CN219227557U

CN219227557U - Vacuum packaging crystal oscillator

Info

Publication number: CN219227557U
Application number: CN202223442741.4U
Authority: CN
Inventors: 张俊; 尹洁
Original assignee: Shenzhen Jinggong Electronic Technology Co ltd
Current assignee: Shenzhen Jinggong Electronic Technology Co ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-06-20
Anticipated expiration: 2032-12-22

Abstract

The utility model discloses a vacuum packaging crystal oscillator, which comprises a crystal oscillator shell, wherein a frequency sheet, electrodes and a base are arranged in the crystal oscillator shell, and the base is fixedly connected with the tops of pins. According to the utility model, the silicon wafer is placed in the groove formed in the outer protective shell, the pins of the crystal oscillator shell base are aligned with the gasket and the penetrating groove formed in the outer protective shell, the gasket and the penetrating groove are penetrated from top to bottom, the crystal oscillator shell is positioned in the movable groove formed in the silicon wafer, the silicon wafer is attached to the crystal oscillator shell, the pins are penetrated and soldered with the hole groove of the circuit board, the bottom of the outer protective shell is fixedly bonded with the circuit board by adopting the colloid, the silicon wafer plays a role of buffering and heat conduction, and the problem that the circuit board is damaged along with the circuit element inside the crystal oscillator shell when the circuit board is knocked due to the fact that the traditional crystal oscillator shell is not protected when being installed is solved.

Description

Vacuum packaging crystal oscillator

Technical Field

The utility model relates to the field of crystal oscillators, in particular to a vacuum packaging crystal oscillator.

Background

The quartz crystal resonator is a quartz crystal resonator made of quartz materials, commonly called crystal oscillator, plays a role in generating frequency, has the characteristics of stability and good anti-interference performance, and is widely applied to various electronic products.

When the crystal oscillator is installed on the circuit board, pins need to be inserted into holes and grooves on the circuit board and then the pins are fused and connected with the circuit board by using soldering equipment, but an internal frequency piece of the crystal oscillator belongs to a precise circuit element, if the circuit board is collided in the transportation process, the crystal oscillator installed on the surface of the circuit board is collided first, and even vacuum tightness is affected when the surface of the crystal oscillator is collided.

Disclosure of Invention

The present utility model is directed to a vacuum packaged crystal oscillator, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a vacuum packaged crystal oscillator comprising:

the crystal oscillator comprises a crystal oscillator shell, wherein a frequency sheet, an electrode and a base are arranged in the crystal oscillator shell, the base is fixedly connected with the tops of the pins, the frequency sheet is positioned at the upper end of the base, and the electrode is positioned at the lower end of the frequency sheet;

a protection mechanism is arranged outside the crystal oscillator shell;

the protection mechanism consists of an outer protection shell, the outer protection shell is provided with a groove, the side edge of the outer protection shell is provided with air holes, the air holes are provided with a plurality of gasket and penetrating grooves, the gasket is communicated with the penetrating grooves, the gasket is positioned at the upper end of the penetrating groove, and the crystal oscillator shell is positioned inside the groove.

The air holes are orderly distributed on two sides of the outer protective shell in a straight shape, and the pins, the washers and the penetrating grooves are movably penetrated in sequence.

Preferably, the pin is fixedly inserted with a rubber ring, the rubber ring is matched with the gasket, and the rubber ring is positioned in the gasket.

Preferably, a silica gel sheet is arranged between the crystal oscillator shell and the groove, a rectangular groove is formed in the inner wall of the silica gel sheet, the rectangular groove is fixedly connected with a heat conducting plate, and the heat conducting plate is intersected with the side edge of the crystal oscillator shell.

Preferably, the silica gel piece is matched with the groove, the silica gel piece is provided with a movable groove, the movable groove is communicated with the rectangular groove, the movable groove is matched with the crystal oscillator shell, two heat conducting plates are arranged, and the two heat conducting plates are symmetrically distributed at the center of the silica gel piece.

The utility model has the technical effects and advantages that:

according to the utility model, the silicon wafer is placed in the groove formed in the outer protective shell, the pins of the crystal oscillator shell base are aligned with the gasket and the penetrating groove formed in the outer protective shell, the pins of the crystal oscillator shell base are penetrated from top to bottom, at the moment, the crystal oscillator shell is positioned in the movable groove formed in the silicon wafer, the silicon wafer is jointed with the crystal oscillator shell, the pins are penetrated and soldered with the hole groove of the circuit board, the bottom of the outer protective shell is fixedly adhered to the circuit board by adopting colloid, the outer protective shell is connected with the circuit board into a whole, the crystal oscillator shell is crashproof and protected by the outer protective shell, the fixedly penetrated rubber rings of the pins are embedded at the gasket, the heat conducting plate on the inner side of the silicon wafer is used for jointing the outer wall of the crystal oscillator shell to absorb the heat of the surface, the heat conducting plate transfers the heat to the silicon wafer, and then the silicon wafer is penetrated outwards to conduct heat dissipation, so that the heat cannot be normally discharged to influence the normal operation of the crystal oscillator shell due to the jointing of the outer protective shell, the outer protective shell is wrapped by the crystal oscillator shell, the crystal oscillator shell is prevented from being crashed, the silicon wafer is prevented from crashing and the crystal oscillator shell is prevented from being damaged by the crystal oscillator shell, and the crystal oscillator is not damaged by the traditional crystal oscillator shell.

Drawings

Fig. 1 is a schematic perspective view of the whole structure of the present utility model.

FIG. 2 is a schematic diagram of the structure of the insertion slot of the present utility model.

Fig. 3 is a schematic structural view of an external protective shell according to the present utility model.

FIG. 4 is a schematic structural diagram of a silica gel sheet according to the present utility model.

Fig. 5 is a schematic view of a gasket according to the present utility model.

FIG. 6 is a schematic view of the rubber ring structure of the present utility model.

In the figure: 1. a crystal oscillator housing; 2. pins; 3. an outer protective shell; 4. ventilation holes; 5. a silicone sheet; 6. inserting slots; 7. a groove; 8. a heat conductive plate; 9. a gasket; 10. a rubber ring.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The present utility model provides a vacuum packaged crystal oscillator as shown in fig. 1-6, comprising:

the crystal oscillator comprises a crystal oscillator shell 1, wherein a frequency sheet, an electrode and a base are arranged in the crystal oscillator shell 1, the base is fixedly connected with the top of a pin 2, the frequency sheet is positioned at the upper end of the base, and the electrode is positioned at the lower end of the frequency sheet;

the crystal oscillator shell 1 is externally provided with a protection mechanism;

the protection mechanism consists of an outer protection shell 3, the outer protection shell 3 is provided with a groove 7, the side edge of the outer protection shell 3 is provided with air holes 4, the air holes 4 are provided with a plurality of air holes, the outer protection shell 3 is provided with a gasket 9 and an inserting groove 6, the gasket 9 is communicated with the inserting groove 6, the gasket 9 is positioned at the upper end of the inserting groove 6, the crystal oscillator shell 1 is positioned in the groove 7, the plurality of air holes 4 are orderly distributed on two sides of the outer protection shell 3 in a line shape, a pin 2 is movably inserted with the gasket 9 and the inserting groove 6 in sequence, the pin 2 is fixedly inserted with a rubber ring 10, the rubber ring 10 is matched with the gasket 9, the rubber ring 10 is positioned in the gasket 9, a silica gel sheet 5 is arranged between the crystal oscillator shell 1 and the groove 7, the inner wall of the silica gel sheet 5 is provided with a rectangular groove, the rectangular groove is fixedly connected with a heat conducting plate 8, the heat conducting plate 8 is intersected with the side edge of the crystal oscillator shell 1, the silica gel sheet 5 is matched with the groove 7, the movable groove is communicated with the rectangular groove, the movable groove is matched with the crystal oscillator shell 1, the two heat conducting plates 8 are symmetrically distributed at the center of the silica gel sheet 5;

the bleeder vent 4 is offered to a plurality of in-line orderly arranging in the both sides of outer protective housing 3, a plurality of bleeder vents 4 are used for outwards deriving the heat of silica gel piece 5 absorption crystal oscillator shell 1, thereby avoid crystal oscillator shell 1 because of the parcel of silica gel piece 5 and outer protective housing 3 leads to the heat dispersion variation and influence the normal use of crystal oscillator shell 1 inner electrode and frequency piece, rubber circle 10 inlays in packing ring 9 department after passing through pin 2 and interlude groove 6 for provide the protection to pin 2, it has the gap activity to avoid pin 2 to pass slot 6 when interlude, heat-conducting plate 8 plays the effect of outwards deriving the heat of crystal oscillator shell 1 surface, silica gel piece 5 utilizes the gap transmission heat, can fill the gap, open the hot passageway between heating position and heat dissipation position, effectively promote heat transfer efficiency, still play the effect such as insulation simultaneously, shock attenuation, seal.

The working principle of the utility model is as follows:

referring to fig. 1 to 4, the silica gel piece 5 is placed in the groove 7 formed in the outer protective shell 3, the pin 2 of the base of the crystal oscillator housing 1 is aligned with the gasket 9 and the penetrating groove 6 formed in the outer protective shell 3, the pin 2 of the base of the crystal oscillator housing 1 is penetrated from top to bottom through the gasket 9 and the penetrating groove 6, at this time, the crystal oscillator housing 1 is located in the movable groove formed in the silica gel piece 5, the silica gel piece 5 is attached to the crystal oscillator housing 1, the pin 2 is penetrated through the hole groove of the circuit board and soldered, the bottom of the outer protective shell 3 is fixedly adhered to the circuit board by adopting colloid, the outer protective shell 3 is connected with the circuit board as a whole, the rubber ring 10 penetrated by the pin 2 is embedded in the gasket 9, the heat conducting plate 8 on the inner side of the silica gel piece 5 is used for attaching the heat on the outer wall adsorption surface of the crystal oscillator housing 1, the heat conducting plate 8 transfers the heat to the silica gel piece 5, the heat is prevented from being discharged out through the ventilation holes 4 normally, the heat cannot be removed from affecting the crystal oscillator housing 1 due to the attachment of the outer protective shell 3, and the crystal oscillator housing 1 is prevented from being damaged by the conventional heat conducting plate 1 is prevented from being damaged by the crystal oscillator housing 1, and the crystal oscillator 1 is prevented from being damaged by the conventional crystal oscillator housing 1.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. A vacuum packaged crystal oscillator comprising:

the crystal oscillator comprises a crystal oscillator shell (1), wherein a frequency sheet, an electrode and a base are arranged in the crystal oscillator shell (1), the base is fixedly connected with the tops of pins (2), the frequency sheet is positioned at the upper end of the base, and the electrode is positioned at the lower end of the frequency sheet;

the crystal oscillator is characterized in that a protection mechanism is arranged outside the crystal oscillator shell (1);

the protection machanism comprises outer protective housing (3), recess (7) have been seted up to outer protective housing (3), bleeder vent (4) have been seted up to outer protective housing (3) side, bleeder vent (4) are provided with a plurality of, packing ring (9) and interlude groove (6) have been seted up to outer protective housing (3), packing ring (9) link up with interlude groove (6), packing ring (9) are located and wear slot (6) upper end, crystal oscillator shell (1) are located inside recess (7).

2. The vacuum packaging crystal oscillator according to claim 1, wherein the plurality of ventilation holes (4) are orderly distributed on two sides of the outer protective shell (3) in a line shape, and the pins (2), the gasket (9) and the penetration grooves (6) are sequentially and movably penetrated.

3. The vacuum package crystal oscillator according to claim 2, wherein the pins (2) are fixedly inserted with rubber rings (10), the rubber rings (10) are matched with the gaskets (9), and the rubber rings (10) are located inside the gaskets (9).

4. The vacuum packaging crystal oscillator according to claim 1, wherein a silica gel sheet (5) is arranged between the crystal oscillator shell (1) and the groove (7), a rectangular groove is formed in the inner wall of the silica gel sheet (5), the rectangular groove is fixedly connected with a heat conducting plate (8), and the heat conducting plate (8) is intersected with the side edge of the crystal oscillator shell (1).

5. The vacuum packaging crystal oscillator according to claim 4, wherein the silica gel sheet (5) is matched with the groove (7), the silica gel sheet (5) is provided with a movable groove, the movable groove is communicated with the rectangular groove, the movable groove is matched with the crystal oscillator shell (1), two heat conducting plates (8) are arranged, and the two heat conducting plates (8) are symmetrically distributed at the center of the silica gel sheet (5).