CN215988259U - Novel shielding heat dissipation type Mylar film - Google Patents
Novel shielding heat dissipation type Mylar film Download PDFInfo
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- CN215988259U CN215988259U CN202122167283.7U CN202122167283U CN215988259U CN 215988259 U CN215988259 U CN 215988259U CN 202122167283 U CN202122167283 U CN 202122167283U CN 215988259 U CN215988259 U CN 215988259U
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Abstract
The utility model discloses a novel shielding heat dissipation Mylar film, which comprises a copper foil layer, a shielding layer, a silica gel layer, a Mylar layer and an adhesive layer, wherein the copper foil layer is provided with a heat dissipation fin structure, a heat conduction connecting structure is arranged between the copper foil layer and the silica gel layer, the shielding layer is provided with a reflection structure, and the silica gel layer is also provided with a plurality of contact convex blocks. The utility model realizes the multifunctional Mylar film integrating high heat conduction and heat dissipation, electromagnetic interference resistance and buffer protection, reduces the thickness and improves the protection performance of electronic elements; the radiating fin structure is arranged to increase the radiating area and improve the radiating effect of the Mylar film body; can prevent the burning to pass the wheat and draw the layer and continue the outdiffusion through setting up fire-retardant medium, improve the security performance of wheat pulling-on piece body, can reduce external electromagnetic signal to the interference of the inside electronic components of wheat pulling-on piece through setting up electrically conductive cloth, promoted the practicality, be used for improving electromagnetic reflectivity through setting up reflection configuration, improve anti-electromagnetic interference effect.
Description
Technical Field
The utility model relates to the technical field of Mylar films, in particular to a novel shielding heat dissipation Mylar film.
Background
The Mylar film is an insulating material, is commonly used for packaging electronic elements, and can improve the safety performance of the electronic elements. The existing Mylar film has low functionality, can only be used for general insulation protection, has low functionality, and needs to be attached to other Mylar films with other protection functions when an electronic element needs to be formed by adding the Mylar film, so that the wrapping thickness of the electronic element is thicker, the subsequent use of the electronic element is influenced, and the Mylar film cannot be used for thin electronic products; the shielding performance of the existing Mylar film is poor, so that the anti-electromagnetic interference performance of an electronic element is low, and the working performance of the electronic element is easily influenced by external electromagnetic interference; the existing Mylar film has poor heat conduction and heat dissipation effects, normal use of an electronic element is affected by high temperature, the electronic element is easily damaged, and the service life of the electronic element is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model provides a novel shielding heat dissipation type wheat pulling-on piece to present technique not enough.
The technical scheme adopted by the utility model for realizing the purpose is as follows:
the utility model provides a novel shielding heat dissipation type wheat pulling-on piece includes wheat pulling-on piece body, wheat pulling-on piece body includes copper foil layer, shielding layer, silica gel layer, wheat and draws layer and viscose layer, the copper foil layer is equipped with heat radiation fin structure, be equipped with heat conduction connection structure between copper foil layer and the silica gel layer, the shielding layer is equipped with reflection structure, the silica gel layer still is equipped with a plurality of contact lugs.
The further improvement is that the thickness of the copper foil layer is 0.1-0.3mm, the radiating fin structure is composed of a plurality of radiating fins, the height of the plurality of radiating fins is 2-3mm, and the plurality of radiating fins are arranged on the upper surface of the copper foil layer in an array mode.
The improved structure comprises a shielding layer, wherein the thickness of the shielding layer is 1-5mm, the shielding layer comprises a flame-retardant medium and conductive cloth, the conductive cloth is wrapped in the flame-retardant medium, a reflection structure is arranged on the conductive cloth and comprises a plurality of grooves, the cross section of each groove is of an inverted trapezoidal structure, and arc-shaped grooves are formed in the bottoms of the grooves.
The shielding layer is further improved, a plurality of through holes are formed in the shielding layer, the heat conduction connecting structure comprises a plurality of heat conduction columns, the heat conduction columns are arranged in the through holes respectively, and filling materials are arranged between the heat conduction columns and the through holes.
The improved structure is characterized in that the heat conducting columns are all of cylindrical structures, and spiral structures are arranged on the outer sides of the heat conducting columns.
The further improvement is that the thickness of the silica gel layer is 0.5-1mm, and a plurality of contact convex blocks are provided with contact convex strips.
The Mylar layer is 1-2mm thick, and is provided with a plurality of first through holes, and a plurality of contact bumps are respectively arranged in the first through holes.
The improved structure is characterized in that the adhesive layer is provided with a plurality of penetrating grooves, the adhesive layer is formed by a plurality of dispensing salient points, and the contact convex strips are respectively arranged in the penetrating grooves.
The improved structure is characterized in that the contact convex strips are elastic heat-conducting silica gel strips, and the bottom surfaces of the contact convex strips are parallel to the surfaces of the dispensing convex points.
The utility model has the beneficial effects that: the multifunctional Mylar film integrating high heat conduction and heat dissipation, electromagnetic interference resistance and buffer protection is realized by arranging the copper foil layer, the shielding layer, the silica gel layer, the Mylar layer and the adhesive layer, so that the thickness is reduced, and the protection performance of an electronic element is improved; the radiating fin structure is arranged to increase the radiating area, improve the radiating effect of the Mylar film body and improve the radiating performance of the pasted electronic element, so that the use performance of the pasted electronic element is improved; the flame-retardant medium is arranged to prevent the combustion from penetrating through the Mylar layer to continue diffusing outwards, so that the safety performance of the Mylar body is improved, the interference of external electromagnetic signals on electronic components inside the Mylar can be reduced by arranging the conductive cloth, the practicability is improved, the reflection structure is arranged to improve the electromagnetic reflectivity, and the anti-electromagnetic interference effect is improved; the heat conduction connecting structure, the contact convex block and the contact convex strip are arranged to improve the direct contact area, so that the heat of the electronic component is quickly guided to the copper foil layer to dissipate heat, and the heat conduction efficiency and the heat dissipation effect are improved.
The utility model is further described with reference to the following detailed description and accompanying drawings.
Drawings
Fig. 1 is a schematic view of an overall structure of the novel heat-shielding mylar tab of this embodiment;
fig. 2 is an exploded view of the novel heat-shielding mylar tab of the present embodiment;
fig. 3 is a schematic cross-sectional view of the shielding layer of the present embodiment.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
In the embodiment, referring to fig. 1 to 3, a novel shielding and heat dissipation mylar sheet 1 includes a mylar sheet body 2, the mylar sheet body 2 includes a copper foil layer 3, a shielding layer 4, a silica gel layer 5, a mylar layer 6 and an adhesive layer 7, the copper foil layer 3 is provided with a heat dissipation fin structure 8, a heat conduction connection structure 9 is provided between the copper foil layer 3 and the silica gel layer 5, the shielding layer 4 is provided with a reflection structure 10, and the silica gel layer 5 is further provided with a plurality of contact bumps 50.
The thickness of the copper foil layer 3 is 0.1-0.3mm, the heat dissipation fin structure 8 is composed of a plurality of heat dissipation fins 80, the height of the plurality of heat dissipation fins 80 is 2-3mm, the plurality of heat dissipation fins 80 are arranged on the upper surface of the copper foil layer 3 in an array mode, the copper foil layer 3 is used for providing heat dissipation performance, and the heat dissipation fin structure 8 is used for improving the heat dissipation area, so that the heat dissipation effect of the Mylar film body 2 is improved, the heat dissipation performance of the pasted electronic element is improved, and the use performance of the pasted electronic element is improved.
The thickness of shielding layer 4 is 1-5mm, shielding layer 4 includes fire-retardant medium 40 and electrically conductive cloth 41, electrically conductive cloth 41 parcel set up in fire-retardant medium 40, fire-retardant medium 40 can prevent that the burning passes wheat pull 6 and continues the outdiffusion, improves wheat pull-tab body 2's security performance, electrically conductive cloth 41 can reduce external electromagnetic signal to the interference of the inside electronic components of wheat pull-tab, has promoted the practicality, reflection configuration 10 sets up on the electrically conductive cloth 41, reflection configuration 10 includes many recesses 100 and constitutes, many the cross section of recess is the structure of falling trapezium, many the bottom of recess 100 all is equipped with convex recess 101, reflection configuration 10 is used for improving electromagnetic reflectivity, improves anti-electromagnetic interference effect.
The shielding layer 4 is provided with a plurality of through holes, the heat conduction connecting structure 9 comprises a plurality of heat conduction columns, the heat conduction columns are arranged in the through holes respectively, filling materials are arranged between the heat conduction columns and the through holes, the heat conduction columns are cylindrical structures, the outer sides of the heat conduction columns are provided with spiral structures 90, and the spiral structures 90 are used for playing a role in buffering protection.
The thickness of silica gel layer 5 is 0.5-1mm, and is a plurality of contact lug 50 all is equipped with contact convex strip 500, silica gel layer 5 is used for playing the heat conduction effect, the thickness of wheat layer 6 is 1-2mm, wheat layer 6 is equipped with a plurality of through-holes one, and is a plurality of contact lug 50 sets up respectively in the through-hole one, adhesive layer 7 is equipped with a plurality of recesses that pass, adhesive layer 7 has a plurality of some to glue the bump constitution, contact convex strip 500 sets up respectively pass in the recess, contact convex strip 500 is for having elastic heat conduction silica gel strip, the bottom surface of contact convex strip 500 with the surface parallel of some bump, contact convex strip 500 is used for improving direct contact area to make electronic components's heat lead copper foil layer 3 fast and dispel the heat, improve heat conduction efficiency and radiating effect.
The multifunctional Mylar film integrating high heat conduction and heat dissipation, electromagnetic interference resistance and buffer protection is realized by arranging the copper foil layer, the shielding layer, the silica gel layer, the Mylar layer and the adhesive layer, so that the thickness is reduced, and the protection performance of an electronic element is improved; the radiating fin structure is arranged to increase the radiating area, improve the radiating effect of the Mylar film body and improve the radiating performance of the pasted electronic element, so that the use performance of the pasted electronic element is improved; the flame-retardant medium is arranged to prevent the combustion from penetrating through the Mylar layer to continue diffusing outwards, so that the safety performance of the Mylar body is improved, the interference of external electromagnetic signals on electronic components inside the Mylar can be reduced by arranging the conductive cloth, the practicability is improved, the reflection structure is arranged to improve the electromagnetic reflectivity, and the anti-electromagnetic interference effect is improved; the heat conduction connecting structure, the contact convex block and the contact convex strip are arranged to improve the direct contact area, so that the heat of the electronic component is quickly guided to the copper foil layer to dissipate heat, and the heat conduction efficiency and the heat dissipation effect are improved.
The present invention is not limited to the above embodiments, and other novel heat-shielding mylar sheets using the same or similar structure or device as the above embodiments of the present invention are within the scope of the present invention.
Claims (9)
1. The utility model provides a novel shielding heat dissipation type Mylar film which characterized in that: novel shielding heat dissipation type Mylar includes the Mylar body, the Mylar body includes copper foil layer, shielding layer, silica gel layer, Mylar layer and viscose layer, the copper foil layer is equipped with heat radiation fin structure, be equipped with heat conduction connection structure between copper foil layer and the silica gel layer, the shielding layer is equipped with reflection configuration, the silica gel layer still is equipped with a plurality of contact lugs.
2. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 1, wherein: the thickness of the copper foil layer is 0.1-0.3mm, the radiating fin structure is composed of a plurality of radiating fins, the height of the plurality of radiating fins is 2-3mm, and the plurality of radiating fins are arranged on the upper surface of the copper foil layer in an array mode.
3. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 2, wherein: the thickness of the shielding layer is 1-5mm, the shielding layer comprises a flame-retardant medium and conductive cloth, the conductive cloth is wrapped in the flame-retardant medium, the reflecting structure is arranged on the conductive cloth and comprises a plurality of grooves, the cross section of each groove is of an inverted trapezoidal structure, and the bottoms of the grooves are provided with arc-shaped grooves.
4. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 3, wherein: the shielding layer is provided with a plurality of through holes, the heat conduction connecting structure comprises a plurality of heat conduction columns, the heat conduction columns are arranged in the through holes respectively, and filling filler is arranged between the heat conduction columns and the through holes.
5. The novel mylar sheet of shielding and heat dissipating type as claimed in claim 4, wherein: the heat conducting columns are all cylindrical structures, and spiral structures are arranged on the outer sides of the heat conducting columns.
6. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 5, wherein: the thickness of silica gel layer is 0.5-1mm, and a plurality of the contact lug all is equipped with the contact sand grip.
7. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 6, wherein: the thickness of the Mylar layer is 1-2mm, the Mylar layer is provided with a plurality of first through holes, and the plurality of contact bumps are arranged in the first through holes respectively.
8. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 7, wherein: the viscose layer is equipped with a plurality of recesses that pass, the viscose layer has a plurality of some glue bumps to constitute, the contact sand grip sets up respectively pass in the recess.
9. The novel mylar sheet of the shielded heat dissipating type as set forth in claim 8, wherein: the contact convex strip is a heat-conducting silica gel strip with elasticity, and the bottom surface of the contact convex strip is parallel to the surface of the dispensing convex point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122167283.7U CN215988259U (en) | 2021-09-07 | 2021-09-07 | Novel shielding heat dissipation type Mylar film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122167283.7U CN215988259U (en) | 2021-09-07 | 2021-09-07 | Novel shielding heat dissipation type Mylar film |
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| Publication Number | Publication Date |
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| CN215988259U true CN215988259U (en) | 2022-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122167283.7U Active CN215988259U (en) | 2021-09-07 | 2021-09-07 | Novel shielding heat dissipation type Mylar film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117641717A (en) * | 2024-01-24 | 2024-03-01 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
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2021
- 2021-09-07 CN CN202122167283.7U patent/CN215988259U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117641717A (en) * | 2024-01-24 | 2024-03-01 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
| CN117641717B (en) * | 2024-01-24 | 2024-05-17 | 荣耀终端有限公司 | Heat conduction piece and electronic equipment |
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