CN115023116A

CN115023116A - Heat dissipation assembly and electronic equipment

Info

Publication number: CN115023116A
Application number: CN202210720387.2A
Authority: CN
Inventors: 田枫林; 谭大治; 江浩
Original assignee: Formovie Chongqing Innovative Technology Co Ltd
Current assignee: Formovie Chongqing Innovative Technology Co Ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2022-09-06

Abstract

The invention discloses a heat dissipation assembly and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation assembly includes: a heating device; The thermal power density of the second heat-generating area; the heat-conducting component is disposed on the heat-generating device, the heat-conducting component includes a first heat-conducting layer and a second heat-conducting layer, and the heat-conductivity of the first heat-conducting layer is greater than that of the second heat-conducting layer The thermal conductivity of the first thermal conductive layer corresponds to the position of the first heat-generating area, and the second thermally-conductive layer corresponds to the position of the second heat-generating area. one side of the heating element. According to the thermal power density of different heating areas of the heating device, the solution of the present invention adopts heat conduction layers with different thermal conductivity, which can achieve better heat dissipation effect.

Description

Heat dissipation assembly and electronic equipment

Technical Field

The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation assembly and an electronic device.

Background

At present, people have more and more requirements on electronic equipment such as mobile phones, projectors, computers, televisions and the like, the electronic equipment cannot be separated in daily life, and a chip, a power tube, a resistor and other heating devices form a control system of the electronic equipment and are of great importance to the electronic equipment.

With the continuous development of the technology, the integration level of the heating device is higher and higher, and the power is higher and higher, so that the heating value of the heating device is higher and higher, and if the temperature of the heating device is too high, the working performance of the heating device is sharply reduced, and the electronic equipment cannot be normally used.

The existing heat dissipation scheme of the heat generating device generally adopts air cooling or arranges a radiator around the heat generating device for heat dissipation, but cannot meet the increasing heat dissipation requirement.

Disclosure of Invention

The invention mainly aims to provide a heat dissipation assembly and electronic equipment, and aims to better dissipate heat of a heating device.

In order to achieve the above object, the present invention provides a heat dissipation assembly, including:

the heating device comprises a first heating area and a second heating area, and the thermal power density of the first heating area is greater than that of the second heating area;

the heat conduction component is arranged on the heating device and comprises a first heat conduction layer and a second heat conduction layer, the heat conductivity of the first heat conduction layer is greater than that of the second heat conduction layer, the first heat conduction layer corresponds to the first heating area, and the second heat conduction layer corresponds to the second heating area;

the radiator is arranged on one side, back to the heating device, of the heat conduction assembly.

Optionally, the second heat conduction layer is provided with a containing groove, the containing groove penetrates through the second heat conduction layer along the thickness direction of the second heat conduction layer, and the first heat conduction layer is arranged in the containing groove.

Optionally, the heat sink includes a heat dissipation body and a first boss disposed on the heat dissipation body and inserted into the accommodation groove, the thickness of the first boss is smaller than that of the second heat conduction layer, the thickness of the first heat conduction layer is smaller than that of the second heat conduction layer, and the surface of the first heat conduction layer away from the heating device contacts with the first boss.

Optionally, the heat sink further includes a second boss, the second boss is disposed between the first boss and the heat dissipation body, a cross-sectional area of the second boss is larger than a cross-sectional area of the first boss, and a surface of the second heat conduction layer away from the heat generating device is in contact with the second boss.

Optionally, an accommodating gap is formed between the peripheral wall of the first boss and the groove wall of the accommodating groove.

Optionally, one side of the heat dissipation body, which is away from the heating device, is provided with a plurality of heat dissipation fins arranged at intervals.

Optionally, the hardness of the first heat conducting layer is less than the hardness of the second heat conducting layer.

Optionally, the first heat conducting layer is one or more of heat conducting silicone grease, heat conducting phase change material, heat conducting gel, liquid metal and heat conducting mud.

Optionally, the heat dissipation assembly further includes a circuit board, the heat generating device is mounted on the circuit board, the heat sink is fixedly connected to the circuit board, and a heat insulation gap is formed between the heat sink and the circuit board.

The invention further provides electronic equipment which comprises the heat dissipation assembly.

In the technical scheme of the invention, the first heat conduction layer corresponds to the first heat-generating area, the second heat conduction layer corresponds to the second heat-generating area, the thermal power density of the first heat-generating area is greater than that of the second heat-generating area, the thermal conductivity of the first heat conduction layer is greater than that of the second heat conduction layer, the radiator is arranged on one side of the heat conduction assembly, which is opposite to the heating device, and the heat conduction layers with different thermal conductivities are adopted according to the thermal power densities of different heat-generating areas of the heating device, so that the thermal power density is matched with the thermal conductivity, and a better heat dissipation effect can be realized.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic cross-sectional view of a heat dissipation assembly of the present invention;

FIG. 2 is a schematic view of the heat sink of the present invention;

fig. 3 is a schematic structural diagram of the heat generating device of the present invention combined with a first heat conducting layer and a second heat conducting layer;

fig. 4 is an exploded view of the heat dissipation assembly of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				100	Heating device	200	The first heat conducting layer
300	The second heat conducting layer	400	Heat radiator
				410	First boss	420	Heat radiation bookBody
430	Second boss	440	Heat radiation fin
				450	Accommodating gap	500	Circuit board

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

With the increasing popularization of electronic products, people have an increasing demand for the functions of the electronic products, the heat productivity and the heat flux density of chips are higher and higher, and designers must design a more efficient heat dissipation system in a limited space to dissipate heat of the chips.

Referring to fig. 1 to 4, the present invention provides a heat dissipation assembly, which includes a heat generating device 100, a first heat conducting layer 200, a second heat conducting layer 300, and a heat sink 400.

The heating device 100 comprises a first heating area and a second heating area, wherein the thermal power density of the first heating area is greater than that of the second heating area; a heat conducting assembly comprising a first heat conducting layer 200 and a second heat conducting layer 300, wherein the heat conductivity of the first heat conducting layer 200 is greater than the heat conductivity of the second heat conducting layer 300, the first heat conducting layer 200 corresponds to the position of the first heat generating region, and the second heat conducting layer 300 corresponds to the position of the second heat generating region; and the heat radiator 400 is attached to one side of the heat conducting component, which faces away from the heating device 100.

Specifically, the heat generating device 100 may be a chip, a power tube, a resistor, or other heat generating devices inside the electronic device, and the heat generating device 100 generates a large amount of heat during operation and needs to be dissipated in time to ensure the service life and the working performance thereof. The first heat conduction layer 200 may be made of heat conductive silicone grease, heat conductive phase change material, heat conductive gel, liquid metal, or heat conductive mud, which have low heat conduction resistance and soft texture, and can well conduct heat generated by the heat generating device 100. The hardness of second heat-conducting layer 300 is higher than the hardness of first heat-conducting layer 200 to have certain elasticity, can also play the cushioning effect when playing the supporting role, moreover, second heat-conducting layer 300 still possesses the heat conduction function, can dispel the heat to the heat transfer of the device that will generate heat to the radiator, and second heat-conducting layer 300 can be the material of other modified materials of silica gel doping. The heat sink 400 may have a shape and a size matched with those of the heat generating device 100 according to the size, the heat generation amount, and the like of the heat generating device 100, and the heat sink 400 may be made of a metal material having good thermal conductivity, such as aluminum, copper, and the like, so as to rapidly transfer heat generated by the heat generating device 100 to the outside.

It should be noted that the first heat generation region and the second heat generation region may be located on the same surface of the heat generating device 100, and the first heat generation region and the second heat generation region are disposed side by side on the same surface of the heat generating device 100, for example, the first heat generation region is located in a central region of a surface of the heat generating device 100, and the second heat generation region is located in a peripheral region of the surface and surrounds the first heat generation region, or the first heat generation region is located in a left region of the surface of the heat generating device 100, and the second heat generation region is located in a right region of the surface of the heat generating device 100. Of course, the first heat generation region and the second heat generation region may also be located on different surfaces of the heat generating device 100, respectively, for example, the first heat generation region is located on the top surface of the heat generating device 100, the second heat generation region is located on the side surface of the heat generating device 100, and so on. Since the thermal power density of the first heat-generating region is greater than the thermal power density of the second heat-generating region, the temperature of the first heat-generating region is greater than the temperature of the second heat-generating region when the heat-generating device 100 is in operation.

The heat conduction assembly is arranged between the heating device 100 and the radiator 400, so that two sides of the first heat conduction layer 200 and the second heat conduction layer 300 are respectively contacted with the heating device 100 and the radiator 400, because the first heat conduction layer 200 corresponds to the first heating area, the second heat conduction layer 300 corresponds to the second heating area, and the thermal power density of the first heating area is greater than the thermal power density of the second heating area and the thermal conductivity of the first heat conduction layer 200 is greater than the thermal conductivity of the second heat conduction layer 300, according to the thermal power densities of different heating areas of the heating device 100, the heat conduction layers with different thermal conductivities are adopted, so that the thermal power density is matched with the thermal conductivity, and a better heat dissipation effect can be realized.

Based on the above embodiment, further, referring to fig. 1 to 4, the first heat generation region and the second heat generation region of the heat generation device 100 are located on the same surface of the heat generation device 100, and the second heat generation region is disposed around the first heat generation region. Correspondingly, the second heat conduction layer 300 is provided with a containing groove, the containing groove runs through the second heat conduction layer 300 in the thickness direction of the second heat conduction layer 300, and the first heat conduction layer 200 is arranged in the containing groove. That is to say, the second heat conduction layer 300 is disposed between the heat generating device 100 and the heat sink 400, and the second heat conduction layer 300 is disposed with a receiving groove for receiving the first heat conduction layer 200, and the first heat conduction layer 200 is in heat conduction connection with the heat generating device 100 and the heat sink 400. In this case, the heat is dissipated between the heat sink 400 and the heat generating device 100 through the first heat conducting layer 200 and the second heat conducting layer 300, and since the heat conduction resistance of the first heat conducting layer 200 is small, the heat dissipated by the heat generating device 100 can be well conducted to the heat sink 400, so that the function of rapid cooling is realized. It should be noted that one or more receiving grooves may be provided in the second heat conduction layer 300, and may be adjusted according to actual situations.

According to the technical scheme of the invention, the second heat conduction layer 300 is arranged between the heating device 100 and the radiator 400, the second heat conduction layer 300 is provided with a containing groove, the containing groove is used for containing the first heat conduction layer 200, and the first heat conduction layer 200 is in heat conduction connection with the heating device 100 and the radiator 400. The second heat conduction layer 300 can play a good supporting role and also can play a heat conduction role, the accommodating groove in the second heat conduction layer 300 is provided with the first heat conduction layer 200 with higher heat conductivity, the first heat conduction layer 200 can play a better heat dissipation effect, and then the heating device 100 is enabled to realize a better heat dissipation effect. In addition, for the heat conduction material, the higher the heat conductivity is, the higher the cost is correspondingly, and the invention can reduce the cost by adopting the heat conduction layer with the matched heat conductivity aiming at the heat power density of different heating areas of the heating device 100 and comparing with the heat conduction layer only using the high heat conductivity material.

Further, the heat generating device 100 may be divided into a region having a relatively large thermal power density and a region having a relatively small thermal power density. The first heat conducting layer 200 is arranged in an area where the heat flux density is large. The first heat conducting layer 200 is disposed in a region where the thermal power density is relatively large, and the second heat conducting layer 300 is disposed in a region where the thermal power density is relatively small. For example, the first heat generating region is located in the central region of the heat generating device 100, and the second heat generating region is located in the peripheral region of the first heat generating region, that is, the central region of the heat generating device 100 generates a larger amount of heat and the peripheral region generates a smaller amount of heat, and accordingly, the first heat conductive layer 200 is located in the central region and the second heat conductive layer 300 is located in the peripheral region. Since the thermal conductivity of the first heat conduction layer 200 is high, a good heat dissipation effect can be achieved, and the first heat conduction layer 200 is made of a soft material, so that the first heat conduction layer can serve as a buffer between the heat sink 400 and the heat generating device 100, and further the fine structure of the heat generating device 100 is protected.

Based on the above embodiment, further, referring to fig. 1 and fig. 2, the heat sink 400 includes a heat dissipation body 420 and a first boss 410 disposed on the heat dissipation body 420 and inserted into the accommodating groove for matching, the thickness of the first boss 410 is smaller than that of the second heat conduction layer 300, the thickness of the first heat conduction layer 200 is smaller than that of the second heat conduction layer 300, and the surface of the first heat conduction layer 200 departing from the heat generating device 100 is in contact with the first boss 410. Since the first bosses 410 are inserted into the receiving slots and the thickness of the first bosses 410 is smaller than that of the second heat conducting layer 300, a gap is formed between the first bosses 410 and the heat generating device 100, and the gap is used for receiving the first heat conducting layer 200. The thickness of the first heat conducting layer 200 is comparable to the thickness of the gap, that is to say the thickness of the first heat conducting layer 200 is smaller than the thickness of the second heat conducting layer 300. It should be noted that, one or more receiving grooves may be disposed in the second heat conduction layer 300, so that one or more first bosses 410 may also be disposed. The arrangement of the first bosses 410 on the heat sink 400 can reduce the distance between the heat generating device 100 and the heat sink 400 and reduce the amount of the material used for the first heat conducting layer 200. The second heat conduction layer 300 wraps the first heat conduction layer 200 inside, so that the first heat conduction layer 200 can be prevented from overflowing and flowing out, volatilization of the first heat conduction layer 200 can be reduced when the heat dissipation assembly works, and the service life and reliability of the heat dissipation assembly are improved.

Further, with continued reference to fig. 1 and 2, the heat sink 400 further includes a second boss 440, the second boss 430 is disposed between the first boss 410 and the heat dissipation body 420, the cross-sectional area of the second boss is larger than that of the first boss, and a surface of the second heat conduction layer 300 facing away from the heat generating device 100 is in contact with the second boss 430. When the heat dissipation assembly works, the heat generating device 100 generates a large amount of heat, the temperature is high, at this time, the heat on the heat generating device 100 is conducted to the heat sink 400 through the first heat conduction layer 200 and the second heat conduction layer 300, and then the heat is dissipated to the outside through the heat sink 400. However, during the heat dissipation process, the temperature of the entire heat sink 400 will also be correspondingly high, and if the heat sink 400 is too close to other components, heat may be conducted to them, so that the components may fail and the overall operation of the machine may be affected. It is understood that the heat generating device 100 and other components are generally mounted on a circuit board, and if the heat sink 400 is close to the circuit board, the heat of the heat sink 400 will adversely affect the operation of the circuit board and other components, so that the second protrusion 430 is provided in this embodiment, so as to increase the distance between the main heat dissipating part of the heat sink 400 and the circuit board, so as to make the distance between the heat sink 400 and the components on the circuit board longer. It should be noted that the thickness of the second bosses 430 can be adjusted according to actual conditions to adapt to different heat generating devices 100 and different heat dissipating bodies 420, so as to achieve a better heat insulation effect.

Further, referring to fig. 1 and fig. 2, a side of the heat dissipation body 420 facing away from the heat generating device 100 is provided with a plurality of heat dissipation fins 440 arranged at intervals. The plurality of heat dissipation fins 440 may be disposed in parallel with each other, and the distances between two adjacent heat dissipation fins 440 are the same. By providing the plurality of heat dissipation fins 440 on the heat dissipation body 420, the heat dissipation area of the heat sink 400 can be increased, and the heat dissipation efficiency can be improved, thereby achieving faster heat dissipation.

Based on the above embodiment, further referring to fig. 1 and fig. 3, an accommodating gap 450 is provided between the peripheral wall of the first boss 410 and the groove wall of the accommodating groove. By arranging the accommodating gap 450, the filling amount of the first heat conduction layer 200 can be increased, and the first heat conduction layer 200 can be ensured to be fully contacted with the heating device 100 and the first boss 410, so that the heat dissipation effect is improved; and when the first heat conduction layer 200 is pressed by the first bosses 410, a flow space is provided for the first heat conduction layer 200, and the first heat conduction layer 200 is prevented from overflowing.

Based on the above embodiments, further, referring to fig. 1, the hardness of the first heat conducting layer 200 should be less than that of the second heat conducting layer 300. Because the second heat conduction layer 300 mainly plays a supporting role, and the first heat conduction layer 200 mainly plays a heat dissipation and protection role, the hardness of the first heat conduction layer 200 is smaller than that of the second heat conduction layer 300, the heat dissipation requirement of the heat-generating device 100 can be met by mutually matching the first heat conduction layer 200 and the second heat conduction layer 300, the second heat conduction layer 300 is utilized to protect the first heat conduction layer 200, and the service life is prolonged.

Based on the above embodiments, further referring to fig. 1, the first thermal conductive layer 200 is one or more of thermal conductive silicone grease, thermal conductive phase change material, thermal conductive gel, liquid metal, and thermal conductive mud. The heat-conducting silicone grease, the heat-conducting phase-change material, the heat-conducting gel, the liquid metal and the heat-conducting mud have good heat conductivity and soft texture, and can avoid damaging the heating device 100 when contacting the heating device 100.

Based on the above embodiment, further, referring to fig. 1, the heat dissipation assembly further includes a circuit board, the heat generating device 100 is mounted on the circuit board 500, the heat sink 400 is further connected and fixed with the circuit board 500, and a heat insulation gap is formed between the heat sink and the circuit board. The heat sink 400 and the circuit board 500 may be pressed and connected by screw fastening. The heat sink 400 and the circuit board 500 are fastened and pressed by screws, so that the heat generating device 100, the second heat conducting layer 300, the first heat conducting layer 200 and the heat sink 400 are combined more tightly, the heat dissipation effect is more obvious, and the heat dissipation function is better.

The invention also provides electronic equipment which comprises an equipment main body and the heat dissipation assembly, wherein the heat dissipation assembly is arranged on the equipment main body. The electronic device can be a mobile phone, a projector, a computer, a television and the like. The specific structure of the heat dissipation assembly refers to the above embodiments, and since the electronic device provided by the present invention uses the heat dissipation assembly of any of the above embodiments, the embodiment of the electronic device provided by the present invention includes all the technical solutions of the above embodiments of the heat dissipation assembly, and the achieved technical effects are also completely the same, and are not described herein again.

The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims

1. A heat sink assembly, comprising:

the radiator is arranged on one side of the heat conduction assembly, which is back to the heating device.

2. The heat dissipating assembly of claim 1, wherein the second thermally conductive layer is provided with a receiving groove disposed through the second thermally conductive layer in a thickness direction of the second thermally conductive layer, and the first thermally conductive layer is disposed in the receiving groove.

3. The heat dissipation assembly of claim 2, wherein the heat sink includes a heat dissipation body and a first protrusion disposed on the heat dissipation body and inserted into the receiving groove, the first protrusion has a thickness smaller than that of the second heat conduction layer, the first heat conduction layer has a thickness smaller than that of the second heat conduction layer, and a surface of the first heat conduction layer facing away from the heat generating device is in contact with the first protrusion.

4. The heat dissipation assembly of claim 3, wherein the heat sink further comprises a second boss disposed between the first boss and the heat dissipation body, the second boss having a cross-sectional area greater than a cross-sectional area of the first boss, and a surface of the second thermally conductive layer facing away from the heat generating device is in contact with the second boss.

5. The heat dissipating assembly of claim 3, wherein a receiving gap is provided between the peripheral wall of the first boss and the wall of the receiving groove.

6. The heat dissipating assembly of claim 3, wherein a plurality of heat dissipating fins are disposed at intervals on a side of the heat dissipating body facing away from the heat generating device.

7. The heat dissipation assembly of claim 1, wherein the first thermally conductive layer has a hardness less than the hardness of the second thermally conductive layer.

8. The heat dissipation assembly of claim 7, wherein the first thermally conductive layer is one or more of thermally conductive silicone grease, thermally conductive phase change material, thermally conductive gel, liquid metal, and thermally conductive mud.

9. The heat dissipation assembly of claim 1, further comprising a circuit board, wherein the heat generating device is mounted on the circuit board, the heat sink is fixedly connected to the circuit board, and a thermal insulation gap is formed between the heat sink and the circuit board.

10. An electronic device, characterized in that the electronic device comprises a heat dissipation assembly as claimed in any one of claims 1-9.