 2008-08-15 | 2010-02-18 | Asia Vital Components Co., Ltd. | Reinforced Thermal Module Structure |
US20110094723A1 (en) * | 2009-10-26 | 2011-04-28 | Meyer Iv George Anthony | Combination of fastener and thermal-conducting member |
US20110149506A1 (en) * | 2009-12-23 | 2011-06-23 | Coolit Systems Inc. | Adjustable mounting bracket for a computer component |
US8120919B2 (en) * | 2009-12-23 | 2012-02-21 | Coolit Systems Inc. | Adjustable mounting bracket for a computer component |
US8009428B1 (en) * | 2010-08-09 | 2011-08-30 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Guiding apparatus |
US20130075567A1 (en) * | 2011-09-26 | 2013-03-28 | Hon Hai Precision Industry Co., Ltd. | Heat dissipating device supporting apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20060126301A1 (en) | 2006-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:LEE, HSIEH-KUN;LAI, CHENG-TIEN;ZHOU, ZHI-YONG;AND OTHERS;REEL/FRAME:016102/0737 Effective date: 20041210 |
|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:019560/0319 Effective date: 20070625 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HON HAI PRECISION INDUSTRY CO., LTD.;REEL/FRAME:019560/0319 Effective date: 20070625 |
|
FPAY | Fee payment |
Year of fee payment: 4 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20150918 |