CN213659388U

CN213659388U - Heat dissipation device of medical computer vision equipment and medical computer vision equipment

Info

Publication number: CN213659388U
Application number: CN202022620907.1U
Authority: CN
Inventors: 曾驰; 何昕
Original assignee: Shanghai Siemens Medical Devices Co ltd
Current assignee: Shanghai Siemens Medical Devices Co ltd; Siemens Shanghai Medical Equipment Ltd
Priority date: 2020-11-13
Filing date: 2020-11-13
Publication date: 2021-07-09
Anticipated expiration: 2030-11-13

Abstract

A heat dissipating device for a medical computer vision apparatus includes a heat dissipating housing (10), a heat conductive member (20), and a heat sink (30). The heat dissipation shell can cover the chip of the medical computer vision equipment. The heat conducting member is arranged in the heat dissipation shell and can conduct heat in a contact mode with the surface of the chip, and the heat conducting member can conduct heat in a contact mode with the inner surface of the heat dissipation shell. The heat sink includes a base (32) that conducts heat in contact with the outer surface of the heat-dissipating housing, and a plurality of heat-dissipating fins (34) formed on the base. The heat dissipation device can protect the chip of the medical computer vision equipment and effectively reduce the operating temperature of the chip. The utility model also provides a medical computer vision equipment that has above-mentioned heat abstractor.

Description

Heat dissipation device of medical computer vision equipment and medical computer vision equipment

Technical Field

The utility model relates to a heat abstractor, especially, medical computer vision equipment. The utility model also provides a medical computer vision equipment that has above-mentioned heat abstractor.

Background

The temperature of the chip may be as high as 90 deg. while the computer vision equipment is in operation. In the international standard IEC60601, the operating temperature of the medical electrical equipment at 35 ° equivalent temperature cannot be higher than 65 °, so when the computer vision equipment is applied to the medical electrical equipment, a heat dissipation device needs to be arranged to reduce the temperature of the chip.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat abstractor can protect the chip of medical computer vision equipment and effectively reduce the operating temperature of chip.

Another object of the utility model is to provide a medical computer vision equipment can satisfy the requirement to operating temperature in the IEC60601 international standard.

The utility model provides a heat abstractor of medical computer vision equipment, including a heat dissipation casing, a heat-conducting piece and a radiator. The heat dissipation shell can cover the chip of the medical computer vision equipment. The heat conducting piece is arranged in the heat dissipation shell, can conduct heat in a contact mode with the surface of the chip, and can conduct heat in a contact mode with the inner surface of the heat dissipation shell. The heat radiator comprises a base, the base conducts heat with the outer surface of the heat radiating shell in a contact mode, and a plurality of heat radiating fins are formed on the base.

The utility model provides a heat abstractor of medical computer vision equipment, heat conduction piece are with the heat conduction of chip to the heat dissipation casing of the mode of contact, make the heat dissipation casing have protection chip and radiating function concurrently. The base of the radiator absorbs heat on the radiating shell in a contact mode and conducts the heat to the air through the radiating fins, so that the heat can be conducted more effectively, and the operating temperature of a chip of the medical computer vision equipment is effectively reduced.

In yet another exemplary embodiment of the heat dissipation apparatus of the medical computer vision device, the heat dissipation apparatus further includes a heat conductive silicone pad disposed between the heat conductive member and the heat dissipation housing. The elasticity of heat conduction silica gel pad can compensate the machining error of heat conduction piece and heat dissipation casing, avoids heat conduction piece and heat dissipation casing to cause the problem that radiating efficiency is low because of the contact is not abundant when direct contact.

In yet another exemplary embodiment of a heat dissipation device for a medical computer vision apparatus, a heat dissipation housing is formed with a plurality of heat dissipation through-holes. The heat dissipation through holes can enable air to enter and exit the heat dissipation shell so as to improve heat dissipation performance.

In another exemplary embodiment of the heat dissipation device of the medical computer vision equipment, the heat dissipation device further comprises a heat dissipation fan which is arranged on the heat sink and can continuously blow air to the heat dissipation fins. Whereby the heat radiation performance of the heat sink can be increased.

In another exemplary embodiment of a heat dissipation device for a medical computer vision apparatus, the heat dissipation housing is an aluminum alloy housing. Therefore, the heat conductivity is guaranteed, meanwhile, the processing is convenient, and the cost can be saved.

In another exemplary embodiment of a heat dissipation device for a medical computer vision apparatus, the inner and outer surfaces of the heat dissipation housing are surfaces that have been subjected to a metal wire drawing process. Thereby improving the heat dissipation performance of the heat dissipation shell.

In another exemplary embodiment of a heat dissipating device for a medical computer vision apparatus, the thermally conductive member is an aluminum alloy plate. Therefore, the heat conductivity is guaranteed, meanwhile, the processing is convenient, and the cost can be saved.

The utility model provides a medical computer vision equipment, including at least one chip and an foretell heat abstractor. The heat dissipation shell can cover the chip, and the heat conducting piece can conduct heat in a contact mode with the surface of the chip. The heat dissipation device can effectively reduce the operating temperature of the chip of the medical computer vision equipment so as to meet the requirement on the operating temperature in the IEC60601 international standard.

Drawings

The following drawings are only schematic illustrations and explanations of the present invention, and do not limit the scope of the present invention.

Fig. 1 is a schematic structural diagram of an exemplary embodiment of a heat dissipation device of a medical computer vision apparatus.

Fig. 2 is a schematic sectional view for explaining a heat dissipating device of the medical computer vision apparatus.

Fig. 3 is a schematic cross-sectional view illustrating another embodiment of a heat sink for a medical computer vision apparatus.

Description of the reference symbols

10 Heat dissipation casing

12 Heat dissipating through-hole

20 Heat conducting member

30 radiator

32 base

34 heat sink fin

40 heat-conducting silica gel pad

50 heat radiation fan

60 chip

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described with reference to the accompanying drawings, wherein the same reference numerals in the drawings denote the same or similar components.

"exemplary" means "serving as an example, instance, or illustration" herein, and any illustration, embodiment, or steps described as "exemplary" herein should not be construed as a preferred or advantageous alternative.

For the sake of simplicity, only the parts relevant to the present invention are schematically shown in the drawings, and they do not represent the actual structure as a product.

Fig. 1 is a schematic structural diagram of an exemplary embodiment of a heat dissipation device of a medical computer vision apparatus. Fig. 2 is a schematic sectional view for explaining a heat dissipating device of the medical computer vision apparatus. Referring to fig. 1 and 2, the heat dissipating apparatus of the medical computer vision device includes a heat dissipating housing 10, a heat conductive member 20, and a heat sink 30.

Referring to fig. 2, the heat dissipation housing 10 can cover a chip 60 of the medical computer vision apparatus. The heat dissipation housing 10 can protect the chip 60, and the heat dissipation housing 10 also has a capability of conducting heat. In the exemplary embodiment, the heat dissipation housing 10 is a metal housing made of 5052 aluminum alloy, and the 5052 aluminum alloy has high strength, high plasticity and high corrosion resistance, so that the heat dissipation housing 10 is convenient to process while ensuring the thermal conductivity thereof, and the cost can be saved. However, the present invention is not limited thereto, and other materials with good thermal conductivity may be used for the heat dissipation housing 10 in other exemplary embodiments.

Referring to fig. 2, the heat conduction member 20 is disposed in the heat dissipation housing 10, and the heat conduction member 20 can conduct heat in contact with the surface of the chip 60, where "contact" may be direct contact as shown in fig. 2 or indirect contact through another material layer. The heat-conducting member 20 is also capable of conducting heat in contact with the inner surface of the heat-dissipating housing 10, where "contact" may also be direct contact as shown in fig. 2 or indirect contact through other material layers. In the illustrated embodiment, the heat conductive member 20 is a 6 mm thick metal plate of 6061 aluminum alloy material. Therefore, the heat conductivity is guaranteed, meanwhile, the processing is convenient, and the cost can be saved. However, the present invention is not limited thereto, and other materials with good thermal conductivity may be used for the thermal conductive member 20 in other exemplary embodiments.

Referring to fig. 1 and 2, the heat sink 30 includes a base 32, and in the illustrated embodiment the base 32 is a flat plate having a surface that conducts heat in contact with the outer surface of the heat dissipation housing 10, where "contact" may be direct contact as shown in fig. 2 or indirect contact through other layers of material. And the area of the base 32 for conducting heat in contact with the heat sink 30 encompasses the area thereof for conducting heat in contact with the heat conductive member 20. As shown in fig. 2, the base 32 and the thermal conduction member 20 are oppositely disposed at two sides of the top of the heat dissipation housing 10, and the contact area of the base 32 and the heat dissipation housing 10 covers the contact area of the thermal conduction member 20 and the heat dissipation housing 10, so that the heat conducted by the thermal conduction member 20 to the heat dissipation housing 10 can be directly and rapidly conducted to the base 32, and the heat conduction speed is increased. A plurality of heat dissipation fins 34 (only one of which is labeled) are formed on the other surface of the base 32, and in the exemplary embodiment, the heat dissipation fins 34 are uniformly arranged on one surface of the base 32, and the heat dissipation fins 34 can increase the area for exchanging heat with the air to improve heat dissipation performance.

The utility model provides a heat abstractor of medical computer vision equipment, medical computer vision equipment chip 60 can produce a large amount of heats when the operation, and heat-conducting piece 20 makes heat dissipation casing 10 have protection chip 60 and radiating function concurrently with the heat conduction of chip 60 to heat dissipation casing 10 with the mode of contact. The base 32 of the heat sink 30 absorbs heat on the heat-dissipating housing 10 in a contact manner and conducts the heat to the air through the heat-dissipating fins 34. The heat dissipation device can protect the chip 60 through the heat dissipation shell 10, and can conduct the heat of the chip 60 to the heat dissipation shell 10 and the heat sink 30 positioned outside the heat dissipation shell 10 in a contact mode so as to conduct the heat to the air, so that the heat dissipation device has good heat dissipation performance, and effectively reduces the operating temperature of the chip 60 of the medical computer vision equipment.

In an exemplary embodiment, referring to fig. 1, a plurality of heat dissipating through-holes 12 (only one of which is labeled) are formed on a heat dissipating case 10. The heat dissipation through holes 12 enable air to enter and exit the heat dissipation case 10 and take away heat in the heat dissipation case 10, thereby improving heat dissipation performance.

In the illustrated embodiment, the inner and outer surfaces of the heat dissipation housing 10 are treated by a metal drawing process. Thereby improving the heat dissipation performance of the heat dissipation case 10.

Fig. 3 is a schematic cross-sectional view illustrating another embodiment of a heat sink for a medical computer vision apparatus. Referring to fig. 3, the same or similar parts as those of the heat dissipation device in fig. 1 are not repeated, and the difference is that the heat dissipation device further includes a heat conductive silicone pad 40. In the exemplary embodiment, the thermally conductive silicone pad 40 is 0.5 mm thick and is disposed between the thermally conductive member 20 and the heat dissipation housing 10. The heat-conducting silica gel pad 40 has good heat conductivity, and the elasticity of the heat-conducting silica gel pad 40 can compensate for the processing error of the heat-conducting piece 20 and the heat-radiating shell 10, so that the problem of low heat-radiating efficiency caused by insufficient contact when the heat-conducting piece 20 and the heat-radiating shell 10 are in direct contact is avoided.

Referring to fig. 3, the heat dissipating apparatus further includes a heat dissipating fan 50 disposed on the heat sink 30 and capable of continuously blowing air toward the heat dissipating fins 34. The heat dissipation fan 50 accelerates the air flow over the heat dissipation fins 34, thereby increasing the heat dissipation performance of the heat sink 30, thereby further reducing the operating temperature of the chip 60 of the medical computer vision apparatus.

The utility model provides a medical computer vision equipment. Referring to fig. 2, the medical computer vision equipment includes a chip 60 and a heat sink as described above. The heat dissipating case 10 can cover the chip 60, and the heat conducting member 20 can conduct heat in contact with the surface of the chip 60. In other exemplary embodiments, the medical computer vision device may include several chips 60. The shape of the heat-conducting member 20 may be adjusted to allow heat to be conducted in contact with the surfaces of the plurality of chips 60. The heat dissipation device can protect the chip 60 and effectively reduce the operating temperature of the chip 60 of the medical computer vision equipment so as to meet the requirement of IEC601 international standard on the operating temperature.

It should be understood that although the present description has been described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein may be combined as suitable to form other embodiments, as will be appreciated by those skilled in the art.

The above list of details is only for the practical examples of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications, such as combinations, divisions or repetitions of the features, which do not depart from the technical spirit of the present invention, should be included in the scope of the present invention.

Claims

1. A heat sink for medical computer vision equipment, comprising:

a heat-dissipating housing (10) capable of housing a chip of the medical computer vision device;

a heat conductive member (20) disposed within the heat dissipating housing (10), the heat conductive member (20) being capable of conducting heat in contact with the surface of the chip, the heat conductive member (20) also being capable of conducting heat in contact with the inner surface of the heat dissipating housing (10);

a heat sink (30) comprising a base (32), said base (32) being capable of conducting heat in contact with the outer surface of said heat dissipating housing (10), said base (32) having a plurality of heat dissipating fins (34) formed thereon.

2. The heat dissipating device according to claim 1, further comprising a thermally conductive silicone pad (40), wherein the thermally conductive silicone pad (40) is disposed between the thermally conductive member (20) and the heat dissipating housing (10).

3. The heat dissipating device as claimed in claim 1, wherein the heat dissipating case (10) is formed with a plurality of heat dissipating through-holes (12).

4. The heat dissipating device according to claim 1, further comprising a heat dissipating fan (50) disposed on the heat sink (30) and capable of continuously blowing air toward the heat dissipating fins (34).

5. The heat dissipating arrangement according to claim 1, characterized in that the heat dissipating housing (10) is an aluminum alloy housing.

6. The heat dissipating device according to claim 5, wherein the inner surface and the outer surface of the heat dissipating case (10) are surfaces treated by a metal drawing process.

7. The heat dissipating device according to claim 1, wherein the heat conducting member (20) is an aluminum alloy plate.

8. Medical computer vision apparatus, comprising:

at least one chip (60); and

the heat dissipating device as claimed in any one of claims 1 to 7, wherein the heat dissipating housing (10) is capable of covering the chip (60), and the heat conducting member (20) is capable of conducting heat in contact with a surface of the chip (60).