CN109768019A - A kind of power module cooling fin and power module made of it - Google Patents
A kind of power module cooling fin and power module made of it Download PDFInfo
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- CN109768019A CN109768019A CN201811633810.5A CN201811633810A CN109768019A CN 109768019 A CN109768019 A CN 109768019A CN 201811633810 A CN201811633810 A CN 201811633810A CN 109768019 A CN109768019 A CN 109768019A
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Abstract
The invention discloses a kind of power module cooling fin and power modules made of it, the heat-radiating substrate is copper sheet, cooling fin further includes the antioxidant coating and resin layer for being separately positioned on copper sheet opposite sides, and resin layer is single layer structure resin layer or double-layer structure resin layer；When resin layer is single layer structure resin layer, single layer structure resin layer is made of the first composition epoxy resin, when resin layer is double-layer structure resin layer, double-layer structure resin layer includes the first resin layer being formed on copper sheet and the second resin layer being formed on the first resin layer, first resin layer is made of the second composition epoxy resin, and the second resin layer is made of third composition epoxy resin；And using power module made of above-mentioned cooling fin；The present invention has that high insulation performance, high-cooling property, scraping and wiping resistance performance are good, are convenient for surface-pasted power module cooling fin, and has both excellent high temperature resistance, while being also equipped with more excellent adhesive property and hardness.
Description
Technical field
The invention belongs to cooling fin fields, and in particular to a kind of power module cooling fin and power mould made of it
Block.
Background technique
The intelligent power module (Intelligent Power Module) being born in recent years is that a kind of new power is opened
The advantages of pass device, it is integrated with GTR and MOSFET, there is high voltage, high input impedance, high switching frequency, low driving power
The advantages that.IPM has been internally integrated logic, control, detection and protection circuit, is easy to use, not only reduces the body of system
The long-pending and development time, the feasibility of system is also greatly strengthened, the developing direction of current power device has been adapted to --- module
Change, Composite and power integrated circuit (PIC), in weaving loom, injection molding machine, convertible frequency air-conditioner, washing machine, refrigerator, electric car, thunder
It is more and more widely used up to the medium field such as servo-system.Compared with conventional power module, intelligent power module body
The features such as product power device that is small, compact-sized and containing is more, cause its power density bigger, and local pyrexia is also more serious, by
Problem of Failure caused by overheating has become one of the bottleneck of intelligent power module development.
Although also having in intelligent power module in the prior art using cooling fin, the substrate that traditional cooling fin uses
For aluminum substrate, the thermal conductivity of aluminium sheet is far from copper sheet height, but copper is easy to happen when being influenced by environment such as moisture, high temperature
Oxidation, in addition copper sheet is being carried and is being easy to happen scratch in use process, its service life is influenced, therefore it is required that copper face is with resistance to
The characteristics such as scratch, resistance to oxidation；In addition, the thermal insulation layer that usually cooling fin uses is single layer structure, insulation performance is limited.Usually
Overall thermal conductivity≤2W/MK of cooling fin, is not achieved IPM for requirement-thermal coefficient >=2.5W/MK of high thermal conductivity,
And traditional technique needs for electronic component to be directly welded at cooling fin (such as cover copper aluminum substrate, cover copper ceramic substrate)
On, dress patch processing is more troublesome.
Based on this, those skilled in the art proposes a kind of improvement project, such as patent CN105280587B, disclosure
Power module cooling fin and power module made of it, the cooling fin include layers of copper, are covered in the one side of layers of copper
One layer of antioxidant coating, the antioxidant coating is by one kind or two or more in silica, aluminium oxide, zirconium oxide, titanium oxide
Inorganic oxide be principal component, the other one side of layers of copper it is upper it is compound not only insulate but also radiate and heat after there is the tree of adhesion strength
Rouge layer, the antioxidant coating with a thickness of 10nm~2 μm, the layers of copper with a thickness of 20 μm~5mm, the resin
Layer with a thickness of 50 μm~1mm, the resin layer includes the hardened layer being formed in the layers of copper, is formed in the hardened layer
On following layer, the gel fraction of the hardened layer is greater than 50%, and the gel fraction of the following layer is less than 50%.
However although this patent realizes preferable thermal conductivity, rub resistance and insulating properties, but in practice, compared with high standard
In the case where standard, the performances such as heating conduction, adhesive property, hardness are still slightly inadequate, wherein at relatively high temperatures (130 DEG C with
On), there is also the reduced performances such as insulating properties, thermal conductivity, adhesive property, proof voltage even larger amplitudes for the made cooling fin of this patent
Spend the potential risk cut down.
Therefore, those skilled in the art urgently seeks a kind of methods to solve the above problems.
Summary of the invention
The technical problem to be solved by the present invention is to overcome deficiency in the prior art, provide a kind of with high insulating properties
Energy, high-cooling property, scraping and wiping resistance performance are good, are convenient for surface-pasted power module cooling fin, and have both excellent heat-resisting quantity
Can, the pattern and properties that can still maintain whole between 150-200 DEG C are basically unchanged, while being also equipped with more excellent
Adhesive property and hardness.
The present invention additionally provides a kind of power module using above-mentioned cooling fin simultaneously.
In order to solve the above technical problems, a kind of technical solution that the present invention takes is as follows:
A kind of power module cooling fin, the cooling fin include heat-radiating substrate, and the heat-radiating substrate is copper sheet, described to dissipate
Backing further includes the antioxidant coating and resin layer for being separately positioned on the copper sheet opposite sides, and the resin layer is single layer structure
Resin layer or double-layer structure resin layer；
When the resin layer is single layer structure resin layer, the single layer structure resin layer is by the first composition epoxy resin
Constitute, in terms of mass fraction, the raw material of first composition epoxy resin include 5-25 parts the first epoxy resin, 2-12 parts
The first phenoxy resin, 2-20 parts of the first curing agent, 65-95 parts of the first heat filling, 0-10 parts of the first dispersing agent；
When the resin layer is double-layer structure resin layer, the double-layer structure resin layer includes being formed on the copper sheet
The first resin layer and the second resin layer for being formed on first resin layer, first resin layer is by the second asphalt mixtures modified by epoxy resin
Oil/fat composition is constituted, and second resin layer is made of third composition epoxy resin；
Wherein, in terms of mass fraction, the raw material of second composition epoxy resin includes 5-25 parts of the second asphalt mixtures modified by epoxy resin
Rouge, 0-12 parts of the second phenoxy resin, 0-20 parts of the first toughening rubber, 5-25 parts of the second curing agent, the of 65-95 parts
Two heat fillings, 0-10 parts of the second dispersing agent, the raw material of the third composition epoxy resin include 5-25 parts of third ring
Oxygen resin, 0-12 parts of third phenoxy resin, 1-20 parts of the second toughening rubber, 2-20 parts of third curing agent, 65-95 parts
Third heat filling, 0-10 parts of third dispersing agent；When in the raw material of second composition epoxy resin without described the
When two phenoxy resins, second epoxy resin is made of at least two epoxy resin；When the third epoxy composite
When being free of the third phenoxy resin in the raw material of object, the third epoxy resin is made of at least two epoxy resin.
Some preferred aspects according to the present invention, when the resin layer is single layer structure resin layer, the single layer structure
The gel fraction of resin layer is less than 50%；
When the resin layer is double-layer structure resin layer, the gel fraction of first resin layer is greater than 50%, and described the
The gel fraction of two resin layers is less than 50%.
Some preferred aspects according to the present invention, first epoxy resin, second epoxy resin and the third
Epoxy resin is separately selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin and modified ring
One of oxygen resin or a variety of combinations；
When being free of second phenoxy resin in the raw material of second composition epoxy resin, second epoxy
Resin by bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin and modified epoxy at least
Two kinds of epoxy resin are constituted；When being free of the third phenoxy resin in the raw material of the third composition epoxy resin, institute
Third epoxy resin is stated by selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin and modified epoxy
At least two epoxy resin are constituted in resin.
More according to the present invention specific and preferred aspect, the bisphenol A type epoxy resin are selected from: South Asia epoxy resin
NPES-901, NPES-902, NPES-903, NPES-903H, NPES-904, NPES-904H, NPES-907, NPES- of company
909；YD-011, YD-012, YD-013, YD-127, YD-127, YD134, YD-901, YD- of national capital chemical company, South Korea
9021；834,1001,1002,1003,1055, the 1004 of Mitsubishi Chemical.
More according to the present invention specific and preferred aspect, the bisphenol f type epoxy resin are selected from: South Asia asphalt mixtures modified by epoxy resin
NPEF-170, NPEF-175 of rouge company, national capital chemical company, South Korea YDF-170, YDF-2001, YDF-2004；Mitsubishi
4005P, 4007P, 4010P.
More according to the present invention specific and preferred aspect, the phenol aldehyde type epoxy resin are selected from South Asia epoxy resin
NPPN-631, NPPN-638S, NPPN-431, NPPN-438, NPPN-272H etc. of company；The EPALLOY of CVC company, the U.S.
8240,EPALLOY 8240E,EPALLOY 8250,EPALLOY8330；YDPN-638, YDPN- of national capital chemical company, South Korea
641、YDPN-644。
More according to the present invention specific and preferred aspect, the modified epoxy are selected from: CVC company, the U.S.
HyPox UA10,HyPox UA11,HyPox DA323；NPER-133L, NPER-450 of South Asia epoxy resin company；State, South Korea
All YD-171, YD-172, KR-628, KR-692, KR-693, KSR-1000, UME-305, UME-315, UME- of chemical company
330。
Some preferred aspects according to the present invention, first toughening rubber, second toughening rubber are respectively to be selected from
One of acrylic rubber, nitrile rubber, silicon rubber, polyurethane rubber and fluorubber or a variety of combinations.
More according to the present invention specific and preferred aspect, first toughening rubber, second toughening rubber point
It Wei not Nipol SBR1723, Nipol SBR1739, Nipol SBR9548, Nipol SBR independently selected from ZEON
NS460、Nipol SBR NS552、Nipol BR1220SG、Nipol BR1220SB、Nipol IR2200、Nipol NBR
DN003、Nipol NBR N41、Nipol NBR DN101、Nipol NBR DN21、Nipol NBR DN4050、Nipol NBR
DN3335,Nipol NBR DN3350,Nipol NBR DN3380,Nipol AR31,Nipol AR51,Nipol AR14；Day
The XER32 of this JSR, XER41, XER81, XER91, XER92.
Some preferred aspects according to the present invention, the inventory of second toughening rubber and the third epoxy resin and
The mass ratio of the total amount of feeding of second phenoxy resin is 1: 7-9.
More according to the present invention specific and preferred aspect, contains when in the raw material of second composition epoxy resin
When second phenoxy resin, the mass ratio that feeds intake of first epoxy resin and first phenoxy resin is 2-4: 1；
When containing the third phenoxy resin in the raw material of the third composition epoxy resin, the third epoxy resin and the
The mass ratio that feeds intake of triple phenoxyl resin is 2-4: 1.
More according to the present invention specific and preferred aspect, the phenoxy resin are selected from bisphenol A-type phenoxy group tree
One of rouge, bisphenol-f type phenoxy resin, bisphenol S type phenoxy resin or a variety of combinations, it is preferable that the phenoxy group
The weight average molecular weight Mw of resin is 10000~100000.
Some specific aspects according to the present invention, the bisphenol A-type phenoxy resin includes but is not limited to: InChem is public
PKHA, PKHB, PKHB+, PKHC, PKHH, PKHJ, PKFE etc. of department；The 1256 of Mitsubishi Chemical；The YP- of aurification lives in Nippon Steel
50、YP-50S、YBP-40PXM40、ERF-001M30。
Some specific aspects according to the present invention, the bisphenol-f type phenoxy resin include but is not limited to that Nippon Steel lives
The FX-316 etc. of aurification.
Some specific aspects according to the present invention, the bisphenol-A and Bisphenol F mixed type phenoxy resin include but unlimited
In Mitsubishi Chemical 4250,4276 etc., YP-70, ZX-1356-2 etc. of aurification live in Nippon Steel.
Some specific aspects according to the present invention, the bisphenol-A and bisphenol S mixed type phenoxy resin include but unlimited
The YPS-007A30 of aurification is lived in Nippon Steel.
Some specific aspects according to the present invention, the phenoxy resin are also an option that the phenoxy resin of special construction
FX-293, FX-280S, FX-310T40 of aurification live in such as Nippon Steel.
More according to the present invention specific and preferred aspect, first curing agent, second curing agent and described
Third curing agent is separately selected from one of amine hardener, imidazole curing agent, phenol curing agent and anhydride curing agent or more
The combination of kind.
It is further preferred that first curing agent, second curing agent and the third curing agent are separately
Selected from amine hardener and/or imidazole curing agent；
Wherein, the amine hardener is in dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone
One or more combinations；The imidazole curing agent be selected from 1- methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole,
N- (3- aminopropyl)-imidazoles, 1- vinyl imidazole, 2- vinyl imidazole, 2- phenylimidazole, 2- phenyl -4-methylimidazole, 1- benzyl
Base -2-methylimidazole, 1- benzyl -2- phenylimidazole, DMIZ 1,2 dimethylimidazole, 1- 1-cyanoethyl-2-methylimidazole, 1- cyanoethyl -
One of 2-ethyl-4-methylimidazole, 1- cyanoethyl -2- undecyl imidazole and 1-cyanoethyl-2-phenylimidazole are a variety of
Combination.
Some specific aspects according to the present invention, the anhydride curing agent preferably comprise acid anhydrides with aromatic backbone,
The modifier of the hydride of the acid anhydrides or the acid anhydrides, or the hydride comprising acid anhydrides, the acid anhydrides with alicyclic skeleton or
The modifier of the acid anhydrides.
Some preferred aspects according to the present invention, when the resin layer is single layer structure resin layer, first dispersion
The additive amount of agent accounts for the 0.1-5% of the first epoxy resin layer gross mass；
When the resin layer is double-layer structure resin layer, the additive amount of second dispersing agent accounts for second asphalt mixtures modified by epoxy resin
The 0.1-5% of rouge layer gross mass；The additive amount of the third dispersing agent accounts for the 0.1- of the third epoxy resin layer gross mass
5%.Being added with for dispersing agent is conducive to be promoted the adherence between resin and heat filling, and increases resin layer and heat-radiating substrate
Between density.
More according to the present invention specific and preferred aspect, the dispersing agent are selected from titanate coupling agent, Aluminate
The combination of one or more of coupling agent, organo silane coupling agent, Organic Chromium complex coupling agent and boric acid ester coupler.
Some specific aspects according to the present invention, the titanate coupling agent include (the dioctylphyrophosphoric acid acyl of isopropyl three
Oxygroup) titanate esters, isopropyl three (dioctyl phosphoric acid acyloxy) titanate esters, isopropyl two oleic acid acyloxy (dioctyl phosphoric acid acyl
Oxygroup) titanate esters, monoalkoxy unsaturated fatty acid titanate esters, Di(dioctylpyrophosphato) ethylene titanate and three second
Chelate, Di(dioctylpyrophosphato) ethylene titanate of hydramine etc..
Some specific aspects according to the present invention, the aluminate coupling agent include aluminium titanium compound, two (acetoacetates
Ethoxycarbonyl) aluminic acid isopropyl ester, two (acetylacetone,2,4-pentanedione) aluminic acid diisopropyl esters, isopropyl stearic acid oxygen base aluminum acid ester, isopropyl two
Stearoyl-oxy Aluminate etc..
Some specific aspects according to the present invention, the organo silane coupling agent include amino silane, epoxy silane, methyl
Acryloxy silane, vinyl silanes, alkyl silane, sulfuric silane, phenoxy group silane, isocyanatosilanes, silicon fluoride etc..
Some specific aspects according to the present invention, the titanate coupling agent include the KR- of Ken Ruiqi company, the U.S.
308S, KR-12, KR-TTS, KR-238S, KR-38S, KR-41B etc..
Some specific aspects according to the present invention, the organo-silicon coupling agent include the KBM- of Japanese SHIN-ETSU HANTOTAI's chemistry
1003、KBE-1003、KBM-303、KBM-403、KBE-402、KBE-403、KBM-1403、KBM-502、KBM-503、KBE-
502, OFS-6011, OFS-6020 of KBE-503 and DOW CORNING, OFS-6030, OFS-6032, OFS-6040, OFS-6076,
OFS-6094, OFS-6106, OFS-6124 etc..
More according to the present invention specific and preferred aspect, first heat filling, second heat filling, institute
Stating third heat filling is respectively independently selected from magnesia, beryllium oxide, aluminium oxide, aluminium nitride, boron nitride, crystallinity titanium dioxide
One of silicon and diamond [being called diamond-like DLC (Diamond-like carbon)] or a variety of combinations.
According to the present invention, first, second heat filling, the third heat filling are respectively thermal coefficient >=10W/
The filler of MK.The thermal coefficient of filler is higher, and the capacity of heat transmission of entire cooling fin can also be promoted, but with thermal coefficient <
The filler of 10W/MK carry out mixing be be also it is feasible.
According to the present invention, first, second heat filling, the third heat filling shape can be cerioid,
One of spherical shape, ball shape, sheet, block-like or a variety of mixtures, it is further preferred that spherical or near-spherical,
Because spherical filler fillibility is relatively good, heating conduction is high.Certain major part is spherical or near-spherical, is refilled
The filler of other shapes is also possible, while also saving cost.
Some preferred aspects according to the present invention, first, second heat filling, third heat filling difference are excellent
What is selected is 0.1 μm~60 μm of diameter of aluminium oxide, it is more preferred to the aluminium oxide that 0.2 μm~50 μm of diameter.In order to obtain more
5 μm of average grain diameter may be selected in good filling effect, and 10 μm of average grain diameter, 20 μm of the average grain diameter spherical fillers waited are taken
With use.
More according to the present invention specific and preferred aspect, the alumina packing includes the aspheric of Japanese Showa electrician
AL-43-KT, AL-47-H, AL-47-1, AL-160SG-3, AL-43-BE, AL-42-2 of shape, spherical AS-05, AS-10,
AS-20, AS-30, AS-40, AS-50, AS-400, spherical CB-P02, CB-P05, CB-P07, CB-P10, CB-P15, CB-
P40,CB-A20S,CB-A30S,CB-A40,CB-A50S；The ball-aluminium oxide of nippon such as AX35-125, AH35-2,
AX10-32, AX3-32, AX3-15 etc..
Some specific aspects according to the present invention, the boron nitride include the UHP- of the laminated structure of Japanese Showa electrician
S1, UHP-1K, UHP-2, such as UHP-EX, UHP-G1, UHP-G3 of block structure.
Some specific aspects according to the present invention, the antioxidant coating is by silica, aluminium oxide, zirconium oxide, oxidation
One kind or two or more inorganic oxide in titanium is principal component, and specifically, the antioxidant coating is inorganic by that can be converted into
After the presoma of oxide is coated in the layers of copper, pass through one of heating, humidification, ultraviolet irradiation method or a variety of sides
The combination of method is formed after being handled.The presoma be positive silicate class, Perhydropolysilazane class, in isocyanatosilanes class
One or more mixtures.After the presoma is coated in the layers of copper, pass through heating, humidification, ultraviolet irradiation
One of method or a variety of methods combination handled after form the antioxidant coating that main component is silica.Above-mentioned side
The antioxidant coating being covered on copper sheet is made in method, does not give only the excellent antioxygenic property of copper sheet, while can also assign copper
The good scraping and wiping resistance performance of plate electrode, it is ensured that copper sheet resistance to oxidation when being influenced by environment such as moisture, high temperature.
Specifically, the positive silicate class includes HAS-1, HAS-2, HAS-3 of Japanese Colcoat, and Germany
The Dynasylan40 of Evonik company, Dynasylan A, Dynasylan AR, Dynasylan M, Dynasylan MKS,
Dynasylan P、Dynasylan MAR。
Specifically, the Perhydropolysilazane class include AZ Electronic Materials company, Britain NN110,
NN310, NL110A, NL120A, NL150A, NP110, NP140, SP140, UP140 and the IOTA- of Anhui Ai Yueta company
PHPS、IOTA-9108、IOTA-9118、IOTA-OPSZ-9150。
Specifically, the isocyanatosilanes class include Japanese Matsumoto Fine Chemical company SI310,
SI400。
Specifically, the antioxidant coating with a thickness of 30nm~2 μm；The copper sheet with a thickness of 20 μm~5mm；It is described
Resin layer with a thickness of 50 μm~1mm.
Resin layer made of above scheme of the present invention can not only have high thermal conductivity and excellent insulation performance, and
And there is splendid bonding force after heating, convenient for the attachment of other subsequent layers, for example including but be not limited to be conducive to subsequent electricity
The attachment of subassembly, conductive layer etc..
Another technical solution provided by the invention: a kind of power module, the power module include cooling fin, the heat dissipation
Piece uses power module cooling fin described above.
Further, the power module further includes the hot conductive layer being compounded on the resin layer, for encapsulating
The potting resin of the cooling fin and the conductive layer.
Still further, the conductive layer and the resin layer are 120 DEG C~160 DEG C, pressure 5Kg/ in temperature
cm2~10Kg/cm2Lower hot pressing 30~40 seconds；Then conductive layer and cooling fin are encapsulated with potting resin together, seal mould item
150~200 DEG C/1min~5min of part obtains power module using 150~200 DEG C/3~7 hours curing reactions with this.
More according to the present invention specific and preferred aspect, the conductive layer and the resin layer packaging by hot pressing
Afterwards, the degree of cross linking of the resin layer is greater than 70%, i.e. the degree of cross linking of hardened layer and following layer is all larger than 70%.
In the present invention, the description of " first, second, third " just to distinguish in several layers respectively containing heat filling,
Epoxy resin, phenoxy resin, curing agent etc. do not do other restrictions.
Due to the implementation of above technical scheme, the invention has the following advantages over the prior art:
The present invention uses specific resin layer, imparts cooling fin with high insulation performance, high-cooling property, scratch resistance
Wipe performance it is good, convenient for excellent high temperature resistance can be had both under the premise of surface-pasted power module cooling fin, can
The pattern and properties for still maintaining whole between 150-200 DEG C are basically unchanged, while being also equipped with more excellent bonding
Performance, processing performance (appearance is good) and hardness, meet the requirement now to high quality standards, and then be particularly suitable for power mould
The use of block improves the application prospect of power module.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of power module cooling fin of the present invention；
Fig. 2 is the structural schematic diagram of power module (cooling fin and conductive layer are packaged together)；
Wherein: 1, antioxidant coating；2, copper sheet；3, resin layer；31, the first resin layer；32, the second resin layer；4, conductive
Layer；5, potting resin.
Specific embodiment
The present invention will be further described in detail combined with specific embodiments below, but the present invention is not limited to following implementations
Example.Implementation condition used in the examples can do further adjustment according to specifically used different requirements, the implementation being not specified
Condition is the condition in routine experiment.
In following, unless otherwise specified, all raw materials are both from conventional method system commercially available or by this field
It is standby and obtain.
The preparation of power module cooling fin:
A clean copper sheet (thickness 0.4mm) is taken, it is by way of dip-coating that presoma (solid content 2~5%) is uniform
Ground is coated on the surface of copper sheet, then 130 DEG C of baking 5min, and the copper sheet after baking is rested on constant temperature, and (temperature is 20~40
DEG C) 3~20 days in the environment of high humidity (humidity be 40~85%), the copper sheet after standing is toasted into 2h in 170 DEG C of vacuum environments,
The copper sheet containing silicon layer is obtained, it is spare.
The preparation of second composition epoxy resin: the second epoxy resin is dissolved in butanone solvent, then molten in resin
The second heat filling, the second dispersing agent, the second curing agent are added in liquid, are selectively added the second phenoxy resin, the first increasing
Tough rubber, high-speed stirred are uniformly mixed, are made；
The preparation of third composition epoxy resin: third epoxy resin is dissolved in butanone solvent, then molten in resin
Third heat filling, the second toughening rubber, third dispersing agent, third curing agent are added in liquid, are selectively added third benzene oxygen
Base resin, high-speed stirred are uniformly mixed, are made；
It is evenly coated with above-mentioned second composition epoxy resin, on 50 μm of release films with the heating rate of 100 DEG C/5min
Solvent heating evaporation is done.The non-silicon process face that second composition epoxy resin face hot pressing is fitted in copper sheet can be realized
Diepoxy resin composition is transferred on copper sheet, then tears release film, and 200 DEG C/1Hr of hot setting can form the first tree
Rouge layer；The release of third composition epoxy resin is coated with for hot repressing another on existing first resin layer with the above method
Film is formed the second resin layer, the production of power module cooling fin is completed with this.
As shown in Figure 1, cooling fin of the invention is divided into 4 layers, 1 it is antioxidant coating, 2 is copper sheet, 31 is the of resin layer
One resin layer, 32 be resin layer the second resin layer.
As shown in Fig. 2, the present invention provides a kind of power module, including be cascading anti-oxidant painting 1, copper sheet 2,
Second resin layer 32 of the first resin layer 31 of resin layer, resin layer, and temperature be 140 DEG C, pressure 8Kg/cm2Lower heat
Pressure 30~40 seconds hot conductive layers 4 being compounded on following layer, the encapsulation trees for conductive layer 4 and cooling fin to be encapsulated together
Rouge 5 seals 180 DEG C/3min of mould condition using 190 DEG C/5 hours curing reactions and the power module is made.
Following offer embodiment 1-8 and comparative example 1-3 prepare the raw material of cooling fin and the cooling fin finally prepared
Performance, it is specific as shown in Table 1 and Table 2, wherein raw material additional amount is in parts by weight in Tables 1 and 2.
Raw material in Tables 1 and 2:
(1) silicon layer: Perhydropolysilazane (PHPS) class, AZ company NL110A；The HAS- of positive silicate class Colcoat company
1；Isocyanatosilanes class, the SI310 of Matsumoto Fine Chemical company.
Bisphenol A type epoxy resin: the YD-134 of national capital chemical company
Bisphenol f type epoxy resin): the YDF-170 of national capital chemical company
Phenol aldehyde type epoxy resin: the YDPN-638 of national capital chemical company
Modified epoxy: the YD-171 of national capital chemical company
Bisphenol A-type phenoxy resin (): aurification YP-50 lives in Nippon Steel
Bisphenol-A and Bisphenol F mixed type phenoxy resin: aurification YP-70 lives in Nippon Steel
Aluminium oxide: Showa electrician AS-50
Dispersing agent: SHIN-ETSU HANTOTAI KBM-403
Curing agent: ATUL DDS, four countries are melted into 2E4MZ-CN.
Table 1
Table 2
The test method of above-mentioned assessment item:
(1) appearance
The visually appearance of the insulating layer after pressing and copper surface-treated layer, there is bubble-free, thickness of insulating layer homogeneity etc.
Judgment criteria:
◎: the appearance bubble-free of insulating layer and copper surface-treated layer, foreign, thickness of insulating layer deviation is less than 3%；
Zero: the appearance bubble-free of insulating layer and copper surface-treated layer, foreign, thickness of insulating layer deviation is less than 5%；
△: the appearance bubble-free of insulating layer and copper surface-treated layer, the slight foreign matter of surface of insulating layer or thickness of insulating layer are inclined
Difference is 5~10%；
×: the appearance of insulating layer and copper surface-treated layer has bubble or the slight foreign matter of surface of insulating layer or thickness of insulating layer
Deviation is greater than 10%.
(2) adherence (adhesion strength)
On the following layer of cooling fin, the electrolytic copper foil of 35 μ m-thick of hot pressing, hot pressing condition 1Mpa/30s, then 200 DEG C of heating 1
Hour completes solidification.Then insulating layer and 90 ° of copper foil removings, are tested peel strength (unit: N/cm).
(3) heat resistance (inoxidizability)
Sample, is then put into baking oven and toasts by the sample that cooling fin is gone out to 5cm × 5cm size with the punching machine of 60Ton
170 DEG C/10 hours, compare the cosmetic variation of heat treatment front and back copper face.
Determinating reference:
Zero: after heat treatment compared with before heat treatment, glossiness keeps > 70%；
△: after heat treatment compared with before heat treatment, glossiness keeps 50%~70%；
×: after heat treatment compared with before heat treatment, glossiness keeps < 50%.
(4) marresistance of copper sheet
The copper surface direction of cooling fin (size 5cm × 10cm) is affixed on straight stainless-steel sheet, is put on cooling fin
The counterweight of one piece of 1kg weight is set, the distance of round-trip 5 times mobile 5cm of cooling fin is then held, allows the silica process layer on copper sheet surface
It rubs with stainless steel, observation scratch situation.
Determinating reference:
Zero: abrasive depth is greater than 0.5 μm, and trace of the length greater than 3cm is less than 5；
△: abrasive depth is greater than 0.5 μm, and trace of the length greater than 3cm is less than 5~10；
×: abrasive depth is greater than 0.5 μm, and trace of the length greater than 3cm is greater than 10；
(5) coating surface hardness test
Referring to GB/T 6739-1996 " coating surface pencil hardness " standard, sample size 5cm × 10cm lies against table top
On, coating faces upward.Test pencil is placed on instruction carriage, pen tip and coating layer touch.Instruction carriage is carried out relative to sample
It is mobile, movement speed 0.5mm/s, moving distance 3mm.Changing position scratches 5.
The use of pencil is one group of China's board advanced drawing pencil, respectively 9H, 8H, 7H, 6H, 5H, 4H, 3H, 2H, H, F,
HB, B, 2B, 3B, 4B, 5B, 6B, wherein 9H is most hard, and 6B is most soft.
The case where coating abrades: scratching in test 5, is considered that coating is not scratched if there is 2 or 2 or more
When, then the pencil for using previous position pencil hardness label instead is equally tested, and the lead that coating is scratched 2 or 2 or more is selected
Pen, writes down the hardness label in this latter position of pencil hardness label.
(6) processability (punching test)
Copper sheet faces upward, and cooling fin is gone out to the sample of 5cm × 5cm size with the punching machine of 60Ton.
Determinating reference:
Zero: adherence is good between insulating layer and copper sheet, no layering；
△: being slightly layered between insulating layer and copper sheet edge, delamination area < 10%；
×: delamination area > 10% between insulating layer and copper sheet.
(7) thermal conductivity is tested
Cooling fin is gone out to the sample of 2.5cm × 2.5cm size with the punching machine of 60Ton, while sample surfaces coat one layer
Heat-conducting silicone grease is tested according to ASTM-D-5470 standard.Test equipment is auspicious neck science and technology LW-9389.
(8) insulation voltage
Cooling fin gone out to the sample of 10cm × 10cm size with the punching machine of 60Ton, sample passes through 200 DEG C, 1 hour
Baking.Then sample is sandwiched in the cylindrical electrode of two diameter 25mm, tests insulation voltage.Test equipment Japan chrysanthemum water
(KIKUSUI model TOS5301) compression tester, rate of pressure rise 1Kv/s, leakage current are less than 1mA.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar cans understand the content of the present invention and implement it accordingly, and it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of power module cooling fin, the cooling fin include heat-radiating substrate, the heat-radiating substrate is copper sheet, the heat dissipation
Piece further includes the antioxidant coating and resin layer for being separately positioned on the copper sheet opposite sides, it is characterised in that: the resin layer
For single layer structure resin layer or double-layer structure resin layer；
When the resin layer is single layer structure resin layer, the single layer structure resin layer is by the first composition epoxy resin structure
At, in terms of mass fraction, the raw material of first composition epoxy resin include 5-25 parts the first epoxy resin, 2-12 parts
First phenoxy resin, 2-20 parts of the first curing agent, 65-95 parts of the first heat filling, 0-10 parts of the first dispersing agent；
When the resin layer is double-layer structure resin layer, the double-layer structure resin layer includes the be formed on the copper sheet
One resin layer and the second resin layer being formed on first resin layer, first resin layer is by the second epoxy resin group
It closes object to constitute, second resin layer is made of third composition epoxy resin；
Wherein, in terms of mass fraction, the raw material of second composition epoxy resin includes 5-25 parts of the second epoxy resin, 0-
12 parts of the second phenoxy resin, 0-20 parts of the first toughening rubber, 5-25 parts of the second curing agent, the second of 65-95 parts are led
Hot filler, 0-10 parts of the second dispersing agent, the raw material of the third composition epoxy resin include 5-25 parts of third asphalt mixtures modified by epoxy resin
Rouge, 0-12 parts of third phenoxy resin, 1-20 parts of the second toughening rubber, 2-20 parts of third curing agent, the of 65-95 parts
Three heat fillings, 0-10 parts of third dispersing agent；When in the raw material of second composition epoxy resin be free of second benzene
When oxygroup resin, second epoxy resin is made of at least two epoxy resin；When the third composition epoxy resin
When being free of the third phenoxy resin in raw material, the third epoxy resin is made of at least two epoxy resin.
2. power module cooling fin according to claim 1, it is characterised in that: when the resin layer is single layer structure tree
When rouge layer, the gel fraction of the single layer structure resin layer is less than 50%；
When the resin layer is double-layer structure resin layer, the gel fraction of first resin layer is greater than 50%, second resin
The gel fraction of layer is less than 50%.
3. power module cooling fin according to claim 1, it is characterised in that: first epoxy resin, described
Diepoxy resin and the third epoxy resin are separately selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol
One of aldehyde type epoxy resin and modified epoxy or a variety of combinations；
When being free of second phenoxy resin in the raw material of second composition epoxy resin, second epoxy resin
By at least two in bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin and modified epoxy
Epoxy resin is constituted；When being free of the third phenoxy resin in the raw material of the third composition epoxy resin, described the
Three epoxy resin are by being selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenol aldehyde type epoxy resin and modified epoxy
In at least two epoxy resin constitute.
4. power module cooling fin according to claim 1, it is characterised in that: first toughening rubber, described
Two toughening rubbers be respectively be selected from one of acrylic rubber, nitrile rubber, silicon rubber, polyurethane rubber and fluorubber or
A variety of combinations.
5. power module cooling fin according to claim 1, it is characterised in that: the inventory of second toughening rubber
Mass ratio with the total amount of feeding of the third epoxy resin and second phenoxy resin is 1: 7-9.
6. power module cooling fin according to claim 1, it is characterised in that: when second composition epoxy resin
Raw material in contain second phenoxy resin when, the matter that feeds intake of first epoxy resin and first phenoxy resin
Amount is than being 2-4: 1；When containing the third phenoxy resin in the raw material of the third composition epoxy resin, the third
The mass ratio that feeds intake of epoxy resin and third phenoxy resin is 2-4: 1.
7. power module cooling fin according to claim 1, it is characterised in that: first curing agent, described second
Curing agent and the third curing agent are separately selected from amine hardener, imidazole curing agent, phenol curing agent and anhydride curing agent
One of or a variety of combinations.
8. power module cooling fin according to claim 7, it is characterised in that: first curing agent, described second
Curing agent and the third curing agent are separately selected from amine hardener and/or imidazole curing agent；
Wherein, the amine hardener is selected from one of dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone
Or a variety of combination；The imidazole curing agent is selected from 1- methylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, N-
(3- aminopropyl)-imidazoles, 1- vinyl imidazole, 2- vinyl imidazole, 2- phenylimidazole, 2- phenyl -4-methylimidazole, 1- benzyl
Base -2-methylimidazole, 1- benzyl -2- phenylimidazole, 1,2- methylimidazole, 1- 1-cyanoethyl-2-methylimidazole, 1- cyanoethyl -
One of 2-ethyl-4-methylimidazole, 1- cyanoethyl -2- undecyl imidazole and 1-cyanoethyl-2-phenylimidazole are a variety of
Combination.
9. power module cooling fin according to claim 1, it is characterised in that: when the resin layer is single layer structure tree
When rouge layer, the additive amount of first dispersing agent accounts for the 0.1-5% of the first epoxy resin layer gross mass；
When the resin layer is double-layer structure resin layer, the additive amount of second dispersing agent accounts for second epoxy resin layer
The 0.1-5% of gross mass；The additive amount of the third dispersing agent accounts for the 0.1-5% of the third epoxy resin layer gross mass.
10. a kind of power module, the power module includes cooling fin, is characterized in that: the cooling fin uses claim 1-9
Any one of power module cooling fin described in claim.
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| CN201811633810.5A CN109768019B (en) | 2018-12-29 | 2018-12-29 | Heat radiating fin for power module and power module manufactured by same |
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| CN201811633810.5A CN109768019B (en) | 2018-12-29 | 2018-12-29 | Heat radiating fin for power module and power module manufactured by same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111138636A (en) * | 2019-12-31 | 2020-05-12 | 浙江华正新材料股份有限公司 | Resin composition, prepreg and laminated board |
| CN114196303A (en) * | 2021-12-03 | 2022-03-18 | 苏州赛伍应用技术股份有限公司 | Intelligent power module and radiating fin for same |
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| CN102593338A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Thin high-thermal-conductivity metal substrate and production method thereof |
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| CN105623198A (en) * | 2015-12-29 | 2016-06-01 | 陕西生益科技有限公司 | High-thermal conductivity resin composition and application thereof |
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| CN111138636A (en) * | 2019-12-31 | 2020-05-12 | 浙江华正新材料股份有限公司 | Resin composition, prepreg and laminated board |
| CN114196303A (en) * | 2021-12-03 | 2022-03-18 | 苏州赛伍应用技术股份有限公司 | Intelligent power module and radiating fin for same |
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| Publication number | Publication date |
|---|---|
| CN109768019B (en) | 2020-12-25 |
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