JP2003249624A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a device so as to be easily compatible with a specification required by a user by making the best use of characteristics of the two-storied system of power circuit/control circuit to improve assembling property and reliability of a product while permitting exchange of externally derivation terminals for the control circuit. <P>SOLUTION: In a semiconductor device, the power circuit 5 and the control circuit 6 are installed in a two-storied system in a package comprising a metallic base 1, an enclosure case 2 integrated with terminals, and an upper lid while the package is sealed by a gel type filler. Externally derivation control terminals 4 for the control circuit are inserted into a control terminal block 9 of an independent component as pin terminals array in conformity with the required specification of the user, and the control terminal block is bridged to fix the same to the central part of upper surface of the enclosure case, while a print substrate 6a of the control circuit is bridged between terminal leads 4a erected inward from the block and the other terminal leads 10a erected from the relaying terminal block 10 arranged in the case so as to connect them. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an intelligent power module (Inte.
It is related to the assembly structure of the semiconductor device for lligent power module).

[0002]

2. Description of the Related Art First, an assembly structure of a conventional example is shown in FIGS. 12 and 13 by taking an intelligent power module applied to an inverter device as an example. 1 in each figure
Is a metal base (copper base) for heat dissipation, 2 is a terminal integrated type enclosure case that is a resin molded product, 3 is a main terminal (input / output to / from the power circuit, and external lead-out terminal (screw terminal) for the brake circuit) ) 4 is a control terminal (control signal input / output external lead terminal (pin terminal) for the control circuit), 5 is a power circuit (circuit assembly), 6 is a control circuit (circuit assembly), and 7 is a bonding wire. (Internal wiring). Here, the power circuit 5 is formed by mounting a power semiconductor element 5b such as an IGBT and a freewheeling diode 5c on a circuit board 5a.
Is a ceramic plate made of alumina, aluminum nitride, etc. with a copper circuit pattern on the upper surface and a copper layer directly on the lower surface.
A rect Bonding Copper substrate is used. On the other hand, the control circuit 6 has a structure in which various circuit components including the IC 6b for driving the power element 5b are mounted on the printed board 6a.

In the assembly structure shown in FIGS. 12 (a) and 12 (b),
The power circuit 5 and the control circuit 6 are mounted side by side on the upper surface of the metal base 1 and assembled by the procedure described below. First, the power circuit 5 on which the elements are mounted is soldered to the metal base plate 1 with the copper layer of the circuit board 5a facing downward,
Similarly, the control circuit 6 on which elements are mounted adheres the printed circuit board 6a to the metal base plate 1 with an adhesive. Then, a bonding wire 7 is connected between the power circuit 5 and the control circuit 6 to provide internal wiring. Next, after covering the metal base plate 1 with the outer casing 2 integrated with the terminals and bonding the same with an adhesive, the tip of the inner lead 3a of the main circuit terminal 3 protruding inward of the outer casing 2 and the power Internal wiring is performed by soldering between the conductor pattern of the circuit board 5a and between the control terminal 4 and the conductor pattern of the control circuit board 6a. In this assembled state, a gel filler (for example, silicone gel) is injected into the package to seal the power circuit 5 and the control circuit 6, and finally, the outer case 2 is covered with an upper lid (not shown). And fix it with adhesive.

On the other hand, the assembly structure of FIG. 13 has a structure in which the power circuit 5 and the control circuit 6 are incorporated in a two-story structure in the package. Here, the power circuit 5 is soldered onto the metal base plate 1 as in FIG. 12, while the control circuit 6 is assembled as described below. That is, after the terminal-integrated enclosure case 2 is stacked on the metal base plate 1 on which the power circuit 5 is mounted and the main circuit terminal 3 and the conductor pattern of the power circuit board 5a are soldered, the terminal is attached to the resin frame 8a. The relay terminal block 8 in which the conductor piece 8b is integrally molded is overlaid on the power circuit 5, the terminal conductor piece 8b and the conductor pattern are soldered, and in this state, the relay terminal block 8 is formed.
The printed circuit board 6a of the control circuit 6 is placed on the above, and the printed circuit board 6a is soldered to the terminal conductor piece 8b and the control terminal 4. After that, the gel filler is injected into the package in the same manner as described with reference to FIG. 12, and finally, the upper lid is covered to assemble.

[0005]

The conventional semiconductor device having the above-mentioned assembly structure has the following problems. That is, (1) In the configuration of FIG. 12, since the power circuit 5 and the control circuit 6 are arranged on the same plane, the package occupies a large area and the semiconductor device becomes large. Power circuit 5 on the metal base plate 1
In the intermediate test of the product with the control circuit 6 installed,
When a defect of a circuit component such as the IC 6b mounted on the printed circuit board 6a of the control circuit 6 is found, the printed circuit board 6a is already firmly fixed to the metal base plate 1 with an adhesive, and thus the printed circuit board 6a. It is impossible to remove only the metal base plate 1 from the metal base plate 1 to replace the defective part and put it back into the assembly line. Therefore, the intermediate assembly of the product must be completely discarded, resulting in a large loss of parts. Become.

(2) Further, in the configuration of FIG. 13, since the semiconductor device is made small and compact, and a defect is found in the mounting parts of the control circuit in the intermediate test performed in the middle of the assembling process because of the two-story system. Even if it does, the advantage is that the control circuit can be easily replaced with a good one, but the following problems remain in the conventional structure. First, the two-story structure inevitably increases the outer height of the module. If the control circuit 6 having the same shape as the power circuit 5 is assembled above the power circuit 5 in the package, the power circuit 5 is hidden behind the control circuit 6 and cannot be seen from the outside. In addition, in the step of injecting the gel-like filler into the package, only a narrow gap remains between the outer case 2 and the peripheral edge of the printed circuit board 6a of the control circuit 6, so that the filler cannot be injected. It takes time.

In addition, in connection with the connection between the power module and the peripheral circuit (inverter device), the main terminals were screwed to the bus bar or the printed circuit board of the peripheral circuit, and the control terminals were usually soldered or connector-connected. However, recently, the main terminal of the power module has a pin terminal structure, the power module is directly mounted on the printed circuit board of the peripheral circuit, and then the main terminal (pin terminal) is joined by a solder flow method or the like. The control terminal (pin terminal) tends to be widely adopted by inserting and connecting to a connector provided on the peripheral circuit side. On the other hand,
In the structure of No. 3, since the lead pin of the control terminal 4 is integrally molded with the outer case 2, it is necessary to make the length, the number and the arrangement order of the pin terminals correspond to the specifications on the user side and the specifications of the connector. Since it is necessary to newly design and manufacture the outer casing 2 with a terminal integrated according to the specifications required by the user, the cost becomes high.

The present invention has been made in view of the above points, and an object thereof is to solve the above-mentioned problems and to take advantage of a two-story system in which a power circuit and a control circuit are vertically arranged and packaged in a package. An object of the present invention is to provide an improved semiconductor device assembling structure in which the assembling property and reliability are improved, and the external lead-out terminal for the control circuit can be replaced to easily meet the specifications required by the user.

[0009]

To achieve the above object, according to the present invention, there is provided a heat dissipating metal base, a terminal integrated type outer case having insert-molded external lead terminals of a main circuit, and an upper lid. A power circuit in which a power circuit and a control circuit are mounted in a two-story structure in a package, and each of the circuits is sealed with a gel filler injected into the package, and a power semiconductor element is mounted on a circuit board. Is mounted on a metal base, and the control circuit has a configuration in which circuit components including an IC for driving a power semiconductor element are mounted on a printed circuit board and arranged above the power circuit. The control terminal block is inserted into a terminal block (resin molded product) that is a separate and independent part from the enclosure case, and then the control terminal block is enclosed in the enclosure case. Assemble it so that it is fixed to this position by straddling it toward the center of the upper surface, and connect the terminal lead protruding from the control terminal block to the inside of the case and the terminal lead standing from the relay terminal block arranged inside the enclosure case. The printed circuit board of the control circuit is carried by being soldered and connected by soldering, and the power circuit and the control circuit are interconnected via the relay terminal (claim 1).

According to the above-described semiconductor device assembly structure,
The power circuit, enclosure case, control terminal block, control circuit, and case lid can all be assembled by stacking operations from above, and an automatic assembly system can be easily supported by an assembly robot. In addition, the wiring path between the main circuit terminal / power circuit, the power circuit / control circuit, and the control circuit / control terminal can be connected in the shortest distance, which suppresses the influence of the wiring inductance and prevents malfunction. In addition, the gel filler can be injected into the package smoothly in a short time.

Further, even if a defect is found in a component such as an IC mounted in a control circuit in an intermediate inspection performed during the assembly process, control is performed by removing a solder joint portion between a printed circuit board of the control circuit and a terminal lead. It is possible to easily replace the circuit with a good one. In addition, the control terminal block is assembled as an independent part in the enclosure case, and the enclosure case is used as a common part, and simply by combining it with a control terminal block that meets the specifications of the user You can easily meet the specifications.

Further, according to the present invention, each structure of the semiconductor device described above can be specifically configured in the following modes. (1) A thin bare chip is adopted as an IC to be mounted on a printed circuit board of a control circuit, and a package of a semiconductor device having this printed circuit board can be made thin (claim 2).

(2) I mounted on the printed circuit board of the control circuit
C is laid out according to the arrangement of the power semiconductor elements mounted on the circuit board of the power circuit so that the power semiconductor elements and the ICs are vertically aligned, and the wiring path between them is minimized to reduce the wiring inductance. The effect of is suppressed to a low level, and the circuit patterns of the circuit board and the printed circuit board are simplified (claim 3).

(3) The external lead-out terminals of the main circuit are pins or plate terminals, are gathered on one side of the rectangular enclosure case and are arranged in a line, and are arranged in parallel with the external lead-out terminal row to form control terminals. After the block is installed near the center of the upper surface of the enclosure case, the control circuit is arranged in the region between the control terminal block and the side of the enclosure case opposite to the terminal row, and the control terminal block and the enclosure case are arranged. A wide injection path for the gel-like filler communicating with the power circuit side is secured between the main terminal array side and the side edge of the main terminal arrangement side.

(4) A terminal lead-out hole is opened in the upper lid of the case, and the terminal lead-out hole is set to be slightly larger than the top contour of the control terminal block, and the control terminal is provided on the printed board on the device side. When the connector is inserted and connected, the connector top and the control terminal are surely connected so that the tip of the other connector does not hit the upper lid of the case and interferes with the connection.

(5) A protrusion is provided on the back surface of the case lid for maintaining a gap with its tip facing the upper surface of the control circuit printed circuit board. Even if the case lid is warped due to a change in ambient temperature, the protrusion is used. Acts as a spacer to prevent the bonding wire wired on the printed circuit board from hitting the case cover and being deformed or crushed (claim 6).

(6) After forming a concave portion on the upper surface side of the case lid, disperse the projections for holding the gap in the above item (5) on the back side area of the concave portion formed on the plate surface of the case lid. The upper surface of the semiconductor device is provided so as to prevent the case upper lid from warping and bending due to the concave portion (bending strength is increased as compared with a flat upper lid) and utilizing the concave space of the concave portion. It is possible to prevent interference with electronic components mounted on the back surface side of the printed board on the side of the device that is placed on top of the above (claim 7).

(7) A state in which the control terminal block is provided with positioning guide pins which are arranged side by side with the control terminal row (pin terminals) to support the printed circuit board of the control circuit in a fitting manner, and the control terminal block is attached to the case. When assembling the printed circuit board of the control circuit in the case, the printed circuit board is fitted into the guide pin and supported at a fixed position so that the subsequent soldering work of the printed circuit board and the control terminal can be performed easily. Item 8).

(8) In the control terminal block, the support portions formed on both ends of the control terminal block are fitted from above into the recessed groove portion formed on the inner surface side of the outer casing of the package and are joined with an adhesive (claim 9). , The control terminal block support is provided with an open adhesive injection hole on its upper surface so that the adhesive can be efficiently applied using a dispenser, and the inner surface of the groove of the case and the block An adhesive guide groove is formed on the outer surface of the support portion so that the adhesive injected from the injection hole is evenly distributed over the joint surface between the block and the concave groove portion (claim 10).

(9) A device assembled by combining a cooling fin and a printed circuit board on the device side, wherein a radiation fin is superposed on the metal base of the semiconductor device, and the main part of the semiconductor device is mounted on the printed circuit board on the device side. The terminal is inserted into the terminal insertion hole of the printed circuit board and soldered, and the control terminal is inserted and connected to the connector equipped on the printed circuit board side, and the main terminal of the semiconductor device is made of a bendable material. Pins or plate-shaped lead terminals are arranged in a row on the upper surface of the package, and the lead terminals are formed into a shape corresponding to the mounting posture of the printed circuit board on the device side to be combined with the semiconductor device. It is inserted into the terminal insertion hole for soldering (claim 11).

As described above, by arranging the main terminals drawn out from the upper surface of the package of the semiconductor device (module) in a straight line and arranging them, and using the material of the lead terminals as a material that can be easily lead bent, When an inverter device or the like is configured by combining the printed circuit board and cooling fins of the device, even if there is a request to lay the module and the printed circuit board on the device side in different directions depending on the design requirements of the user, the module can be adapted to the layout. The main terminal of the module is formed and the direction of the tip of the terminal is changed, so that the main terminal of the module can be directly inserted and connected to the terminal insertion hole formed in the printed board.

Further, the main terminal is a copper lead terminal, and the lead terminal is subjected to nickel plating, solder plating, or gold plating, so that the solderability to the copper lead terminal, the wire bonding property, and the contact property with the connector are achieved. (Claim 12). Further, the tip of the main terminal is formed into an L shape, and the main terminal is inserted and joined from a side into a terminal insertion hole formed along the edge of the printed circuit board on the side of the device, so that the printed circuit board is in a vertical posture with respect to the semiconductor device. (Claim 13).

By adopting this assembly structure, the cooling fins and the semiconductor device (module) are arranged on the rear surface side of the unit case, and the printed circuit board on the device side is laid in the depth direction of the unit case to form the semiconductor device (module). Even when the device is configured with a layout such that it is arranged in front of the printed circuit board, the printed circuit board can be inserted into the main terminal (lead terminal) bent into an L shape by aligning the terminal insertion hole of the printed circuit board from the side. (Module) and can be mounted in a vertical position.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to an embodiment shown in FIGS. 1 to 11, taking a power module applied to an inverter (three-phase) device as an example. In each embodiment, members corresponding to those in FIGS. 12 and 13 are designated by the same reference numerals, and the description thereof will be omitted. Further, in the drawings of the embodiments, reference numeral 9 is a control terminal block which is an independent component assembled on the upper surface side of the outer casing 2 according to the present invention, and 10 is a relay arranged along the inner peripheral side edge of the outer casing 2. The terminal block 11 is a case upper cover attached to the upper surface of the outer case 2. In addition, regarding the terminal symbols marked on the case lid in Fig. 4 (a), P and N are DC input terminals,
U, V, and W are AC output terminals for each phase, B is a terminal of the brake unit, and NO. 1 to 19 are terminal numbers of control terminals.

First, FIGS. 1 (a) and 1 (b) show the overall structure of an embodiment of the present invention. That is, in the assembly structure of the illustrated embodiment, the metal base 1 and the rectangular enclosure case (resin case) are the same as the two-story module described in FIG.
The power circuit 5 and the control circuit 6 are incorporated in a two-story system in a package formed by combining 2 and the case upper lid 11. Here, the IC 6b mounted on the printed circuit board 6a of the control circuit 6 has a thin module. In order to achieve this, a bare chip is adopted, and the layout thereof is laid out so as to correspond to the arrangement of the power semiconductor elements (IGBTs) 5b mounted side by side on the circuit board 5a of the power circuit 5, and the power circuit 5 and the control circuit 6 are arranged. The length of the wiring path between and is shortened to suppress the influence of the wiring inductance.

In the case 2, the main terminals (P, N, U, V, W, and B) made of a copper frame are provided on one side of the long sides of the four sides of the case. Is integrally insert-molded, and its pin-shaped terminal projects upward from the outer case 2. Further, as shown in FIG. 3 (a), on the upper surface of the short side of the enclosure case 2, there is a stepped concave portion for fitting and supporting a control terminal block to be described later at a position near the center spaced from the main terminal row. Groove 2a (Fig. 3,
9) is formed.

The control terminal block 9 is provided as an independent component on the upper surface side of the enclosure case 2 so as to extend between the concave grooves 2a. That is, the support portions 9a formed at both ends of the horizontally long resin block body are fitted into the above-mentioned recessed grooves 2a formed at the inner edge of the outer case 2, and are joined and fixed by an adhesive as described later. In addition, control terminals 4 serving as pin terminals are insert-molded on the top surface 9b of the block body, which bulges in a trapezoidal shape, so that the control terminals 4 are arranged in a row on the left and right and protrude upward. The inner lead) 4a is bent into an L shape and is drawn out to the side of the block (the side opposite to the arrangement of the main terminals 3), and the tip leg portion thereof is bent upward. In addition, 9c is a guide pin of the connector planted at both ends of the control terminal block 9.

The relay terminal block 10 provided inside the outer case 2 is formed by insert-molding an L-shaped terminal lead 10a in a resin block, and one end of the terminal lead 10a stands up from the upper surface of the block. It has a protruding structure and is bonded to the control terminal block 9 along the inner surface (the long side opposite to the long side on which the main terminals 3 are arranged) of the enclosure case 2 facing the control terminal block 9. In addition, the block top surface of the relay terminal block 10 is set so as to be lined up at the same height position as the tip leg portion 4a of the terminal lead drawn out from the control terminal block 9 inward of the case.

Then, the printed circuit board of the control circuit 6 straddles between the terminal lead 4a of the control terminal 4 pulled out from the control terminal block 9 into the case and the terminal lead 10a erected from the relay terminal block 10. The terminal leads 4a and 10a are inserted into the through holes of the printed circuit board 6 and soldered.

Further, as shown in FIG. 4, the outer case 2
The case upper lid 11 attached to the case has a terminal lead-out hole 11a corresponding to the control terminal block 9 described above, and the terminal lead-out hole 11a has a trapezoidal shape of the control terminal block 9 in which the control terminals 4 are arranged side by side. It is set to be slightly larger than the contour of the top portion 9b, and in the state where the upper lid 11 is attached as shown in the figure, a concave groove portion is left between the terminal drawing hole 11a and the top portion 9b of the control terminal block. In the state where the upper lid 11 is attached, the peripheral portion of the control terminal block 9 overlaps the back surface of the upper lid 11 to close the hole from the inner surface side. By forming the terminal lead-out holes 11a in the case upper lid 11 in this manner, as shown in FIG. 4 (b), the connector provided on the printed circuit board by combining the device side printed circuit board 12 on the power module. 13 to control terminal 4
It is possible to prevent the legs of the connector terminals 13a protruding to the back surface side of the printed circuit board 12 from coming into contact with the module-side upper lid 11 and obstructing the connection of the connector during the plug-in connection.

Next, a procedure for assembling the semiconductor device having the above structure will be described. First, as shown in FIG. 2, the metal base 1
Circuit board 5a on which each element of the power circuit 5 is mounted
To solder. Next, as shown in FIGS. 3 (a) and 3 (b), the enclosure case 2 is covered on the metal base 1 and bonded with an adhesive, and then the conductor patterns of the power semiconductor element 5b, the diode 5c, and the circuit board 5a. The bonding wire 7 is wired between the circuit board 5a and the main terminal 3 provided on the outer case and the terminal lead 10a of the relay terminal block 10.

Next, the control terminal block 9 is assembled to the outer case 2 from above, and the support portions 9a at both ends thereof are fitted into the left and right recessed grooves 2a (see FIG. 3) formed on the case side and temporarily fixed. Then, the parts are bonded with an adhesive as described later. In the next assembling step, the printed circuit board 6a of the control circuit 6 is inserted into the outer case 2 from above, and the terminal lead 4a of the control terminal 4 protruding from the control terminal block 9 into the case and the relay terminal block 10 are inserted. After being laid over between the terminal lead 10a standing upright, the printed circuit board 6a and the terminal lead 4 are
Solder a and 10a. With this, the main terminal 3 and the power circuit 5, the power circuit 5 and the control circuit 6, and the control circuit 6 and the control terminal 4 are interconnected by the shortest wiring path.

Subsequently, the step of injecting the filler is started, and the gel filler (silicone gel) is injected into the outer case 2.
In this case, the filler flows into the gap between the power circuit 5 and the control circuit 6 using the opening remaining between the control terminal block 9 and the peripheral frame of the outer case where the main terminals 3 are arranged as an injection passage. The power circuit 5 and the control circuit 6 are sealed by filling every corner of the case. Then, in the final assembly step, the terminal lead-out hole 11a opened in the case upper lid 11 is provided on the outer case 2.
The control terminal block 9 and the control terminal block 9 are aligned and covered from above, and the outer case 2 is joined with an adhesive. As a result, the product of the power module shown in FIG. 4 (c) is completed.

Next, application examples of the present invention relating to the case upper lid 11 will be described with reference to FIGS. That is,
In the module assembled state shown in FIG. 4, the control circuit is provided with a predetermined space between the case upper lid 11 covering the upper surface of the outer case 2 and the printed circuit board 6a of the control circuit 6 incorporated in the case. It is necessary not to interfere with the IC mounted on the IC 6, various components, and the bonding wire 7 thereof.

By the way, as shown in FIG. 4, the case upper lid 11 made of resin is made of a flat resin plate having the terminal lead-out holes 11a opened, and if the thickness of the plate is reduced to make the package thinner, heat cycle, etc. Warping and bending are likely to occur due to changes in the ambient temperature. Moreover, if the upper lid 11 is deformed in a concave shape due to warping or the like, the distance between the upper lid 11 and the printed circuit board 6a of the control circuit may be shortened, and the upper lid 11 may crush the bonding wire to cause an unexpected short circuit accident.

Therefore, in this embodiment, as shown in FIGS. 5 (a) to 5 (c), the case upper cover 11 has a lower surface side in a surface area facing the printed circuit board 6a of the control circuit 5 on the side of the terminal lead-out hole 11a. A concave surface portion 11b is formed on the back surface of the concave surface portion 11b, and projections 11c for holding the gap are formed on the left and right sides of the concave surface portion 11b in a dispersed manner on the rear surface thereof so that the tips of the concave surface portion 11b project to face the printed circuit board 6a. The length of the protrusion 11c is set so that the protrusion 11c faces the upper surface of the printed circuit board 6a in the assembled state of the module, leaving a slight play gap.

With this structure, even if the case upper lid 11 is warped due to the heat cycle, the projection 1
1c hits the upper surface of the printed circuit board 6a and maintains a predetermined space between the upper lid 11 and the printed circuit board 6a. Therefore, there is no possibility that the bonding wire will be crushed by the upper lid 11. Further, by forming the concave portion 11b in the case upper lid 11, the cross-section coefficient increases and the bending strength of the upper lid increases, and as shown in FIG. 7, the printed circuit board 12 of the peripheral circuit is superposed on the module. When the electronic component 12a is mounted on the back surface side of the printed board 12, the printed board 12 can be attached to the module while avoiding unnecessary interference between the electronic component 12a and the upper lid 11. Is obtained.

Next, application examples of the present invention relating to the above-mentioned control terminal block 9 will be described with reference to FIGS. That is, in the assembly structure of the module shown in FIG. 1, the printed circuit board 6a of the control circuit 6 is insert-molded into the control terminal block 9 and is pulled out inward, and the terminal lead 4a of the control terminal (pin terminal) 4 and the relay terminal block 10 are formed. From above to support the lead terminal 10a standing upward,
The tip of the lead terminal is inserted into a through hole formed in the printed circuit board 6a for soldering.
These terminal leads 4a and 10a are easily deformed in strength,
If the printed circuit board 6a hits the terminal lead in the assembling process, the printed circuit board 6a may be easily deformed and may not fit properly into the through hole of the printed circuit board 6a, which may interfere with the subsequent soldering process.

Therefore, in this embodiment, as shown in FIGS. 8 (a) and 8 (b), the resin block is formed so as to extend laterally from the lower end side along the longitudinal direction of the control terminal block 9. Further, the guide pin 9d, which is juxtaposed with the terminal lead 4a of the control terminal 4 pulled out from the protruding portion so as to stand upright, stands upright from both left and right sides thereof.
(The guide pin is set to be longer than the leg portion of the terminal lead 4a) is integrally formed with the resin block, and guide pin holes are drilled in the left and right ends of the printed circuit board 6a corresponding to the guide pin 9d. Keep it.

In the process of assembling the printed circuit board 6a of the control circuit 6, when the printed circuit board 6a is inserted into the guide pin 9d from above by relying on the guide pin 9d, the printed circuit board 6a is guided by the guide pin 9d and the printed circuit board 6a is fixed. The through holes for the terminals, which are positioned at the positions and are drilled in the board, are properly fitted to the control terminals 4, and the respective terminal leads 4a, 10a of the relay terminal block 10. As a result, the subsequent soldering work of the terminals can be performed without any trouble. Moreover, the control terminal block 9 is provided on the back side of the printed circuit board 6a.
Since the solder balls are squeezed out, there is no possibility that the molten solder balls will be spilled onto the power circuit 5 (see FIG. 8B) during soldering.

Further, in this embodiment, the following measures are taken in order to improve the process of fitting the control terminal block 9 into the concave groove 2a of the enclosure case 2 and joining with the adhesive. ing. That is, in the method in which the adhesive is first applied to the inner surface of the concave groove 2a and then the support portion 9a of the control terminal block is fitted and joined, since the dimension of the concave groove 2a is small, a dispenser (robot operation) is used. It is extremely difficult to uniformly apply the adhesive to the inner wall surface of the groove.

Therefore, in this embodiment, as shown in FIGS. 9 (a) and 9 (b), the support portion 9a of the control terminal block 9 is provided with an adhesive injection hole 9a-1 penetrating vertically. At the same time, a concave adhesive guiding groove 9a-2 is formed on the outer peripheral surface, and the stepped concave groove 2a formed on the outer case 2 is further guided to the bottom surface and the inner surface thereof. The groove 2a-1 is formed by engraving.

Then, in the assembling process of mounting the control terminal block 9 on the outer case 2, first, the left and right recessed grooves 2 in which the support portions 9a at both ends of the terminal block 9 are formed on the outer case side.
Fit from above over a. Subsequently, a dispenser nozzle for the adhesive is aligned with the adhesive injection hole 9a-1 by robot operation, and a fixed amount of the adhesive is injected from the dispenser under pressure. As a result, the adhesive flows out from the injection hole 9a-1 to the bottom surface side of the concave groove 2a, and from there, the adhesive spreads evenly over the entire bonding surface through the adhesive guide grooves 2a-1 and 9a-2. The block 9 can be reliably joined.

The adhesive injection hole 9a-1 also serves as a mounting hole for the guide pin 9c of the socket shown in FIG.
After the injection of the adhesive, the guide pin 9c is press-fitted and fixed by adhesion. Next, application examples of the present invention relating to an inverter device assembled by combining a cooling fin and a printed circuit board of a device side peripheral circuit will be described with reference to FIGS. In FIG. 10, 21 is an IPM that constitutes an inverter circuit, 23 is a printed circuit board that constitutes a device-side circuit (control of the inverter device, protection circuit) that is combined with the IPM 21, and 24 is a housing for the above-mentioned components, Unit case with input and output sockets, display panel, etc.
25 is attached to the back surface of the unit case 24 and the IPM 21
It is a cooling fin for heat dissipation that is heat-transfer coupled to. As shown in FIGS. 1 (a) and 1 (b), the IPM 21 has a main circuit 5 and a control circuit 6 which are power circuits in a package consisting of a metal base 1, a resin-molded case 2 and an upper lid. The interior of the package is a two-story system, and the package has a main terminal 5 serving as an input / output external lead-out terminal for the main circuit 5, a control terminal (signal terminal) 4 serving as an external lead-out terminal for the control circuit 6, and a main circuit 5. The configuration is such that a relay terminal 10a for connecting the control circuit 6 and the like is provided.

Here, the main circuit 5 is a circuit assembly in which a power semiconductor element (eg, IGBT) is mounted on a circuit board in combination with a freewheeling diode, and is solder-mounted on the metal base 1. Further, the control circuit 6 has circuit components such as a drive IC for a power semiconductor element mounted on its circuit board, and is bridged between the lead leg portion of the control terminal 4 and the relay terminal 10a which is erected upward to form a main circuit. It is arranged above 5.

On the other hand, the main terminal 3 is insert-molded integrally with the peripheral wall portion of the outer case 2, and the terminal tips are made to stand upright and drawn out to the upper surface side of the package. In addition, the control terminal 4 is insert-molded as a pin terminal into a control terminal block 9 which is a single component that is a resin molded product, and is then mounted over the center of the upper surface of the outer case 2 so as to penetrate the case upper lid. It is pulled out to the upper surface side and guide pins are planted at both ends. In addition, 7 is a bonding wire wired between the main circuit 5, the main terminal 3, and the relay terminal 11.

When the above-mentioned inverter device is constructed,
In the conventional assembly structure, the printed circuit board 23 on the device side is overlapped with the IPM 21 so that the surface is parallel to the package upper surface of the module, and the main terminals 3 standing upright from the package upper surface are directly connected to the terminal insertion holes formed in the printed circuit board. Since they are inserted and joined, the IPM 21 to be assembled in the unit case 24, the printed circuit board 3. The arrangement of the cooling fins 25 is necessarily limited.

On the other hand, depending on the configuration designated by the user, the layout of the IPM and the printed circuit board may not match. For example, the unit case 2 in the control panel
The cooling fins 25 arranged on the side surface of the
If there is a user design requirement to change to the back side of
IPM21 together with cooling fins 25 to meet this requirement
Is moved to the rear surface side of the unit case 24, the direction of the main terminal 3 standing upright from the package of the IPM 21 is orthogonal to the direction of the terminal insertion hole formed in the printed circuit board 23 laid in the front-back direction of the device. As it is, the main terminal 3 cannot be directly inserted into the printed circuit board 23 for soldering.

Therefore, by arranging the main circuit terminals drawn out from the upper surface of the package of the module in a straight line and arranging them, and using the material of the lead terminals as a material that is easy to bend the leads, the module is mounted on the printed circuit board of the device, When the cooling fins are combined to form an inverter device, etc., even if the module and the printed circuit board on the device side are required to be installed in different directions depending on the design requirements of the user, the main circuit terminals of the module should be matched to the layout. By forming and changing the direction of the terminal tips, the main circuit terminals of the module can be directly inserted into the terminal insertion holes formed in the printed circuit board and connected.

To this end, (1) the main terminals of the module are made of copper lead terminals, and the lead terminals are subjected to plating treatment such as nickel plating, solder plating, gold plating, and the like, and the solderability to the copper lead terminals, and Improve the wire bondability and contactability with the connector.

(2) The tip of the main terminal of the module is formed into an L shape, and the terminal is inserted into a terminal insertion hole formed in the edge of the printed circuit board and joined to the terminal so that the printed circuit board on the device side is in a vertical posture with respect to the power module. Install. By adopting this assembly structure, the cooling fins and the module are arranged on the back side of the unit case, and the printed circuit board on the device side is laid in the depth direction of the unit case and arranged in front of the module. Even in the case of the configuration, the printed circuit board can be mounted in a vertical posture with respect to the module by inserting the terminal insertion hole of the printed circuit board from the side into the main terminal (lead terminal) of the module bent into the L shape.

That is, the structure of the IPM 21 is such that, particularly for the main terminal 3, a bendable material (JIS C1100, C
1020, C2600, C2680, etc., and its terminals have nickel plating with a film thickness of 10 μm or less, solder plating with a film thickness of 10 μm or less, or film thickness so as to improve the wettability of solder and the bondability with bonding wires. Gold plating of 2 μm or less (in the case of gold plating, gold plating is performed on Ni plating) is applied.

Then, the cooling fin 2 is attached to the IPM 21.
5. When assembling the inverter device by combining the printed circuit board 23 of the device side, the main terminal 3 standing upright from the package upper surface of the IPM 21 is combined with the module according to the layout according to the design requirements of the user side. After forming (bending) into a shape corresponding to the posture of the printed circuit board 23, the device is assembled by directly inserting into a terminal insertion hole punched in the printed circuit board 23 and soldering.

Here, as shown in FIG. 11, the cooling fins 25 are installed on the back side of the unit case 24, the metal base of the module is placed on the front side of the cooling fins 25 to assemble the IPM 21 in the case, and at the same time, on the side of the device side. Printed circuit board 2
3 is divided into two pieces, and the divided boards 23A, 23
An assembling procedure will be described with reference to FIGS. 10 (a) and 10 (b), taking an inverter device in which B is laid in the case in the front-back direction and is attached to the main terminal 3 of the IPM 21 as an example. First,
As shown in the enlarged view of FIG. 10 (a), the lead terminals of the main terminals 3 of the IPM 21 are aligned, and the lead terminals are formed into L-shapes (bending). On the other hand, in the printed circuit board 23A connected to the main terminal 3, the terminal insertion holes 33a corresponding to the arrangement of the main terminals 3 are arranged in a line along the edge of the circuit board and punched, and the printed circuit board 23B connected to the control terminal 4 is formed.
A connector 13 to be connected to a control terminal (pin terminal) is attached to the green end of the connector.

Here, the printed board 23 is mounted on the IPM 21.
To mount A and 23B, place the IPM 21 from the side with the printed circuit board 23A standing upright as shown in the figure.
The terminal insertion hole 33a formed in the lower edge of the printed board 23A is inserted into the main terminal 3 from the side, and the main terminal 3 and the conductor pattern of the printed board 23A are soldered. On the other hand, in the print board 23B, the connectors 13 are aligned with the control terminals 4 arranged in a horizontal line, and pushed in from above to make a plug connection. As a result, as shown in FIG. 10 (b), the IPM2
The two printed circuit boards 23A and 23B are connected in a vertical posture. Then, after the cooling fins 25 are combined with the above-mentioned circuit assembly, this is assembled in the unit case 24 to form the inverter device of FIG. 11. By connecting and holding the printed circuit boards 23A and 23B to the IPM 21 in the vertical posture in this manner, the upper surface of the IPM 21 is not blocked by the printed circuit board, and the heat dissipation to the upper surface side of the IPM itself is improved. , Printed circuit board 2
The noise that enters the IPM 21 from 3 is also reduced.

[0056]

As described above, the claims 1 to 3 of the present invention are as follows.
The configuration described in each item of 13 has the following effects. (1) Along with the miniaturization and thinning of the semiconductor device, the wiring path between the main terminal-power circuit-control circuit-control terminal can be minimized, which prevents malfunction of the device due to the influence of wiring inductance. Reliability can be improved.

(2) The printed circuit board of the control circuit can be easily attached and detached, and I can be used at an intermediate check in the assembly process.
Even if a defect of C is found, only the control circuit can be easily removed and replaced. (3) In the assembled state of the semiconductor device, through the gap opened across the entire width between the outer case and the control terminal block,
The gel filler can be easily injected into every corner of the package without being blocked by the printed circuit board of the control circuit.

(4) By mounting the control terminal block as an independent component in the outer casing, the outer casing is used as a common component, and the length and arrangement of the pin terminals of the control terminal block can be specified by the user. By making them together, it is possible to meet the individual requirements of customers at low cost. (5) The pin of the control terminal block according to claim 5, wherein the terminal lead-out hole opened in the case top cover is set to be slightly larger than the top contour of the control terminal block to form a recessed portion in the peripheral region of the control terminal. When inserting the connector mounted on the printed circuit board on the peripheral circuit side into the terminal, it is possible to prevent the unnecessary interference between the connector and the upper lid, and securely insert the connector into the control terminal for connection.

(6) Providing a protrusion for holding a gap on the back surface side of the case lid, and the tip of the protrusion facing the printed circuit board of the control circuit, even if the lid is warped or bent due to a heat cycle or the like, the top lid is prevented. It is safe because there is no danger of touching or crushing the bonding wires that are laid on the printed board. In addition, by forming a concave portion on the upper surface side of the upper lid together with this protrusion, unnecessary interference with electronic components mounted on the back surface of the peripheral circuit printed board to be mounted on the upper surface of the semiconductor device is avoided. be able to.

(7) Since the control terminal block is provided with the guide pin for positioning the printed circuit board of the control circuit in a fixed position, the printed board is assembled and the subsequent soldering to the control terminal is accurately performed. It can be carried out. (8) Both ends of the control terminal block are fitted in concave grooves formed in the outer case so that they are joined by an adhesive.Here, adhesive injection holes are opened in both end support portions of the terminal block, and the support is further supported. By forming the adhesive guide groove on the peripheral surface of the portion and on the inner surface of the concave groove on the side of the outer case, the adhesive is dispensed by the XY axis robot in the temporary assembly state in which the terminal block is fitted in the outer case. Can be applied and evenly applied to the joint surface by operation.

(9) A main terminal pulled out from the upper surface of the package of the module is inserted into a terminal of the printed circuit board for an inverter device or the like in which a semiconductor fin module such as an IPM is combined with a cooling fin and a printed circuit board on the device side. In a semiconductor device assembled by inserting it into a hole and soldering it, and inserting and connecting the control terminal to the connector equipped on the printed circuit board side, the main terminal of the module is a pin or plate made of a bendable material. The lead terminals are arranged side by side on a straight line, and the lead terminals are formed into a shape corresponding to the mounting posture of the printed circuit board on the device side to be combined with the module, and the lead terminals are inserted into the terminal insertion holes of the printed circuit board. As it is inserted and soldered, it is incorporated in the unit case like a conventional device Modules and printed circuit boards. The layout of the cooling fins is not uniquely limited, and even if the layout is such that the printed circuit board of the device is laid in different directions with respect to the module, the main terminals of the module are bent according to the direction of the printed circuit board. By that,
The printed circuit board can be directly inserted into the module and soldered, which allows the user to meet individual design requirements without changing the package structure of the module.

As a result, the reliability and assembly of the semiconductor device can be improved.

[Brief description of drawings]

FIG. 1 is an assembly structure diagram of a semiconductor device according to an embodiment of the present invention, (a) is a plan view with a case upper lid removed, and (b) is a plan view.
(a) arrow XX sectional view

FIG. 2 is a plan view of the power circuit shown in FIG. 1 mounted on a metal base.

FIG. 3 is a state diagram in which an outer case is combined with the assembly of FIG. 2 and wire bonding is performed between the assembly and the power circuit.
Is a plan view, (b) is a cross-sectional view taken along line XX of (a)

4 is a completed view of a product in which a case top cover is attached to the assembly of FIG. 1, (a) is a plan view, (b) is a cross-sectional view taken along the line XX of (a), and (c) is an external view. Perspective view

5A and 5B are configuration diagrams of a case upper lid according to an application example of the invention, in which FIG. 5A is a plan view, FIG. 5B is a side view, and FIG. 5C is a view A in FIG.
-A sectional view

FIG. 6 is an external perspective view of a semiconductor device with the case top cover of FIG. 5 attached.

FIG. 7 is a sectional view of an assembly structure of a semiconductor device according to an application example of the present invention.

FIG. 8 shows an application example of a control terminal block, (a) is a plan view with a case top lid removed, and (b) is a plan view.
Side view cross section of (a)

9 is a main part configuration diagram of FIG. 8, (a) is an exploded perspective view of an outer case and a control terminal block, and (b) is an enlarged plan view of a groove portion formed in the outer case in (a).

FIG. 10 is a view for explaining an assembling procedure of a module and a printed circuit board according to an application example of the present invention, in which (a) and (b) are perspective views showing states before and after assembling, respectively.

11 is an assembly configuration diagram of an inverter device corresponding to FIG.

12A and 12B are assembly structural views of a semiconductor device of a conventional example, FIG. 12A is an exploded perspective view, and FIG. 12B is a perspective view of an assembled state.

13A and 13B are assembly structural views of a conventional example of a two-story semiconductor device different from FIG. 12, where FIG. 13A is an exploded perspective view and FIG. 13B is a perspective view of an assembled state.

[Explanation of symbols]

1 metal base 2 enclosure case 2a Groove for terminal block mounting 2a-1 Adhesive guide groove 3 main terminals 4 control terminals 4a terminal lead 5 power circuits 5a power circuit board 5b Power semiconductor device 6 control circuit 6a printed circuit board 6b IC 7 Bonding wire 9 Control terminal block 9a Supports at both ends 9a-1 Adhesive injection hole 9a-2 Adhesive guide groove 9b top 9d Guide pin for supporting control circuit 10 Relay terminal block 10a terminal lead 11 Case lid 11a Terminal drawing hole 11b concave part 11c Space-holding protrusion 21 IPM 23 Printed circuit board on the device side 24 unit case 25 cooling fins 26 packages

Claims (13)

[Claims] 1. A package consisting of a metal base for heat radiation, an outer casing of a terminal integrated type in which external lead-out terminals of a main circuit are insert-molded, and an upper lid, in which a power circuit and a control circuit are mounted in a two-story structure, and A semiconductor device in which each circuit is sealed with a gel-like filler injected into the package,
A power circuit in which a power semiconductor element is mounted on a circuit board is mounted on a metal base, and a control circuit has circuit components including an IC for driving the power semiconductor element mounted on a printed circuit board and is arranged above the power circuit. In the thing, after the external lead-out terminal for the control circuit is insert-formed in the terminal block which becomes an independent part as a pin terminal,
The control terminal block is bridged and fixed near the center of the upper surface of the enclosure case, and a terminal lead protruding from the control terminal block inward of the case and a terminal lead standing up from a relay terminal block arranged inside the enclosure case are provided. A semiconductor device, wherein a printed circuit board of a control circuit is carried and connected between the power circuit and the control circuit, and the power circuit and the control circuit are interconnected via the relay terminal. 2. The semiconductor device according to claim 1, wherein a bare chip is adopted as an IC mounted on a printed circuit board of a control circuit. 3. The semiconductor device according to claim 1, wherein the IC mounted on the printed circuit board of the control circuit is laid out according to the arrangement of the power semiconductor elements of the power circuit. 4. The semiconductor device according to claim 1, wherein the external lead-out terminals of the main circuit are collectively arranged as pins or plate terminals on one side of the outer case, and control terminals are arranged in parallel with the terminal row. A semiconductor device, wherein the block is installed near the center of the upper surface of the enclosure case, and the control circuit is arranged in a region between the control terminal block and the side of the enclosure case opposite to the terminal row. 5. The semiconductor device according to claim 1, wherein a terminal lead-out hole is opened in the case lid, and the terminal lead-out hole is set to be slightly larger than the top contour of the control terminal block. . 6. The semiconductor device according to claim 1, wherein a protrusion is provided on the back surface of the case upper lid for maintaining a gap, the tip of which faces the upper surface of the control circuit printed circuit board. 7. The semiconductor device according to claim 6, wherein the projections for holding the space are dispersedly provided on the back surface of the concave portion formed on the upper surface side of the case upper lid. 8. The semiconductor device according to claim 1, wherein the control terminal block is provided with guide pins for positioning and supporting the printed circuit board of the control circuit. 9. The semiconductor device according to claim 1, wherein the support portions formed at both ends of the control terminal block are fitted into the recessed groove portions formed on the inner surface side of the outer casing of the package and joined by an adhesive. Characteristic semiconductor device. 10. The semiconductor device according to claim 9, wherein both ends of the control terminal block are provided with adhesive injection holes opened on the upper surface thereof, and the inner surface of the recessed groove portion of the outer case and the support portion of the block are provided. A semiconductor device, wherein an adhesive guide groove for guiding the adhesive injected from the injection hole to the joint surface is formed on the outer surface. 11. The semiconductor device according to claim 1, wherein the cooling fin and the printed circuit board on the device side are combined and assembled, and a radiation fin is superposed on the metal base of the semiconductor device, and the printed circuit board on the device side. In contrast, the main terminal of the semiconductor device is inserted into the terminal insertion hole of the printed circuit board and soldered, and the control terminal is inserted and connected to the connector equipped on the printed circuit board side, and the main terminal of the semiconductor device is bent. Pins or plate-shaped lead terminals made of a workable material are arranged in a row on the upper surface of the package, and the lead terminals are combined with the semiconductor device. After forming into a shape corresponding to the mounting posture of the printed circuit board on the device side, Then, the semiconductor device is characterized in that the terminal tips are inserted into the terminal insertion holes of the printed circuit board and soldered. 12. The semiconductor device according to claim 11,
A semiconductor device characterized in that a lead terminal made of copper is used as a main terminal, and the lead terminal is plated with nickel, solder or gold. 13. The semiconductor device according to claim 11,
The front end of the main terminal is formed into an L shape, and the main terminal is inserted and joined from a side into a terminal insertion hole formed along the edge of the printed circuit board on the device side to mount the printed circuit board in a vertical posture with respect to the semiconductor device. A semiconductor device characterized by the above.