CN113498303A - Heat dissipation device with heat dissipation fan for electrical equipment - Google Patents

Heat dissipation device with heat dissipation fan for electrical equipment Download PDF

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Publication number
CN113498303A
CN113498303A CN202110805413.7A CN202110805413A CN113498303A CN 113498303 A CN113498303 A CN 113498303A CN 202110805413 A CN202110805413 A CN 202110805413A CN 113498303 A CN113498303 A CN 113498303A
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heat dissipation
heat
chip
fan
thermally conductive
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刘成彬
赵泽强
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Jiangsu Simec Heat Dissipation Technology Co ltd
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Jiangsu Simec Heat Dissipation Technology Co ltd
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Priority to CN202110805413.7A priority Critical patent/CN113498303A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

本发明公开了一种设有散热风扇的电器设备用散热装置，属于散热技术领域，电器设备包括本体和固定在本体上的芯片，在芯片上相对于本体的另一侧，依次设有导热硅胶垫片、散热模组和散热风扇；散热装置还包括PLC和热电偶，热电偶的感温探头固定在芯片的表面上，PLC分别与热电偶和散热风扇电气连接。本发明将导热硅胶垫片、散热模组和散热风扇组合使用，与传统铝挤散热结构相比，在同等条件下，散热效率高、散热均匀，可有效减少热量堆积，更能够将高温区域的热量迅速导出传输到散热模组上，通过散热风扇将散热模组上的热量带走，散热效率更高，应用领域更广。

Figure 202110805413

The invention discloses a heat dissipation device for electrical equipment provided with a heat dissipation fan, belonging to the technical field of heat dissipation. The electrical equipment includes a body and a chip fixed on the body. On the other side of the chip relative to the body, thermally conductive silica gel is arranged in sequence. Gasket, cooling module and cooling fan; the cooling device also includes PLC and thermocouple, the temperature sensing probe of the thermocouple is fixed on the surface of the chip, and the PLC is electrically connected to the thermocouple and the cooling fan respectively. Compared with the traditional aluminum extrusion heat dissipation structure, the present invention has high heat dissipation efficiency and uniform heat dissipation under the same conditions, can effectively reduce heat accumulation, and can effectively reduce heat accumulation in the high temperature area. The heat is quickly exported and transferred to the cooling module, and the heat on the cooling module is taken away by the cooling fan, which has higher cooling efficiency and wider application fields.

Figure 202110805413

Description

Heat dissipation device with heat dissipation fan for electrical equipment
Technical Field
The invention belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation device with a heat dissipation fan for electrical equipment.
Background
In order to improve the comprehensive performance of the electrical equipment, the chip is arranged in the electrical equipment, and the chip is one of the parts with the largest heat productivity in the whole electrical equipment, and the heat needs to be dissipated in time, otherwise, the electrical equipment is overheated, the working performance of the electrical equipment is affected, and even some safety accidents can be caused.
In the prior art, the heat dissipation structure of the chip is generally an aluminum extrusion structure, and the heat dissipation efficiency of the traditional aluminum extrusion heat dissipation structure is low, the heat transmission is slow, the thermal resistance is large, the heat transmission is uneven, so that the heat cannot be timely dissipated to the outside of the electrical equipment, the temperature inside the electrical equipment can be rapidly increased, the performance is rapidly reduced, and therefore the traditional aluminum extrusion heat dissipation structure needs to be improved, and the heat dissipation effect of the chip in the electrical equipment is improved.
Disclosure of Invention
The present invention is directed to a heat dissipation device for electrical equipment, which is provided with a heat dissipation fan, to solve the technical problems mentioned in the background art.
In order to achieve the purpose, the invention discloses a heat dissipation device provided with a heat dissipation fan and used for electrical equipment, wherein the electrical equipment comprises a body and a chip fixed on the body, and a heat conduction silica gel gasket, a heat dissipation module and the heat dissipation fan are sequentially arranged on the other side, opposite to the body, of the chip;
the heat dissipation device further comprises a PLC and a thermocouple, a temperature sensing probe of the thermocouple is fixed on the surface of the chip, and the PLC is electrically connected with the thermocouple and the heat dissipation fan respectively.
The heat-conducting silica gel gasket and the heat-conducting silica gel have the characteristics that the heat conductivity coefficient is not limited, the heat on the chip can be quickly conducted out, and the thermal resistance is small.
Furthermore, the heat dissipation module is an aluminum extrusion or a fin.
Furthermore, the heat dissipation fan is adhered to the heat dissipation module through the heat conduction silicon adhesive.
Furthermore, the heat dissipation module is of a two-layer stepped structure, the heat dissipation fan is arranged above the first-layer stepped structure of the heat dissipation module, the length and the width of the heat dissipation fan are respectively equal to those of the first-layer stepped structure of the heat dissipation module, and the height of the heat dissipation fan is equal to that of the second-layer stepped structure on the heat dissipation module.
Further, the heat dissipation fan is a variable speed fan.
Set up PLC, thermocouple and variable speed fan, but the temperature of real-time supervision chip, PLC receives this temperature after, can adjust the rotational speed of variable speed fan in real time, can in time spill the heat in the electrical equipment, again can the energy saving, when the temperature of chip is not high in the electrical equipment, in time reduces the rotational speed of variable speed fan, has saved the consumption of electric energy.
Further, the heat-conducting silica gel gasket is pasted on the upper surface of the chip, and the heat dissipation module is pasted on the upper surface of the heat-conducting silica gel gasket.
Further, the heat-conducting silica gel gasket comprises a first heat-conducting silica gel gasket and a second heat-conducting silica gel gasket, and a heat dissipation element is arranged between the first heat-conducting silica gel gasket and the second heat-conducting silica gel gasket.
Further, the heat dissipation element is a heat pipe or a vapor chamber. The number, size and shape of the heat dissipation elements can be determined according to the specific structure of the body and the chip. When heat transmission is to radiating element on, radiating element inside working medium can vaporize in the twinkling of an eye, conducts the heat along one-dimensional linear direction or two-dimensional plane direction rapidly, more can derive the heat in high temperature region rapidly, and effective reduction heat is piled up, and the radiating efficiency is higher, can take away a large amount of heats on the chip fast, can not appear the heat and pile up the phenomenon.
Furthermore, the first heat-conducting silica gel gasket is adhered to the upper surface of the chip, the heat dissipation element is adhered to the upper surface of the first heat-conducting silica gel gasket, the second heat-conducting silica gel gasket is arranged on the other side of the heat dissipation element, the second heat-conducting silica gel gasket is adhered to the upper surface of the heat dissipation element, and the heat dissipation module is adhered to the upper surface of the second heat-conducting silica gel gasket.
Furthermore, the thermocouple detects the temperature of the chip in real time and transmits the temperature to the PLC, and the PLC controls the rotating speed of the cooling fan in real time according to the temperature of the chip; the control process of the rotating speed of the cooling fan is as follows: (1) when the temperature of the chip is t ≧ 50 ℃, the rotating speed k of the cooling fan is k 1; (2) when the temperature of the chip is 40 ℃ < t < 50 ℃, the rotating speed k of the heat radiation fan is 0.8 k 1; (3) when the temperature of the chip is less than 30 ℃ and less than 40 ℃, the rotating speed k of the heat radiation fan is 0.6 k 1; (4) when the temperature of the chip is less than t < 30 ℃, the rotating speed k of the heat radiation fan is 0; where k1 is the maximum rotational speed of the radiator fan.
Compared with the existing product, the heat dissipation device for the electrical equipment provided with the heat dissipation fan has the following advantages:
(1) according to the invention, by using the heat-conducting silica gel, the heat-conducting silica gel gasket and the heat-radiating module and combining the heat pipe or the soaking plate and the heat-radiating fan, compared with the traditional aluminum extruded heat-radiating structure, under the same condition, the heat-radiating device disclosed by the invention has the advantages that the heat-conducting efficiency is improved, the heat radiation is more uniform, the heat accumulation can be effectively reduced, the heat in a high-temperature area can be rapidly led out and transmitted to the heat-radiating module, the heat on the heat-radiating module is taken away through the heat-radiating fan, and the heat-radiating efficiency is higher.
(2) In the invention, the shapes of the heat-conducting silica gel gasket, the heat-radiating element and the heat-radiating module are not limited, and the heat-conducting silica gel gasket, the heat-radiating element and the heat-radiating module can be designed according to the structural sizes of the electrical equipment and the chip in the electrical equipment, so that the structure of the heat-radiating device has strong adaptability.
(3) The variable-speed radiating fan is adopted, the rotating speed of the fan can be adjusted in real time according to the temperature of the chip, and the energy consumption is saved while the radiating effect is ensured.
(4) According to the invention, the radiating fan is adhered to the radiating module, and can form a regular cuboid structure together with the radiating module, so that the structure is more regular, and meanwhile, the thickness of the radiating module can be thinner while the radiating effect is ensured, so that the thickness of the whole radiating device can be thinner, and the weight is lighter.
Drawings
FIG. 1: a heat radiation schematic diagram of a heat radiation device for electric appliances provided with a heat radiation fan in embodiment 1 and embodiment 2.
FIG. 2: embodiment 1 is a schematic view of an overall structure of a heat dissipating device for electrical equipment provided with a heat dissipating fan.
FIG. 3: embodiment 1 is a schematic diagram of a partial explosion structure of a heat dissipation device for electrical equipment provided with a heat dissipation fan.
FIG. 4: embodiment 2 is a schematic view of an overall structure of a heat dissipating device for electrical equipment provided with a heat dissipating fan.
FIG. 5: embodiment 2 is a schematic diagram of a partial explosion structure of a heat dissipation device for electrical equipment provided with a heat dissipation fan.
Description of reference numerals: 1-body; 2-chip; 3-heat conducting silica gel gasket; 4-a heat-dissipating element; 5-a heat dissipation module; 6-a heat dissipation fan; 31-a first heat-conducting silica gel gasket; 32-a second thermally conductive silicone gasket; 7-a thermocouple; 8-PLC.
Detailed Description
The technical solution of the present invention will be described in detail by the following specific examples.
Example 1
As shown in fig. 1-3, the heat dissipation device for electrical equipment with a heat dissipation fan includes a body 1 and a chip 2 disposed above the body 1, wherein a first heat conductive silicone gasket 31, a heat dissipation element 4, a second heat conductive silicone gasket 32, a heat dissipation module 5 and the heat dissipation fan 6 are sequentially disposed on the other side of the chip 2 opposite to the body 1; the heat dissipation element 4 is a heat pipe or a vapor chamber, and the heat dissipation fan 6 is a variable speed fan.
In the embodiment 1, the heat dissipation module 5 is an aluminum extrusion, and the heat dissipation fan 6 is fixed on the aluminum extrusion. Specifically, the heat dissipation fan 6 may be fixed on the upper surface of the heat dissipation module 5 by a heat conductive silicone or screws.
Chip 2 is cuboid sheet structure, the pin welding of chip 2 is on body 1, the size of first heat conduction silica gel gasket 31 equals with the upper surface size of chip 2, first heat conduction silica gel gasket 31 pastes the upper surface at chip 2, heat radiating element 4 pastes the upper surface at first heat conduction silica gel gasket 31, at heat radiating element 4's opposite side, be equipped with second heat conduction silica gel gasket 32, the size of second heat conduction silica gel gasket 32 equals with heat radiating element 4's upper surface size.
The upper surface of the second heat-conducting silica gel gasket 32 is provided with the heat dissipation module 5, the heat dissipation module 5 is of a two-layer stepped structure, the size of the lower surface of the heat dissipation module 5 is equal to that of the second heat-conducting silica gel gasket 32, and the heat dissipation module 5 is adhered to the upper surface of the second heat-conducting silica gel gasket 32; the heat dissipation fan 6 is arranged above the first layer of the stepped structure of the heat dissipation module 5 and is fixedly adhered to the upper surface of the heat dissipation module 5 through heat conduction silica gel; the length and width of the heat dissipation fan 6 are respectively equal to those of the first-layer stepped structure of the heat dissipation module 5, and the height of the heat dissipation fan 6 is equal to that of the second-layer stepped structure of the heat dissipation module 5, so that the heat dissipation module 5 and the heat dissipation fan 6 are integrally formed into a regular rectangular parallelepiped structure.
In embodiment 1, the heat dissipating apparatus for electrical equipment provided with a heat dissipating fan further includes a PLC8 and a thermocouple 7, a temperature sensing probe of the thermocouple 7 is fixed on the surface of the chip 2, and a PLC8 is electrically connected to the thermocouple 7 and the heat dissipating fan 6, respectively; the thermocouple 7 detects the temperature of the chip 2 in real time and transmits the temperature to the PLC8, and the PLC8 controls the rotating speed of the cooling fan 6 in real time according to the temperature of the chip 2 8;
the control process of the rotating speed of the cooling fan 6 is as follows: (1) when the temperature t of the chip 2 is larger than or equal to 50 ℃, the rotating speed k of the cooling fan 6 is k 1; (2) when the temperature of the chip 2 is 40 ℃ < t < 50 ℃, the rotating speed k of the heat radiation fan 6 is 0.8 k 1; (3) when the temperature of the chip 2 is 30 ℃ < t < 40 ℃, the rotating speed k of the heat radiation fan 6 is 0.6 k 1; (4) when the temperature of the chip 2 is t < 30 ℃, the rotation speed k of the heat radiation fan 6 is 0, namely, the heat radiation fan 6 stops rotating. Where k1 is the maximum rotation speed of the radiator fan 6.
Example 2
In embodiment 2, the heat dissipation principle of the heat dissipation device for electric equipment provided with the heat dissipation fan is the same as that of embodiment 1, as shown in fig. 1; the structure of the heat sink is substantially the same as that of embodiment 1, as shown in fig. 4 and 5, in this embodiment 2:
the heat dissipation device provided with the heat dissipation fan for the electrical equipment comprises a body 1 and a chip 2 arranged above the body 1, wherein a heat conduction silica gel gasket 3, a heat dissipation module 5 and the heat dissipation fan 6 are sequentially arranged on the other side, opposite to the body 1, of the chip 2; the heat dissipation element 4 is a heat pipe or a vapor chamber, and the heat dissipation fan 6 is a variable speed fan.
In the embodiment 2, the heat dissipation module 5 is an aluminum extrusion, and the heat dissipation fan 6 is fixed on the aluminum extrusion. Specifically, the heat dissipation fan 6 may be fixed on the upper surface of the heat dissipation module 5 by a heat conductive silicone or screws.
The chip 2 is of a cuboid sheet structure, pins of the chip 2 are welded on the body 1, the size of the heat conduction silica gel gasket 3 is equal to that of the upper surface of the chip 2, the heat conduction silica gel gasket 3 is adhered to the upper surface of the chip 2, the upper surface of the heat conduction silica gel gasket 3 is provided with a heat dissipation module 5, the heat dissipation module 5 is of a two-layer stepped structure, and the lower surface of the heat dissipation module 5 is adhered to the upper surface of the heat conduction silica gel gasket 3; the heat dissipation fan 6 is arranged above the first layer of the stepped structure of the heat dissipation module 5 and is fixedly adhered to the upper surface of the heat dissipation module 5 through heat conduction silica gel; the length and width of the heat dissipation fan 6 are respectively equal to those of the first-layer stepped structure of the heat dissipation module 5, and the height of the heat dissipation fan 6 is equal to that of the second-layer stepped structure of the heat dissipation module 5, so that the heat dissipation module 5 and the heat dissipation fan 6 are integrally formed into a regular rectangular parallelepiped structure.
In embodiment 2, the heat dissipating device for electrical equipment provided with a heat dissipating fan further includes a PLC8 and a thermocouple 7, a temperature sensing probe of the thermocouple 7 is fixed on the surface of the chip 2, and a PLC8 is electrically connected to the thermocouple 7 and the heat dissipating fan 6, respectively; the thermocouple 7 detects the temperature of the chip 2 in real time and transmits the temperature to the PLC8, and the PLC8 controls the rotating speed of the cooling fan 6 in real time according to the temperature of the chip 2 8;
the control process of the rotating speed of the cooling fan 6 is as follows: (1) when the temperature t of the chip 2 is larger than or equal to 50 ℃, the rotating speed k of the cooling fan 6 is k 1; (2) when the temperature of the chip 2 is 40 ℃ < t < 50 ℃, the rotating speed k of the heat radiation fan 6 is 0.8 k 1; (3) when the temperature of the chip 2 is 30 ℃ < t < 40 ℃, the rotating speed k of the heat radiation fan 6 is 0.6 k 1; (4) when the temperature of the chip 2 is t < 30 ℃, the rotation speed k of the heat radiation fan 6 is 0, namely, the heat radiation fan 6 stops rotating. Where k1 is the maximum rotation speed of the radiator fan 6.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.

Claims (10)

1.一种设有散热风扇的电器设备用散热装置，其特征在于：所述电器设备包括本体和固定在本体上的芯片，在芯片上相对于本体的另一侧，依次设有导热硅胶垫片、散热模组和散热风扇；1. A cooling device for electrical equipment provided with a cooling fan, characterized in that: the electrical equipment comprises a body and a chip fixed on the body, and on the other side of the chip relative to the body, a thermally conductive silicone pad is arranged in turn Chips, cooling modules and cooling fans; 所述散热装置还包括PLC和热电偶，热电偶的感温探头固定在芯片的表面上，PLC分别与热电偶和散热风扇电气连接。The cooling device further includes a PLC and a thermocouple, the temperature sensing probe of the thermocouple is fixed on the surface of the chip, and the PLC is electrically connected to the thermocouple and the cooling fan respectively. 2.如权利要求1所述的散热装置，其特征在于：所述散热模组为铝挤或翅片。2 . The heat dissipation device of claim 1 , wherein the heat dissipation module is aluminum extrusion or fins. 3 . 3.如权利要求1或2所述的散热装置，其特征在于：所述散热风扇通过导热硅胶粘贴或螺丝固定在散热模组上。3 . The heat dissipation device according to claim 1 or 2 , wherein the heat dissipation fan is fixed on the heat dissipation module by means of thermal conductive silica gel paste or screws. 4 . 4.如权利要求3所述的散热装置，其特征在于：所述散热模组为两层阶梯形结构，散热风扇置于散热模组上第一层阶梯结构的上方，散热风扇的长度和宽度分别与散热模组上第一层阶梯结构的长度和宽度相等，散热风扇的高度与散热模组上第二层阶梯结构的高度相等。4. The heat dissipation device of claim 3, wherein the heat dissipation module is a two-layer stepped structure, the heat dissipation fan is placed above the first layer of the stepped structure on the heat dissipation module, and the length and width of the heat dissipation fan are They are respectively equal to the length and width of the first layer of the stepped structure on the heat dissipation module, and the height of the heat dissipation fan is equal to the height of the second layer of the stepped structure on the heat dissipation module. 5.如权利要求1所述的散热装置，其特征在于：所述散热风扇为变速风扇。5. The heat dissipation device of claim 1, wherein the heat dissipation fan is a variable speed fan. 6.如权利要求1所述的散热装置，其特征在于：所述导热硅胶垫片粘贴在芯片的上表面，散热模组粘贴在导热硅胶垫片的上表面。6 . The heat dissipation device of claim 1 , wherein the thermally conductive silicone gasket is attached to the upper surface of the chip, and the heat dissipation module is attached to the upper surface of the thermally conductive silicone gasket. 7 . 7.如权利要求1所述的散热装置，其特征在于：所述导热硅胶垫片包括第一导热硅胶垫片和第二导热硅胶垫片，在第一导热硅胶垫片和第二导热硅胶垫片之间设有散热元件。7. The heat dissipation device of claim 1, wherein the thermally conductive silicone gasket comprises a first thermally conductive silicone gasket and a second thermally conductive silicone gasket, and the first thermally conductive silicone gasket and the second thermally conductive silicone gasket There are heat dissipation elements between the sheets. 8.如权利要求7所述的散热装置，其特征在于：所述散热元件为热管或均热板。8. The heat dissipation device of claim 7, wherein the heat dissipation element is a heat pipe or a vapor chamber. 9.如权利要求7所述的散热装置，其特征在于：所述第一导热硅胶垫片粘贴在芯片的上表面，散热元件粘贴在第一导热硅胶垫片的上表面，在散热元件的另一侧，设有第二导热硅胶垫片，第二导热硅胶垫片粘贴在散热元件的上表面，散热模组粘贴在第二导热硅胶垫片的上表面。9 . The heat dissipation device according to claim 7 , wherein the first thermally conductive silicone gasket is attached to the upper surface of the chip, the heat dissipation element is attached to the upper surface of the first thermally conductive silicone gasket, and the other side of the thermal dissipation element is attached to the upper surface of the first thermally conductive silicone gasket. 10 . One side is provided with a second thermally conductive silicone gasket, the second thermally conductive silicone gasket is pasted on the upper surface of the heat dissipation element, and the heat dissipation module is pasted on the upper surface of the second thermally conductive silicone gasket. 10.如权利要求5所述的散热装置，其特征在于：所述热电偶实时探测芯片的温度，并将温度传输给PLC，PLC根据芯片的温度，对散热风扇的转速进行实时控制；散热风扇转速的控制过程为：(1)当芯片的温度为t≧50℃时，散热风扇的转速k＝k1；(2)当芯片的温度为40℃≦t﹤50℃时，散热风扇的转速k＝0.8˙k1；(3)当芯片的温度为30℃≦t﹤40℃时，散热风扇的转速k＝0.6˙k1；(4)当芯片的温度为t﹤30℃时，散热风扇的转速k＝0；其中，k1为散热风扇的最大转速。10. The cooling device of claim 5, wherein: the thermocouple detects the temperature of the chip in real time, and transmits the temperature to the PLC, and the PLC controls the rotating speed of the cooling fan in real time according to the temperature of the chip; The control process of the speed is as follows: (1) When the temperature of the chip is t≧50℃, the speed of the cooling fan is k=k1; (2) When the temperature of the chip is 40℃≦t﹤50℃, the speed of the cooling fan is k ＝0.8˙k1; (3) When the temperature of the chip is 30℃≦t﹤40℃, the speed of the cooling fan k=0.6˙k1; (4) When the temperature of the chip is t﹤30℃, the speed of the cooling fan k=0; wherein, k1 is the maximum rotational speed of the cooling fan.
CN202110805413.7A 2021-07-16 2021-07-16 Heat dissipation device with heat dissipation fan for electrical equipment Pending CN113498303A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115379726A (en) * 2022-08-10 2022-11-22 深圳市时代信创新技术有限公司 Heat dissipation module and mobile terminal

Citations (5)

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TWM322561U (en) * 2007-03-29 2007-11-21 Coretronic Corp Backlight module
CN202362720U (en) * 2011-11-16 2012-08-01 武汉新科泰电子有限公司 Radiating case of television and computer all-in-one machine
CN202406450U (en) * 2011-12-30 2012-08-29 四川鋈新能源科技有限公司 Radiator with uniform temperature plate
CN213659388U (en) * 2020-11-13 2021-07-09 上海西门子医疗器械有限公司 Cooling device for medical computer vision equipment and medical computer vision equipment
CN216057983U (en) * 2021-07-16 2022-03-15 江苏矽美科散热科技有限公司 Heat dissipation device with heat dissipation fan for electrical equipment

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Publication number Priority date Publication date Assignee Title
TWM322561U (en) * 2007-03-29 2007-11-21 Coretronic Corp Backlight module
CN202362720U (en) * 2011-11-16 2012-08-01 武汉新科泰电子有限公司 Radiating case of television and computer all-in-one machine
CN202406450U (en) * 2011-12-30 2012-08-29 四川鋈新能源科技有限公司 Radiator with uniform temperature plate
CN213659388U (en) * 2020-11-13 2021-07-09 上海西门子医疗器械有限公司 Cooling device for medical computer vision equipment and medical computer vision equipment
CN216057983U (en) * 2021-07-16 2022-03-15 江苏矽美科散热科技有限公司 Heat dissipation device with heat dissipation fan for electrical equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115379726A (en) * 2022-08-10 2022-11-22 深圳市时代信创新技术有限公司 Heat dissipation module and mobile terminal

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