CN215451378U

CN215451378U - Novel packaging for anti-static ESD device of charging interface

Info

Publication number: CN215451378U
Application number: CN202121272641.4U
Authority: CN
Inventors: 艾亮东
Original assignee: Beijing Sizhong Electronic Technology Co ltd
Current assignee: Beijing Sizhong Electronic Technology Co ltd
Priority date: 2021-06-08
Filing date: 2021-06-08
Publication date: 2022-01-07
Anticipated expiration: 2031-06-08

Abstract

The utility model discloses a novel package for a charging interface antistatic ESD device, which comprises a first package shell and a second package shell, wherein the front surface and the back surface of the first package shell are both provided with rectangular hole sites, the interiors of the two rectangular hole sites are both provided with heat dissipation substrates through adhesive, the front surface of one heat dissipation substrate and the back surface of the other heat dissipation substrate are both provided with streamline ceramic sheets, the middle part of the first package shell is provided with a mounting cavity, the bottoms of the two sides of the first package shell are both connected with electrode pins in an inserting way, the two electrode pins positioned in the first package shell are both provided with pin connecting holes, the utility model can increase the surface area of the streamline ceramic sheets through the streamline ceramic sheets and micropores on the surfaces of the streamline ceramic sheets, further increase the heat absorption area, improve the heat dissipation effect, and simultaneously match with a ceramic heat conduction disc at the top part of the second package shell, the heat dissipation performance is greatly improved, and the service life of the ESD device is effectively guaranteed.

Description

Novel packaging for anti-static ESD device of charging interface

Technical Field

The utility model relates to a novel package, in particular to a novel package for an anti-static ESD device of a charging interface, and belongs to the technical field of packages.

Background

Packaging, namely hiding the attribute and implementation details of the object, only externally disclosing an interface and controlling the access level of reading and modifying the attribute in the program; the abstracted data and behaviors (or functions) are combined to form an organic whole, namely, the data and source codes of operation data are combined organically to form a class, wherein the data and the functions are members of the class. In electronic terms, packaging refers to the use of wire bonding of circuit pins on a silicon die to external connections for connection to other devices.

The ESD device is used as an electrostatic protection device and generally needs to be packaged, however, the existing package has some defects, for example, most of the existing packages adopt a sealing structure, the heat dissipation performance of the ESD device is often poor, the service life of the ESD device is further influenced, meanwhile, the flame retardant performance of the existing package cannot reach the standard, the practicability is poor, and therefore the novel package for the charging interface electrostatic prevention ESD device is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a novel packaging for a charging interface anti-static ESD device, and aims to solve the problems that the existing packaging proposed in the background technology has some defects, for example, most of the existing packaging adopts a sealing structure, the heat dissipation of the ESD device is often deteriorated, the service life of the ESD device is further influenced, and meanwhile, the existing packaging has poor anti-flame retardant performance and poor practicability.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a be used for novel encapsulation of interface antistatic ESD device that charges, includes first packaging shell and second packaging shell, the rectangle hole site has all been seted up, two in the front and the back of first packaging shell the heat dissipation base plate, one of them is all installed through the adhesive tape in the inside of rectangle hole site the front of heat dissipation base plate and one of them another streamlined potsherd is all installed at the back of heat dissipation base plate, the installation cavity has been seted up at the middle part of first packaging shell, the laminating of inner wall department of installation cavity is connected with fire-retardant cover, the bottom of first packaging shell both sides all alternates and is connected with the electrode pin, is located two of first packaging shell inside the foot has all been seted up and has been connect the electric hole.

As a preferable technical scheme of the utility model, the flame-retardant sleeve is prepared by mixing foamed rubber and silicon rubber.

As a preferred technical scheme of the utility model, a circular hole is formed in the middle of the top end of the first packaging shell, and a ceramic heat conduction disc is mounted inside the circular hole through adhesive glue.

As a preferred technical scheme of the present invention, two opposite corners of the top end of the first package casing are both provided with positioning grooves, and both the positioning grooves are in inserting fit connection with the positioning column at the bottom end of the second package casing.

As a preferred technical scheme of the utility model, the surfaces of the two streamline ceramic pieces are respectively provided with a plurality of micropores.

As a preferred technical solution of the present invention, the gap between the first package casing and the second package casing is filled with an epoxy resin sealant.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the novel packaging structure for the charging interface anti-static ESD device, the streamline ceramic piece and the micropores on the surface of the streamline ceramic piece are arranged, the micropores can increase the surface area of the streamline ceramic piece, further increase the heat absorption area and improve the heat dissipation effect, and meanwhile, the ceramic heat conduction disc arranged at the top of the second packaging shell is matched, so that the heat dissipation performance is greatly improved, and the service life of the ESD device is effectively guaranteed.

2. The novel packaging structure for the charging interface antistatic ESD device is provided with the flame-retardant sleeve, and the flame-retardant sleeve is prepared by mixing the foamed rubber and the silicon rubber, so that the flame-retardant performance of the flame-retardant sleeve is improved, the fireproof performance of the packaging structure is further guaranteed, and the safety is good.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the separated structure of the flame retardant sleeve and the streamlined ceramic wafer in the present invention;

FIG. 3 is a schematic structural diagram of a first package according to the present invention;

fig. 4 is a schematic structural diagram of a second package according to the present invention.

In the figure: 1. a first package case; 2. a second package housing; 3. a ceramic heat transfer plate; 4. a heat-dissipating substrate; 5. an electrode pin; 6. a flame-retardant sleeve; 7. a rectangular hole site; 8. streamline ceramic plates; 9. micropores; 10. positioning a groove; 11. a mounting cavity; 12. a pin connection hole; 13. and (6) forming a circular hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution for a novel package of an ESD protection device for a charging interface:

according to the drawings shown in fig. 1-4, the packaging structure comprises a first packaging shell 1 and a second packaging shell 2, rectangular hole sites 7 are formed in the front and the back of the first packaging shell 1, heat dissipation substrates 4 are mounted inside the two rectangular hole sites 7 through adhesive glue, streamline ceramic pieces 8 are mounted on the front of one heat dissipation substrate 4 and the back of the other heat dissipation substrate 4, a mounting cavity 11 is formed in the middle of the first packaging shell 1, a flame-retardant sleeve 6 is attached to the inner wall of the mounting cavity 11, electrode pins 5 are connected to the bottoms of the two sides of the first packaging shell 1 in an inserting mode, and pin connection holes 12 are formed in the two electrode pins 5 inside the first packaging shell 1.

According to the figures 1 and 2, the flame-retardant sleeve 6 is prepared by mixing foamed rubber and silicon rubber, the flame-retardant performance of the flame-retardant sleeve 6 is improved, the safety is good, a circular hole 13 is formed in the middle of the top end of the first packaging shell 1, a ceramic heat conduction disc 3 is installed inside the circular hole 13 through adhesive glue, heat can be conducted to the outside conveniently, better heat dissipation is achieved, positioning grooves 10 are formed in two corners of the top end of the first packaging shell 1, the two positioning grooves 10 are connected with a positioning column at the bottom end of the second packaging shell 2 in an inserting and matching mode, the positioning grooves 10 enable the first packaging shell 1 and the second packaging shell 2 to be in alignment and seamless connection, a plurality of micropores 9 are formed in the surfaces of the two streamline ceramic pieces 8, the heat absorption area is increased, the heat dissipation effect is improved, epoxy resin sealant is filled in a gap between the first packaging shell 1 and the second packaging shell 2, and better sealing effect is achieved conveniently.

When the novel packaging structure is used in detail, the ESD device is placed in the mounting cavity 11, the ESD device is connected with the two electrode pins 5 through the pin connection holes 12, then the first packaging shell 1 and the second packaging shell 2 are combined together and are filled through epoxy resin sealant, the streamline ceramic chip 8 and the micropores 9 on the surface of the streamline ceramic chip 8 are arranged, the micropores 9 can increase the surface area of the streamline ceramic chip 8, further increase the heat absorption area and improve the heat dissipation effect, meanwhile, the ceramic heat conduction disc 3 on the top of the second packaging shell 2 is matched, the heat dissipation performance is greatly improved, the service life of the ESD device is effectively guaranteed, the flame retardant sleeve 6 is prepared by mixing foamed rubber and silicon rubber through the flame retardant sleeve 6, the flame retardant performance of the flame retardant sleeve 6 is improved, and the fireproof performance of the packaging is further guaranteed, the safety is good.

In the description of the present invention, it is to be understood that the indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings and are only for convenience in describing the present invention and simplifying the description, but are not intended to indicate or imply that the indicated devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly attached, detachably attached, or integrated; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A novel packaging for a charging interface antistatic ESD device comprises a first packaging shell (1) and a second packaging shell (2), it is characterized in that the front and the back of the first packaging shell (1) are both provided with rectangular hole sites (7), the insides of the two rectangular hole sites (7) are both provided with a heat dissipation substrate (4) through adhesive glue, streamline ceramic plates (8) are respectively arranged on the front surface of one heat dissipation substrate (4) and the back surface of the other heat dissipation substrate (4), an installation cavity (11) is arranged in the middle of the first packaging shell (1), the inner wall of the installation cavity (11) is jointed and connected with a flame-retardant sleeve (6), the bottom of the two sides of the first packaging shell (1) is respectively and alternately connected with an electrode pin (5), and two electrode pins (5) positioned inside the first packaging shell (1) are respectively provided with a pin power connection hole (12).

2. The novel package of claim 1, wherein the ESD protection device comprises: the flame-retardant sleeve (6) is prepared by mixing foamed rubber and silicon rubber.

3. The novel package of claim 1, wherein the ESD protection device comprises: a circular hole (13) is formed in the middle of the top end of the first packaging shell (1), and a ceramic heat conduction disc (3) is mounted inside the circular hole (13) through adhesive glue.

4. The novel package of claim 1, wherein the ESD protection device comprises: positioning grooves (10) are formed in two opposite corners of the top end of the first packaging shell (1), and the two positioning grooves (10) are connected with positioning columns at the bottom end of the second packaging shell (2) in an inserting and matching mode.

5. The novel package of claim 1, wherein the ESD protection device comprises: the surfaces of the two streamline ceramic plates (8) are provided with a plurality of micropores (9).

6. The novel package of claim 1, wherein the ESD protection device comprises: and epoxy resin sealant is filled in a gap between the first packaging shell (1) and the second packaging shell (2).