CN216849927U - Packaging structure for improving reliability of GaN chip - Google Patents
Packaging structure for improving reliability of GaN chip Download PDFInfo
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- CN216849927U CN216849927U CN202220446989.9U CN202220446989U CN216849927U CN 216849927 U CN216849927 U CN 216849927U CN 202220446989 U CN202220446989 U CN 202220446989U CN 216849927 U CN216849927 U CN 216849927U
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Abstract
The utility model discloses an improve packaging structure of gaN chip reliability, which comprises a substrate, the top of base plate is fixedly connected with adhesion layer and pin board respectively, the fixed adhesion in top on adhesion layer has the chip, the fixed adhesion in top of chip has the heat-conducting layer, the fixed adhesion in top of heat-conducting layer has the insulating layer, the fixed adhesion in top of insulating layer has the heat-conducting plate, the top fixedly connected with casing of base plate, the top fixedly connected with closing cap of casing, the top of heat-conducting plate and the bottom swing joint of closing cap, the top of closing cap is run through and is provided with fixing bolt, fixing bolt's bottom is run through to in the heat-conducting plate. This practicality possesses the good advantage of radiating effect, has solved GaN chip packaging structure at long-time during operation, and is relatively poor to the radiating effect and the protecting effect of GaN chip, has reduced the reliability that the GaN chip used, leads to the heat that the GaN chip produced to pile up the problem in packaging structure easily.
Description
Technical Field
The utility model relates to a gaN chip packaging technology field specifically is an improve packaging structure of gaN chip reliability.
Background
The GaN chip has smaller chip size, higher bearable switching frequency and greatly increased power density, the chip package is a shell for mounting a semiconductor integrated circuit chip and has the functions of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, the chip package is a bridge for communicating the internal world of the chip with an external circuit, the connection point of the chip is connected to the pin of the package shell by a lead, and the pin is connected with other devices by the lead on the printed board.
When the GaN chip packaging structure works for a long time, the heat dissipation effect and the protection effect of the GaN chip are poor, the use reliability of the GaN chip is reduced, and heat generated by the GaN chip is easily accumulated in the packaging structure.
Disclosure of Invention
An object of the utility model is to provide an improve packaging structure of gaN chip reliability possesses the good advantage of radiating effect, has solved gaN chip packaging structure at long-time during operation, and is relatively poor to gaN chip's radiating effect and protecting effect, has reduced the reliability that gaN chip used, leads to the heat that gaN chip produced to pile up the problem in packaging structure easily.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an improve packaging structure of GaN chip reliability, includes the base plate, fixedly connected with adhesion layer and pin board respectively at the top of base plate, the fixed adhesion in top on adhesion layer has the chip, the fixed adhesion in top of chip has the heat-conducting layer, the fixed adhesion in top of heat-conducting layer has the insulating layer, the fixed adhesion in top of insulating layer has the heat-conducting plate, the top fixedly connected with casing of base plate, the top fixedly connected with closing cap of casing, the top of heat-conducting plate and the bottom swing joint of closing cap, the top of closing cap is run through and is provided with fixing bolt, fixing bolt's bottom is run through to in the heat-conducting plate, the top fixedly connected with fin of closing cap.
For the convenience of connecting circuit board, as the utility model discloses an improve packaging structure of GaN chip reliability is preferred, the pin has all been welded to the left and right sides of pin board, the pin is kept away from the one end of pin board and is run through to the surface of casing.
In order to carry out spacing its of preventing to the chip and rock, conduct the utility model discloses an improve packaging structure of GaN chip reliability is preferred, the top fixedly connected with locating part of pin board, the surface of chip and the inner wall swing joint of locating part.
In order to facilitate passing through metal lead wire connection chip and pin board, conduct the utility model discloses an improve packaging structure of GaN chip reliability is preferred, the top of chip is provided with first connecting pin, the top of pin board is provided with the second and connects the foot, first connecting pin passes through metal lead wire electric connection with the second connection foot.
In order to facilitate dismantling and installing the fin, as the utility model discloses an improve packaging structure of GaN chip reliability is preferred, one side that closing cap and fin are relative is provided with heat conduction silicone grease, the installed part has all been welded to the left and right sides of fin, the top of installed part is run through and is provided with mounting bolt, mounting bolt's bottom is run through to in the closing cap.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a base plate, closing cap, fin, construction bolt, installed part, casing, pin, fixing bolt, first connecting foot, second connecting foot, pin board, chip, heat-conducting plate, insulating layer, heat-conducting layer, adhesion layer and locating part's cooperation is used, has solved GaN chip packaging structure and has been used for a long time at long-time during operation, and is relatively poor to the radiating effect and the protecting effect of GaN chip, has reduced the reliability that the GaN chip used, leads to the heat that the GaN chip produced to pile up the problem in packaging structure easily.
2. The utility model discloses a set up the pin board, can carry out electric connection to pin and second connection foot, the cooperation of connecting foot and first connection foot through the second is used, can be convenient for carry out electric connection to pin board and chip, through setting up the insulating layer, can be convenient for insulate the top of chip, through setting up the heat-conducting layer, can be convenient for conduct the heat that the chip produced in the heat-conducting plate, cooperation through heat-conducting plate and closing cap is used, can be convenient for dispel the heat to the chip, through setting up the heat-conducting plate, can be convenient for increase the radiating effect of closing cap.
Drawings
FIG. 1 is an isometric view of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is an explosion diagram of the connection structure of the chip and the pin plate according to the present invention.
In the figure: 1. a substrate; 2. sealing the cover; 3. a heat sink; 4. installing a bolt; 5. a mounting member; 6. a housing; 7. a pin; 8. fixing the bolt; 9. a first connecting pin; 10. a second connecting pin; 11. a foot guide plate; 12. a chip; 13. a heat conducting plate; 14. an insulating layer; 15. a heat conductive layer; 16. an adhesion layer; 17. and a limiting member.
Detailed Description
Referring to fig. 1-3, a package structure for improving reliability of a GaN chip includes a substrate 1, the top of the substrate 1 is fixedly connected with an adhesion layer 16 and a pin plate 11, the top of the adhesion layer 16 is fixedly adhered with a chip 12, the top of the chip 12 is fixedly adhered with a heat conduction layer 15, the top of the heat conduction layer 15 is fixedly adhered with an insulation layer 14, the top of the insulation layer 14 is fixedly adhered with a heat conduction plate 13, the top of the substrate 1 is fixedly connected with a casing 6, the top of the casing 6 is fixedly connected with a sealing cover 2, the top of the heat conduction plate 13 is movably connected with the bottom of the sealing cover 2, the top of the sealing cover 2 is provided with a fixing bolt 8 in a penetrating manner, the bottom of the fixing bolt 8 penetrates into the heat conduction plate 13, and the top of the sealing cover 2 is fixedly connected with a heat sink 3.
In this embodiment: when it is desired to package chip 12, chip 12 is secured on top of adhesive layer 16, adhesive layer 16 adheres chip 12 on top of substrate 1, the chip 12 and the pin plate 11 are connected by metal leads, after the mounting is completed, an insulating layer 14 and a heat conducting layer 15 are sequentially coated on the top of the chip 12, and the heat conducting plate 13 is arranged on the top of the heat conducting layer 15, the insulating layer 14 is made of epoxy resin, the heat conducting layer 15 is made of heat conducting glue, after the installation is finished, the sealing cover 2 is fixed on the top of the shell 6, the sealing cover 2 and the heat conducting plate 13 are connected through the fixing bolt 8, and in the working process of the chip 12, the heat that chip 12 gived off enters into heat-conducting plate 13 through heat-conducting layer 15 in, heat-conducting plate 13 conducts the heat to closing cap 2 and dispels the heat, and heat dissipation piece 3 absorbs the heat of closing cap 2 to enlarge heat radiating area, increase packaging structure's radiating effect.
As a technical optimization scheme of the utility model, pin 7 has all been welded to the left and right sides of pin board 11, and pin 7 keeps away from the one end of pin board 11 and runs through to the surface of casing 6.
In this embodiment: through setting up pin 7, can be convenient for connect pin board 11 and circuit board, make the chip normally work on the circuit board, the quantity of pin 7 is a plurality of, and the through-hole that uses with the cooperation of pin 7 has all been seted up to the left and right sides of casing 6.
As a technical optimization scheme of the utility model, the top fixedly connected with locating part 17 of pin board 11, the surface of chip 12 and the inner wall swing joint of locating part 17.
In this embodiment: in the process of installing the chip 12, the outer surface of the chip 12 is movably connected with the inner wall of the limiting part 17, the limiting part 17 limits the chip 12, the chip 12 is prevented from shaking to cause damage, and safety protection is carried out on the chip 12.
As a technical optimization scheme of the utility model, the top of chip 12 is provided with first connecting foot 9, and the top of pin board 11 is provided with the second and connects foot 10, and first connecting foot 9 is connected foot 10 with the second and is passed through metal lead wire electric connection.
In this embodiment: through the cooperation use of first connecting pin 9 and second connecting pin 10, can be convenient for connect the metal lead wire between chip 12 and the pin board 11, first connecting pin 9 is convenient for weld the lead wire on chip 12, and second connecting pin 10 is convenient for weld the lead wire of the other end at the top of pin board 11.
As a technical optimization scheme of the utility model, one side that closing cap 2 and fin 3 are relative is provided with heat conduction silicone grease, and installed part 5 has all been welded to the left and right sides of fin 3, and installed part 5's top is run through and is provided with mounting bolt 4, and mounting bolt 4's bottom is run through to in the closing cap 2.
In this embodiment: through setting up heat conduction silicone grease, can be convenient for conduct the heat on the closing cap 2 in the fin 3, use through the cooperation of mounting bolt 4 and installed part 5, can be convenient for install fin 3 at the top of closing cap 2, and dismantle the clearance to fin 3.
When the chip 12 is required to be packaged, the chip 12 is fixed on the top of the adhesive layer 16, the chip 12 is adhered on the top of the substrate 1 by the adhesive layer 16, the chip 12 and the pin plate 11 are connected by metal leads, after the mounting is completed, an insulating layer 14 and a heat conducting layer 15 are sequentially coated on the top of the chip 12, and the heat conducting plate 13 is arranged on the top of the heat conducting layer 15, the insulating layer 14 is made of epoxy resin, the heat conducting layer 15 is made of heat conducting glue, after the installation is finished, the sealing cover 2 is fixed on the top of the shell 6, the sealing cover 2 and the heat conducting plate 13 are connected through the fixing bolt 8, and in the working process of the chip 12, the heat that chip 12 gived off enters into heat-conducting plate 13 through heat-conducting layer 15 in, heat-conducting plate 13 conducts the heat to closing cap 2 and dispels the heat, and heat dissipation piece 3 absorbs the heat of closing cap 2 to enlarge heat radiating area, increase packaging structure's radiating effect.
In summary, the following steps: this improve packaging structure of GaN chip reliability, through base plate 1, closing cap 2, fin 3, construction bolt 4, installed part 5, casing 6, pin 7, fixing bolt 8, first connecting foot 9, second connecting foot 10, pin board 11, chip 12, heat-conducting plate 13, insulating layer 14, heat-conducting layer 15, adhesion layer 16 and locating part 17's cooperation is used, GaN chip packaging structure has been solved at long-time during operation, it is relatively poor to the radiating effect and the guard effect of GaN chip, the reliability that the GaN chip used has been reduced, lead to the heat that the GaN chip produced to pile up the problem in packaging structure easily.
Claims (5)
1. A packaging structure for improving the reliability of a GaN chip comprises a substrate (1), and is characterized in that: the heat conduction plate comprises a base plate (1), wherein the top of the base plate (1) is fixedly connected with an adhesion layer (16) and a pin plate (11) respectively, the top of the adhesion layer (16) is fixedly adhered with a chip (12), the top of the chip (12) is fixedly adhered with a heat conduction layer (15), the top of the heat conduction layer (15) is fixedly adhered with an insulation layer (14), and the top of the insulation layer (14) is fixedly adhered with a heat conduction plate (13);
the utility model discloses a heat-conducting plate, including base plate (1), the top fixedly connected with casing (6) of casing (6), the top of heat-conducting plate (13) and the bottom swing joint of closing cap (2), the top of closing cap (2) is run through and is provided with fixing bolt (8), the bottom of fixing bolt (8) is run through to heat-conducting plate (13) in, the top fixedly connected with fin (3) of closing cap (2).
2. The package structure of claim 1, wherein: pins (7) are welded on the left side and the right side of the pin plate (11), and one end, far away from the pin plate (11), of each pin (7) penetrates through the outer surface of the shell (6).
3. The package structure of claim 1, wherein: the top of the pin plate (11) is fixedly connected with a limiting piece (17), and the outer surface of the chip (12) is movably connected with the inner wall of the limiting piece (17).
4. The package structure of claim 1, wherein: the top of chip (12) is provided with first connecting pin (9), the top of pin board (11) is provided with second connecting pin (10), first connecting pin (9) and second connecting pin (10) pass through metal lead electric connection.
5. The package structure of claim 1, wherein: one side that closing cap (2) and fin (3) are relative is provided with heat conduction silicone grease, installed part (5) have all been welded to the left and right sides of fin (3), the top of installed part (5) is run through and is provided with mounting bolt (4), the bottom of mounting bolt (4) is run through to in closing cap (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220446989.9U CN216849927U (en) | 2022-03-02 | 2022-03-02 | Packaging structure for improving reliability of GaN chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220446989.9U CN216849927U (en) | 2022-03-02 | 2022-03-02 | Packaging structure for improving reliability of GaN chip |
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| CN216849927U true CN216849927U (en) | 2022-06-28 |
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| CN202220446989.9U Active CN216849927U (en) | 2022-03-02 | 2022-03-02 | Packaging structure for improving reliability of GaN chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115832860A (en) * | 2022-11-21 | 2023-03-21 | 武汉泵浦科技有限公司 | Tunable laser chip |
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2022
- 2022-03-02 CN CN202220446989.9U patent/CN216849927U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115832860A (en) * | 2022-11-21 | 2023-03-21 | 武汉泵浦科技有限公司 | Tunable laser chip |
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