JP3901038B2 - Semiconductor device and inverter device using the same - Google Patents

Semiconductor device and inverter device using the same Download PDF

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Publication number
JP3901038B2
JP3901038B2 JP2002188178A JP2002188178A JP3901038B2 JP 3901038 B2 JP3901038 B2 JP 3901038B2 JP 2002188178 A JP2002188178 A JP 2002188178A JP 2002188178 A JP2002188178 A JP 2002188178A JP 3901038 B2 JP3901038 B2 JP 3901038B2
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Japan
Prior art keywords
terminal
semiconductor device
circuit board
printed circuit
control
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JP2002188178A
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Japanese (ja)
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JP2003249624A (en
Inventor
伸 征矢野
英司 望月
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富士電機デバイステクノロジー株式会社
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Priority to JP2001-220913 priority Critical
Priority to JP2001220913 priority
Priority to JP2001-220914 priority
Priority to JP2001220914 priority
Priority to JP2001382405 priority
Priority to JP2001-382405 priority
Priority to JP2002188178A priority patent/JP3901038B2/en
Application filed by 富士電機デバイステクノロジー株式会社 filed Critical 富士電機デバイステクノロジー株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4911Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49111Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device intended for an intelligent power module applied to an inverter device or the like, and more particularly to an assembly structure thereof.
[0002]
[Prior art]
First, taking an intelligent power module applied to an inverter device as an example, the assembly structure of the conventional example is shown in FIGS.
In each figure, 1 is a heat-dissipating metal base (copper base), 2 is a terminal-integrated enclosure case that becomes a resin molded product, and 3 is a main terminal (input / output to / from power circuit, and external lead for brake circuit) Terminal (screw terminal)), 4 is a control terminal (control signal input / output for control circuit, external lead-out terminal (pin terminal)), 5 is a power circuit (circuit assembly), and 6 is a control circuit (circuit assembly). , 7 are bonding wires (internal wiring). Here, the power circuit 5 includes a power semiconductor element 5b such as IGBT and a freewheeling diode 5c mounted on a circuit board 5a. The power circuit board 5a has an upper surface of a ceramic plate such as alumina or aluminum nitride. A direct bonding copper substrate with a copper circuit pattern and a copper layer directly bonded to the lower surface is used. On the other hand, the control circuit 6 has a configuration in which various circuit components including an IC 6b for driving the power element 5b are mounted on a printed board 6a.
[0003]
12 (a) and 12 (b), the power circuit 5 and the control circuit 6 are mounted side by side on the upper surface of the metal base 1, and are assembled in the following procedure. First, the power circuit 5 on which the element is mounted is soldered to the metal base plate 1 with the copper layer of the circuit board 5a facing down, and the control circuit 6 on which the element is mounted is also attached to the printed board 6a with an adhesive. Adhere to the metal base plate 1. Subsequently, a bonding wire 7 is connected between the power circuit 5 and the control circuit 6 to provide internal wiring. Next, a terminal-integrated outer casing 2 is placed on the metal base plate 1 and bonded with an adhesive, and then the tip of the inner lead 3a of the main circuit terminal 3 protruding inward of the outer casing 2 and the power Internal wiring is performed by soldering between the conductor pattern of the circuit board 5a and between the control terminal 4 and the conductor pattern of the control circuit board 6a. In this assembled state, a gel filler (for example, silicone gel) is injected into the package to seal the power circuit 5 and the control circuit 6, and finally the outer case 2 is covered with an upper cover (not shown). To fix.
[0004]
On the other hand, the assembly structure of FIG. 13 has a configuration in which the power circuit 5 and the control circuit 6 are incorporated into the package in a two-story manner. Here, the power circuit 5 is soldered onto the metal base plate 1 as in FIG. 12, while the control circuit 6 is assembled as follows. That is, the terminal case-integrated enclosure case 2 is superposed on the metal base plate 1 on which the power circuit 5 is mounted and soldered between the main circuit terminal 3 and the conductor pattern of the power circuit board 5a, and then the terminal is connected to the resin frame 8a. The relay terminal block 8 integrally molded with the conductor piece 8b is overlaid on the power circuit 5, and the terminal conductor piece 8b and the conductor pattern are soldered. In this state, the printed circuit board of the control circuit 6 is placed on the relay terminal block 8. 6a is placed, and the printed circuit board 6a, the terminal conductor piece 8b, and the control terminal 4 are soldered. Thereafter, in the same manner as described with reference to FIG. 12, a gel filler is injected into the package, and finally the upper lid is put on and assembled.
[0005]
[Problems to be solved by the invention]
However, the conventional semiconductor device having the assembly structure has the following problems. That is,
(1) In the configuration of FIG. 12, since the power circuit 5 and the control circuit 6 are arranged on the same plane, the occupied area of the package is increased and the semiconductor device is increased in size. If a defect in a circuit component such as an IC 6b mounted on the printed circuit board 6a of the control circuit 6 is found in an intermediate test of the product performed with the power circuit 5 and the control circuit 6 mounted on the board 1, the printed circuit board is already Since 6a is firmly fixed to the metal base plate 1 with an adhesive, it is impossible to remove only the printed circuit board 6a from the metal base plate 1 to replace defective parts and to put them back into the assembly line. Therefore, it is necessary to dispose of the intermediate assembly of the product as a whole, resulting in a large part loss.
[0006]
(2) Further, in the configuration of FIG. 13, the two-story method is adopted, so that even when a defect is found in the mounted part of the control circuit in the intermediate test performed in the middle of the downsizing and compacting of the semiconductor device and the assembly process. While there is an advantage that the control circuit can be easily replaced with a non-defective one, the following problems remain in the conventional structure.
First, the two-story structure inevitably increases the external height of the module. In addition, if a control circuit 6 that is substantially the same shape as the power circuit is assembled above the power circuit 5 in the package, the power circuit 5 is hidden behind the control circuit 6 and cannot be seen from the outside. In addition, in the step of injecting the gel filler into the package, only a narrow gap remains between the outer case 2 and the peripheral edge of the printed circuit board 6a of the control circuit 6, so that the filler is injected. It takes time.
[0007]
In addition, for the connection between the power module and the peripheral circuit (inverter device), the main terminal was screwed to the bus bar or the printed circuit board of the peripheral circuit, and the control terminal was soldered or connected to the connector. However, in recent years, the main terminal of the power module has a pin terminal structure, and after mounting the power module directly on the printed circuit board of the peripheral circuit, the main terminal (pin terminal) is joined by the solder flow method etc., and the control terminal ( For pin terminals), there is a tendency that a method of inserting and connecting to a connector provided on the peripheral circuit side is widely adopted. On the other hand, in the structure of FIG. 13, since the lead pins of the control terminal 4 are integrally formed with the outer case 2, the length, number and arrangement order of the pin terminals are determined by the user side specifications and connector specifications. In order to meet the specifications, it is necessary to newly design and manufacture a terminal-integrated enclosure case 2 that meets the specifications required by the user, resulting in high costs.
[0008]
The present invention has been made in view of the above points, and its object is to solve the above-mentioned problems, while taking advantage of the features of the two-storey system in which the power circuit and the control circuit are arranged in the upper and lower stages and installed in the package, An object of the present invention is to provide an improved assembly structure of a semiconductor device in which reliability is improved and an external lead-out terminal for a control circuit can be replaced to easily cope with specifications required by a user.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a power circuit and a control circuit are provided on a package comprising a metal base for heat dissipation, a terminal-integrated outer case in which an external lead-out terminal of the main circuit is insert-molded, and an upper cover. This is a semiconductor device that is built in a two-story structure and sealed with a gel-like filler in which each circuit is injected into a package. A power circuit in which a power semiconductor element is mounted on a circuit board is mounted on a metal base and controlled. The circuit has a configuration in which circuit components including an IC for driving a power semiconductor element are mounted on a printed circuit board and arranged above the power circuit.
The lead-out terminal for the control circuit is used as a pin terminal, insert-formed into a terminal block (resin molded product) that becomes a separate and independent part from the outer case, and the control terminal block is bridged near the center of the upper surface of the outer case Assemble to fix to the lever position and protrude from the control terminal block to the inside of the case control Standing up from the terminal lead and the relay terminal block placed inside the outer case relay Soldering and connecting the printed circuit board of the control circuit carried between the terminal lead and the relay terminal Lead The power circuit and the control circuit are configured to be interconnected via each other (claim 1).
[0010]
According to the assembly structure of the semiconductor device described above, the power circuit, the enclosure case, the control terminal block, the control circuit, and the case top cover can be assembled by stacking operation from above, and the automatic assembly method by an assembly robot or the like. Can be easily accommodated. In addition, the wiring path between the main circuit terminal / power circuit, the power circuit / control circuit, and the control circuit / control terminal can be connected with the shortest distance, thereby suppressing the influence of wiring inductance and preventing malfunction. Further, the gel filler can be smoothly injected into the package in a short time.
[0011]
Even if an IC or other component mounted on the control circuit is found to be defective during an intermediate inspection performed during the assembly process, the control circuit can be removed by removing the solder joint between the control circuit printed board and the terminal lead. And can be easily replaced. Furthermore, with the configuration in which the control terminal block is assembled as an independent part in the outer case, the outer case is used as a common part, and only the control terminal block that meets the user's specifications is combined with the user's requirements. It can easily correspond to the specifications to be done.
[0012]
In addition, according to the present invention, each part structure of the semiconductor device described above can be specifically configured in the following manner.
(1) A thin bare chip is employed as an IC to be mounted on a printed circuit board of a control circuit, so that a semiconductor device package in which the printed circuit board is housed can be thinned.
[0013]
(2) The IC mounted on the printed circuit board of the control circuit is laid out in accordance with the arrangement of the power semiconductor elements mounted on the circuit board of the power circuit so that the power semiconductor elements and the ICs are aligned vertically. In addition to minimizing the influence of wiring inductance by minimizing the wiring path between the two, the circuit patterns of the circuit board and the printed circuit board are also simplified.
[0014]
(3) The main circuit external lead-out terminals are pins or plate terminals, and are arranged in a row in one side of a rectangular outer casing, and arranged in parallel with the external lead-out terminal row to remove the control terminal block. Place the control circuit in the area between the control terminal block and the side of the surrounding case opposite to the terminal row, and install the control circuit near the center of the top surface of the surrounding case. A wide injection path of the gel filler that leads to the power circuit side is secured between the side of the array side and the side of the array side.
[0015]
(4) Open a terminal lead hole in the case top cover, set the terminal lead hole to be slightly larger than the top contour of the control terminal block, and insert the connector provided on the printed board on the device side into this control terminal. When connecting, the connector and the control terminal can be reliably connected so that the tip of the mating connector does not hit the case top cover and interfere with the connection.
[0016]
(5) On the back surface of the case top cover, a protrusion for holding the gap is provided with the tip facing the top surface of the control circuit printed circuit board. Even if the case top warps due to changes in ambient temperature, the protrusion is The bonding wire wired on the printed circuit board that plays a role prevents the case upper cover from being deformed or crushed (claim 6).
[0017]
(6) After forming the concave portion on the upper surface side of the case upper lid, the protrusions for holding the gap in the previous item (5) are distributed and provided on the back side area of the concave portion formed on the plate surface of the case upper lid, The concave surface of the case (which increases the bending strength compared to a flat upper lid) warps the case upper lid and suppresses the occurrence of bending, and uses the concave space of the concave surface to overlap the semiconductor device. Interference with an electronic component mounted on the back side of the printed circuit board on the apparatus side to be placed is prevented (claim 7).
[0018]
(7) The control terminal block is provided with positioning guide pins that are aligned with the control terminal row (pin terminals) and support the printed circuit board of the control circuit in a fitting manner, and the control circuit is mounted with the control terminal block attached to the case. When the printed board is assembled in the case, the printed board is inserted into the guide pin and supported at a fixed position, so that the subsequent soldering operation between the printed board and the control terminal can be performed easily. .
[0019]
(8) The control terminal block has support portions formed at both ends thereof fitted into a recessed groove portion formed on the inner surface side of the package enclosing case from above and joined with an adhesive (Claim 9). The support part of the control terminal block is provided with an open adhesive injection hole on its upper surface so that the adhesive can be efficiently applied using a dispenser, and the inner surface of the concave groove part of the case and the outer surface of the support part of the block An adhesive guide groove is formed in the adhesive so that the adhesive injected from the injection hole spreads over the joint surface between the block and the groove (claim 10).
[0020]
(9) The semiconductor device, Cooling fins and Inverter constituting control and protection circuit of the inverter device A device assembled by combining printed circuit boards on the device side, with heat radiation fins superimposed on the metal base of the semiconductor device, Inverter Printed circuit board on the device side The main terminal of the semiconductor device is inserted into the terminal insertion hole of Plug and solder, The control terminal of the semiconductor device is connected to the connector provided on the printed circuit board side of the inverter device side. Like plug-in connection,
Mounting the printed circuit board on the device side, in which the main terminals of the semiconductor device are arranged in a row on the upper surface of the package as pins or plate-like lead terminals made of a material that can be bent, and the lead terminals are combined with the semiconductor device After forming into a shape corresponding to the posture, On the inverter side It inserts in the terminal insertion hole of a printed circuit board, and is made to solder-joint (Claim 11).
[0021]
In this way, the main terminals drawn out from the upper surface of the package of the semiconductor device (module) are arranged in a straight line, and the lead terminal material is made of a material that can be easily bent, so that the device can be printed on the module. When configuring an inverter device or the like by combining a board and cooling fins, even if there is a requirement to lay the module and the printed circuit board on the device side in different directions depending on the user's design requirements, the main terminal of the module according to the layout The main terminal of the module can be directly inserted into the terminal insertion hole formed in the printed circuit board and connected by changing the direction of the terminal tip.
[0022]
Also, Of the semiconductor device The main terminal is a copper lead terminal, and the lead terminal is subjected to nickel plating, solder plating, or gold plating to improve solderability to the copper lead terminal, wire bonding, and contact with the connector. (Claim 12).
Also, Of the semiconductor device The leading end of the main terminal is formed into an L shape, and the main terminal is inserted and joined from the side to a terminal insertion hole formed along the edge of the printed circuit board on the apparatus side, and the printed circuit board is attached in a vertical posture with respect to the semiconductor device. (Claim 13).
[0023]
By adopting this assembly structure, the cooling fins and the semiconductor device (module) are arranged on the back side of the unit case, and the printed circuit board on the device side is laid in the depth direction of the unit case and in front of the semiconductor device (module). Even when the device is configured in such a layout as to be arranged, the printed circuit board is mounted on the semiconductor device (module) by inserting the terminal insertion hole of the printed circuit board from the side into the main terminal (lead terminal) bent into an L shape. And can be mounted in a vertical position.
[0024]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described based on examples shown in FIGS. 1 to 11, taking a power module applied to an inverter (three-phase) device as an example.
In each embodiment, members corresponding to those in FIGS. 12 and 13 are denoted by the same reference numerals and description thereof is omitted. In the figure of the embodiment, reference numeral 9 is a control terminal block as an independent part assembled on the upper surface side of the outer casing 2 according to the present invention, and 10 is a relay arranged along the inner peripheral side edge of the outer casing 2. A terminal block 11 is a case upper cover attached to the upper surface of the outer case 2. 4 (a), P and N are DC input terminals, U, V and W are AC output terminals for each phase, B is a brake terminal, NO.1 ~ Reference numeral 19 denotes a terminal number of the control terminal.
[0025]
First, FIGS. 1A and 1B show the overall structure of the embodiment of the present invention. That is, in the assembly structure of the illustrated embodiment, in the same manner as the two-story module described in FIG. 12, the package is a combination of the metal base 1, the rectangular outer case (resin case) 2, and the case upper lid 11. The power circuit 5 and the control circuit 6 are incorporated in a two-story system. Here, the IC 6b mounted on the printed circuit board 6a of the control circuit 6 adopts a bare chip in order to make the module thin, and its arrangement Is laid out so as to correspond to the arrangement of power semiconductor elements (IGBTs) 5b mounted in a line on the circuit board 5a of the power circuit 5, and the wiring path length between the power circuit 5 and the control circuit 6 is shortened. The effect of inductance is kept low.
[0026]
Here, with respect to the surrounding case 2, main terminals (P, N, U, V, W, and B) made of a copper frame are integrated with the case on one side of the long side of the four surrounding sides. It is insert-molded, and its pin-shaped terminal protrudes upward from the outer casing 2. Further, as shown in FIG. 3 (a), the upper surface of the short side of the enclosing case 2 has a stepped recess for inserting and supporting a control terminal block, which will be described later, at a central position spaced from the main terminal row. A groove 2a (see FIGS. 3 and 9) is formed.
[0027]
The control terminal block 9 is installed on the upper surface side of the outer casing 2 so as to be spanned between the concave grooves 2a as an independent part. That is, the support portions 9a formed at both ends of the horizontally long resin block body are fitted into the concave grooves 2a formed at the inner edge of the outer casing 2, and are bonded and fixed with an adhesive as described later. Further, the control terminal 4 as a pin terminal is insert-molded so as to protrude in a line in the left and right rows on the top portion 9b bulging in a trapezoidal shape on the upper surface side of the block body, and the terminal lead ( The inner lead 4a is bent into an L shape and pulled out to the side of the block (the side opposite to the arrangement of the main terminals 3), and the tip leg portion is bent upward. Reference numeral 9c denotes a guide pin for a connector planted at both ends of the control terminal block 9.
[0028]
Further, the relay terminal block 10 provided inside the outer case 2 is formed by insert-molding an L-shaped terminal lead 10a into a resin block, and protrudes so that one end of the terminal lead 10a rises upward from the upper surface of the block. It has a structure and is bonded along the inner surface of the outer casing 2 (the long side opposite to the long side on which the main terminals 3 are arranged) facing the control terminal block 9. Note that the block top surface of the relay terminal block 10 is set so as to be arranged at the same height as the distal end leg portion 4a of the terminal lead led out from the control terminal block 9 to the inside of the case.
[0029]
Then, the printed circuit board 6a of the control circuit 6 is bridged between the terminal lead 4a of the control terminal 4 drawn from the control terminal block 9 to the inside of the case and the terminal lead 10a rising from the relay terminal block 10. The tip of each terminal lead 4a and 10a is inserted into the through hole of the printed circuit board 6 and soldered.
[0030]
Further, as shown in FIG. 4, the case upper cover 11 attached to the outer case 2 is provided with a terminal lead hole 11a corresponding to the control terminal block 9, and the terminal lead hole 11a is controlled. When the terminal 4 is set to be slightly larger than the outline of the trapezoidal top portion 9b of the control terminal block 9 arranged side by side, and the top cover 11 is attached as shown, the terminal lead hole 11a and the top portion 9b of the control terminal block A concave groove is left between the two. When the upper lid 11 is attached, the peripheral edge of the control terminal block 9 overlaps the back surface of the upper lid 11 to close the hole from the inner surface side. By forming the terminal lead hole 11a in the case upper lid 11 in this way, as shown in FIG. 4B, a connector provided on the printed circuit board by combining the printed circuit board 12 on the apparatus side on the power module. When the connector 13 is inserted into the control terminal 4 and connected, the legs of the connector terminal 13a protruding to the back side of the printed circuit board 12 can be prevented from coming into contact with the upper lid 11 on the module side and interfering with the connection of the connector.
[0031]
Next, an assembling procedure of the semiconductor device having the above configuration will be described. First, as shown in FIG. 2, a circuit board 5 a on which each element of the power circuit 5 is mounted is soldered on the metal base 1. Next, as shown in FIGS. 3A and 3B, the outer casing 2 is placed on the metal base 1 and bonded with an adhesive, and then the power semiconductor element 5b, the diode 5c and the conductor pattern of the circuit board 5a are connected. Bonding wires 7 are routed between the circuit terminals 5 a and the main terminals 3 provided in the outer case and the terminal leads 10 a of the relay terminal block 10.
[0032]
Next, the control terminal block 9 is assembled to the outer case 2 from above, and the support portions 9a at both ends thereof are fitted into the left and right concave grooves 2a (see FIG. 3) formed on the case side and temporarily fixed, The parts are joined with an adhesive as described below. In the next assembly process, the printed circuit board 6a of the control circuit 6 is inserted into the inside of the outer casing 2 from above, and from the terminal lead 4a and the relay terminal block 10 of the control terminal 4 protruding from the control terminal block 9 into the case. After bridging between the terminal leads 10a erected upward, the printed circuit board 6a and the terminal leads 4a and 10a are soldered. Thus, the main terminal 3 and the power circuit 5, the power circuit 5 and the control circuit 6, and the control circuit 6 and the control terminal 4 are interconnected by the shortest wiring path.
[0033]
Subsequently, the process proceeds to a filler injection step, and a gel filler (silicone gel) is injected into the outer case 2. In this case, the filler flows into the gap between the power circuit 5 and the control circuit 6 with the opening remaining between the control terminal block 9 and the peripheral frame of the surrounding case in which the main terminals 3 are arranged as an injection passage, The power circuit 5 and the control circuit 6 are sealed by filling every corner of the case. Then, in the final assembly step, the terminal lead hole 11a opened in the case upper lid 11 and the control terminal block 9 are aligned and covered on the surrounding case 2 from above and covered with the surrounding case 2 with an adhesive. Join. As a result, the product of the power module shown in FIG. 4C is completed.
[0034]
Next, application examples of the present invention relating to the case upper lid 11 will be described with reference to FIGS. That is, in the module assembly state shown in FIG. 4, a predetermined gap is secured between the case upper lid 11 that covers the upper surface of the outer case 2 and the printed circuit board 6a of the control circuit 6 incorporated in the case. It is necessary not to interfere with the IC mounted on the control circuit 6, various components, and their bonding wires 7.
[0035]
By the way, if the case top lid 11 made of resin is made of a flat resin plate having terminal lead holes 11a as shown in FIG. 4 and the plate thickness is reduced from the thinning of the package, the ambient temperature such as heat cycle is reduced. Warping and bending are likely to occur due to changes. In addition, when the upper lid 11 is deformed in a concave shape due to warpage or the like, the distance between the control circuit and the printed circuit board 6a is reduced, and the upper lid 11 may crush the bonding wire and cause an unexpected short-circuit accident.
[0036]
Therefore, in this embodiment, as shown in FIGS. 5 (a) to 5 (c), the case upper cover 11 is recessed on the lower surface side in the surface area facing the printed circuit board 6a of the control circuit 5 on the side of the terminal lead hole 11a. The concave surface portion 11b is formed, and on the back surface of the concave surface portion 11b, spacing holding projections 11c protruding so as to face the printed circuit board 6a are formed in a distributed manner on the left and right. The protrusion 11c is set to have a length dimension so as to face each other with a slight play gap between the module 11 and the upper surface of the printed circuit board 6a.
[0037]
With this configuration, even when the case upper lid 11 is warped due to a heat cycle, the protrusion 11c hits the upper surface of the printed circuit board 6a to maintain a predetermined distance between the upper cover 11 and the printed circuit board 6a. Therefore, there is no possibility that the bonding wire is crushed by the upper lid 11. Further, by forming the concave surface portion 11b on the case upper lid 11, the section modulus is increased and the bending strength of the upper lid is increased, and the printed circuit board 12 of the peripheral circuit is superimposed on the module as shown in FIG. If the electronic component 12a is mounted on the back side of the printed board 12, the printed board 12 can be attached to the module while avoiding unnecessary interference between the electronic component 12a and the upper lid 11. Is obtained.
[0038]
Next, an application embodiment of the present invention relating to the control terminal block 9 will be described with reference to FIGS. That is, in the assembly structure of the module shown in FIG. 1, the printed circuit board 6a of the control circuit 6 is insert-molded into the control terminal block 9 and pulled out to the inside, and the terminal lead 4a of the control terminal (pin terminal) 4 and the relay terminal block 10 The lead terminals 10a erected upward from the top of the lead terminals 10a are supported and then soldered by inserting the tips of the lead terminals into through holes drilled in the printed circuit board 6a. 4a and 10a are easily deformed in strength. If the board hits the terminal lead in the process of assembling the printed circuit board 6a, it is easily deformed and does not fit well in the through hole of the printed circuit board 6a, which hinders the subsequent soldering process. May come.
[0039]
Therefore, in this embodiment, as shown in FIGS. 8A and 8B, the resin block is formed so as to protrude sideways from the lower end side along the longitudinal direction of the control terminal block 9, A guide pin 9d which is juxtaposed with the terminal lead 4a of the control terminal 4 pulled out so as to stand upward from the protruding portion and rises upward from both the left and right sides (the guide pin is more than the leg portion of the terminal lead 4a). Are set integrally with the resin block, and guide pin holes are drilled in the left and right ends of the printed circuit board 6a corresponding to the guide pins 9d.
[0040]
In the assembly process of the printed circuit board 6a of the control circuit 6, when the printed circuit board 6a is inserted into the guide pin 9d from above with the guide pin 9d, the printed circuit board 6a is positioned at a fixed position by being guided by the guide pin 9d. Then, the through hole for the terminal drilled in the board is properly fitted to the control terminal 4 and the terminal leads 4a and 10a of the relay terminal block 10. Thereby, the subsequent soldering operation of the terminal can be performed without any trouble. In addition, since the control terminal block 9 protrudes from the back side of the printed circuit board 6a, there is no possibility that the molten solder ball spills onto the power circuit 5 (see FIG. 8B) during soldering. .
[0041]
In this embodiment, the following measures are taken in order to improve the process when the control terminal block 9 is inserted into the recessed groove 2a of the outer casing 2 and joined with an adhesive. That is, in the method in which the adhesive is first applied to the inner surface of the groove 2a and then the support terminal 9a of the control terminal block is inserted and joined, the dispenser (robot operation) is used because the size of the groove 2a is small. It is extremely difficult to uniformly apply the adhesive to the inner wall surface of the groove.
[0042]
Therefore, in this embodiment, as shown in FIGS. 9A and 9B, the support portion 9a of the control terminal block 9 is perforated with an adhesive injection hole 9a-1 penetrating in the vertical direction, A concave adhesive guide groove 9a-2 is engraved on the outer peripheral surface, and an adhesive guide groove 2a- is formed on the bottom and inner side surfaces of the stepped concave groove 2a formed in the outer casing 2. 1 is engraved.
[0043]
In the assembly process of mounting the control terminal block 9 on the outer casing 2, first, the support portions 9 a at both ends of the terminal block 9 are inserted from above over the left and right concave grooves 2 a formed on the outer casing side. To do. Subsequently, an adhesive dispenser nozzle is positioned by robot operation in the adhesive injection hole 9a-1, and a predetermined amount of adhesive is injected under pressure from the dispenser. As a result, the adhesive flows out from the injection hole 9a-1 to the bottom surface side of the concave groove 2a, and from there, the adhesive spreads over the entire joint surface through the adhesive guide grooves 2a-1 and 9a-2. The block 9 can be reliably joined.
[0044]
The adhesive injection hole 9a-1 also serves as a mounting hole for the guide pin 9c of the socket shown in FIG. 1, and after the injection of the adhesive, the guide pin 9c is press-fitted and fixed.
Next, application examples of the present invention relating to an inverter device assembled by combining a cooling fin and a printed circuit board of the device side peripheral circuit will be described with reference to FIGS. In FIG. 10, 21 is an IPM constituting an inverter circuit, 23 is a printed circuit board constituting a device side circuit (inverter device control and protection circuit) combined with the IPM 21, and 24 accommodates the above-mentioned components on the front surface. A unit case 25 provided with input / output sockets, a display panel, and the like, and 25 are heat-dissipating cooling fins attached to the back surface of the unit case 24 and thermally coupled to the IPM 21. Further, as shown in FIGS. 1 (a) and 1 (b), the IPM 21 has a main circuit 5 and a control circuit 6 which are power circuits in a package including a metal base 1, an outer case 2 of a resin molded product, and an upper lid. The two-story system is used, and the package further includes a main terminal 3 serving as an external lead-out terminal for the main circuit 5, a control terminal (signal terminal) 4 serving as an external lead-out terminal for the control circuit 6, and the main circuit 5 The relay terminal 10a for connecting the control circuit 6 is provided.
[0045]
Here, the main circuit 5 is a circuit assembly in which a power semiconductor element (for example, IGBT) is mounted on a circuit board in combination with a freewheeling diode, and is mounted on the metal base 1 by soldering. The control circuit 6 is mounted on the circuit board with circuit components such as a drive IC for a power semiconductor element, and is bridged between the lead leg of the control terminal 4 and the relay terminal 10a that stands upward. 5 is disposed above.
[0046]
On the other hand, the main terminal 3 is insert-molded integrally with the peripheral wall portion of the surrounding case 2, and the terminal tip is made to stand upright to be drawn out to the upper surface side of the package. Further, the control terminal 4 is insert-molded into a single component control terminal block 9 which becomes a resin molded product as a pin terminal, and is assembled over the center of the upper surface of the outer case 2 so as to penetrate the case upper cover. Pulled out to the upper surface side, guide pins are planted at both ends. Reference numeral 7 denotes a bonding wire wired between the main circuit 5 and the main terminals 3 and the relay terminals 11.
[0047]
In the case of configuring the inverter device, in the conventional assembly structure, the printed circuit board 23 on the device side is overlapped with the IPM 21 so that the surface is parallel to the upper surface of the package of the module, and the main terminal 3 standing upright from the upper surface of the package is provided. 2. Since it is directly inserted and joined to the terminal insertion hole drilled in the printed circuit board, the IPM 21 assembled to the unit case 24, the printed circuit board on the apparatus side. The arrangement of the cooling fins 25 is necessarily limited.
[0048]
On the other hand, depending on the configuration designated by the user, the arrangement of the IPM and the printed board may not be compatible. For example, when there is a user's design requirement to change the cooling fin 25 arranged on the side surface of the unit case 24 in the control panel to the back side of the case 24, the IPM 21 together with the cooling fin 25 meets this requirement. Is moved to the rear side of the unit case 24, the direction of the main terminal 3 standing upright from the package of the IPM 21 and the direction of the terminal insertion hole drilled in the printed circuit board 23 installed in the front-rear direction of the apparatus are orthogonal to each other. In this state, the main terminal 3 cannot be directly inserted into the printed circuit board 23 and soldered.
[0049]
Therefore, the main circuit terminals drawn out from the upper surface of the module package are arranged in a straight line, and the lead terminals are made of a material that can be easily bent. When configuring an inverter device etc. in combination, even if there is a request to lay the module and the printed circuit board on the device side in different directions depending on the design requirements of the user, the main circuit terminal of the module is formed according to the layout, By changing the direction of the terminal tip, the main circuit terminal of the module can be directly inserted and connected to the terminal insertion hole formed in the printed circuit board.
[0050]
for that purpose,
(1) The main terminal of the module is a copper lead terminal, and the lead terminal is plated with nickel plating, solder plating, gold plating, etc., so that it can be soldered to the copper lead terminal, wire bonding, and connector. To improve contact with
[0051]
(2) The tip of the main terminal of the module is formed into an L shape, and the terminal is inserted into a terminal insertion hole drilled in the edge of the printed circuit board and joined to the terminal, and the printed circuit board on the apparatus side is attached to the power module in a vertical posture. By adopting this assembly structure, the cooling fin and the module are arranged on the back side of the unit case, and the apparatus printed circuit board is laid in the depth direction of the unit case and arranged in front of the module. Even in the case of the configuration, the printed circuit board can be attached to the module in a vertical posture by inserting the terminal insertion hole of the printed circuit board from the side into the main terminal (lead terminal) of the module bent into an L shape.
[0052]
That is, the structure of the IPM 21 is made of a material that can be bent (JIS C1100, C1020, C2600, C2680, etc.) as a lead terminal that becomes a pin or a plate, particularly for the main terminal 3, and the terminal is soldered. Nickel plating with a film thickness of 10 μm or less, solder plating with a film thickness of 10 μm or less, or gold plating with a film thickness of 2 μm or less (in the case of gold plating, gold plating on the Ni plating) ).
[0053]
When the inverter device is assembled by combining the IPM 21 with the cooling fins 25 and the device-side printed circuit board 23, the main terminals standing upright from the upper surface of the package of the IPM 21 in accordance with the layout according to the design requirements on the user side. 3 is formed into a shape corresponding to the posture of the printed circuit board 23 to be combined with the module (bending process), and then directly inserted into the terminal insertion hole formed in the printed circuit board 23 and soldered to assemble the apparatus. To do.
[0054]
Here, as shown in FIG. 11, the cooling fins 25 are installed on the back side of the unit case 24, and the IPM 21 is assembled in the case by superimposing the metal base of the module on the front side. Is divided into two, and the divided board 23A, 23B is installed in the case in the front-rear direction and attached to the main terminal 3 of the IPM 21, taking as an example the assembly procedure shown in FIG. ) and (b). First, as shown in the enlarged view of FIG. 10 (a), the main terminals 3 of the IPM 21 are formed (bent) into an L shape with the tips of the lead terminals aligned. On the other hand, on the printed board 23A connected to the main terminal 3, terminal insertion holes 33a corresponding to the arrangement of the main terminals 3 are formed in a row along the edge of the board, and the printed board 23B connected to the control terminal 4 is formed. Is mounted with a connector 13 connected to a control terminal (pin terminal) at its end green.
[0055]
Here, in order to attach the printed circuit boards 23A and 23B to the IPM 21, with the printed circuit board 23A in a vertical posture as shown in the figure, a terminal drilled in the lower edge of the printed circuit board 23A from the main terminal 3 of the IPM 21 from the side. The insertion hole 33a is inserted from the side, and the main terminal 3 and the conductor pattern of the printed board 23A are soldered. On the other hand, the print base 23B aligns the connector 13 with the control terminals 4 arranged in a horizontal row, and pushes it in from above to connect it. As a result, as shown in FIG. 10B, the printed boards 23A and 23B divided into two pieces in the IPM 21 are connected in a vertical posture. And after combining the cooling fin 25 with said circuit assembly, this is integrated in the unit case 24, and the inverter apparatus of FIG. 11 is comprised. In this way, by connecting and holding the printed boards 23A and 23B to the IPM 21 in a vertical posture, the upper surface of the IPM 21 is not blocked by the printed board, so that the heat dissipation to the upper surface side of the IPM itself is increased. In addition, noise entering the IPM 21 from the printed circuit board 23 is also reduced.
[0056]
【The invention's effect】
As described above, according to the configurations described in the first to thirteenth aspects of the present invention, the following effects can be obtained.
(1) Along with the miniaturization and thinning of semiconductor devices, the wiring path between the main terminal, power circuit, control circuit, and control terminal can be minimized, thereby making it difficult for the device to malfunction due to the influence of wiring inductance. Reliability can be improved.
[0057]
(2) The printed circuit board of the control circuit can be easily assembled and removed, and even if an IC failure is found during an intermediate check in the assembly process, only the control circuit can be removed and replaced easily.
(3) In the assembled state of the semiconductor device, the gel filler is not disturbed by the printed circuit board of the control circuit through the gap opened across the entire width between the outer case and the control terminal block. Easy injection to every corner.
[0058]
(4) Since the control terminal block is assembled to the outer case as an independent part, the length and arrangement of the pin terminals of the control terminal block are manufactured according to the user's specifications using the outer case as a common part. By doing so, it is possible to respond to individual customer requests at a low cost.
(5) According to the configuration of claim 5, the terminal lead hole opened in the case top cover is set to be slightly larger than the top contour of the control terminal block to form a recessed portion in the peripheral area of the control terminal block. When the connector attached to the printed circuit board on the peripheral circuit side is inserted into the terminal, unnecessary interference between the connector and the upper lid can be prevented and the connector can be securely inserted into the control terminal and connected.
[0059]
(6) By providing a gap-holding projection on the back side of the case top cover and having its tip opposed to the printed circuit board of the control circuit, even if the top cover warps or bends due to heat cycles, the top cover will remain on the printed board. There is no risk of touching or crushing the bonding wire wired above, and it is safe. In addition, by forming a concave portion on the upper surface side of the upper lid in conjunction with this protrusion, unnecessary interference with electronic components mounted on the back surface of the peripheral circuit printed board mounted on the upper surface of the semiconductor device is avoided. be able to.
[0060]
(7) The control terminal block is provided with a guide pin for positioning the printed circuit board of the control circuit at a fixed position, so that the assembly of the printed board and subsequent soldering to the control terminal can be performed accurately. it can.
(8) The both ends of the control terminal block are fitted into the recessed grooves formed in the outer case, and are joined by an adhesive. Here, an adhesive injection hole is opened at both ends of the terminal block, and the support is further supported. Dispenser by an XY axis robot in a temporarily assembled state in which the terminal block is fitted to the outer case by forming the adhesive guide groove on the inner peripheral surface of the groove and the inner surface of the concave groove on the outer case side Can be applied and evenly applied to the joint surface by operation.
[0061]
(9) For an inverter device configured by combining a semiconductor power module such as an IPM with a cooling fin and a printed circuit board on the device side, the main terminal drawn from the upper surface of the module package is inserted into the terminal insertion hole of the printed circuit board. This is a semiconductor device that is assembled by inserting and connecting the control terminal to the connector equipped on the printed circuit board side, and the module's main terminal as a pin or plate-like lead terminal made of a material that can be bent After arranging the lead terminals into a shape corresponding to the mounting posture of the printed circuit board on the device side to be combined with the module, insert the lead terminals into the terminal insertion holes of the printed circuit board. A module that is built into a unit case like a conventional device by soldering, Printed board. The layout of the cooling fins is not uniquely limited, and the main terminals of the module are bent according to the orientation of the printed circuit board even in the layout in which the printed circuit board of the device is laid in a different direction with respect to the module. As a result, the printed circuit board can be directly inserted into the module and soldered, so that it is possible to meet individual design requirements on the user side without changing the package structure of the module.
[0062]
As a result, the reliability and assembly of the semiconductor device can be improved.
[Brief description of the drawings]
1A and 1B are assembly structure diagrams of a semiconductor device according to an embodiment of the present invention, in which FIG. 1A is a plan view with a case top cover removed, and FIG. 1B is a cross-sectional view taken along line XX in FIG.
FIG. 2 is a plan view of a state in which the power circuit in FIG. 1 is mounted on a metal base.
3 is a state diagram in which an outer case is combined with the assembly of FIG. 2 and wire bonding is performed between the power circuit and (a) is a plan view, and (b) is an arrow X- X cross section
4 is a completed view of a product in which the case top cover is attached to the assembly of FIG. 1, (a) is a plan view, (b) is a sectional view taken along line XX in (a), and (c) is an external view. Perspective view
5A and 5B are configuration diagrams of a case top cover according to an application example of the present invention, in which FIG. 5A is a plan view, FIG. 5B is a side view, and FIG. 5C is a cross-sectional view taken along line AA in FIG.
6 is an external perspective view of a semiconductor device with the case top cover of FIG. 5 attached thereto.
FIG. 7 is a sectional view of an assembly structure of a semiconductor device according to an application example of the invention.
FIGS. 8A and 8B show an application example of a control terminal block, where FIG. 8A is a plan view with a case top lid removed, and FIG. 8B is a side sectional view of FIG.
9 is a configuration diagram of a main part of FIG. 8, in which (a) is an exploded perspective view of an outer casing and a control terminal block, and (b) is an enlarged plan view of a concave groove portion formed in the outer casing in (a).
FIGS. 10A and 10B are diagrams illustrating an assembling procedure of a module and a printed circuit board according to an application example of the present invention, and FIGS. 10A and 10B are perspective views showing states before and after assembling, respectively.
11 is an assembly configuration diagram of an inverter device corresponding to FIG. 10;
12A and 12B are assembly structure diagrams of a conventional semiconductor device, in which FIG. 12A is an exploded perspective view, and FIG.
13 is an assembly structure diagram of a conventional example of a two-story semiconductor device different from FIG. 12, in which (a) is an exploded perspective view and (b) is an assembled perspective view.
[Explanation of symbols]
1 Metal base
2 Enclosure case
2a Concave groove for terminal block mounting
2a-1 Adhesive guide groove
3 Main terminal
4 Control terminal
4a Terminal lead
5 Power circuit
5a Power circuit board
5b Power semiconductor element
6 Control circuit
6a Printed circuit board
6b IC
7 Bonding wire
9 Control terminal block
9a Supports at both ends
9a-1 Adhesive injection hole
9a-2 Adhesive guide groove
9b top
9d Guide pin for supporting control circuit
10 Relay terminal block
10a Terminal lead
11 Case top cover
11a Terminal extraction hole
11b Concave surface
11c Projection for spacing
21 IPM
23 Printed circuit board on the device side
24 unit case
25 Cooling fin
26 packages

Claims (13)

  1. A package consisting of a metal base for heat dissipation, a terminal-integrated outer case with insert-molded external lead-out terminals of the main circuit, and a top cover, and a power circuit and a control circuit are housed in a two-story manner, and each circuit is contained in the package A semiconductor device sealed with a gel-like filler injected into the substrate, a power circuit in which a power semiconductor element is mounted on a circuit board is mounted on a metal base, and a control circuit includes an IC for driving the power semiconductor element on a printed circuit board In the configuration where the circuit components are mounted and arranged above the power circuit,
    The external lead-out terminal for the control circuit is inserted into a terminal block that becomes an independent part as a pin terminal, and the control terminal block is bridged and fixed near the center of the upper surface of the outer case, and the control terminal block is connected to the inside of the case. A printed circuit board of the control circuit is carried and connected between the control terminal lead protruding toward the relay terminal and the relay terminal lead standing from the relay terminal block arranged inside the outer case, and the power circuit is connected via the relay terminal lead. And a control circuit are connected to each other.
  2. 2. The semiconductor device according to claim 1, wherein a bare chip is employed for the IC mounted on the printed circuit board of the control circuit.
  3. 2. The semiconductor device according to claim 1, wherein the IC mounted on the printed circuit board of the control circuit is laid out in accordance with the arrangement of the power semiconductor elements of the power circuit.
  4. 2. The semiconductor device according to claim 1, wherein external lead-out terminals of the main circuit are arranged as pins or plate terminals in a concentrated manner on one side of the enclosing case, and the control terminal block is arranged in parallel with the terminal row. And a control circuit arranged in a region between the control terminal block and the side of the outer case opposite to the terminal row.
  5. 2. The semiconductor device according to claim 1, wherein a terminal lead hole is opened in the case upper lid, and the terminal lead hole is set to be slightly larger than a top contour of the control terminal block.
  6. 2. The semiconductor device according to claim 1, wherein a protrusion for holding a gap is provided on the back surface of the case upper lid so that the tip thereof faces the upper surface of the control circuit printed board.
  7. 7. The semiconductor device according to claim 6, wherein the projections for holding the gap are distributed on the back surface of the concave surface portion formed on the upper surface side of the case upper lid.
  8. 2. The semiconductor device according to claim 1, wherein guide pins for positioning and supporting the printed circuit board of the control circuit are provided on the control terminal block.
  9. 2. The semiconductor device according to claim 1, wherein the support portions formed at both ends of the control terminal block are fitted into concave grooves formed on the inner surface side of the outer case of the package and bonded with an adhesive. .
  10. 10. The semiconductor device according to claim 9, wherein an adhesive injection hole that is open on an upper surface of the control terminal block is provided at both ends of the support terminal block, and the injection is provided on the inner surface of the recessed groove portion of the outer casing and on the outer surface of the support portion of the block. A semiconductor device characterized in that an adhesive guide groove for guiding an adhesive injected from a hole to a bonding surface is formed.
  11. In the inverter device using the semiconductor device according to claim 1,
    The device assembled by combining the semiconductor device, the cooling fin and the inverter device side printed circuit board constituting the control and protection circuit of the inverter device,
    Superimposing heat radiation fins on the metal base of the semiconductor device,
    The main terminal of the semiconductor device is inserted into the terminal insertion hole of the printed circuit board on the inverter device side and soldered , and the control terminal of the semiconductor device is inserted and connected to the connector provided on the printed circuit board side of the inverter device side. West,
    Mounting the printed circuit board on the device side, in which the main terminals of the semiconductor device are arranged in a row on the upper surface of the package as pins or plate-like lead terminals made of a material that can be bent, and the lead terminals are combined with the semiconductor device in terms of the Fuomingu into a shape corresponding to the posture, an inverter apparatus, characterized in that the solder joint by inserting a pin tip into the terminal insertion holes of the printed circuit board of the inverter apparatus.
  12. An inverter apparatus according to claim 11, wherein the main terminals of the semiconductor device and the copper of the lead terminals, and nickel plating to the lead terminals, the inverter apparatus characterized by having been subjected to solder plating or gold plating.
  13. 12. The inverter device according to claim 11, wherein the tip of the main terminal of the semiconductor device is formed into an L shape, and the main terminal is inserted from the side into a terminal insertion hole formed along the edge of the printed circuit board on the device side. An inverter device characterized in that a printed circuit board is attached in a vertical posture with respect to a semiconductor device.
JP2002188178A 2001-07-23 2002-06-27 Semiconductor device and inverter device using the same Active JP3901038B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2001-220913 2001-07-23
JP2001220913 2001-07-23
JP2001-220914 2001-07-23
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JP2001-382405 2001-12-17
JP2001382405 2001-12-17
JP2002188178A JP3901038B2 (en) 2001-07-23 2002-06-27 Semiconductor device and inverter device using the same

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JP4715283B2 (en) * 2005-04-25 2011-07-06 日産自動車株式会社 Power converter and manufacturing method thereof
JP4640089B2 (en) * 2005-10-03 2011-03-02 日産自動車株式会社 Power converter
DE102006014582B4 (en) * 2006-03-29 2011-09-15 Infineon Technologies Ag Semiconductor module
US7944042B2 (en) 2007-03-08 2011-05-17 Fuji Electric Device Technology Co., Ltd. Semiconductor device and method of manufacturing same
JP4818218B2 (en) * 2007-07-27 2011-11-16 三洋電機株式会社 Power supply for vehicle
JP5251066B2 (en) * 2007-10-15 2013-07-31 富士電機株式会社 Semiconductor device
JP5176507B2 (en) * 2007-12-04 2013-04-03 富士電機株式会社 Semiconductor device
JP2012238651A (en) * 2011-05-10 2012-12-06 Ikegami Tsushinki Co Ltd Housing heat radiation structure for field pickup unit
JP2013057581A (en) 2011-09-08 2013-03-28 Mitsubishi Electric Corp Evaluation substrate
JP6485257B2 (en) * 2015-07-01 2019-03-20 富士電機株式会社 Semiconductor device and manufacturing method of semiconductor device
JP6444451B2 (en) * 2017-05-22 2018-12-26 三菱電機株式会社 Insert resin molded product

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