CN220065681U - Novel packaging structure of wafer - Google Patents
Novel packaging structure of wafer Download PDFInfo
- Publication number
- CN220065681U CN220065681U CN202321479228.4U CN202321479228U CN220065681U CN 220065681 U CN220065681 U CN 220065681U CN 202321479228 U CN202321479228 U CN 202321479228U CN 220065681 U CN220065681 U CN 220065681U
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- China
- Prior art keywords
- piece
- plate
- fastener
- sides
- novel
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 39
- 239000013078 crystal Substances 0.000 claims abstract description 34
- 238000010521 absorption reaction Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 230000004907 flux Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a novel wafer packaging structure which comprises a bottom shell, an assembly, supporting pieces and a wrapping piece, wherein the assembly is arranged at the top end of the bottom shell, the supporting pieces are arranged at two sides of the bottom shell, the wrapping piece is arranged at the top of the supporting piece, the wrapping piece comprises a packaging cover and a fastener, and the fasteners are arranged at two sides of the bottom end of the packaging cover. In this novel packaging structure of wafer, the crystal piece is installed on the support plate, by combining mutually between scaling powder and the tin powder material, be convenient for switch on the transmission output, and the support plate is inside to be provided with the heat absorption room, pass through the indoor conducting strip of heat absorption, improve the heat dissipation, bottom plate top both sides are provided with the catching groove with encapsulation lid bottom assorted afterwards, thereby be convenient for encapsulate the lid and pass through the middle part of fastener embedding at the bottom plate, make the fastener support in the catching groove, and leave in the space between the inside of encapsulation lid and the crystal piece top, its inside is placed the inoxidizing coating, can play fine guard action to the crystal piece.
Description
Technical Field
The utility model relates to the technical field of wafer packaging, in particular to a novel wafer packaging structure.
Background
The package refers to the circuit pins on the chip, which are connected to external connectors by wires for connection with other devices, and the package refers to the housing for mounting the semiconductor integrated circuit chip, which not only plays the roles of mounting, fixing, sealing, protecting the chip and enhancing electrothermal performance, but also is connected to the pins of the package housing by wires through the contacts on the chip, which are connected with other devices by wires on the printed circuit board, thereby realizing the connection of the internal chip and the external circuit.
The chip package on the market has poor overall compressive resistance in use, is inconvenient to install and has limited heat dissipation capacity, so that the stability of the normal operation of the chip is affected.
Disclosure of Invention
The present utility model is directed to a novel chip package structure, so as to solve the problems set forth in the above background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a novel packaging structure of wafer, includes drain pan, sub-assembly, support piece and parcel piece, the top of drain pan is provided with the sub-assembly, the both sides of drain pan are provided with support piece, and the top of support piece is provided with the parcel piece, the parcel piece is including encapsulation lid and fastener, and the bottom both sides of encapsulation lid are provided with the fastener.
Furthermore, the packaging cover and the supporting piece are connected in an embedded mode, and the fastener and the packaging cover are integrated.
Further, the support piece comprises a bottom plate and buckling grooves, and buckling grooves are formed in two sides of the top of the bottom plate.
Further, the bottom plate is attached to the bottom shell, and the bottom plate is convex.
Further, the bottom shell comprises a carrier plate, a heat absorption chamber and heat conducting fins, the bottom end of the inner part of the carrier plate is provided with the heat absorption chamber, and the bottom of the heat absorption chamber is provided with the heat conducting fins.
Further, the heat conducting fin is connected with the heat absorbing chamber.
Further, the assembly includes a tin powder material, a flux, and a crystal plate, and the side of the tin powder material is provided with the flux, and the top of the flux is provided with the crystal plate.
Further, the soldering flux wraps the tin powder material, and the soldering flux is connected with the crystal plate.
Compared with the prior art, the utility model has the beneficial effects that:
in this novel packaging structure of wafer, the crystal piece is installed on the support plate, by combining mutually between scaling powder and the tin powder material, be convenient for switch on the transmission output, and the support plate is inside to be provided with the heat absorption room, pass through the indoor conducting strip of heat absorption, improve the heat dissipation, bottom plate top both sides are provided with the catching groove with encapsulation lid bottom assorted afterwards, thereby be convenient for encapsulate the lid and pass through the middle part of fastener embedding at the bottom plate, make the fastener support in the catching groove, and leave in the space between the inside of encapsulation lid and the crystal piece top, its inside is placed the inoxidizing coating, can play fine guard action to the crystal piece.
The crystal plate is wrapped by the packaging cover, a gap is reserved between the inside of the packaging cover and the top of the crystal plate, and the protective layer is placed in the packaging cover, so that the crystal plate can be well protected, the damage caused by external impact is better resisted, and the overall strength is further improved.
The buckle grooves matched with the bottom ends of the packaging covers are formed in the two sides of the top end of the bottom plate, so that the packaging covers are conveniently embedded in the middle of the bottom plate through the fasteners, the fasteners are abutted in the buckle grooves, and the stability of the packaging covers during placement is improved.
The heat absorption chamber is communicated with the top crystal plate, so that tin powder materials at the bottom of the crystal plate are in closer contact with the carrier plate for heat conduction, heat conduction sheets in the heat absorption chamber are used for transmission, and the heat conduction sheets are made of graphite sheets, so that the overall heat dissipation effect is improved.
Drawings
FIG. 1 is a schematic diagram of the front internal structure of the present utility model;
FIG. 2 is a schematic perspective view of the present utility model;
fig. 3 is a schematic view of the internal perspective structure of the bottom shell of the present utility model.
In the figure: 1. a bottom case; 101. a carrier plate; 102. a heat absorption chamber; 103. a heat conductive sheet; 2. an assembly; 201. a tin powder material; 202. soldering flux; 203. a crystal plate; 3. a support; 301. a bottom plate; 302. a buckling groove; 4. a wrapper; 401. a package cover; 402. a fastener.
Detailed Description
Example 1
As shown in fig. 1-2, a novel chip package structure includes: the bottom shell 1, the assembly 2, the support 3 and the parcel 4, the assembly 2 is provided on the top of the bottom shell 1, the support 3 is provided on both sides of the bottom shell 1, the parcel 4 comprises a packaging cover 401 and a fastener 402, the fastener 402 is provided on both sides of the bottom end of the packaging cover 401, the packaging cover 401 is connected with the support 3 in an embedded manner, the fastener 402 and the packaging cover 401 are integrated, the packaging cover 401 wraps the crystal plate 203, a gap is reserved between the inside of the packaging cover 401 and the top of the crystal plate 203, a protective layer is placed inside the packaging cover 401, the crystal plate 203 can be well protected, external impact damage is better resisted, overall strength is further improved, the support 3 comprises a bottom plate 301 and a buckling groove 302, buckling grooves 302 are formed in both sides of the top of the bottom plate 301, the bottom plate 301 is attached to the bottom shell 1, the bottom plate 301 is in a convex shape, the buckling groove 302 is matched with the bottom end of the packaging cover 401, the packaging cover 401 is conveniently embedded in the middle of the bottom plate 301 through the fastener 402, the packaging cover 402 is enabled to prop up against the buckling groove 202, when the packaging cover 401 is placed against the buckling groove 202, the crystal plate 203 is well protected against the crystal plate 203, the crystal plate 203 is better against the external impact damage, the external impact damage is further improved, the whole strength is attached to the bottom plate is provided with the crystal plate 203, the crystal plate is provided with the crystal plate 203, and the adhesive powder, the adhesive side 201, the adhesive material is 201, and the welding flux is 201 is attached to the bottom plate is 201, and the adhesive material is coated with the bottom plate and is 201.
Example 2
As shown in fig. 3, a novel wafer packaging structure, the bottom shell 1 includes a carrier plate 101, a heat absorbing chamber 102 and a heat conducting fin 103, and the bottom of the inner part of the carrier plate 101 is provided with the heat absorbing chamber 102, the bottom of the heat absorbing chamber 102 is provided with the heat conducting fin 103, the heat conducting fin 103 is connected with the heat absorbing chamber 102, the middle inner end of the carrier plate 101 is provided with the heat absorbing chamber 102, the heat absorbing chamber 102 is communicated with a top crystal plate 203, so that tin powder material 201 at the bottom of the crystal plate 203 is more tightly connected with the carrier plate 101 for heat conduction, the heat is transferred through the heat conducting fin 103 in the heat absorbing chamber 102, and the heat conducting fin 103 is made of graphite sheet material, thereby improving the overall heat dissipation effect.
In summary, in the novel packaging structure of the wafer, firstly, the crystal plate 203 is mounted on the carrier plate 101, the soldering flux 202 and the tin powder material 201 are combined, conduction, transmission and output are facilitated, the heat absorption chamber 102 is arranged in the carrier plate 101, heat dissipation is improved through the heat conduction plate 103 in the heat absorption chamber 102, then both sides of the top end of the bottom plate 301 are provided with buckling grooves 302 matched with the bottom end of the packaging cover 401, the packaging cover 401 is conveniently embedded in the middle of the bottom plate 301 through the fastener 402, the fastener 402 is propped against the buckling grooves 302, the packaging cover 401 wraps the crystal plate 203, a gap is reserved between the inside of the packaging cover 401 and the top of the crystal plate 203, and a protective layer is placed in the packaging cover, so that the crystal plate 203 can play a good role in protecting the crystal plate 203, and better resist external impact damage, and further improve the overall strength.
Claims (8)
1. Novel packaging structure of wafer, including drain pan (1), sub-assembly (2), support piece (3) and parcel piece (4), its characterized in that: the top of drain pan (1) is provided with sub-assembly (2), the both sides of drain pan (1) are provided with support piece (3), and the top of support piece (3) is provided with parcel piece (4), parcel piece (4) are including encapsulation lid (401) and fastener (402), and the bottom both sides of encapsulation lid (401) are provided with fastener (402).
2. The novel chip package structure of claim 1, wherein: the packaging cover (401) is connected with the supporting piece (3) in an embedded mode, and the fastener (402) and the packaging cover (401) are integrated.
3. The novel chip package structure of claim 1, wherein: the support piece (3) comprises a bottom plate (301) and buckling grooves (302), and buckling grooves (302) are formed in two sides of the top of the bottom plate (301).
4. A novel chip package structure according to claim 3, wherein: the bottom plate (301) is attached to the bottom shell (1), and the bottom plate (301) is in a convex shape.
5. The novel chip package structure of claim 1, wherein: the bottom shell (1) comprises a carrier plate (101), a heat absorption chamber (102) and heat conducting fins (103), wherein the heat absorption chamber (102) is arranged at the bottom end of the inner part of the carrier plate (101), and the heat conducting fins (103) are arranged at the bottom of the heat absorption chamber (102).
6. The novel chip package structure of claim 5, wherein: the heat conducting fin (103) is connected with the heat absorbing chamber (102).
7. The novel chip package structure of claim 1, wherein: the assembly (2) comprises a tin powder material (201), a soldering flux (202) and a crystal plate (203), wherein the soldering flux (202) is arranged on the side of the tin powder material (201), and the crystal plate (203) is arranged on the top of the soldering flux (202).
8. The novel chip package structure of claim 7, wherein: the soldering flux (202) is wrapped with tin powder material (201), and the soldering flux (202) is connected with the crystal piece (203).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321479228.4U CN220065681U (en) | 2023-06-09 | 2023-06-09 | Novel packaging structure of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321479228.4U CN220065681U (en) | 2023-06-09 | 2023-06-09 | Novel packaging structure of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220065681U true CN220065681U (en) | 2023-11-21 |
Family
ID=88767789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321479228.4U Active CN220065681U (en) | 2023-06-09 | 2023-06-09 | Novel packaging structure of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220065681U (en) |
-
2023
- 2023-06-09 CN CN202321479228.4U patent/CN220065681U/en active Active
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| GR01 | Patent grant | ||
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