CN218749705U - Heat-conducting silicone grease film of efficient heat transfer plate - Google Patents
Heat-conducting silicone grease film of efficient heat transfer plate Download PDFInfo
- Publication number
- CN218749705U CN218749705U CN202222650269.7U CN202222650269U CN218749705U CN 218749705 U CN218749705 U CN 218749705U CN 202222650269 U CN202222650269 U CN 202222650269U CN 218749705 U CN218749705 U CN 218749705U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat transfer
- transfer plate
- efficiency heat
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a heat-conducting silicone grease film of a high-efficiency heat transfer plate, which sequentially comprises the high-efficiency heat transfer plate, an adsorption layer, a first conductive layer, a second conductive layer and a protective layer, wherein the adsorption layer is contacted and bonded with the high-efficiency heat transfer plate; the first conducting layer is bonded with the adsorption layer through a first bonding layer; the second conductive layer is bonded to the first conductive layer through a second bonding layer; the second conductive layer is bonded to the protective layer by a third adhesive layer. The utility model has the characteristics of with this kind of high-efficient heat transfer plate adaptations such as aluminum plate/copper board/water-cooling board/samming board/mouth musical instrument board, do not influence radiating while and have fine adhesion effect, more have the practicality.
Description
Technical Field
The utility model belongs to the technical field of heat conduction structure, concretely relates to heat conduction silicone grease membrane of high-efficient heat transfer plate.
Background
A general high-efficiency heat transfer plate is a technique for achieving high-efficiency heat transfer by controlling the microstructure state of a heat transfer medium in a closed system. With high heat transfer rates and high heat flow densities. The method can be widely applied to the industries of aerospace, power electronics, communication, computers, high-speed rails, electric automobiles, solar energy, wind power and the like.
The heat superconducting pipeline is a composite plate type structure comprising a first plate, a second plate and a third plate, a heat superconducting pipeline with a specific structural shape is formed between the first plate and the second plate, and the heat superconducting pipeline comprises a first etching channel positioned on the surface of the first plate and a second etching channel positioned on the surface of the second plate; heat transfer working medium is filled in the heat superconducting pipeline; the forced heat dissipation channel with the specific shape is formed between the second plate and the third plate, and due to the structural design, at least one surface of the high-efficiency heat transfer plate is of an uneven structure, the high-efficiency heat transfer plate similar to the high-efficiency heat transfer plate further comprises high-efficiency heat transfer plates such as a constant temperature plate, an aluminum plate, a copper plate and a harmonica plate, the high-efficiency heat transfer plates need to be packaged, but the packaging structure of the high-efficiency heat transfer plates needs to meet the requirement that the heat dissipation process is not fallen off and the good heat transfer effect is achieved, so that the packaging heat conduction silicone film for packaging the high-efficiency heat transfer plates is needed and is used for solving the technical problems.
Disclosure of Invention
For solving the problem that proposes among the above-mentioned background art, the utility model provides a heat conduction silicone grease membrane of high-efficient heat transfer plate has fine absorption efficiency, has fine radiating effect and insulating effect simultaneously, and has reduced the installation degree of difficulty of high-efficient heat transfer plate.
The utility model provides a packaging heat-conducting silicone grease film of a high-efficiency heat transfer plate, which sequentially comprises the high-efficiency heat transfer plate, an adsorption layer, a first conduction layer, a second conduction layer and a protection layer, wherein the adsorption layer is in contact connection with the high-efficiency heat transfer plate, and the first conduction layer is bonded with the adsorption layer through a first bonding layer; the second conductive layer is bonded to the first conductive layer by a second bonding layer; the second conducting layer is bonded with the protective layer through the third bonding layer, and the surface of one side, far away from the second conducting layer, of the protective layer is a plane.
As a further description of the above technical solution: the adsorption layer is composed of aluminum hydroxide, resin and silica gel, and the expansion coefficient range is 1.77 multiplied by 10^ -5 ℃ -1 to 2.25 multiplied by 10^ -5 ℃ -1.
As a further description of the above technical solution: the thickness of the adsorption layer is not more than 20 μm.
As a further description of the above technical solution: the first conducting layer is a conducting layer composed of aluminum nitride and graphite, and the heat conductivity coefficient is 1.2w-5 w.
As a further description of the above technical solution: the second conducting layer is a conducting layer composed of aluminum nitride, carbon fibers and boron nitride, and the heat conductivity coefficient is 1.2w-5 w.
As a further description of the above technical solution: the first adhesive layer, the second adhesive layer and the third adhesive layer are made of any one of resin, silica gel or organic polymer material gel.
As a further description of the above technical solution: the first adhesive layer, the second adhesive layer and the third adhesive layer have a thickness of 20 to 90 μm.
As a further description of the above technical solution: the surfaces of the first adhesion layer, the second adhesion layer and the third adhesion layer further include an aluminum nitride particle layer.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a carry out the stratiform setting to adsorbed layer, first conducting layer, second conducting layer and protective layer for can just can satisfy different performance demands through the thickness that changes first conducting layer, second conducting layer and protective layer, the production and processing is very convenient, high-efficient, and owing to set up the protective layer, further promoted the utility model discloses an safety in utilization.
2. The structure of various high-efficiency heat transfer plates such as an adsorption layer adaptive aluminum plate/copper plate/water-cooled plate/temperature-equalizing plate/harmonica plate and the like and the surface of the protective layer on one side far away from the second heat transfer layer are planes, so that the mounting difficulty of the high-efficiency heat transfer plates and other devices is indirectly reduced, and the actual heat dissipation area of the high-efficiency heat transfer plates is increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a first embodiment of a heat-conducting silicone film of a high-efficiency heat transfer plate according to the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of a heat conductive silicone film of a high-efficiency heat transfer plate according to the present invention;
fig. 3 is a schematic structural diagram of a third embodiment of a heat conductive silicone film of a high-efficiency heat transfer plate according to the present invention.
Reference numerals:
10 … … high-efficiency heat transfer plate
11 … … adsorption layer
111 … … adsorption groove
12 … … a first conductive layer
121 … … first adhesive layer
13 … … second conductive layer
131 … … second adhesive layer
132 … … third adhesive layer
14 … … protective layer
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a packaging heat-conducting silicone grease film for a high-efficiency heat transfer plate, which sequentially comprises a high-efficiency heat transfer plate 10, an adsorption layer 11, a first conductive layer 12, a second conductive layer 13, and a protective layer 14, wherein the adsorption layer 11 is in contact connection with the high-efficiency heat transfer plate 10.
Further, the contact surface of adsorbed layer 11 and high-efficient heat transfer plate 10 forms and adsorbs recess 111 with the heat dissipation guide slot assorted on the high-efficient heat transfer plate 10, sets up like this, makes the utility model discloses with the structure looks adaptation of high-efficient heat transfer plate 10's surface unevenness, have very high practical value.
In one embodiment, the contact surface of the adsorption layer 11 and the high-efficiency heat transfer plate 10 forms a circular adsorption groove 111 matching with the circular heat dissipation channel on the high-efficiency heat transfer plate 10.
In the second embodiment, the adsorption layer 11 forms an inverted trapezoidal adsorption groove 111 matching with the trapezoidal heat dissipation channel of the high-efficiency heat transfer plate 10.
In the third embodiment, the adsorption layer 11 forms a square adsorption groove 111 that matches the square heat radiation guide groove of the high-efficiency heat transfer plate 10.
In one embodiment, the high efficiency heat transfer plate 10 is made of high efficiency conductive aluminum, the absorption layer 11 is made of aluminum hydroxide, resin and silica gel, and the expansion coefficient is in the range of 1.77 x 10 < -5 > -1 to 2.25 x 10 < -5 > -1.
Specifically, at 20-50 ℃, the adsorption layer 11 is coated on the high-efficiency heat transfer plate 10, the adsorption layer 11 can form an adsorption groove 111 matched with the uneven structure on the outer surface of the high-efficiency heat transfer plate 10, and the adsorption force of the adsorption layer 11 on the high-efficiency heat transfer plate 10 can be increased by the arrangement, meanwhile, in order to match the high-efficiency heat transfer plate 10 made of aluminum alloy, the expansion coefficient after being heated is in the range of 1.881 x 10^ 5-1 to 2.360 x 10^ 5-1, and the expansion coefficient of the adsorption layer 11 is preferably 2.25 x 10^ 5-1, so that the expansion speeds of the adsorption layer 11 and the high-efficiency heat transfer plate 10 are synchronous in the heat dissipation process of the high-temperature heat transfer plate 10, and the structure arrangement enables the adsorption layer 11 not to easily fall off from the high-efficiency heat transfer plate 10, and enables the connection of the adsorption layer 11 and the high-efficiency heat transfer plate 10 to be very reliable.
Preferably, the thickness of the adsorption layer 11 is not more than 20 μm.
Further, in order to achieve a heat conduction effect, a first conductive layer 12 is further arranged on the adsorption layer 11, the first conductive layer 12 is a conductive layer composed of aluminum nitride and graphite, and the heat conduction coefficient is 1.2W-5W.
In one embodiment, the first conductive layer 12 further includes a first adhesive layer 121, and the first conductive layer 12 is bonded to the adsorption layer 11 by the first adhesive layer 121.
Specifically, the material of the first adhesive layer 121 is any one or a mixture of several of resin, silica gel, and organic polymer material gel.
Further, the thickness of the first adhesive layer 121 is 20 to 90 μm.
In an embodiment, in order to improve the adhesion effect of the first adhesion layer 121, a layer of aluminum nitride particles is further disposed on the surface of the first adhesion layer 121.
Further, the second conductive layer 13 is adhered to the first conductive layer 12 by a second adhesive layer 131.
Specifically, the material of the second adhesive layer 131 is any one or a mixture of several of resin, silica gel, and organic polymer material gel.
Further, the thickness of the second adhesive layer 131 is 20 to 90 μm.
In an embodiment, in order to improve the adhesion effect of the second adhesion layer 131, a layer of aluminum nitride particles is further disposed on the surface of the second adhesion layer 131.
Further, the second conductive layer 13 is bonded to the protective layer 14 by a third adhesive layer 132.
In one embodiment, the second conductive layer 13 is a conductive layer composed of aluminum nitride, carbon fiber and boron nitride, and the thermal conductivity is 1.2w-5 w.
Specifically, the material of the third adhesive layer 132 is any one or a mixture of several of resin, silica gel, and organic polymer material.
Further, the thickness of the third adhesive layer 132 is 20 to 90 μm.
In an embodiment, in order to improve the adhesion effect of the third adhesion layer 132, a layer of aluminum nitride particles is further disposed on the surface of the third adhesion layer 132.
Further, the protective layer 14 may include a waterproof layer, a fireproof layer, an anti-corrosion layer, an insulating layer, and the like, which are not exhaustive, and may have a technical effect of protecting the adsorption layer 11, the first conductive layer 12, and the second conductive layer 13.
Further, the surface of the protective layer 14 on the side away from the second conductive layer 13 is a plane.
Set up like this for high-efficient heat transfer plate 10's unevenness's surface is through connecting the utility model provides a pair of high-efficient heat transfer plate's heat conduction silicone grease membrane after, just become the plane with the surface that external other devices are connected to reached and increased high-efficient heat transfer plate 10 effective heat radiating area's when being connected with other parts technical effect, simultaneously, also reduced high-efficient heat transfer plate 10's the installation degree of difficulty.
Specifically, when the conductivity of the present invention needs to be increased, the thickness of the first conductive layer 12 and/or the second conductive layer 13 can be increased appropriately, and when the protection performance of the present invention needs to be increased, the thickness of the protection layer 14 can be increased appropriately. When the conductivity of the present invention needs to be reduced, the thickness of the first conductive layer 12 and/or the second conductive layer 13 can be reduced appropriately, and when the protection performance of the present invention needs to be reduced, the thickness of the protection layer 14 can be reduced appropriately. Set up like this, make the utility model discloses through simple transformation just can adapt to different demands, very economy, convenience.
Fig. 2 is a schematic structural diagram of a second embodiment of a heat conductive silicone film of a high-efficiency heat transfer plate according to the present invention; the efficient heat transfer plate 10 is a copper plate with a planar structure, and similarly, the packaging heat-conducting silicone grease film of the efficient heat transfer plate sequentially comprises the efficient heat transfer plate 10, an adsorption layer 11, a first conducting layer 12, a second conducting layer 13 and a protective layer 14, wherein the adsorption layer 11 is a tiled structure and is attached to the efficient heat transfer plate 10, the efficient heat transfer plate 10 is made of a copper material with efficient conduction, the adsorption layer 11 is composed of aluminum hydroxide, resin and silica gel, the expansion coefficient range is 1.7 multiplied by 10 < -5 > -1 >, and the rest structures are consistent with the first embodiment, so that the description is not repeated here.
Fig. 3 is a schematic structural view of a third embodiment of a heat conductive silicone film of a high-efficiency heat transfer plate according to the present invention; the efficient heat transfer plate 10 is a harmonica heat dissipation plate structure, and similarly, the packaging heat conduction silicone grease film of the efficient heat transfer plate sequentially comprises the efficient heat transfer plate 10, an adsorption layer 11, a first conduction layer 12, a second conduction layer 13 and a protection layer 14, wherein the adsorption layer 11 is a flat structure and is attached to the efficient heat transfer plate 10, and the rest structures are consistent with the first embodiment and will not be described in a repeated way.
The utility model discloses a theory of operation and use flow: the utility model discloses a carry out the stratiform setting to adsorbed layer 11, first conducting layer 12, second conducting layer 13 and protective layer 14, adsorbed layer 11 can match high-efficient heat transfer plate 10's surface structure, and the thickness through changing first conducting layer 12, second conducting layer 13 and protective layer 14 just can satisfy different performance demands, and the production and processing is very convenient, high-efficient, and owing to set up protective layer 14, has further promoted the utility model discloses a safety in utilization. Furthermore, because the surface of the protective layer 14 away from the second heat transfer layer 13 is a plane, the actual heat dissipation area of the high-efficiency heat transfer plate 10 is increased, and the difficulty in mounting the high-efficiency heat transfer plate 10 and other devices is indirectly reduced.
The utility model has the advantages that:
1. the utility model discloses a carry out the stratiform setting to adsorbed layer 11, first conducting layer 12, second conducting layer 13 and protective layer 14 for can just can satisfy different performance demands through the thickness that changes first conducting layer 12, second conducting layer 13 and protective layer 14, the production and processing is very convenient, high-efficient, and owing to set up protective layer 14, further promoted the utility model discloses an safety in utilization.
2. The structure of the adsorption layer 11 adapted to various high-efficiency heat transfer plates 10 such as an aluminum plate, a copper plate, a water-cooled plate, a temperature-equalizing plate, a piano plate and the like and the surface of the protective layer 14 far away from one side of the second heat transfer layer 13 are flat surfaces, so that the mounting difficulty of the high-efficiency heat transfer plates and other devices is indirectly reduced, and the actual heat dissipation area of the high-efficiency heat transfer plates 10 is increased.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
In the description of the present specification, reference to the description of "one embodiment," "another embodiment," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The further embodiments of the present invention disclosed above are merely intended to help illustrate the present invention. Further examples are not intended to be exhaustive or to limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention.
Claims (5)
1. A heat-conducting silicone grease film of a high-efficiency heat transfer plate, characterized in that: the heat-transfer plate sequentially comprises a high-efficiency heat-transfer plate (10), an adsorption layer (11), a first conductive layer (12), a second conductive layer (13) and a protective layer (14);
the adsorption layer (11) is in contact connection with the high-efficiency heat transfer plate (10);
the first conductive layer (12) is bonded to the adsorption layer (11) by a first adhesive layer (121); the second conductive layer (13) is bonded to the first conductive layer (12) by a second adhesive layer (131);
the second conductive layer (13) is bonded to the protective layer (14) by a third adhesive layer (132);
the surface of one side of the protective layer (14) far away from the second conductive layer (13) is a plane.
2. A heat conductive silicone film for a high efficiency heat transfer plate according to claim 1, wherein: the thickness of the adsorption layer (11) is not more than 20 mu m.
3. A heat conductive silicone film for a high efficiency heat transfer plate according to claim 1, wherein: the first adhesive layer (121), the second adhesive layer (131) and the third adhesive layer (132) are made of any one of resin, silica gel or organic polymer material gel.
4. A thermally conductive silicone membrane for a high efficiency heat transfer plate as claimed in claim 3, wherein: the first adhesive layer (121), the second adhesive layer (131), and the third adhesive layer (132) have a thickness of 20 to 90 [ mu ] m.
5. A heat conductive silicone film for a high efficiency heat transfer plate according to claim 4, wherein: the surfaces of the first adhesion layer (121), the second adhesion layer (131), and the third adhesion layer (132) further include an aluminum nitride particle layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222650269.7U CN218749705U (en) | 2022-10-09 | 2022-10-09 | Heat-conducting silicone grease film of efficient heat transfer plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222650269.7U CN218749705U (en) | 2022-10-09 | 2022-10-09 | Heat-conducting silicone grease film of efficient heat transfer plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218749705U true CN218749705U (en) | 2023-03-28 |
Family
ID=85699371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222650269.7U Active CN218749705U (en) | 2022-10-09 | 2022-10-09 | Heat-conducting silicone grease film of efficient heat transfer plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218749705U (en) |
-
2022
- 2022-10-09 CN CN202222650269.7U patent/CN218749705U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20120038347A (en) | Radiant heat structure of solar cell for photovoltaic power generation | |
| AU2008304869A1 (en) | Solar cell unit | |
| CN206532849U (en) | A kind of heat conductive silica gel vulcanization silica gel etching chip battery heating plate | |
| WO2020011045A1 (en) | Heat dissipation device | |
| CN218749705U (en) | Heat-conducting silicone grease film of efficient heat transfer plate | |
| CN202135441U (en) | Composite radiating fin | |
| CN203590662U (en) | Electronic component cooling device | |
| CN210432265U (en) | Heat radiation structure of high-heating graphene | |
| CN216057982U (en) | Light and thin heat dissipation device for electrical equipment | |
| CN203340509U (en) | Novel heat radiation fin | |
| CN111356329A (en) | Thin high-conductivity heat-dissipation composite material with low interface thermal resistance | |
| CN206611702U (en) | A kind of radiating structure based on composite stone layer of ink | |
| CN212062423U (en) | Graphene radiating fin with high heat dissipation performance | |
| CN210576332U (en) | Cylindrical battery module cooling system and battery module | |
| CN213692150U (en) | Lithium ion laminate polymer battery ization becomes splint and ization becomes holder | |
| CN103648253A (en) | Novel thermally conductive and insulating structure | |
| CN210142697U (en) | New energy automobile power battery tray with heat pipe heat abstractor | |
| CN203633041U (en) | Electronic element heat dissipation apparatus | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN200997744Y (en) | Heat-transfer soaker | |
| CN210560208U (en) | Bonding layer for heat dissipation of electronic device and heat dissipation structure thereof | |
| CN212269970U (en) | Insulating type heat conduction silica gel piece | |
| CN221978049U (en) | Battery module with thermal management | |
| CN208028194U (en) | A kind of aluminium base heating plate | |
| CN219279785U (en) | High-adhesion heat-conducting gel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |