CN106753018A - A kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad - Google Patents

A kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad Download PDF

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Publication number
CN106753018A
CN106753018A CN201710102321.6A CN201710102321A CN106753018A CN 106753018 A CN106753018 A CN 106753018A CN 201710102321 A CN201710102321 A CN 201710102321A CN 106753018 A CN106753018 A CN 106753018A
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China
Prior art keywords
heat
heat conduction
foam
foam pad
cpu
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Withdrawn
Application number
CN201710102321.6A
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Chinese (zh)
Inventor
李林军
梁超云
纪双明
李世强
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SHENZHEN JINHUI TECHNOLOGY Co Ltd
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SHENZHEN JINHUI TECHNOLOGY Co Ltd
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Priority to CN201710102321.6A priority Critical patent/CN106753018A/en
Publication of CN106753018A publication Critical patent/CN106753018A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/36—After-treatment
    • C08J9/365—Coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/26—Porous or cellular plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2101/00—Manufacture of cellular products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • C08J2375/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2433/00—Presence of (meth)acrylic polymer
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate

Abstract

The invention discloses a kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad, including the fire-retardant foam of heat resistance, heat-insulated thermosol, heat-conducting layer, heat conduction pressure sensitive adhesive and release liners, the fire-retardant foam of heat resistance is by heat-insulated PUR and heat-conducting layer molding bonded, the bottom of the heat-conducting layer is provided with heat conduction pressure sensitive adhesive, the heat conduction pressure sensitive adhesive opposite side has release liners, the heat-conducting layer from inside to outside includes the coat of metal successively, PET film, graphene layer, conductive graphite paper and heat conductive insulating silica gel, the both sides of the edge position of the heat conductive insulating silica gel is provided with heat-conducting glue.Heat conduction foam pad elasticity of the invention is preferably, and using after a period of time, its elasticity only has minor variations with the time, its elasticity is still very good after long-time use, heat conduction foam pad using will not be bent and the thermal conductivity factor of heat conduction foam pad is better than like product after a while simultaneously so that the radiating efficiency of whole radiator is greatly improved.

Description

A kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad
Technical field
The present invention relates to CPU field of radiating, and in particular to a kind of structure of CPU heat transmissions heat conduction foam pad and manufacture work Skill.
Background technology
PC and electronic product now, in supper-fast development model.Therefore, the heating of electronic original part has become The bottleneck of restriction microelectric technique.With the continuous propulsion of technology, power and the performance also more and more higher of CPU, it is contemplated that CPU Caloric value in unit area is very surprising.Therefore, the heat dispersion of CPU is also increasingly taken seriously.
Cpu heat plays very crucial effect, good cpu heat, it is ensured that CPU is steady to the performance of system Fixed efficient operating, extends the service life of CPU.Current CPU radiating modes mainly divide three major types, and a class is wind-cooling heat dissipating, one Class is heat pipe heat radiation, and also one kind is exactly water-cooling.
Cpu heat the more commonly used at present is the combined process of wind-cooling heat dissipating or heat pipe heat radiation or both, and both dissipate Hot mode, although radiating efficiency is not as good as water-cooling, but its is cheap, very Jing Yin in running.Accordingly, as general The first-selection of computer clients.With the continuous improvement of cpu performance, the radiating efficiency of both radiating modes is all unable to catch up with its development Trend, is limited in two kinds of radiating modes and will use heat conductive silica gel pad wherein topmost, and this pad thermal conductivity factor is only There is 5W/ (m.k) left and right, its copper pipe and aluminium flake have the thermal conductivity factor of 300W/ (m.k) left and right by contrast, therefore, thermal conductive silicon rubber cushion Piece has had a strong impact on the radiating efficiency of whole radiator.
The content of the invention
The technical problem to be solved in the present invention is the defect for overcoming prior art, there is provided a kind of CPU heat transmissions heat conduction bubble The structure and manufacturing process of cotton pad piece.
In order to solve the above-mentioned technical problem, the invention provides following technical scheme：A kind of CPU heat transmissions heat conduction foam The structure and manufacturing process of pad, including the fire-retardant foam of heat resistance, heat-insulated thermosol, heat-conducting layer, heat conduction pressure sensitive adhesive and release liners, The fire-retardant foam of heat resistance is by heat-insulated PUR and heat-conducting layer molding bonded, and it is pressure-sensitive that the bottom of the heat-conducting layer is provided with heat conduction Glue, the heat conduction pressure sensitive adhesive opposite side have release liners, the heat-conducting layer from inside to outside successively include the coat of metal, PET film, Graphene layer, conductive graphite paper and heat conductive insulating silica gel, the both sides of the edge position of the heat conductive insulating silica gel are provided with heat-conducting glue, two Conductive graphite paper and graphene layer are provided between the individual heat-conducting glue, the conductive graphite paper is connected with graphene layer, described to lead Hot glue is connected with heat conductive insulating silica gel and PET film respectively, and the PET film bottom is connected with the coat of metal.
Preferably, the fire-retardant foam of the heat resistance is treated polyurethane foam, and thickness is 0.5mm-30mm, specifically Technique is as follows：
S1：Liquid flame retardant is added in Isocyanate prepolymers body, after being well mixed, PPG, foaming is added Various auxiliary agents such as agent, catalyst, foam stabiliser, foamed formation polyurethane foam material；
S2：Shape and design grinding tool according to required product are ground to polyurethane foam material, poly- ammonia needed for obtaining Ester foam；
S3：Water flame-proof paint is sprayed on polyurethane foam, by 80 DEG C of drying 30min, heat resistance used is obtained final product Fire-retardant foam.
Preferably, the liquid flame retardant is composite flame-retardant agent, specially liquid flame retardant RDP (resorcinol (diphenyl Phosphate)), in liquid flame retardant TPP (triphenyl phosphate) and liquid flame retardant BDP (bisphenol-A is double (diphenyl phosphoester)) One or more.
Preferably, the water flame-proof paint is：Powdery flame retardent and water-base resin are added in a certain amount of water, it is high Speed is uniformly mixed, that is, obtain water flame-proof paint used by this foam, and the granularity of powdery flame retardent is 1-5 μm；
Preferably, the heat-insulated PUR is PA PURs, EVA hot-melt adhesive, one kind of PE PURs.
Preferably, the thickness of the heat-conducting layer is 0.5mm-2.0mm, and the thickness of the conductive graphite paper is 0.05mm- 0.5mm, the thickness of the graphene layer is 0.005mm-0.02mm, and the thickness of the PET film is 0.1mm-0.5mm, described The thickness of heat conductive insulating silica gel is 0.2mm-1.0mm, and the thickness of the coat of metal is 0.005mm-0.02mm, and the heat conduction is exhausted The width of edge silica gel is greater than the width of conductive graphite paper and graphene layer, and the width of the PET film is greater than heat conductive insulating The width of silica gel.
Preferably, the coat of metal is the one kind in copper, nickel, silver, gold plate.
Preferably, the thickness of the heat conduction pressure sensitive adhesive is 0.03mm-0.08mm, specially heat conduction acrylate pressure sensitive adhesive.
Preferably, the thickness of the release liners is 0.05mm-0.1mm, and the off-type force of the release liners is 15g-20g.
The beneficial effect that is reached of the present invention is：
1. the elastic difference compared with the heat conduction foam pad that patent of the present invention is used of heat conductive silica gel pad is far, and leads Using after a period of time, its heat conductive silica gel can be hardened hot silica gel pad, and the heat conduction foam pad bullet that patent of the present invention is used Property only has minor variations with the time, and its elasticity is still very good after long-time use.
2. heat conductive silica gel pad has a strong impact on heat dispersion using that can bend after a period of time, and the present invention is specially The heat conduction foam pad that profit is used will not then bend.
3. the heat conduction foam pad thermal conductivity factor that patent of the present invention is used is better than like product so that entirely radiator is scattered The thermal efficiency is greatly improved.
Brief description of the drawings
Accompanying drawing is used for providing a further understanding of the present invention, and constitutes a part for specification, with reality of the invention Applying example is used to explain the present invention together, is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 be a kind of CPU heat transmissions heat conduction foam pad of the invention structure and manufacturing process in heat conduction foam pad knot Structure schematic diagram；
Fig. 2 be a kind of CPU heat transmissions heat conduction foam pad of the invention structure and manufacturing process in heat conduction foam pad cut open Face structural representation；
Fig. 3 be a kind of CPU heat transmissions heat conduction foam pad of the invention structure and manufacturing process in the structure of heat-conducting layer show It is intended to；
Fig. 4 be a kind of CPU heat transmissions heat conduction foam pad of the invention structure and manufacturing process in cpu heat structure show It is intended to；
Fig. 5 be a kind of CPU heat transmissions heat conduction foam pad of the invention structure and manufacturing process in heat conduction foam pad Manufacturing process flow diagram；
In figure：1st, the fire-retardant foam of heat resistance；2nd, heat-insulated thermosol；3rd, heat-conducting layer；4th, heat conduction pressure sensitive adhesive；5th, release liners；6、 Conductive graphite paper；7th, heat conductive insulating silica gel；8th, graphene layer；9th, heat-conducting glue；10th, PET film；11st, the coat of metal；12nd, radiate Fan；13rd, fin；14th, heat conduction foam pad；15th, cpu chip；16th, PCB.
Specific embodiment
The preferred embodiments of the present invention are illustrated below in conjunction with accompanying drawing, it will be appreciated that preferred reality described herein Apply example to be merely to illustrate and explain the present invention, be not intended to limit the present invention.
Embodiment 1
As shown in Figure 1-Figure 3, the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad of the present embodiment, bag Include the fire-retardant foam 1 of heat resistance, heat-insulated thermosol 2, heat-conducting layer 3, heat conduction pressure sensitive adhesive 4 and release liners 5, the fire-retardant foam of heat resistance 1 by heat-insulated PUR 2 and the molding bonded of heat-conducting layer 3, and the bottom of the heat-conducting layer 3 is provided with heat conduction pressure sensitive adhesive 4, the heat conduction pressure The opposite side of quick glue 4 has release liners 5, and the heat-conducting layer 3 from inside to outside includes the coat of metal 11, PET film 10, Graphene successively Layer 8, conductive graphite paper 6 and heat conductive insulating silica gel 7, the both sides of the edge position of the heat conductive insulating silica gel 7 is provided with heat-conducting glue 9, two Conductive graphite paper 6 and graphene layer 8 are provided between the individual heat-conducting glue 9, the conductive graphite paper 6 is connected with graphene layer 8, institute State heat-conducting glue 9 to be connected with heat conductive insulating silica gel 7 and PET film 10 respectively, the bottom of the PET film 10 and the phase of the coat of metal 11 Even.
The fire-retardant foam 1 of heat resistance is treated polyurethane foam, and thickness is 5mm, and concrete technology is as follows：
S1：Liquid flame retardant is added in Isocyanate prepolymers body, after being well mixed, PPG, foaming is added Various auxiliary agents such as agent, catalyst, foam stabiliser, foamed formation polyurethane foam material；
S2：Shape and design grinding tool according to required product are ground to polyurethane foam material, poly- ammonia needed for obtaining Ester foam；
S3：Water flame-proof paint is sprayed on polyurethane foam, by 80 DEG C of drying 30min, heat resistance used is obtained final product Fire-retardant foam.
The liquid flame retardant is composite flame-retardant agent, and specially RDP (resorcinol (diphenyl phosphoester)) and BDP are (double Phenol A double (diphenyl phosphoester)) mixture, ratio is 1:2；The water flame-proof paint is specially：By polypentaerythritol phosphorus Acid esters white powder and waterborne polyurethane resin are added in a certain amount of water, and high-speed stirred is well mixed, that is, obtain this foam institute With water flame-proof paint, polymeric pentaerythrityl phosphate white powder granularity is 1 μm；The heat-insulated PUR 2 is PA PURs；Institute The thickness of heat-conducting layer 3 is stated for 0.765mm, the thickness of the conductive graphite paper 6 is 0.2mm, and the thickness of the graphene layer 8 is 0.005mm, the thickness of the PET film 10 is 0.3mm, and the thickness of the heat conductive insulating silica gel 7 is 0.25mm, the metal-plated The thickness of layer 11 is 0.01mm, and the width of the heat conductive insulating silica gel 7 is greater than the width of conductive graphite paper 6 and graphene layer 8, The width of the PET film 10 is greater than the width of heat conductive insulating silica gel 7；The coat of metal 11 is copper electroplating layer；It is described to lead The thickness of hot pressure sensitive adhesive 4 is 0.05mm, specially heat conduction acrylate pressure sensitive adhesive；The thickness of the release liners 5 is 0.05mm, described The off-type force of release liners 5 is 15g.
Performance indications and some method of testings：
Specific embodiment：As shown in figure 4, the concrete structure that Fig. 4 is the cpu heat that the present invention is applied in CPU shows It is intended to, including radiator fan 12, fin 13, heat conduction foam pad 14, cpu chip 15 and PCB 16, the radiation air Fan 12 is located at the top of cpu heat, and the radiator fan 12 is connected with fin 13, and the fin 13 can also be replaced with Radiating tube, the bottom of the fin 13 is provided with heat conduction foam pad 14, the bottom of heat conduction foam pad 14 and cpu chip 15 It is connected, the bottom of the cpu chip 15 is connected with CPU line road plate 16, the conductive graphite paper 6 used in the heat conduction foam pad 14 The thermal conductivity factor of 1000W/ (m.k) is held up to, heat can be preferably conducted, the heat superconducting function of graphene layer 8, heat conduction is aided in Speed faster, while can prevent graphite paper 6 and graphene layer 8 from falling as heat conductive insulating protective layer using heat conductive insulating layer of silica gel 7 Powder or the short circuit risk brought that comes off.
Finally it should be noted that：The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, Although being described in detail to the present invention with reference to the foregoing embodiments, for a person skilled in the art, it still may be used Modified with to the technical scheme described in foregoing embodiments, or equivalent is carried out to which part technical characteristic. All any modification, equivalent substitution and improvements within the spirit and principles in the present invention, made etc., should be included in of the invention Within protection domain.

Claims (9)

1. a kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad, including the fire-retardant foam of heat resistance (1), insulation thermal Colloidal sol (2), heat-conducting layer (3), heat conduction pressure sensitive adhesive (4) and release liners (5), the fire-retardant foam of heat resistance (1) is by heat-insulated hot melt Glue (2) and heat-conducting layer (3) molding bonded, the bottom of the heat-conducting layer (3) is provided with heat conduction pressure sensitive adhesive (4), the heat conduction pressure sensitive adhesive (4) opposite side have release liners (5), the heat-conducting layer (3) from inside to outside successively include the coat of metal (11), PET film (10), Graphene layer (8), conductive graphite paper (6) and heat conductive insulating silica gel (7), the both sides of the edge position of the heat conductive insulating silica gel (7) Heat-conducting glue (9) is provided with, conductive graphite paper (6) and graphene layer (8), the heat conduction stone are provided between two heat-conducting glues (9) Black paper (6) is connected with graphene layer (8), and the heat-conducting glue (9) is connected with heat conductive insulating silica gel (7) and PET film (10) respectively, PET film (10) bottom is connected with the coat of metal (11).
2. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The fire-retardant foam of heat resistance (1) is treated polyurethane foam, and thickness is 0.5mm-30mm, and concrete technology is as follows：
S1：Liquid flame retardant is added in Isocyanate prepolymers body, after being well mixed, PPG, foaming agent is added, is urged Various auxiliary agents such as agent, foam stabiliser, foamed formation polyurethane foam material；
S2：Shape and design grinding tool according to required product are ground to polyurethane foam material, obtain required polyurethane foam Cotton；
S3：Water flame-proof paint is sprayed on polyurethane foam, by 80 DEG C of drying 30min, heat resistance used is obtained final product fire-retardant Foam.
3. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 2, its feature exists In:The liquid flame retardant is composite flame-retardant agent, specially liquid flame retardant RDP (resorcinol (diphenyl phosphoester)), liquid One or more in body fire retardant TPP (triphenyl phosphate) and liquid flame retardant BDP (bisphenol-A is double (diphenyl phosphoester)).
4. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 2, its feature exists In：The water flame-proof paint is：Powdery flame retardent and water-base resin are added in a certain amount of water, high-speed stirred mixing is equal It is even, that is, water flame-proof paint used by this foam is obtained, the granularity of powdery flame retardent is 1-5 μm.
5. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The heat-insulated PUR (2) is PA PURs, EVA hot-melt adhesive, one kind of PE PURs.
6. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The thickness of the heat-conducting layer (3) is 0.5mm-2.0mm, and the thickness of the conductive graphite paper (6) is 0.05mm-0.5mm, institute The thickness of graphene layer (8) is stated for 0.005mm-0.02mm, the thickness of the PET film (10) is 0.1mm-0.5mm, described to lead The thickness of heat insulation silica gel (7) is 0.2mm-1.0mm, and the thickness of the coat of metal (11) is 0.005mm-0.02mm, described The width of heat conductive insulating silica gel (7) is greater than the width of conductive graphite paper (6) and graphene layer (8), the PET film (10) Width is greater than the width of heat conductive insulating silica gel (7)..
7. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The coat of metal (11) is copper, the one kind in nickel, silver, gold plate.
8. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The thickness of the heat conduction pressure sensitive adhesive (4) is 0.03mm-0.08mm, specially a kind of heat conduction acrylate pressure sensitive adhesive.
9. the structure and manufacturing process of a kind of CPU heat transmissions heat conduction foam pad according to claim 1, its feature exists In:The thickness of the release liners (5) is 0.05mm-0.1mm, and the off-type force of the release liners (5) is 15g-20g.
CN201710102321.6A 2017-02-24 2017-02-24 A kind of structure and manufacturing process of CPU heat transmissions heat conduction foam pad Withdrawn CN106753018A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108184316A (en) * 2017-11-21 2018-06-19 上海阿莱德实业股份有限公司 The high heat conduction piece of abrasion-resistant and its application
CN109233671A (en) * 2018-10-24 2019-01-18 苏州益邦电子材料有限公司 The dust-proof damping rubber band of Notebook Battery
CN109483968A (en) * 2018-11-09 2019-03-19 中国兵器工业第五九研究所 Composite heat-insulated material layer, insulating product and application
CN112590347A (en) * 2020-12-07 2021-04-02 苏州林大新型材料科技有限公司 Ultrathin foam for radiating mobile phone and production process thereof
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
CN115287009A (en) * 2022-07-14 2022-11-04 深圳稀导技术有限公司 Multi-channel heat conduction gasket and manufacturing method thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108184316A (en) * 2017-11-21 2018-06-19 上海阿莱德实业股份有限公司 The high heat conduction piece of abrasion-resistant and its application
CN109233671A (en) * 2018-10-24 2019-01-18 苏州益邦电子材料有限公司 The dust-proof damping rubber band of Notebook Battery
CN109483968A (en) * 2018-11-09 2019-03-19 中国兵器工业第五九研究所 Composite heat-insulated material layer, insulating product and application
US11483948B2 (en) 2019-08-28 2022-10-25 Laird Technologies, Inc. Thermal interface materials including memory foam cores
CN112590347A (en) * 2020-12-07 2021-04-02 苏州林大新型材料科技有限公司 Ultrathin foam for radiating mobile phone and production process thereof
CN115287009A (en) * 2022-07-14 2022-11-04 深圳稀导技术有限公司 Multi-channel heat conduction gasket and manufacturing method thereof
CN115287009B (en) * 2022-07-14 2023-10-20 深圳稀导技术有限公司 Multi-channel heat conduction gasket and manufacturing method thereof

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