CN214228722U

CN214228722U - Heat conducting gasket of electronic product

Info

Publication number: CN214228722U
Application number: CN202022928363.5U
Authority: CN
Inventors: 王小见; 牛小虎; 康文盛; 汪晓雪
Original assignee: Lanzhou Jiaotong University
Current assignee: Lanzhou Jiaotong University
Priority date: 2020-12-09
Filing date: 2020-12-09
Publication date: 2021-09-17
Anticipated expiration: 2030-12-09

Abstract

The utility model relates to the technical field of heat conducting gaskets, in particular to an electronic product heat conducting gasket, which comprises a metal layer, a heat conducting silica gel layer and a heat radiating fin layer, wherein the metal layer is provided with two layers, the heat conducting silica gel is arranged between the metal layers, the heat radiating fin layer is connected on the top surface of the metal layer on the upper layer, and a fin I is arranged on the top surface of the heat radiating fin layer, the utility model can effectively and quickly remove the heat generated in the operation process of electronic components, on one hand, the metal layer can effectively contact the interfaces in the heat transfer process, greatly improve the microscopic local contact phenomenon, effectively transfer the heat, on the other hand, the metal layer is softened into a semi-liquid state, and due to the existence of a small amount of phase change heat absorption, the heat can be quickly and effectively absorbed, the electronic components which generate heat are cooled, especially the metal layer on the lower layer, the fin I can quickly and effectively radiate the heat into the surrounding air, thereby avoiding the accumulation of the micro heat, the utility model discloses make convenient, the performance is excellent, and the material low price of chooseing for use has spreading value.

Description

Heat conducting gasket of electronic product

Technical Field

The utility model relates to a heat gasket technical field specifically is an electronic product heat gasket.

Background

With the development of science and technology, heat conduction materials are continuously and widely applied to various fields, in particular to the fields of miniaturization, integration and light electronic information. Electronic components are core components of electronic products, such as a CPU (central processing unit) and the like, and due to the miniaturization and integration of the electronic products and the remarkable enhancement of the functions of the core components, the load operation of the electronic components is increased, so that the heat per unit area of the electronic components is sharply increased in the operation process, and if the heat is not removed in time, the electronic components can be directly damaged or burnt, and the use of the electronic products is influenced. At present, a metal radiator is usually adopted for radiating heat of an electronic component, but the metal radiator cannot be in direct contact with the electronic component, and a layer of heat conducting gasket material is required to be added between the electronic component and the metal radiator, so that on one hand, the heat generated by the electronic component is transferred to the metal radiator through high heat conducting performance of the heat conducting gasket material, and on the other hand, the contact area between interfaces is increased to effectively transfer the heat, and therefore, the heat conducting performance and the interface combination performance of the heat conducting gasket material are related to the performance of an electronic product to a certain extent. Nowadays, the heat conduction gasket is generally used for heat conduction and heat dissipation in integrated circuit packaging and electronic product fields, and mainly adds the heat conduction gasket between the electronic components and heat abstractor of two kinds of hard materials, and the interface microcavity that produces when filling the contact increases interface contact and reduces the thermal resistance, improves the radiating performance of heat conduction to electronic components, can help electronic components heat conduction and heat dissipation in the operation process to a certain extent effectively. In addition, the small fan is matched to effectively dissipate heat generated in the operation process of the electronic components, so that the stable and reliable operation of the electronic product is ensured.

The key factors for restricting the heat conducting performance of the heat conducting gasket in the prior art mainly relate to the contact effect between interfaces and the heat conducting rate. Although various heat-conducting gaskets are designed, most of the heat-conducting gaskets cannot meet the strict requirement of heat dissipation in the field of electronic products, the heat-conducting performance is poor due to the fact that the heat-conducting gaskets are made of heat-conducting silica gel, the strict heat dissipation requirement cannot be met, gaps exist between the heat-conducting silica gel and a heat dissipation device, heat generated by electronic components cannot be effectively transferred to the heat dissipation device, and the electronic components cannot stably and reliably operate.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an electronic product heat conduction gasket gets rid of the heat that electronic components operation in-process produced fast effectively, makes electronic components keep the stable state operation of lower temperature.

In order to solve the technical problem, the utility model relates to an electronic product heat conduction gasket is including metal level, heat conduction silica gel and heat dissipation fin layer, and the metal level is equipped with two-layerly, is equipped with heat conduction silica gel between the metal level, and the heat dissipation fin layer is connected on the metal level top surface on upper strata, is equipped with fin I on the heat dissipation fin layer top surface.

Further, be equipped with fin II on the metal level bottom surface on upper strata in the two-layer metal level, II linear arrangements of fin are equipped with a plurality ofly, and a plurality of fins II all connect in heat conduction silica gel, be equipped with fin II on the top surface of the metal level of lower floor in the two-layer metal level, II linear arrangements of fin are equipped with a plurality ofly, and a plurality of fins II all connect in heat conduction silica gel.

Further, the bottom surface of the upper metal layer in the two metal layers is a wavy surface, the top surface of the lower metal layer in the two metal layers is a wavy surface, and the heat-conducting silica gel is connected between the two wavy surfaces.

Further, be equipped with fin II on the metal level bottom surface on the upper strata in two-layer metal level, fin II linear arrangement is equipped with a plurality ofly, be equipped with the fin groove on the top surface of the metal level of lower floor in two-layer metal level, fin groove linear arrangement is equipped with a plurality ofly, and a plurality of fins II are connected in a plurality of fin inslots, have the clearance between fin II and the fin groove, have the clearance between the metal level bottom surface on upper strata and the metal level top surface of lower floor, and heat conduction silica gel connects in the clearance between fin II and the fin groove and the clearance between the metal level bottom surface on upper strata and the metal level top surface of lower floor.

Further, the phase transition temperature of the metal layer 1 is 26-35 ℃.

Further, the metal layer 1 is made of bismuth-indium alloy, bismuth-tin alloy, bismuth-indium-tin alloy or bismuth-base alloy.

The utility model has the advantages that: the heat-conducting silicon rubber is connected to the top surface of the metal layer on the upper layer, and the fins I are arranged on the top surface of the heat-radiating fin layer. The utility model discloses get rid of the heat that electronic components operation in-process produced fast effectively, make electronic components keep the stable state operation of lower temperature, the metal level can make the interfacial contact effectively in the heat transfer process on the one hand, improves microcosmic local contact phenomenon by a wide margin, makes the heat transmit effectively, and on the other hand metal level softens into semi-liquid, because the endothermic existence of a small amount of phase transition, can absorb the heat fast effectively, the electronic components that the cooling generates heat, especially the metal level of lower floor, fin I gives off the heat to the surrounding air fast effectively, avoids the little heat gathering, the utility model discloses it is convenient to make, excellent performance, the material low price who chooses for use has spreading value.

Drawings

FIG. 1 is a cross-sectional view of an embodiment of the present invention;

FIG. 2 is a cross-sectional view of a second embodiment of the present invention;

fig. 3 is a cross-sectional view of the third structure of the embodiment of the present invention.

In the figure: 1. a metal layer; 101. a wavy surface; 2. heat conducting silica gel; 3. a heat dissipating fin layer; 301. a fin I; 4. a fin II; 102. fin grooves.

Detailed Description

As shown in fig. 1, an embodiment of a heat conductive gasket for electronic products of the present invention includes a metal layer 1, a heat conductive silica gel layer 2 and a heat dissipation fin layer 3, wherein the metal layer 1 has two layers, the heat conductive silica gel layer 2 is disposed between the metal layers 1, the heat dissipation fin layer 3 is connected to the top surface of the metal layer 1 on the upper layer, and a fin i 301 is disposed on the top surface of the heat dissipation fin layer 3; be equipped with fin II 4 on the 1 bottom surface of metal level on the upper strata in two-layer metal level 1, fin II 4 linear arrangement is equipped with a plurality ofly, and a plurality of fins II 4 are all connected in heat conduction silica gel 2, be equipped with fin II 4 on the top surface of metal level 1 of lower floor in two-layer metal level 1, fin II 4 linear arrangement is equipped with a plurality ofly, and a plurality of fins II 4 are all connected in heat conduction silica gel 2.

Further, the phase transition temperature of the metal layer 1 is 26-35 ℃.

The fins II 4 of the upper metal layer 1 and the lower metal layer 1 are connected in the heat-conducting silica gel 2, so that the two metal layers 1 and the heat-conducting silica gel 2 can be more effectively subjected to heat transfer; the phase transition temperature of the metal layer 1 is 26-35 ℃, is determined according to the minimum generation temperature of the component, and generally, the metal layer 1 cannot be melted at 25 ℃ at normal temperature, is melted into a semi-liquid state at the temperature of more than 35 ℃, and can influence the operation of the electronic component due to heat collection when not melted at the temperature of more than 35 ℃;

as shown in fig. 2, the second embodiment of the heat conductive gasket for electronic products of the present invention is different from the first embodiment in that the bottom surface of the metal layer 1 on the upper layer in the two-layer metal layer 1 is a wavy surface 101, the top surface of the metal layer 1 on the lower layer in the two-layer metal layer 1 is a wavy surface 101, and the heat conductive silica gel 2 is connected between the two wavy surfaces 101. Compared with the fin II 4, the two wavy surfaces 101 can effectively reduce the distance between the upper metal layer 1 and the lower metal layer 1, and further improve the heat dissipation efficiency.

As shown in fig. 3, the utility model relates to an electronic product heat conduction gasket's embodiment three in two-layer metal level 1 on the metal level 1 bottom surface of upper strata be equipped with fin II 4, fin II 4 linear arrangement is equipped with a plurality ofly, be equipped with fin groove 102 on the metal level 1's of lower floor the top surface in two-layer metal level 1, fin groove 102 linear arrangement is equipped with a plurality ofly, and a plurality of fin II 4 are connected in a plurality of fin grooves 102, have the clearance between fin II 4 and the fin groove 102, have the clearance between the metal level 1 bottom surface of upper strata and the metal level 1 top surface of lower floor, and heat conduction silica gel 2 connects in the clearance between fin II 4 and fin groove 102 and the clearance between the metal level 1 bottom surface of upper strata and the metal level 1 top surface of lower floor. The heat conduction and heat radiation efficiency is improved, and the total thickness of the gasket is effectively reduced.

Claims

1. A heat conduction gasket for electronic products is characterized in that: the heat dissipation fin comprises a metal layer (1), heat conduction silica gel (2) and a heat dissipation fin layer (3), wherein the metal layer (1) is provided with two layers, the heat conduction silica gel (2) is arranged between the metal layers (1), the heat dissipation fin layer (3) is connected to the top surface of the metal layer (1) on the upper layer, and a fin I (301) is arranged on the top surface of the heat dissipation fin layer (3).

2. The electronic product thermal pad of claim 1, wherein: be equipped with fin II (4) on metal level (1) bottom surface on upper strata in two-layer metal level (1), fin II (4) linear arrangement is equipped with a plurality ofly, and a plurality of fins II (4) are all connected in heat conduction silica gel (2), be equipped with fin II (4) on the top surface of metal level (1) of lower floor in two-layer metal level (1), fin II (4) linear arrangement is equipped with a plurality ofly, and a plurality of fins II (4) are all connected in heat conduction silica gel (2).

3. The electronic product thermal pad of claim 1, wherein: the two-layer metal level (1) in upper metal level (1) bottom surface be wave face (101), two-layer metal level (1) in the top surface of metal level (1) of lower floor be wave face (101), heat conduction silica gel (2) are connected between two wave faces (101).

4. The electronic product thermal pad of claim 1, wherein: be equipped with fin II (4) on metal level (1) bottom surface on upper strata in two-layer metal level (1), fin II (4) linear arrangement is equipped with a plurality ofly, be equipped with fin groove (102) on the top surface of metal level (1) of lower floor in two-layer metal level (1), fin groove (102) linear arrangement is equipped with a plurality ofly, and a plurality of fin II (4) are connected in a plurality of fin grooves (102), have the clearance between fin II (4) and fin groove (102), have the clearance between metal level (1) bottom surface on upper strata and lower floor metal level (1) top surface, and heat conduction silica gel (2) are connected in the clearance between fin II (4) and fin groove (102) and the clearance between metal level (1) bottom surface on upper strata and lower floor metal level (1) top surface.

5. The thermal pad for electronic products of any one of claims 1-4, wherein: the phase transition temperature of the metal layer (1) is 26-35 ℃.

6. The electronic product thermal pad of claim 5, wherein: the metal layer (1) is made of bismuth-indium alloy, bismuth-tin alloy, bismuth-indium-tin alloy or bismuth-base alloy.