CN114196303A - Intelligent power module and radiating fin for same - Google Patents
Intelligent power module and radiating fin for same Download PDFInfo
- Publication number
- CN114196303A CN114196303A CN202111465735.8A CN202111465735A CN114196303A CN 114196303 A CN114196303 A CN 114196303A CN 202111465735 A CN202111465735 A CN 202111465735A CN 114196303 A CN114196303 A CN 114196303A
- Authority
- CN
- China
- Prior art keywords
- heat
- epoxy resin
- parts
- resin
- conducting filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 claims abstract description 123
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 123
- 229920005989 resin Polymers 0.000 claims abstract description 90
- 239000011347 resin Substances 0.000 claims abstract description 90
- 239000000945 filler Substances 0.000 claims abstract description 64
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 47
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 47
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 45
- 239000002270 dispersing agent Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 239000010410 layer Substances 0.000 claims description 124
- 239000000203 mixture Substances 0.000 claims description 44
- 239000002994 raw material Substances 0.000 claims description 21
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 20
- 239000007822 coupling agent Substances 0.000 claims description 18
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 18
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 14
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 12
- -1 phenolic aldehyde Chemical class 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000002356 single layer Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 6
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical group [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 claims description 6
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 claims description 4
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 claims description 4
- 150000004645 aluminates Chemical class 0.000 claims description 4
- 150000004678 hydrides Chemical class 0.000 claims description 4
- 150000001282 organosilanes Chemical class 0.000 claims description 4
- 229910000077 silane Inorganic materials 0.000 claims description 4
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims description 3
- GIWQSPITLQVMSG-UHFFFAOYSA-N 1,2-dimethylimidazole Chemical compound CC1=NC=CN1C GIWQSPITLQVMSG-UHFFFAOYSA-N 0.000 claims description 2
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 claims description 2
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 claims description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical group CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims description 2
- MLMGJTAJUDSUKA-UHFFFAOYSA-N 2-ethenyl-1h-imidazole Chemical compound C=CC1=NC=CN1 MLMGJTAJUDSUKA-UHFFFAOYSA-N 0.000 claims description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- NLSFWPFWEPGCJJ-UHFFFAOYSA-N 2-methylprop-2-enoyloxysilicon Chemical compound CC(=C)C(=O)O[Si] NLSFWPFWEPGCJJ-UHFFFAOYSA-N 0.000 claims description 2
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 claims description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 2
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 claims description 2
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 claims description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 claims description 2
- KDHWOCLBMVSZPG-UHFFFAOYSA-N 3-imidazol-1-ylpropan-1-amine Chemical compound NCCCN1C=CN=C1 KDHWOCLBMVSZPG-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 claims description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 125000004423 acyloxy group Chemical group 0.000 claims description 2
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 150000001343 alkyl silanes Chemical class 0.000 claims description 2
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- 230000003064 anti-oxidating effect Effects 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- 239000013522 chelant Substances 0.000 claims description 2
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 claims description 2
- XPBBUZJBQWWFFJ-UHFFFAOYSA-N fluorosilane Chemical compound [SiH3]F XPBBUZJBQWWFFJ-UHFFFAOYSA-N 0.000 claims description 2
- BUZRAOJSFRKWPD-UHFFFAOYSA-N isocyanatosilane Chemical compound [SiH3]N=C=O BUZRAOJSFRKWPD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims description 2
- RBCYCMNKVQPXDR-UHFFFAOYSA-N phenoxysilane Chemical compound [SiH3]OC1=CC=CC=C1 RBCYCMNKVQPXDR-UHFFFAOYSA-N 0.000 claims description 2
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052717 sulfur Inorganic materials 0.000 claims description 2
- 239000011593 sulfur Substances 0.000 claims description 2
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 2
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910002026 crystalline silica Inorganic materials 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 claims 1
- 238000007790 scraping Methods 0.000 abstract description 2
- 239000011231 conductive filler Substances 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 10
- 238000007254 oxidation reaction Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000002335 surface treatment layer Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- NPEWZDADCAZMNF-UHFFFAOYSA-N gold iron Chemical compound [Fe].[Au] NPEWZDADCAZMNF-UHFFFAOYSA-N 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000007516 Chrysanthemum Nutrition 0.000 description 1
- 244000189548 Chrysanthemum x morifolium Species 0.000 description 1
- 241000180701 Nitzschia <flatworm> Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- HHEFNVCDPLQQTP-UHFFFAOYSA-N ammonium perchlorate Chemical compound [NH4+].[O-]Cl(=O)(=O)=O HHEFNVCDPLQQTP-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910021488 crystalline silicon dioxide Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
- C09D171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09D171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09D171/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
Abstract
The invention discloses a radiating fin for an intelligent power module, which comprises a radiating substrate and a resin layer coated on the radiating substrate, wherein the resin layer comprises the following components in parts by weight: 5-25 parts of epoxy resin, 0-12 parts of phenoxy resin, 2-20 parts of curing agent, 65-100 parts of heat-conducting filler and 0-5 parts of dispersing agent. The radiating fin prepared by the invention has high insulating property, high heat dissipation, good scraping resistance and convenient surface mounting, can have excellent high temperature resistance, can still keep the integral appearance and various performances unchanged at the temperature of 150-.
Description
Technical Field
The invention belongs to the technical field of radiating fins, and particularly relates to a radiating fin for an intelligent power module and the intelligent power module.
Background
An intelligent Power module ipm (intelligent Power module) which is produced in recent years is a highly integrated Power driving device, and can be used as a variable frequency speed regulation controller and applied to textile machines, injection molding machines, variable frequency air conditioners, washing machines, refrigerators, electric vehicles, radar servo systems and the like. The use of IPM greatly improves the working efficiency of electronic and electric products and reduces the energy consumption at the same time. Logic, control, detection and protection circuits are integrated in the IPM, the IPM is convenient to use, the size and the development time of a system are reduced, the possibility of the system is greatly enhanced, the IPM is suitable for the development direction of the current power device, namely modularization, composition and Power Integrated Circuit (PIC), and the IPM is more and more widely applied to the field of power electronics. However, the large amount of heat generated by the power modules with higher and higher integration levels during operation also becomes a main factor affecting the operating efficiency and long-term service life of the power modules.
In the prior art, the intelligent power module uses the radiating fins, such as a copper-clad aluminum substrate, a copper-clad ceramic substrate and the like, electronic devices need to be welded on the surface of the radiating fins, the process is complex, and the yield is low. Traditional fin chooses aluminium base for use as its base plate, and the heat conductivity is far away not high than the copper sheet, but the copper base fin is because the copper receives when environmental influences such as moisture, high temperature, takes place the oxidation easily, influences its performance and life-span, and the anti-oxidant processing technology of copper is complicated, and is with high costs, and the copper takes place the fish tail easily in transport and use in addition.
Disclosure of Invention
The invention aims to provide the heat radiating fin for the power module, which has good insulating property, high thermal conductivity, good scratch resistance and convenient surface mounting, has excellent high temperature resistance, can keep the integral appearance and various performances basically unchanged at the temperature of 150-.
In order to achieve the purpose, the invention adopts the technical scheme that: the utility model provides a fin for intelligent power module, includes heat dissipation base plate and the resin layer of coating on heat dissipation base plate, the resin layer is counted by weight, includes the following component: 5-25 parts of epoxy resin, 0-12 parts of phenoxy resin, 2-20 parts of curing agent, 65-100 parts of heat-conducting filler and 0-5 parts of dispersing agent.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the scheme, the resin layer is a single-layer resin structure layer, the single-layer resin layer is composed of a first epoxy resin composition, and the raw materials of the first epoxy resin composition comprise, by weight, 5-25 parts of a first epoxy resin, 2-12 parts of a first phenoxy resin, 1-5 parts of a first curing agent, 50-75 parts of a first heat-conducting filler, 15-25 parts of a second heat-conducting filler and 0-5 parts of a first dispersing agent;
the addition amount of the first dispersing agent accounts for 0.1-5% of the total mass of the first epoxy resin layer.
2. In the above aspect, the single-layer structure resin layer has a gel fraction of less than 50%.
3. In the above aspect, the resin layer is a two-layer structure resin layer including a first resin layer formed on the heat dissipating substrate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition;
the raw materials of the second epoxy resin composition comprise, by mass, 5-25 parts of a second epoxy resin, 0-12 parts of a second phenoxy resin, 1-5 parts of a second curing agent, 50-75 parts of a third heat-conducting filler, 15-25 parts of a fourth heat-conducting filler and 0-5 parts of a second dispersing agent; the addition amount of the second dispersing agent accounts for 0.1-5% of the total mass of the second epoxy resin layer;
the raw materials of the third epoxy resin composition comprise 5-25 parts of third epoxy resin, 0-12 parts of third phenoxy resin, 2-20 parts of third curing agent, 50-75 parts of fifth heat-conducting filler, 15-25 parts of sixth heat-conducting filler and 0-5 parts of third dispersing agent; the addition amount of the third dispersing agent accounts for 0.1-5% of the total mass of the third epoxy resin layer.
4. In the above aspect, the gel fraction of the first resin layer of the two-layer structure resin layer is greater than 50%, and the gel fraction of the second resin layer is less than 50%.
5. In the above aspect, when the second phenoxy resin is not contained in the raw material of the second epoxy resin composition, the second epoxy resin is composed of at least two kinds of epoxy resins; when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins. This design can ensure good adhesion of the resin layer to the metal substrate while maintaining good flexibility, while taking into consideration uniformity of thickness of the resin layer during processing.
6. In the above aspect, the first epoxy resin, the second epoxy resin, and the third epoxy resin are each independently selected from one or a combination of two or more of a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a novolac type epoxy resin, and a modified epoxy resin.
7. In the above aspect, the bisphenol a epoxy resin is selected from: NPES-901, NPES-902, NPES-903H, NPES-904, NPES-904H, NPES-907, NPES-909 from south Asia epoxy resin company; YD-011, YD-012, YD-013, YD-127, YD-128, YD134, YD-901, YD-9021 of Korean Dow chemical company; 834, 1001, 1002, 1003, 1055, 1004 of mitsubishi chemical.
8. In the above embodiment, the bisphenol F epoxy resin is selected from: NPEF-170 and NPEF-175 of southeast Asia epoxy resin company, YDF-170, YDF-2001 and YDF-2004 of Korean Dow chemical company; 4005P, 4007P, 4010P of Mitsubishi chemical.
9. In the scheme, the phenolic epoxy resin is selected from NPPN-631, NPPN-638S, NPPN-431, NPPN-438, NPPN-272H and the like of south Asia epoxy resin company; EPALLOY 8240, EPALLOY 8240E, EPALLOY 8250, EPALLOY 8330, CVC USA; YDPN-638, YDPN-641 and YDPN-644 of Korean Country chemical company.
10. In the above scheme, the modified epoxy resin is selected from: hypox UA10, Hypox UA11, HyPox DA323, CVC USA; NPER-133L, NPER-450 from south Asia epoxy company; YD-171, YD-172, KR-628, KR-692, KR-693, KSR-1000, UME-305, UME-315, UME-330 of Korean Dow chemical company.
11. In the above aspect, when the second phenoxy resin is not contained in the raw material of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins selected from a bisphenol a type epoxy resin, a bisphenol F type epoxy resin, a phenol type epoxy resin, and a modified epoxy resin; when the raw material of the second epoxy resin composition contains the second phenoxy resin, the feeding mass ratio of the second epoxy resin to the second phenoxy resin is 2-4: 1;
when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic aldehyde type epoxy resin and modified epoxy resin; when the third epoxy resin composition contains the third phenoxy resin in the raw materials, the feeding mass ratio of the third epoxy resin to the third phenoxy resin is 2-4: 1.
12. in the scheme, the phenoxy resin is one or a combination of bisphenol A type phenoxy resin, bisphenol F type phenoxy resin and bisphenol S type phenoxy resin, and the weight average molecular weight Mw of the phenoxy resin is 10000-100000.
13. In the above scheme, the bisphenol a phenoxy resin includes but is not limited to: PKHA, PKHB +, PKHC, PKHH, PKHJ, PKFE, etc. of the company InChem; 1256, Mitsubishi chemical; YP-50, YP-50S, YBP-40PXM40 and ERF-001M30 of Xinri Cijin chemical.
14. In the above scheme, the bisphenol F type phenoxy resin includes, but is not limited to FX-316 of Nippon iron-gold chemical, etc.
15. In the above scheme, the bisphenol A and bisphenol F mixed phenoxy resin includes, but is not limited to, Mitsubishi chemical 4250, 4276, etc., Xinri Cishi chemical YP-70, ZX-1356-2, etc.
16. In the above scheme, the bisphenol A and bisphenol S mixed phenoxy resin includes but is not limited to YPS-007A30 of Nitzschia chemical.
17. In the scheme, the phenoxy resin can also be selected from phenoxy resins with special structures such as FX-293, FX-280S, FX-310T40 and the like of Nippon iron-gold chemical.
18. In the above scheme, the first curing agent, the second curing agent and the third curing agent are respectively and independently selected from one or more of an amine curing agent, an imidazole curing agent, a phenol curing agent and an anhydride curing agent; the amine curing agent is one or more of dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone; the imidazole curing agent is selected from 1-methylimidazole, 2-ethyl-4-methylimidazole, N- (3-aminopropyl) -imidazole, 1-vinylimidazole, 2-vinylimidazole and 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1, 2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and 1-cyanoethyl-2-phenylimidazole; the acid anhydride curing agent preferably contains an acid anhydride having an aromatic skeleton, a hydride of the acid anhydride, or a modified product of the acid anhydride, or contains an acid anhydride having an alicyclic skeleton, a hydride of the acid anhydride, or a modified product of the acid anhydride.
19. In the above embodiment, the first curing agent, the second curing agent and the third curing agent are independently selected from an amine curing agent and/or an imidazole curing agent.
20. In the above scheme, the dispersant is one or a combination of several selected from titanate coupling agent, aluminate coupling agent, organosilane coupling agent, organic chromium complex coupling agent and borate coupling agent; the addition of the dispersant is beneficial to improving the adherence between the resin and the heat-conducting filler and increasing the adherence between the resin layer and the heat-radiating substrate.
The titanate coupling agent comprises isopropyl tri (dioctyl pyrophosphoryl oxy) titanate, isopropyl tri (dioctyl phosphatoyloxy) titanate, isopropyl dioleate acyloxy (dioctyl phosphatoyloxy) titanate, monoalkoxy unsaturated fatty acid titanate, chelate of bis (dioctyl pyrophosphate) ethylene titanate and triethanolamine, and bis (dioctyl pyrophosphate) ethylene titanate; the aluminate coupling agent comprises an aluminum-titanium compound, di (ethyl acetoacetate) isopropyl aluminate, di (acetylacetone) diisopropyl aluminate, isopropyl distearoyloxy aluminate and the like; the organosilane coupling agent includes aminosilane, epoxy silane, methacryloxy silane, vinyl silane, alkyl silane, sulfur-containing silane, phenoxy silane, isocyanato silane, fluorosilane, and the like.
21. In the scheme, the titanate coupling agent comprises KR-308S, KR-12, KR-TTS, KR-238S, KR-38S, KR-41B and the like of KenreQi company in the United states.
22. In the above scheme, the organosilicon coupling agent includes KBM-1003, KBE-1003, KBM-303, KBM-403, KBE-402, KBE-403, KBM-1403, KBM-502, KBM-503, KBE-502, KBE-503, and KBE-503 of Japan Beacon chemical, and OFS-6011, OFS-6020, OFS-6030, OFS-6032, OFS-6040, OFS-6076, OFS-6094, OFS-6106, OFS-6124 and the like.
23. In the above solution, the first heat conductive filler, the second heat conductive filler, the third heat conductive filler, the fourth heat conductive filler, the fifth heat conductive filler, and the sixth heat conductive filler are respectively one or more combinations independently selected from magnesium oxide, beryllium oxide, aluminum nitride, boron nitride, crystalline silicon dioxide, and artificial Diamond (also called Diamond-like carbon (DLC)).
24. In the above scheme, the first heat conductive filler, the second heat conductive filler, the third heat conductive filler, the fourth heat conductive filler, the fifth heat conductive filler, and the sixth heat conductive filler are two kinds of alumina fillers with different particle diameters, or alumina and aluminum nitride, alumina and boron nitride are used in combination.
25. In the above scheme, the first heat conducting filler, the second heat conducting filler, the third heat conducting filler, the fourth heat conducting filler, the fifth heat conducting filler and the sixth heat conducting filler are respectively fillers with a heat conductivity coefficient of more than or equal to 10W/M · K. The higher the thermal conductivity of the filler, the higher the thermal conductivity of the entire fin, but it is also possible to mix it with a filler having a thermal conductivity of < 10W/M.K.
26. In the above aspect, the first heat conductive filler, the second heat conductive filler, the third heat conductive filler, the fourth heat conductive filler, the fifth heat conductive filler, and the sixth heat conductive filler may have one or a mixture of a plurality of shapes selected from a polygonal shape, a spherical-like shape, a spherical shape, a sheet shape, and a block shape, and a spherical shape or a spherical-like shape is further preferable because spherical fillers have a relatively good filling property and a high heat conductivity. Of course, the main part is spherical or spheroidal, and the filling of the filler with other shapes is also possible, and meanwhile, the cost is saved.
27. In the above aspect, the first heat conductive filler, the second heat conductive filler, the third heat conductive filler, the fourth heat conductive filler, the fifth heat conductive filler, and the sixth heat conductive filler are preferably fillers having a diameter of 0.1 μm to 60 μm, and more preferably fillers having a diameter of 0.2 μm to 50 μm, respectively. In order to obtain better filling effect, the filler with the average grain diameter of 0.5-25 μm is selected for matching use.
28. In the above scheme, the alumina filler comprises non-spherical Al-43-KT, AL-47-H, AL-47-1, AL-160SG-3, AL-43-BE, AL-42-2, spheroidal AS-05, AS-10, AS-20, AS-30, AS-40, AS-50, AS-400, spherical CB-P02, CB-P05, CB-P07, CB-P10, CB-P15, CB-P40, CB-A20S, CB-A30S, CB-A40, CB-A50S of Showa; spherical alumina of Nippon iron such as AX35-125, AH35-2, AX10-32, AX3-32, AX3-15 and the like, Baituo spherical alumina BAK-1, BAK-2, BAK-5, BAK-10, BAK-20, BAK-30 and BAK-40.
29. In the above scheme, the boron nitride includes UHP-S1 and UHP-1K, UHP-2 of sheet structure of Showa Denko Kogyo, UHP-EX, UHP-G1 and UHP-G3 of block structure, and BBN-5, BBN-10 and BBN-30 of Baituo province.
30. In the scheme, the aluminum nitride comprises TA-1, TA-F01, TA-F30 and TA-F50 of hundred-gram-share spherical structures.
31. In the above scheme, the heat dissipation substrate is an aluminum plate.
The other technical scheme of the invention is as follows: a smart power module, said power only module comprising said heat sink.
The technical scheme of further improvement in the technical scheme is as follows:
1. in the above scheme, the power module further comprises a conductive layer thermally compounded on the resin layer, and packaging resin for packaging the heat sink and the conductive layer, wherein an anti-oxidation coating is arranged on the surface of the heat sink opposite to the resin layer.
2. In the scheme, the conducting layer and the resin layer are hot-pressed for 30-40 seconds at the temperature of 120-160 ℃ and the pressure of 5-10 Kg/cm 2; and then packaging the conducting layer and the radiating fin together by using packaging resin, sealing the die for 150-200 ℃/1-5 min, and carrying out curing reaction for 150-200 ℃/3-7 hours to obtain the power module.
3. In the above scheme, after the conductive layer and the resin layer are subjected to hot press packaging, the crosslinking degree of the resin layer is greater than 70%, that is, the crosslinking degrees of the first resin layer and the second resin layer are both greater than 70%.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. the resin layer of the heat sink for the intelligent power module not only has high heat conducting performance and excellent insulating performance, but also has excellent bonding force after heating, thereby facilitating the mounting of other subsequent layers, such as but not limited to the mounting of subsequent electronic components, conductive layers and the like.
2. The invention adopts the specific resin layer, endows the radiating fin with excellent high temperature resistance on the premise of having high insulating property, high heat dissipation, good scraping resistance and convenient surface mounting of the radiating fin for the power module, can still keep the integral appearance and various performances basically unchanged at the temperature of 150 plus 200 ℃, simultaneously has excellent bonding property, processing property and hardness, meets the requirements on the high quality standard at present, is particularly suitable for the use of the power module, and improves the application prospect of the power module.
Drawings
Fig. 1 is a schematic structural view of a heat sink for a power module according to the present invention;
FIG. 2 is a schematic diagram of a power module (heat sink and conductive layer packaged together);
wherein: 1. an oxidation resistant coating; 2. a heat-dissipating substrate; 3. a resin layer; 31. a first resin layer; 32. a second resin layer; 4. a conductive layer; 5. and (3) encapsulating the resin.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
The invention is further described below with reference to the following examples:
examples 1 to 3: a heat sink for an intelligent power module comprises a heat dissipation substrate 2 and a resin layer 3 coated on the heat dissipation substrate 2, wherein the resin layer 3 is a single-layer resin structure layer, the single-layer resin layer is composed of a first epoxy resin composition, and the raw materials of the first epoxy resin composition comprise, by weight, 5-25 parts of a first epoxy resin, 2-12 parts of a first phenoxy resin, 1-5 parts of a first curing agent, 50-75 parts of a first heat-conducting filler, 15-25 parts of a second heat-conducting filler and 0-5 parts of a first dispersing agent; the addition amount of the first dispersing agent accounts for 0.1-5% of the total mass of the first epoxy resin layer.
The single-layer structure resin layer has a gel fraction of less than 50%.
TABLE 1
A preparation method of the radiating fin for the power module comprises the following steps:
taking a clean radiating substrate 1 (with the thickness of 0.4mm), and carrying out single-side or double-side anodic oxidation treatment on the radiating substrate 1;
preparation of the first epoxy resin composition: dissolving first epoxy resin in butanone solvent, adding a first heat-conducting filler, a second heat-conducting filler, a first dispersing agent and a first curing agent into the resin solution, adding second phenoxy resin, stirring at high speed, and uniformly mixing to obtain the epoxy resin-based heat-conducting resin;
the first epoxy resin composition was uniformly coated on a50 μm release film, and the solvent was evaporated to dryness by heating at a temperature rising rate of 100 ℃/5 min. And (3) thermally pressing and adhering the first epoxy resin composition surface to the anodic oxidation surface or the non-anodic oxidation surface of the aluminum plate, so that the first epoxy resin composition can be transferred to the aluminum plate, then tearing off the release film, and curing at high temperature of 200 ℃/1Hr to form a single-layer resin structure layer, thereby finishing the manufacture of the heat sink for the power module.
Examples 4 to 7: a heat sink for a smart power module includes a heat dissipating substrate 2 and a resin layer 3 coated on the heat dissipating substrate 2, the resin layer 3 being a two-layer structure resin layer including a first resin layer formed on the heat dissipating substrate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition;
the raw materials of the second epoxy resin composition comprise, by mass, 5-25 parts of a second epoxy resin, 0-12 parts of a second phenoxy resin, 1-5 parts of a second curing agent, 50-75 parts of a third heat-conducting filler, 15-25 parts of a fourth heat-conducting filler and 0-5 parts of a second dispersing agent; the addition amount of the second dispersing agent accounts for 0.1-5% of the total mass of the second epoxy resin layer;
the raw materials of the third epoxy resin composition comprise 5-25 parts of third epoxy resin, 0-12 parts of third phenoxy resin, 2-20 parts of third curing agent, 50-75 parts of fifth heat-conducting filler, 15-25 parts of sixth heat-conducting filler and 0-5 parts of third dispersing agent; the addition amount of the third dispersing agent accounts for 0.1-5% of the total mass of the third epoxy resin layer.
The gel fraction of the first resin layer of the two-layer structure resin layer is more than 50%, and the gel fraction of the second resin layer is less than 50%. As shown in table 2:
TABLE 2
Preparation of a heat sink for a smart power module:
taking a clean radiating substrate 2 (with the thickness of 0.4mm), and carrying out single-side or double-side anodic oxidation treatment on the radiating substrate 2;
preparation of the second epoxy resin composition: dissolving second epoxy resin in butanone solvent, adding third heat-conducting filler, fourth heat-conducting filler, second dispersant and second curing agent into the resin solution, selectively adding second phenoxy resin, stirring at high speed, and uniformly mixing to obtain the final product;
preparation of the third epoxy resin composition: dissolving third epoxy resin in butanone solvent, adding fifth heat-conducting filler, sixth heat-conducting filler, third dispersant and third curing agent into the resin solution, selectively adding third phenoxy resin, stirring at high speed, and uniformly mixing to obtain the epoxy resin-based epoxy resin composite material;
the second epoxy resin composition was uniformly coated on a50 μm release film, and the solvent was evaporated to dryness by heating at a temperature rising rate of 100 ℃/5 min. The second epoxy resin composition surface is thermally pressed and attached to the anodic oxidation surface or the non-anodic oxidation surface of the aluminum plate, so that the second epoxy resin composition can be transferred to the aluminum plate, then the release film is torn off, and the first resin layer can be formed after high-temperature curing at 200 ℃/1 Hr; and hot pressing another release film coated with the third epoxy resin composition on the existing first resin layer to form a second resin layer, thereby completing the manufacture of the heat sink for the power module.
The heat dissipating substrate 2 used in examples 1 to 9 was anodized aluminum, and had a thickness of 0.4mm and the resin layer 3 had a thickness of 160 μm.
The properties of the heat sink sheets prepared in examples 1 to 9 are shown in table 2:
table 2 example fin performance results
Comparative examples 1 to 2: a heat sink for a smart power module includes a heat dissipating substrate 2 and a resin layer 3 coated on the heat dissipating substrate 2, the resin layer 3 being a two-layer structure resin layer including a first resin layer formed on the heat dissipating substrate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition; the paint comprises the following components in parts by mass as shown in Table 3:
TABLE 3
Comparative example the procedure was as in example.
The properties of the fins prepared in comparative examples 1 to 3 are shown in table 4:
table 4 comparative example fin performance results
| Detecting items | Comparative example 1 | Comparative example 2 | Comparative example 3 |
| Cost of | X | ○ | ○ |
| Appearance of the Heat sink | ○ | ○ | X |
| Oxidation resistance of metal plate | ○ | ○ | ○ |
| Scratch resistance of metal plate | ○ | ○ | ○ |
| Workability | △ | ○ | ○ |
| Hardness of coating surface | ≥2H | ≥4H | ≥4H |
| Insulation voltage (KV) | 5.0 | 5.0 | 5.0 |
| Thermal conductivity (W/(m.K)) | 3.5 | 2.5 | 3.8 |
| Adhesive Strength (N/cm) | 20 | 21 | 22 |
The detection method of the detection items comprises the following steps:
(1) appearance of the product
The appearance of the laminated insulating layer and the metal surface treatment layer was visually checked for the presence or absence of bubbles, the thickness uniformity of the insulating layer, and the like
And (4) judging the standard:
very good: the insulating layer and the metal surface treatment layer have no bubbles and foreign matters in appearance, and the thickness deviation of the insulating layer is less than 3 percent;
o: the insulating layer and the metal surface treatment layer have no bubbles and foreign matters in appearance, and the thickness deviation of the insulating layer is less than 5 percent;
and (delta): the appearances of the insulating layer and the metal surface treatment layer are free of bubbles, and slight foreign matters on the surface of the insulating layer or thickness deviation of the insulating layer is 5-10%;
x: the appearance of the insulating layer and the metal surface treatment layer has bubbles, or slight foreign matters on the surface of the insulating layer, or the thickness deviation of the insulating layer is more than 10 percent.
(2) Adhesion (bond strength)
On the adhesion layer of the heat sink, 35 μm thick electrolytic copper foil was hot-pressed under a hot-pressing condition of 1MPa/30s, and then heated at 200 ℃ for 1 hour to complete curing. The insulating layer and the copper foil were then peeled at 90 ℃ and the peel strength (unit: N/cm) was measured.
(3) Heat resistance (Oxidation resistance)
A sample of 5cm × 5cm size was punched out of the heat sink by a 60Ton punch, and then the sample was placed in an oven and baked at 170 deg.C/10 hours to compare the appearance change of the metal surface before and after the heat treatment.
Judging the standard:
o: gloss retention was > 70% after heat treatment compared to before heat treatment;
and (delta): the glossiness is kept between 50 and 70 percent after the heat treatment and before the heat treatment;
x: the gloss remained < 50% after heat treatment compared to before heat treatment.
(4) Scratch resistance of metal plate
The metal surface direction of a radiating fin (with the size of 5cm multiplied by 10cm) is attached to a straight stainless steel plate, a weight with the weight of 1kg is placed on the radiating fin, then the radiating fin is held by hands to move back and forth for 5 times for a distance of 5cm, the surface layer of the metal plate is rubbed with the stainless steel, and the scratching condition is observed.
Judging the standard:
o: the depth of the scratch is more than 0.5 μm, and the number of the traces with the length of more than 3cm is less than 5;
and (delta): the depth of the scratch is more than 0.5 mu m, and the number of the traces with the length of more than 3cm is less than 5-10;
x: the depth of the scratch is more than 0.5 μm, and the length of the scratch is more than 10 marks of 3 cm;
(5) hardness test of coating surface
Referring to GB/T6739-. The test pencil was placed on the test car with the tip in contact with the coating. The test car was moved relative to the sample at a speed of 0.5mm/s and a distance of 3 mm. The position was changed and 5 strokes were made.
The pencil used is a group of Chinese high-grade drawing pencils which are respectively 9H, 8H, 7H, 6H, 5H, 4H, 3H, 2H, F, HB, B, 2B, 3B, 4B, 5B and 6B, wherein 9H is the hardest and 6B is the softest.
Case of coating scratching: in the 5-pass scratch test, if 2 or more passes are considered to be the case where the coating is not scratched, the same test is carried out by using a pencil with the pencil hardness mark of the previous pencil, the pencil with the coating scratched for 2 or more passes is selected, and the hardness mark of the pencil one position after the pencil hardness mark is recorded.
(6) Processability (punching test)
The metal plate was faced up and the heat sink was punched out with a 25Ton punch to form a 5cm x 5cm sample.
Judging the standard:
o: the adhesion between the insulating layer and the metal plate is good, and no layering exists;
and (delta): light micro layering is arranged between the insulating layer and the edge of the metal plate, and the layering area is less than 10%;
x: the layering area between the insulating layer and the metal plate is more than 10 percent.
(7) Thermal conductivity test
The heat sink was punched out of a 2.5cm by 2.5cm sample using a 60Ton punch, while the sample was coated with a layer of heat conductive silicone grease, and tested according to ASTM-D-5470. The testing equipment is Rayleigh-tech LW-9389.
(8) Insulation voltage
The heat sink was punched out into a10 cm × 10cm sample by a 60Ton punch and the sample was baked at 200 ℃ for 1 hour. The sample was then clamped between two cylindrical electrodes of 25mm diameter and tested for the insulation voltage. The test equipment is a Japanese chrysanthemum water (KIKUSUI model TOS5301) pressure resistance tester, the boosting rate is 1Kv/s, and the leakage current is less than 1mA
As shown in the evaluation results of tables 2 and 4, the heat sink prepared in the examples has excellent high temperature resistance on the premise of having high insulating property, high heat dissipation property, good scratch resistance and convenience for surface mounting, can still maintain the overall appearance and various performances at the temperature of 150 ℃ and 200 ℃, and also has excellent adhesion property, processability and hardness, and meets the requirements of the current high quality standard; the comparison example changes the base material and the formula of the resin layer, so that various performances of the radiating fin do not reach the standard, and the radiating fin cannot meet the requirements of various performances such as appearance, hardness, heat conductivity and the like.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. The utility model provides a fin for intelligent power module which characterized in that: the heat-dissipating substrate comprises a heat-dissipating substrate and a resin layer coated on the heat-dissipating substrate, wherein the resin layer comprises the following components in parts by weight: 5-25 parts of epoxy resin, 0-12 parts of phenoxy resin, 2-20 parts of curing agent, 65-100 parts of heat-conducting filler and 0-5 parts of dispersing agent.
2. The heat sink for smart power module as claimed in claim 1, wherein: the resin layer is a single-layer resin structure layer, the single-layer resin layer is composed of a first epoxy resin composition, and the raw materials of the first epoxy resin composition comprise, by weight, 5-25 parts of a first epoxy resin, 2-12 parts of a first phenoxy resin, 1-5 parts of a first curing agent, 50-75 parts of a first heat-conducting filler, 15-25 parts of a second heat-conducting filler and 0-5 parts of a first dispersing agent;
the addition amount of the first dispersing agent accounts for 0.1-5% of the total mass of the first epoxy resin layer.
3. The heat sink for smart power module as claimed in claim 2, wherein: the single-layer structure resin layer has a gel fraction of less than 50%.
4. The heat sink for smart power module as claimed in claim 1, wherein: the resin layer is a two-layer structure resin layer including a first resin layer formed on the heat dissipation substrate and a second resin layer formed on the first resin layer, the first resin layer being composed of a second epoxy resin composition, the second resin layer being composed of a third epoxy resin composition;
the raw materials of the second epoxy resin composition comprise, by mass, 5-25 parts of a second epoxy resin, 0-12 parts of a second phenoxy resin, 1-5 parts of a second curing agent, 50-75 parts of a third heat-conducting filler, 15-25 parts of a fourth heat-conducting filler and 0-5 parts of a second dispersing agent; the addition amount of the second dispersing agent accounts for 0.1-5% of the total mass of the second epoxy resin layer;
the raw materials of the third epoxy resin composition comprise 5-25 parts of third epoxy resin, 0-12 parts of third phenoxy resin, 2-20 parts of third curing agent, 50-75 parts of fifth heat-conducting filler, 15-25 parts of sixth heat-conducting filler and 0-5 parts of third dispersing agent; the addition amount of the third dispersing agent accounts for 0.1-5% of the total mass of the third epoxy resin layer.
5. The heat sink for smart power module as claimed in claim 4, wherein: the gel fraction of the first resin layer of the two-layer structure resin layer is more than 50%, and the gel fraction of the second resin layer is less than 50%.
6. The heat sink for smart power module as claimed in any one of claim 4, wherein: when the second phenoxy resin is not contained in the raw material of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins; when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins.
7. The heat sink for smart power module as claimed in any one of claims 2 to 6, wherein: the first epoxy resin, the second epoxy resin and the third epoxy resin are respectively and independently selected from one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic type epoxy resin and modified epoxy resin;
when the second phenoxy resin is not contained in the raw materials of the second epoxy resin composition, the second epoxy resin is composed of at least two epoxy resins selected from bisphenol a type epoxy resins, bisphenol F type epoxy resins, phenol type epoxy resins, and modified epoxy resins; when the raw material of the second epoxy resin composition contains the second phenoxy resin, the feeding mass ratio of the second epoxy resin to the second phenoxy resin is 2-4: 1;
when the third phenoxy resin is not contained in the raw materials of the third epoxy resin composition, the third epoxy resin is composed of at least two epoxy resins selected from bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenolic aldehyde type epoxy resin and modified epoxy resin; when the third epoxy resin composition contains the third phenoxy resin in the raw materials, the feeding mass ratio of the third epoxy resin to the third phenoxy resin is 2-4: 1;
preferably, the phenoxy resin is one or more selected from bisphenol A type phenoxy resin, bisphenol F type phenoxy resin and bisphenol S type phenoxy resin, and the weight average molecular weight Mw of the phenoxy resin is 10000-100000.
8. The heat sink for smart power module as claimed in any one of claims 2 to 6, wherein: the first curing agent, the second curing agent and the third curing agent are respectively and independently selected from one or more of an amine curing agent, an imidazole curing agent, a phenol curing agent and an anhydride curing agent; the amine curing agent is one or more of dicyandiamide, aromatic amine, diaminodiphenylmethane and diaminodiphenylsulfone; the imidazole curing agent is selected from 1-methylimidazole, 2-ethyl-4-methylimidazole, N- (3-aminopropyl) -imidazole, 1-vinylimidazole, 2-vinylimidazole and 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1, 2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, and 1-cyanoethyl-2-phenylimidazole; the acid anhydride curing agent preferably contains an acid anhydride having an aromatic skeleton, a hydride of the acid anhydride, or a modified product of the acid anhydride, or contains an acid anhydride having an alicyclic skeleton, a hydride of the acid anhydride, or a modified product of the acid anhydride;
preferably, the first curing agent, the second curing agent and the third curing agent are each independently selected from an amine curing agent and/or an imidazole curing agent;
preferably, the dispersant is one or more of titanate coupling agent, aluminate coupling agent, organosilane coupling agent, organic chromium complex coupling agent and borate coupling agent; the titanate coupling agent comprises isopropyl tri (dioctyl pyrophosphoryl oxy) titanate, isopropyl tri (dioctyl phosphatoyloxy) titanate, isopropyl dioleate acyloxy (dioctyl phosphatoyloxy) titanate, monoalkoxy unsaturated fatty acid titanate, chelate of bis (dioctyl pyrophosphate) ethylene titanate and triethanolamine, and bis (dioctyl pyrophosphate) ethylene titanate; the aluminate coupling agent comprises an aluminum-titanium compound, di (ethyl acetoacetate) isopropyl aluminate, di (acetylacetone) diisopropyl aluminate, isopropyl distearoyloxy aluminate and the like; the organosilane coupling agent includes aminosilane, epoxy silane, methacryloxy silane, vinyl silane, alkyl silane, sulfur-containing silane, phenoxy silane, isocyanato silane, fluorosilane, and the like.
Preferably, the first heat-conducting filler, the second heat-conducting filler, the third heat-conducting filler, the fourth heat-conducting filler, the fifth heat-conducting filler and the sixth heat-conducting filler are respectively one or more combinations independently selected from magnesium oxide, beryllium oxide, aluminum nitride, boron nitride, crystalline silica and synthetic diamond.
Preferably, the first heat-conducting filler, the second heat-conducting filler, the third heat-conducting filler, the fourth heat-conducting filler, the fifth heat-conducting filler and the sixth heat-conducting filler are selected from two alumina fillers with different particle sizes for use in combination, or alumina and aluminum nitride, alumina and boron nitride for use in combination.
Preferably, the first heat-conducting filler, the second heat-conducting filler, the third heat-conducting filler, the fourth heat-conducting filler, the fifth heat-conducting filler and the sixth heat-conducting filler are respectively fillers with heat conductivity coefficient more than or equal to 10W/M.K.
9. An intelligent power module, comprising: the power-only module includes the heat sink of any one of claims 1 to 5.
10. The smart power module of claim 9, wherein: the power module also comprises a conductive layer thermally compounded on the resin layer and packaging resin used for packaging the radiating fin and the conductive layer, wherein an anti-oxidation coating is arranged on the surface, opposite to the resin layer, of the radiating fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111465735.8A CN114196303A (en) | 2021-12-03 | 2021-12-03 | Intelligent power module and radiating fin for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111465735.8A CN114196303A (en) | 2021-12-03 | 2021-12-03 | Intelligent power module and radiating fin for same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114196303A true CN114196303A (en) | 2022-03-18 |
Family
ID=80650347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111465735.8A Pending CN114196303A (en) | 2021-12-03 | 2021-12-03 | Intelligent power module and radiating fin for same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114196303A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116082986A (en) * | 2023-01-10 | 2023-05-09 | 惠州市帕克威乐新材料有限公司 | Heat-conducting adhesive film and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
| CN105713527A (en) * | 2016-01-30 | 2016-06-29 | 珠海格力电器股份有限公司 | Heat conduction adhesive sheet and preparation method thereof, electronic element and household appliance |
| CN109768019A (en) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of power module cooling fin and power module made of it |
| CN111844951A (en) * | 2020-08-05 | 2020-10-30 | 福建臻璟新材料科技有限公司 | High-frequency heat-conducting substrate and preparation method thereof |
-
2021
- 2021-12-03 CN CN202111465735.8A patent/CN114196303A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105280587A (en) * | 2015-07-03 | 2016-01-27 | 苏州赛伍应用技术有限公司 | Radiator fin for power module and power module made of the same |
| CN105713527A (en) * | 2016-01-30 | 2016-06-29 | 珠海格力电器股份有限公司 | Heat conduction adhesive sheet and preparation method thereof, electronic element and household appliance |
| CN109768019A (en) * | 2018-12-29 | 2019-05-17 | 苏州赛伍应用技术股份有限公司 | A kind of power module cooling fin and power module made of it |
| CN111844951A (en) * | 2020-08-05 | 2020-10-30 | 福建臻璟新材料科技有限公司 | High-frequency heat-conducting substrate and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116082986A (en) * | 2023-01-10 | 2023-05-09 | 惠州市帕克威乐新材料有限公司 | Heat-conducting adhesive film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5947297B2 (en) | Highly efficient heat-dissipating paint composition using carbon material | |
| TWI633813B (en) | Boron nitride-resin composite circuit substrate, boron nitride-resin composite heat release plate integrated circuit substrate | |
| CN109762497B (en) | Insulating heat-conducting adhesive film for heating device and heating device made of insulating heat-conducting adhesive film | |
| KR20120068949A (en) | Resin composition, resin sheet, and resin cured product and method for producing same | |
| WO2011114665A1 (en) | Heat-resistant adhesive | |
| JP2016108457A (en) | Resin composition and method for producing the same | |
| CN107614619B (en) | Thermosetting material and cured product | |
| CN105659711A (en) | Epoxy-resin composition, carrier material with resin layer, metal-based circuit board, and electronic device | |
| WO2021020540A1 (en) | Inorganic particle dispersion resin composition and manufacturing method of inorganic particle dispersion resin composition | |
| JP2014185296A (en) | Liquid resin composition and processed product | |
| JP6919575B2 (en) | Manufacturing method of prepreg, printed wiring board, semiconductor package and printed wiring board | |
| CN109768019B (en) | Heat radiating fin for power module and power module manufactured by same | |
| CN114196303A (en) | Intelligent power module and radiating fin for same | |
| JP2024050865A (en) | Method for producing aluminum nitride particles coated with silicon-containing oxide and aluminum nitride particles coated with silicon-containing oxide | |
| JP2016004841A (en) | Metal foil-clad board, circuit board and heating element mounting board | |
| CN105713527B (en) | Thermally conductive film and preparation method thereof and electronic component and household electrical appliance | |
| JP5760702B2 (en) | Adhesive composition for electronic device and adhesive sheet for electronic device | |
| US20210238465A1 (en) | Method of producing glass-coated aluminum nitride particles and method of producing heat-dissipating resin composition comprising these glass-coated aluminum nitride particles | |
| CN110234712B (en) | Resin material and laminate | |
| EP3988621A2 (en) | Thermally conductive and electrically insulating paint composition, and exterior steel sheet for solar cell, comprising same | |
| JP2021084814A (en) | Surface-treated boron nitride production method, surface-treated boron nitride, resin composition, and cured product | |
| CN111040699B (en) | Adhesive, preparation method thereof and PET (polyethylene terephthalate) reinforced adhesive tape containing adhesive | |
| JP7395849B2 (en) | Thermosetting resin composition, its resin sheet, and metal base substrate | |
| CN111479773B (en) | Glass-coated aluminum nitride particles, process for producing the same, and heat-radiating resin composition containing the same | |
| CN113292933B (en) | High-thermal-conductivity-coefficient pressure-sensitive adhesive and high-thermal-conductivity-coefficient pressure-sensitive adhesive tape |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220318 |