CN218896627U

CN218896627U - SBD device encapsulation heat radiation structure

Info

Publication number: CN218896627U
Application number: CN202223024793.XU
Authority: CN
Inventors: 周兵兵; 周炳
Original assignee: Dexing Yifa Power Semiconductor Co ltd
Current assignee: Dexing Yifa Power Semiconductor Co ltd
Priority date: 2022-11-15
Filing date: 2022-11-15
Publication date: 2023-04-21
Anticipated expiration: 2032-11-15

Abstract

The utility model discloses an SBD device packaging heat dissipation structure, which comprises: the novel solar cell comprises an SBD chip, an insulating packaging substrate, a first heat conducting block, a second heat conducting block, a first pin and a second pin, wherein the SBD chip is arranged in the insulating packaging substrate, the first pin is arranged on the upper portion of the SBD chip, bends and extends to the left lower side of the SBD chip to the outer side of the insulating packaging substrate, the second pin is arranged on the lower portion of the SBD chip, bends and extends to the right lower side of the SBD chip to the outer side of the insulating packaging substrate, a first insulating adhesive is arranged above the first pin, the first heat conducting block is arranged on the first insulating adhesive and extends upwards to the top surface of the insulating packaging substrate, a second insulating adhesive arranged right below the SBD chip is arranged on the bottom surface of the second pin, and the second heat conducting block is arranged at the bottom of the second insulating adhesive and extends downwards to the bottom surface of the insulating packaging substrate. The SBD device packaging heat dissipation structure has good heat dissipation effect and is beneficial to improving the use safety and reliability.

Description

SBD device encapsulation heat radiation structure

Technical Field

The utility model relates to the technical field of SBD device production, in particular to an SBD device packaging heat dissipation structure.

Background

SBDs (schottky diodes) require packaging during production, and are classified into two packaging forms, i.e., leaded and surface mount (chip-on-board) according to the packaging form.

In order to reduce the cost and ensure the insulation safety, the SBD can be packaged by adopting an insulation plastic material. The insulating plastic material has good insulating and dampproof effects, but has poor heat conduction and heat dissipation effects. The SBD device can generate heat during operation, if the heat dissipation effect is poor, the normal operation of the SBD device can be influenced by the generated heat accumulation, and the SBD device is damaged during severe operation. The utility model of application No. 202220648239.X discloses an anti-vibration schottky diode, in which a plurality of radiating fins are built, but the radiating fins are not in contact with the schottky chip or the outside air, so that the radiating effect is limited, and improvement is needed.

Disclosure of Invention

The utility model aims to provide an SBD device packaging heat dissipation structure, which ensures the structural safety and improves the heat dissipation effect.

To achieve the purpose, the utility model adopts the following technical scheme:

an SBD device package heat dissipation structure, comprising: the novel solar cell comprises an SBD chip, an insulating packaging substrate, a first heat conducting block, a second heat conducting block, a first pin and a second pin, wherein the SBD chip is arranged in the insulating packaging substrate, the first pin is arranged on the upper portion of the SBD chip, bends and extends to the left lower side of the SBD chip to the outer side of the insulating packaging substrate, the second pin is arranged on the lower portion of the SBD chip, bends and extends to the right lower side of the SBD chip to the outer side of the insulating packaging substrate, a first insulating adhesive arranged right above the SBD chip is arranged on the first pin, the first heat conducting block is arranged on the first insulating adhesive and extends upwards to the top surface of the insulating packaging substrate, a second insulating adhesive arranged right below the SBD chip is arranged on the bottom surface of the second pin, and the second heat conducting block is arranged at the bottom of the second insulating adhesive and extends downwards to the bottom surface of the insulating packaging substrate.

The top surface of the SBD chip is provided with first conductive adhesive connected with the first pins.

And the bottom surface of the SBD chip is provided with second conductive adhesive connected with the second pin.

Wherein, the first heat conduction block and the second heat conduction block adopt the aluminium piece respectively.

The top surface of the first heat conduction block is concavely provided with a plurality of first heat dissipation holes.

And a plurality of second heat dissipation holes are concavely formed in the bottom of the second heat conduction block.

The utility model has the beneficial effects that: the utility model provides a SBD device encapsulation heat radiation structure, specially designed first heat conduction piece and second heat conduction piece, can follow SBD chip top and below and carry out the conduction of heat, directly conduct the space to insulating encapsulation base member top and below with heat to increase the radiating area with the air contact through first louvre and second louvre, promoted the radiating effect, and utilized first insulating glue and second insulating glue to carry out insulation and heat conduction, be favorable to promoting security and the reliability of use.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a schematic view of the structure of fig. 1 with the insulating package matrix removed.

Detailed Description

The technical scheme of the utility model is further described below by means of specific embodiments in combination with fig. 1-2.

The SBD device package heat dissipation structure shown in fig. 1 includes: the SBD chip 8, the insulating packaging matrix 1, the first heat conduction block 11, the second heat conduction block 7, the first pin 3 and the second pin 2, wherein the SBD chip 8 is arranged in the insulating packaging matrix 1, the insulating packaging matrix 1 can be made of insulating plastic materials, the cost is low, and the insulating and dampproof effects are good.

The first leads 3 are disposed on the upper portion of the SBD chip 8 and bent and extended to the left and lower sides to the outside of the insulating package substrate 1, and in this embodiment, the top surface of the SBD chip 8 is provided with a first conductive adhesive 12 connected to the first leads 3, so as to electrically connect the SBD chip 8 and the first leads 3.

The second pins are disposed at the lower part of the SBD chip and bent and extended to the outer side of the insulating package substrate towards the right lower side, in this embodiment, the second conductive adhesive 4 connected with the second pins 2 is disposed on the bottom surface of the SBD chip 8, so that the electrical connection between the SBD chip 8 and the second pins 2 is performed, and the structure is stable and the assembly is convenient.

In this embodiment, the first insulation glue 9 located right above the SBD chip 8 is disposed on the first lead 3, the first heat conducting block 11 is disposed on the first insulation glue 9 and extends upward to the top surface of the insulating package substrate 1, and conducts heat from above the SBD chip 8, directly conducts heat to the space above the insulating package substrate 1, and avoids the problem of electric leakage through the first insulation glue 9.

As shown in fig. 1, the bottom surface of the second lead 2 is provided with a second insulating adhesive 5 located right below the SBD chip 8, and the second heat conducting block 7 is disposed at the bottom of the second insulating adhesive 5 and extends downward to the bottom surface of the insulating package substrate 1, and conducts heat from below the SBD chip 8 through the second heat conducting block 7, so as to directly conduct heat to a space below the insulating package substrate 1.

In this embodiment, the first heat conducting block 11 and the second heat conducting block 7 are aluminum blocks respectively, so that the self weight is light, and the heat conducting effect is good. As shown in fig. 1, the top surface indent of the first heat conduction block 11 is provided with a plurality of first heat dissipation holes 10, the bottom indent of the second heat conduction block 7 is provided with a plurality of second heat dissipation holes 6, which increases the heat dissipation area contacting with air, improves the heat dissipation effect, and makes the work of the SBD chip 8 more stable and the reliability of the use process high.

In addition, the first heat dissipation holes 10 and the second heat dissipation holes 6 can be matched with positioning pins in the mold, so that the embedded positioning of the first heat conduction block 11 and the second heat conduction block 7 is realized when the insulating packaging substrate 1 is molded, the positioning of the SBD chip 8 in the mold is further realized, and the production convenience is improved.

The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims

1. An SBD device package heat dissipation structure, comprising: the novel solar cell comprises an SBD chip, an insulating packaging substrate, a first heat conducting block, a second heat conducting block, a first pin and a second pin, wherein the SBD chip is arranged in the insulating packaging substrate, the first pin is arranged on the upper portion of the SBD chip, bends and extends to the left lower side of the SBD chip to the outer side of the insulating packaging substrate, the second pin is arranged on the lower portion of the SBD chip, bends and extends to the right lower side of the SBD chip to the outer side of the insulating packaging substrate, a first insulating adhesive arranged right above the SBD chip is arranged on the first pin, the first heat conducting block is arranged on the first insulating adhesive and extends upwards to the top surface of the insulating packaging substrate, a second insulating adhesive arranged right below the SBD chip is arranged on the bottom surface of the second pin, and the second heat conducting block is arranged at the bottom of the second insulating adhesive and extends downwards to the bottom surface of the insulating packaging substrate.

2. The SBD device package heat dissipation structure of claim 1, wherein a top surface of the SBD chip is provided with a first conductive paste connected to the first leads.

3. The SBD device package heat dissipation structure of claim 1, wherein a bottom surface of the SBD chip is provided with a second conductive paste connected to the second leads.

4. The SBD device package heat dissipation structure of claim 1, wherein the first and second heat conductive blocks each comprise an aluminum block.

5. The SBD device package heat dissipation structure of claim 1, wherein the top surface of the first heat conductive block is recessed with a plurality of first heat dissipation holes.

6. The SBD device package heat dissipation structure of claim 1, wherein the second heat conductive block has a plurality of second heat dissipation holes recessed in a bottom thereof.