TW201331536A - Heat dissipating device and method of manufacturing the same - Google Patents

Heat dissipating device and method of manufacturing the same Download PDF

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Publication number
TW201331536A
TW201331536A TW101102186A TW101102186A TW201331536A TW 201331536 A TW201331536 A TW 201331536A TW 101102186 A TW101102186 A TW 101102186A TW 101102186 A TW101102186 A TW 101102186A TW 201331536 A TW201331536 A TW 201331536A
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TW
Taiwan
Prior art keywords
base
heat pipe
heat
heat sink
fixing member
Prior art date
Application number
TW101102186A
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Chinese (zh)
Inventor
Han-Lin Chen
Hsuan-Hao Pai
Cheng-En Tsai
Original Assignee
Cooler Master Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Cooler Master Co Ltd filed Critical Cooler Master Co Ltd
Priority to TW101102186A priority Critical patent/TW201331536A/en
Priority to US13/414,730 priority patent/US20130186599A1/en
Publication of TW201331536A publication Critical patent/TW201331536A/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49353—Heat pipe device making

Abstract

A heat dissipating device includes a base, a heat pipe and a fixing member. The base includes an accommodating recess and two restraining portions, wherein the two restraining portions are located at opposite sides of the accommodating recess and an opening is between the two restraining portions. A first end of the heat pipe is disposed in the accommodating recess such that a bottom surface of the first end is exposed out of the opening, wherein a width of the opening is smaller than a maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the two restraining portions.

Description

散熱裝置及其製造方法Heat sink and method of manufacturing same

本發明關於一種散熱裝置及其製造方法，尤指一種具有以壓鑄製程成型之底座的散熱裝置及其製造方法。The present invention relates to a heat dissipating device and a method of manufacturing the same, and more particularly to a heat dissipating device having a base formed by a die casting process and a method of manufacturing the same.

散熱裝置與電子產品的發展息息相關。由於電子產品在運作時，電路中的電流會因阻抗的影響而產生不必要的熱能，如果這些熱能不能有效地排除而累積在電子產品內部的電子元件上，電子元件便有可能因為不斷升高的溫度而導致損壞。因此，散熱裝置的優劣影響電子產品的運作甚鉅。Heat sinks are closely related to the development of electronic products. Since the current in the circuit generates unnecessary heat due to the influence of the impedance when the electronic product is in operation, if the thermal energy cannot be effectively eliminated and accumulated on the electronic components inside the electronic product, the electronic component may be raised because of the rising The temperature causes damage. Therefore, the advantages and disadvantages of the heat sink affect the operation of electronic products.

一般而言，許多散熱裝置中皆設置有熱管，用來將電子元件所產生的熱能傳導至散熱器，再由散熱器將熱能排出電子產品外部。目前，習知散熱裝置中用來承載熱管之底座皆須經過好幾道製程處理，於每道製程之間搬運底座時會耗費不少時間，使得生產效率降低且生產成本提高。In general, many heat sinks are provided with heat pipes for conducting the heat energy generated by the electronic components to the heat sink, and the heat sinks discharge the heat energy to the outside of the electronic products. At present, the base for carrying the heat pipe in the conventional heat sink device has to undergo several processes, and it takes a lot of time to transport the base between each process, which reduces the production efficiency and increases the production cost.

本發明提供一種散熱裝置及其製造方法，其係以壓鑄製程成型用來承載熱管之底座，以解決上述之問題。The invention provides a heat dissipating device and a manufacturing method thereof, which are formed by a die casting process for carrying a base of a heat pipe to solve the above problems.

根據一實施例，本發明之散熱裝置包含一底座、一熱管以及一固定件。底座包含一容置槽以及二擋止部，其中二擋止部分別位於容置槽之相對二側，且一開口介於二擋止部之間。熱管之一第一端設置於容置槽中，使得第一端之底面外露於開口中，其中開口之寬度小於第一端之最大寬度。固定件設置於底座上，使得熱管之第一端固定於固定件與二擋止部之間。According to an embodiment, the heat sink of the present invention comprises a base, a heat pipe and a fixing member. The base includes a receiving slot and a second stopping portion, wherein the two stopping portions are respectively located on opposite sides of the receiving groove, and an opening is between the two stopping portions. The first end of one of the heat pipes is disposed in the receiving groove such that the bottom surface of the first end is exposed in the opening, wherein the width of the opening is smaller than the maximum width of the first end. The fixing member is disposed on the base such that the first end of the heat pipe is fixed between the fixing member and the second stopping portion.

根據另一實施例，本發明之散熱裝置之製造方法包含：以一壓鑄製程成型一底座，其中底座包含一容置槽；將一熱管之一第一端設置於容置槽中；將一固定件設置於底座上，以將熱管之第一端固定於容置槽中；以及銑削底座之底面，以於容置槽之一側形成一開口，使得第一端之底面外露於開口中，其中開口之寬度小於第一端之最大寬度。According to another embodiment, the method for manufacturing the heat dissipating device of the present invention comprises: forming a base by a die casting process, wherein the base comprises a receiving groove; a first end of a heat pipe is disposed in the receiving groove; The first end of the heat pipe is fixed in the receiving groove; and the bottom surface of the grinding base is formed to form an opening on one side of the receiving groove, so that the bottom surface of the first end is exposed in the opening, wherein The width of the opening is less than the maximum width of the first end.

於上述之實施例中，可將外露於容置槽之開口中之熱管貼附於電子元件上，以對電子元件進行散熱。In the above embodiments, the heat pipe exposed in the opening of the receiving groove may be attached to the electronic component to dissipate heat from the electronic component.

綜上所述，由於本發明之散熱裝置之底座係以壓鑄製程成型，製程簡單，可有效提高生產效率且降低生產成本。此外，在熱管設置於底座之容置槽後，本發明再銑削底座之底面，以使熱管外露，進而將外露的熱管貼附於電子元件上。藉此，可有效降低散熱裝置之整體高度，使得本發明之散熱裝置有利於薄型化的設計。In summary, since the base of the heat dissipating device of the present invention is formed by a die-casting process, the process is simple, and the production efficiency can be effectively improved and the production cost can be reduced. In addition, after the heat pipe is disposed in the receiving groove of the base, the present invention further mills the bottom surface of the base to expose the heat pipe, thereby attaching the exposed heat pipe to the electronic component. Thereby, the overall height of the heat sink can be effectively reduced, so that the heat sink of the present invention is advantageous for a thin design.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。The advantages and spirit of the present invention will be further understood from the following detailed description of the invention.

請參閱第1圖至第8圖，第1圖為根據本發明一實施例之散熱裝置之製造方法的流程圖，第2圖為底座10的立體圖，第3圖為底座10、熱管12以及散熱器14的組合圖，第4圖為底座10、熱管12、散熱器14以及固定件16的組合圖，第5圖為第4圖中的底座10、熱管12以及固定件16沿X-X線的剖面圖，第6圖為第5圖中的部分底座10被銑削掉的剖面圖，第7圖為以第1圖所示之製造方法製造而成之散熱裝置1的背面立體圖，第8圖為第7圖中的底座10的正面立體圖，其中第2圖至第6圖為搭配第1圖的製程示意圖。Please refer to FIG. 1 to FIG. 8 . FIG. 1 is a flow chart of a method for manufacturing a heat dissipation device according to an embodiment of the present invention. FIG. 2 is a perspective view of the base 10 , and FIG. 3 is a base 10 , a heat pipe 12 , and a heat dissipation device . FIG. 4 is a combination view of the base 10, the heat pipe 12, the heat sink 14, and the fixing member 16. FIG. 5 is a cross section of the base 10, the heat pipe 12, and the fixing member 16 along the line XX in FIG. Fig. 6 is a cross-sectional view showing a portion of the base 10 in Fig. 5 being milled off, and Fig. 7 is a rear perspective view of the heat sink 1 manufactured by the manufacturing method shown in Fig. 1, and Fig. 8 is a view 7 is a front perspective view of the base 10 in the figure, wherein the second to sixth figures are schematic views of the process with the first drawing.

首先，執行步驟S10，以一壓鑄製程成型一底座10，其中底座10包含一容置槽100、一第一半部102、一第二半部104、二肋部106以及四鉚接部108，如第2圖所示。容置槽100形成於第一半部102與第二半部104之間。二肋部106位於底座10之相對二側，且連接第一半部102與第二半部104。需說明的是，肋部106與鉚接部108的數量與位置可根據實際應用而決定，不以第2圖所示之實施例為限。First, in step S10, a base 10 is formed by a die casting process, wherein the base 10 includes a receiving groove 100, a first half 102, a second half 104, two ribs 106, and four riveting portions 108, such as Figure 2 shows. The accommodating groove 100 is formed between the first half 102 and the second half 104. The two ribs 106 are located on opposite sides of the base 10 and connect the first half 102 and the second half 104. It should be noted that the number and position of the ribs 106 and the caulking portions 108 can be determined according to practical applications, and are not limited to the embodiment shown in FIG. 2 .

接著，執行步驟S12，將一熱管12之一第一端120設置於容置槽100中，且將一散熱器14設置於熱管12之一第二端122上，如第3圖所示。熱管12之第一端120係自底座10側邊之穿孔110(示於第2圖中)穿入而設置於容置槽100中。於此實施例中，熱管12為一扁平熱管。然而，於另一實施例中，熱管12亦可為圓形熱管或其它形式熱管，視實際應用而定。此外，散熱器14可由多個散熱鰭片組合而成，但不以此為限。Then, in step S12, one of the first ends 120 of the heat pipe 12 is disposed in the accommodating groove 100, and a heat sink 14 is disposed on the second end 122 of the heat pipe 12, as shown in FIG. The first end 120 of the heat pipe 12 is inserted into the accommodating groove 100 from the through hole 110 (shown in FIG. 2) on the side of the base 10. In this embodiment, the heat pipe 12 is a flat heat pipe. However, in another embodiment, the heat pipe 12 can also be a circular heat pipe or other form of heat pipe, depending on the actual application. In addition, the heat sink 14 may be composed of a plurality of heat dissipating fins, but is not limited thereto.

接著，執行步驟S14，將一固定件16設置於底座10上，以將熱管12之第一端120固定於容置槽100中，如第4圖所示。於實際應用中，固定件16可為金屬彈片，但不以此為限。於此實施例中，可將固定件16鉚接於底座10之鉚接部108。此外，若於壓鑄製程中沒有在底座10上形成鉚接部108，則可利用螺絲鎖固、焊接或其它固定方式將固定件16設置於底座10上。在固定件16設置於底座10上後，肋部106係與固定件16位於底座10之同一側。如第5圖所示，底座10之底面112與容置槽100之底面114具有一厚度T1。Next, in step S14, a fixing member 16 is disposed on the base 10 to fix the first end 120 of the heat pipe 12 in the receiving groove 100, as shown in FIG. In practical applications, the fixing member 16 can be a metal dome, but is not limited thereto. In this embodiment, the fixing member 16 can be riveted to the rivet portion 108 of the base 10. In addition, if the rivet portion 108 is not formed on the base 10 in the die casting process, the fixing member 16 can be placed on the base 10 by screwing, welding or other fixing means. After the fixing member 16 is disposed on the base 10, the rib 106 is located on the same side of the base 10 as the fixing member 16. As shown in FIG. 5, the bottom surface 112 of the base 10 and the bottom surface 114 of the receiving groove 100 have a thickness T1.

最後，執行步驟S16，銑削底座10之底面112，以於容置槽100之一側形成一開口116，使得熱管12之第一端120之底面124外露於開口116中，如第6圖所示。換言之，步驟S16係將第5圖所示之厚度T1的材料銑削掉，以使熱管12之第一端120之底面124外露。此時，二擋止部118分別位於容置槽100之相對二側，且開口116介於二擋止部118之間。於此實施例中，開口116之寬度W1小於熱管12之第一端120之最大寬度W2，使得二擋止部118可將熱管12之第一端120支撐於容置槽100中，以防止熱管12之第一端120自開口116脫落。換言之，熱管12之第一端120係固定於固定件16與二擋止部118之間。此外，由於熱管12之第一端120的二側為弧面，二擋止部118與熱管12之第一端120接觸之表面亦為弧面，以使熱管12之第一端120可與二擋止部118緊密貼合而穩固地設置於容置槽100中。需說明的是，若熱管12之第一端120的二側為斜面，則二擋止部118與熱管12之第一端120接觸之表面亦為斜面。Finally, step S16 is performed to mill the bottom surface 112 of the base 10 to form an opening 116 on one side of the receiving groove 100, so that the bottom surface 124 of the first end 120 of the heat pipe 12 is exposed in the opening 116, as shown in FIG. . In other words, step S16 mills the material of thickness T1 shown in FIG. 5 to expose the bottom surface 124 of the first end 120 of the heat pipe 12. At this time, the two stoppers 118 are respectively located on opposite sides of the accommodating groove 100, and the opening 116 is interposed between the two stoppers 118. In this embodiment, the width W1 of the opening 116 is smaller than the maximum width W2 of the first end 120 of the heat pipe 12, so that the second stopping portion 118 can support the first end 120 of the heat pipe 12 in the receiving groove 100 to prevent the heat pipe. The first end 120 of the 12 is detached from the opening 116. In other words, the first end 120 of the heat pipe 12 is fixed between the fixing member 16 and the second stopping portion 118. In addition, since the two sides of the first end 120 of the heat pipe 12 are curved surfaces, the surface of the second stop portion 118 contacting the first end 120 of the heat pipe 12 is also curved, so that the first end 120 of the heat pipe 12 can be combined with two The stopper portion 118 is closely fitted and firmly disposed in the accommodating groove 100. It should be noted that if the two sides of the first end 120 of the heat pipe 12 are inclined, the surface of the second stop portion 118 in contact with the first end 120 of the heat pipe 12 is also a slope.

經由上述之步驟S10至步驟S16，即可完成如第7圖所示之散熱裝置1的製造。於實際應用中，可將外露的熱管12之第一端120之底面124貼附於電子元件(未顯示)上，再將固定件16鎖固於電子產品中的電路板(未顯示)上，以對電子元件進行散熱。如第7圖所示，散熱裝置1製造完成後，熱管12之第一端120之底面124可與銑削後之底座10之底面112共平面，以增加熱管12之散熱面積以及貼附於電子元件上的穩定性。再者，連接第一半部102與第二半部104的二肋部106可加強底座10之剛性，以避免散熱裝置1於組裝時因過度受壓而損壞。Through the above steps S10 to S16, the manufacture of the heat sink 1 as shown in Fig. 7 can be completed. In a practical application, the bottom surface 124 of the first end 120 of the exposed heat pipe 12 can be attached to an electronic component (not shown), and the fixing component 16 can be locked on a circuit board (not shown) in the electronic product. To dissipate heat from electronic components. As shown in FIG. 7, after the heat sink 1 is manufactured, the bottom surface 124 of the first end 120 of the heat pipe 12 can be coplanar with the bottom surface 112 of the milled base 10 to increase the heat dissipation area of the heat pipe 12 and to be attached to the electronic component. Stability on the top. Moreover, the two ribs 106 connecting the first half 102 and the second half 104 can strengthen the rigidity of the base 10 to prevent the heat sink 1 from being damaged due to excessive pressure during assembly.

請參閱第9圖至第15圖，第9圖為底座30的立體圖，第10圖為底座30、熱管32以及散熱器34的組合圖，第11圖為底座30、熱管32、散熱器34以及固定件36的組合圖，第12圖為第11圖中的底座30、熱管32以及固定件36沿Y-Y線的剖面圖，第13圖為第12圖中的部分底座30被銑削掉的剖面圖，第14圖為以第1圖所示之製造方法製造而成之另一散熱裝置3的背面立體圖，第15圖為第14圖中的底座30的正面立體圖，其中第9圖至第13圖為搭配第1圖的另一製程示意圖。Please refer to FIG. 9 to FIG. 15. FIG. 9 is a perspective view of the base 30, FIG. 10 is a combination view of the base 30, the heat pipe 32 and the heat sink 34, and FIG. 11 is a base 30, a heat pipe 32, a heat sink 34, and FIG. 12 is a cross-sectional view of the base 30, the heat pipe 32, and the fixing member 36 along the line YY in FIG. 11, and FIG. 13 is a cross-sectional view of the portion of the base 30 in FIG. 12 being milled off. Fig. 14 is a rear perspective view of another heat sink 3 manufactured by the manufacturing method shown in Fig. 1, and Fig. 15 is a front perspective view of the base 30 in Fig. 14, wherein Figs. 9 to 13 To match the other process schematic of Figure 1.

首先，執行步驟S10，以一壓鑄製程成型一底座30，其中底座30包含一容置槽300、一第一半部302、一第二半部304、二肋部306以及四鉚接部308，如第9圖所示。容置槽300形成於第一半部302與第二半部304之間。二肋部306位於底座30之相對二側，且連接第一半部302與第二半部304。需說明的是，肋部306與鉚接部308的數量與位置可根據實際應用而決定，不以第9圖所示之實施例為限。First, in step S10, a base 30 is formed by a die casting process, wherein the base 30 includes a receiving slot 300, a first half 302, a second half 304, two ribs 306, and a fourth riveting portion 308, such as Figure 9 shows. The accommodating groove 300 is formed between the first half 302 and the second half 304. The two ribs 306 are located on opposite sides of the base 30 and connect the first half 302 and the second half 304. It should be noted that the number and position of the rib 306 and the rivet 308 can be determined according to the practical application, and are not limited to the embodiment shown in FIG.

接著，執行步驟S12，將一熱管32之一第一端320設置於容置槽300中，且將一散熱器34設置於熱管32之一第二端322上，如第10圖所示。熱管32之第一端320係自底座30上方向下置入容置槽300中。於此實施例中，熱管32為一扁平熱管。然而，於另一實施例中，熱管32亦可為圓形熱管或其它形式熱管，視實際應用而定。Then, in step S12, a first end 320 of a heat pipe 32 is disposed in the accommodating groove 300, and a heat sink 34 is disposed on one of the second ends 322 of the heat pipe 32, as shown in FIG. The first end 320 of the heat pipe 32 is placed into the accommodating groove 300 downward from above the base 30. In this embodiment, the heat pipe 32 is a flat heat pipe. However, in another embodiment, the heat pipe 32 can also be a circular heat pipe or other form of heat pipe, depending on the actual application.

接著，執行步驟S14，將一固定件36設置於底座30上，以將熱管32之第一端320固定於容置槽300中，如第11圖所示。於實際應用中，固定件36可為金屬彈片，但不以此為限。於此實施例中，可將固定件36鉚接於底座30之鉚接部308。此外，若於壓鑄製程中沒有在底座30上形成鉚接部308，則可利用螺絲鎖固、焊接或其它固定方式將固定件36設置於底座30上。在固定件36設置於底座30上後，肋部306係與固定件36位於底座10之相對二側。如第12圖所示，底座30之底面312與容置槽300之底面314具有一厚度T2。Next, in step S14, a fixing member 36 is disposed on the base 30 to fix the first end 320 of the heat pipe 32 in the receiving groove 300, as shown in FIG. In practical applications, the fixing member 36 can be a metal dome, but is not limited thereto. In this embodiment, the fixing member 36 can be riveted to the riveting portion 308 of the base 30. In addition, if the rivet portion 308 is not formed on the base 30 in the die casting process, the fixing member 36 can be placed on the base 30 by screwing, welding or other fixing means. After the fixing member 36 is disposed on the base 30, the rib 306 and the fixing member 36 are located on opposite sides of the base 10. As shown in FIG. 12, the bottom surface 312 of the base 30 and the bottom surface 314 of the receiving groove 300 have a thickness T2.

最後，執行步驟S16，銑削底座30之底面312，以於容置槽300之一側形成一開口316，使得熱管32之第一端320之底面324外露於開口316中，如第13圖所示。換言之，步驟S16係將第12圖所示之厚度T2的材料銑削掉，以使熱管32之第一端320之底面324外露。此時，二擋止部318分別位於容置槽300之相對二側，且開口316介於二擋止部318之間。於此實施例中，開口316之寬度W3小於熱管32之第一端320之最大寬度W4，使得二擋止部318可將熱管32之第一端320支撐於容置槽300中，以防止熱管32之第一端320自開口316脫落。換言之，熱管32之第一端320係固定於固定件36與二擋止部318之間。此外，由於熱管32之第一端320的二側為弧面，二擋止部318與熱管32之第一端320接觸之表面亦為弧面，以使熱管32之第一端320可與二擋止部318緊密貼合而穩固地設置於容置槽300中。需說明的是，若熱管32之第一端320的二側為斜面，則二擋止部318與熱管32之第一端320接觸之表面亦為斜面。Finally, step S16 is performed to mill the bottom surface 312 of the base 30 to form an opening 316 on one side of the receiving groove 300, so that the bottom surface 324 of the first end 320 of the heat pipe 32 is exposed in the opening 316, as shown in FIG. . In other words, step S16 mills the material of thickness T2 shown in FIG. 12 to expose the bottom surface 324 of the first end 320 of the heat pipe 32. At this time, the two stoppers 318 are respectively located on opposite sides of the accommodating groove 300, and the opening 316 is located between the two stoppers 318. In this embodiment, the width W3 of the opening 316 is smaller than the maximum width W4 of the first end 320 of the heat pipe 32, so that the second stopping portion 318 can support the first end 320 of the heat pipe 32 in the receiving groove 300 to prevent the heat pipe. The first end 320 of the 32 is detached from the opening 316. In other words, the first end 320 of the heat pipe 32 is fixed between the fixing member 36 and the second stopping portion 318. In addition, since the two sides of the first end 320 of the heat pipe 32 are curved, the surface of the second stop portion 318 contacting the first end 320 of the heat pipe 32 is also curved, so that the first end 320 of the heat pipe 32 can be combined with the second end 320. The stopper portion 318 is closely fitted and firmly disposed in the accommodating groove 300. It should be noted that if the two sides of the first end 320 of the heat pipe 32 are inclined, the surface of the second stop portion 318 contacting the first end 320 of the heat pipe 32 is also a slope.

經由上述之步驟S10至步驟S16，即可完成如第14圖所示之散熱裝置3的製造。於實際應用中，可將外露的熱管32之第一端320之底面324貼附於電子元件(未顯示)上，再將固定件36鎖固於電子產品中的電路板(未顯示)上，以對電子元件進行散熱。如第13圖所示，散熱裝置3製造完成後，熱管32之第一端320之底面324可與銑削後之底座30之底面312共平面，以增加熱管32之散熱面積以及貼附於電子元件上的穩定性。再者，連接第一半部302與第二半部304的二肋部306可加強底座30之剛性，以避免散熱裝置3於組裝時因過度受壓而損壞。Through the above steps S10 to S16, the manufacture of the heat sink 3 as shown in Fig. 14 can be completed. In a practical application, the bottom surface 324 of the first end 320 of the exposed heat pipe 32 can be attached to an electronic component (not shown), and the fixing component 36 can be locked on a circuit board (not shown) in the electronic product. To dissipate heat from electronic components. As shown in FIG. 13, after the heat sink 3 is manufactured, the bottom surface 324 of the first end 320 of the heat pipe 32 can be coplanar with the bottom surface 312 of the milled base 30 to increase the heat dissipation area of the heat pipe 32 and to be attached to the electronic component. Stability on the top. Moreover, the two ribs 306 connecting the first half 302 and the second half 304 can strengthen the rigidity of the base 30 to prevent the heat sink 3 from being damaged due to excessive pressure during assembly.

相較於先前技術，由於本發明之散熱裝置之底座係以壓鑄製程成型，製程簡單，可有效提高生產效率且降低生產成本。此外，在熱管設置於底座之容置槽後，本發明再銑削底座之底面，以使熱管外露，進而將外露的熱管貼附於電子元件上。藉此，可有效降低散熱裝置之整體高度，使得本發明之散熱裝置有利於薄型化的設計。Compared with the prior art, since the base of the heat dissipating device of the present invention is formed by a die-casting process, the process is simple, and the production efficiency can be effectively improved and the production cost can be reduced. In addition, after the heat pipe is disposed in the receiving groove of the base, the present invention further mills the bottom surface of the base to expose the heat pipe, thereby attaching the exposed heat pipe to the electronic component. Thereby, the overall height of the heat sink can be effectively reduced, so that the heat sink of the present invention is advantageous for a thin design.

以上所述僅為本發明之較佳實施例，凡依本發明申請專利範圍所做之均等變化與修飾，皆應屬本發明之涵蓋範圍。The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

1、3．．．散熱裝置1, 3. . . Heat sink

10、30．．．底座10, 30. . . Base

12、32．．．熱管12, 32. . . Heat pipe

14、34．．．散熱器14, 34. . . heat sink

16、36．．．固定件16, 36. . . Fastener

100、300．．．容置槽100, 300. . . Locating slot

102、302．．．第一半部102, 302. . . First half

104、304．．．第二半部104, 304. . . Second half

106、306．．．肋部106, 306. . . Rib

108、308．．．鉚接部108, 308. . . Riveting

110．．．穿孔110. . . perforation

112、114、124、312、314、324．．．底面112, 114, 124, 312, 314, 324. . . Bottom

116、316．．．開口116, 316. . . Opening

118、318．．．擋止部118,318. . . Stop

120、320．．．第一端120, 320. . . First end

122、322．．．第二端122, 322. . . Second end

T1、T2．．．厚度T1, T2. . . thickness

W1、W2、W3、W4．．．寬度W1, W2, W3, W4. . . width

X-X、Y-Y．．．剖面線X-X, Y-Y. . . Section line

S10-S16．．．步驟S10-S16. . . step

第1圖為根據本發明一實施例之散熱裝置之製造方法的流程圖。Fig. 1 is a flow chart showing a method of manufacturing a heat sink according to an embodiment of the present invention.

第2圖為底座的立體圖。Figure 2 is a perspective view of the base.

第3圖為底座、熱管以及散熱器的組合圖。Figure 3 is a combination of the base, heat pipe and heat sink.

第4圖為底座、熱管、散熱器以及固定件的組合圖。Figure 4 is a combination of the base, heat pipe, heat sink and fixture.

第5圖為第4圖中的底座、熱管以及固定件沿X-X線的剖面圖。Fig. 5 is a cross-sectional view of the base, the heat pipe, and the fixing member taken along line X-X in Fig. 4.

第6圖為第5圖中的部分底座被銑削掉的剖面圖。Figure 6 is a cross-sectional view of a portion of the base in Figure 5 being milled away.

第7圖為以第1圖所示之製造方法製造而成之散熱裝置的背面立體圖。Fig. 7 is a rear perspective view of the heat sink manufactured by the manufacturing method shown in Fig. 1.

第8圖為第7圖中的底座的正面立體圖。Figure 8 is a front perspective view of the base in Figure 7.

第9圖為底座的立體圖。Figure 9 is a perspective view of the base.

第10圖為底座、熱管以及散熱器的組合圖。Figure 10 is a combination of the base, heat pipe and heat sink.

第11圖為底座、熱管、散熱器以及固定件的組合圖。Figure 11 is a combination of the base, heat pipe, heat sink and fixture.

第12圖為第11圖中的底座、熱管以及固定件沿Y-Y線的剖面圖。Figure 12 is a cross-sectional view of the base, the heat pipe, and the fixing member taken along line Y-Y in Fig. 11.

第13圖為第12圖中的部分底座被銑削掉的剖面圖。Figure 13 is a cross-sectional view showing a portion of the base in Fig. 12 being milled off.

第14圖為以第1圖所示之製造方法製造而成之另一散熱裝置的背面立體圖。Fig. 14 is a rear perspective view showing another heat sink manufactured by the manufacturing method shown in Fig. 1.

第15圖為第14圖中的底座的正面立體圖。Figure 15 is a front perspective view of the base in Figure 14.

1．．．散熱裝置1. . . Heat sink

10．．．底座10. . . Base

12．．．熱管12. . . Heat pipe

14．．．散熱器14. . . heat sink

16．．．固定件16. . . Fastener

102．．．第一半部102. . . First half

104．．．第二半部104. . . Second half

106．．．肋部106. . . Rib

112、124．．．底面112, 124. . . Bottom

116．．．開口116. . . Opening

118．．．擋止部118. . . Stop

120．．．第一端120. . . First end

122．．．第二端122. . . Second end

W1、W2．．．寬度W1, W2. . . width

Claims (16)

一種散熱裝置，包含：一底座，包含一容置槽以及二擋止部，該二擋止部分別位於該容置槽之相對二側，一開口介於該二擋止部之間；一熱管，該熱管之一第一端設置於該容置槽中，使得該第一端之底面外露於該開口中，該開口之寬度小於該第一端之最大寬度；以及一固定件，設置於該底座上，使得該熱管之該第一端固定於該固定件與該二擋止部之間。A heat dissipating device includes: a base, comprising a receiving groove and a second stopping portion, wherein the two blocking portions are respectively located on opposite sides of the receiving groove, and an opening is interposed between the two blocking portions; a heat pipe a first end of the heat pipe is disposed in the receiving groove, such that a bottom surface of the first end is exposed in the opening, a width of the opening is smaller than a maximum width of the first end; and a fixing member is disposed on the The base is fixed to the first end of the heat pipe between the fixing member and the second stopping portion. 如請求項1所述之散熱裝置，其中該第一端之底面與該底座之底面共平面。The heat sink of claim 1, wherein the bottom surface of the first end is coplanar with the bottom surface of the base. 如請求項1所述之散熱裝置，其中該底座更包含一第一半部、一第二半部以及至少一肋部，該容置槽形成於該第一半部與該第二半部之間，且該至少一肋部連接該第一半部與該第二半部。The heat dissipation device of claim 1, wherein the base further comprises a first half, a second half and at least one rib, the receiving groove being formed in the first half and the second half And the at least one rib connects the first half and the second half. 如請求項3所述之散熱裝置，其中該至少一肋部與該固定件位於該底座之同一側。The heat sink of claim 3, wherein the at least one rib and the fixing member are located on the same side of the base. 如請求項3所述之散熱裝置，其中該至少一肋部與該固定件位於該底座之相對二側。The heat sink of claim 3, wherein the at least one rib and the fixing member are located on opposite sides of the base. 如請求項1所述之散熱裝置，其中該二擋止部與該熱管之該第一端接觸之表面為弧面或斜面。The heat dissipating device of claim 1, wherein the surface of the second stop contacting the first end of the heat pipe is a curved surface or a sloped surface. 如請求項1所述之散熱裝置，更包含一散熱器，設置於該熱管之一第二端上。The heat dissipating device of claim 1, further comprising a heat sink disposed on one of the second ends of the heat pipe. 如請求項1所述之散熱裝置，其中該熱管為一扁平熱管。The heat sink of claim 1, wherein the heat pipe is a flat heat pipe. 一種散熱裝置之製造方法，包含：以一壓鑄製程成型一底座，其中該底座包含一容置槽；將一熱管之一第一端設置於該容置槽中；將一固定件設置於該底座上，以將該熱管之該第一端固定於該容置槽中；以及銑削該底座之底面，以於該容置槽之一側形成一開口，使得該第一端之底面外露於該開口中，其中該開口之寬度小於該第一端之最大寬度。A method for manufacturing a heat dissipating device comprises: forming a base by a die casting process, wherein the base comprises a receiving groove; a first end of a heat pipe is disposed in the receiving groove; and a fixing member is disposed on the base The first end of the heat pipe is fixed in the accommodating groove; and the bottom surface of the base is milled to form an opening on one side of the accommodating groove, such that the bottom surface of the first end is exposed to the opening Where the width of the opening is less than the maximum width of the first end. 如請求項9所述之散熱裝置之製造方法，其中該第一端之底面與銑削後之該底座之底面共平面。The method of manufacturing a heat sink according to claim 9, wherein the bottom surface of the first end is coplanar with the bottom surface of the base after milling. 如請求項9所述之散熱裝置之製造方法，其中該底座更包含一第一半部、一第二半部以及至少一肋部，該容置槽形成於該第一半部與該第二半部之間，且該至少一肋部連接該第一半部與該第二半部。The method of manufacturing the heat sink according to claim 9, wherein the base further comprises a first half, a second half and at least one rib, the receiving groove being formed in the first half and the second Between the half portions, and the at least one rib connects the first half and the second half. 如請求項11所述之散熱裝置之製造方法，其中該至少一肋部與該固定件位於該底座之同一側。The method of manufacturing a heat sink according to claim 11, wherein the at least one rib and the fixing member are located on the same side of the base. 如請求項11所述之散熱裝置之製造方法，其中該至少一肋部與該固定件位於該底座之相對二側。The method of manufacturing a heat sink according to claim 11, wherein the at least one rib and the fixing member are located on opposite sides of the base. 如請求項9所述之散熱裝置之製造方法，其中該開口介於二擋止部之間，且該二擋止部與該熱管之該第一端接觸之表面為弧面或斜面。The method of manufacturing a heat sink according to claim 9, wherein the opening is between the two stops, and the surface of the second stop contacting the first end of the heat pipe is a curved surface or a slope. 如請求項9所述之散熱裝置之製造方法，更包含：將一散熱器設置於該熱管之一第二端上。The method for manufacturing a heat sink according to claim 9, further comprising: disposing a heat sink on one of the second ends of the heat pipe. 如請求項9所述之散熱裝置之製造方法，其中該熱管為一扁平熱管。The method of manufacturing a heat sink according to claim 9, wherein the heat pipe is a flat heat pipe.
TW101102186A 2012-01-19 2012-01-19 Heat dissipating device and method of manufacturing the same TW201331536A (en)

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