CN107573446A - Boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method - Google Patents
Boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method Download PDFInfo
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Abstract
The invention provides a kind of boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method.The thermal interfacial material includes carbopol gel matrix and heat filling, and wherein carbopol gel matrix, which includes ferric ion carbopol gel or modified silicon ball carbopol gel, heat filling, includes boron nitride nanosheet.The preparation method of the thermal interfacial material is：Acrylic acid, water and trivalent iron salt or modified silicon ball are well mixed, boron nitride nanosheet is added and is well mixed, is stirred, then stirring reaction 30 40 minutes in the presence of initiator, then reaction 40 48 hours are stood at 35 ± 2 DEG C, obtains the thermal interfacial material.Thermal interfacial material provided by the invention is a kind of deformable and recoverable gel thermal interfacial material, it has excellent heat conductivility, and it can be brought into close contact in the various surfaces that need to be radiated, make there is no air circulation in the gap between heater element and spreader surface completely.
Description
Technical field
The present invention relates to a kind of boron nitride nanosheet and carbopol gel composite heat interfacial material and preparation method thereof, category
In thermal interfacial material technical field.
Background technology
With the electronic products such as computer chip, high-power electronic device and photoelectric device, air-conditioning, TV, refrigerator, LED
The modern transportation such as family expenses and industrial electric apparatus, automobile, aircraft, steamer, the high ferro equipment such as illumination are to lightweight, miniaturization, height
Power direction develops, and heat caused by its unit area is more and more high, and higher requirement is proposed to heat control system.Therefore, such as
What quick, safety heat taken away on heater element becomes an important topic for restricting many industrial circle development.
In above-mentioned field, by taking integrated circuit as an example, with its various electronics and its association area flourish and
Widely use, how to solve the heat dissipation problem of integrated circuit becomes the main problem that the field needs to solve.Overheat will be big
Amplitude slows down the operating efficiency of integrated circuit, in addition integrated circuit is caused it is badly damaged, and may be over time it is tired
Product makes whole equipment eventual failure.Generally, the problems of excessive heat of integrated circuit be by thereon install additional radiator or
Fan can also add thermal interfacial material to help its radiating to solve in the gap of integrated circuit and radiator
(TIM) heat transfer is carried out.
Existing thermal interfacial material mainly includes thermal paste, thermally conductive gel, phase-change thermal interface material, polymer-based compound
Several classes such as thermal interfacial material and metal heat interface material.Wherein, heat filling is especially used as using aluminum oxide, boron nitride or aluminium nitride
Thermal interfacial material be widely studied and develop.Compound of the boron nitride (Boron Nitride, BN) as similar graphite,
Material science research field has shown many noticeable characteristics, such as high intrinsic thermal conductivity, excellent chemical stability
With heat endurance, broad-band gap and good greasy property.Especially, due to boron nitride nanosheet (boron nitride
Nanosheets, BNNS) there is higher aspect ratio (aspect ratio) and specific surface area, compared with its block materials, table
Reveal more excellent material property.
In recent years, existing thermal interfacial material can not already meet that integrated level and power density further carry in electronic technology
It is high to the requirement that radiates, and (including elasticity, viscosity, tensile strength etc. are just for the mechanical performance of existing thermal interfacial material
Face) still need to further improve, therefore a kind of new thermal interfacial material using boron nitride nanosheet as heat filling is developed, into
For one of this area urgent problem to be solved.
The content of the invention
In order to solve the above technical problems, it is an object of the invention to provide a kind of boron nitride nanosheet and carbopol gel
Composite heat interfacial material and preparation method thereof.The thermal interfacial material is a kind of deformable and recoverable hot interface material of gel
Material, it has excellent heat conductivility, and can be brought into close contact in the various surfaces that need to be radiated, and makes heater element and radiator
There is no air circulation in gap between surface completely.
To reach above-mentioned purpose, present invention firstly provides a kind of boron nitride nanosheet and carbopol gel compound thermal circle
Plane materiel material, the thermal interfacial material includes carbopol gel matrix and heat filling, wherein the carbopol gel matrix
Boron nitride is comprised at least including ferric ion-carbopol gel or modified silicon ball-carbopol gel, the heat filling
Nanometer sheet.
In above-mentioned thermal interfacial material, it is preferable that a diameter of 200-2000nm of used boron nitride nanosheet, individual layer
Thickness is about 0.8-1.2nm, and single-sheet thickness is about 5-15nm, and thermal conductivity is about 200-800W/mK.
In above-mentioned thermal interfacial material, it is preferable that prepare boron nitride nanosheet and third used by the thermal interfacial material
The mass ratio of olefin(e) acid is (1-5):10.
In above-mentioned thermal interfacial material, it is preferable that the heat filling can further include aluminum oxide, aluminium nitride and
One or more of combinations in carborundum etc., prepare aluminum oxide, aluminium nitride and carborundum used by the thermal interfacial material
The mass ratio of one or more of combinations and acrylic acid in is (0-5):10, the mass ratio is preferably (1-5):10.
In above-mentioned thermal interfacial material, it is preferable that prepare ferric ion and propylene used by the thermal interfacial material
The mol ratio of acid is (0.4-0.6):100, the mol ratio is more preferably (0.45-0.55):100.
In above-mentioned thermal interfacial material, it is preferable that prepare modified silicon ball and acrylic acid used by the thermal interfacial material
Mass ratio be 0.09-0.11:100.The modification silicon ball can include vinyl silicon ball, and the diameter of the vinyl silicon ball can be
2.5-3.5nm。
According to the embodiment of the present invention, it is preferable that above-mentioned boron nitride nanosheet and carbopol gel compound thermal
The thermal conductivity of boundary material is 1-3.5W/mK, complex viscosity 105-108Pas, tensile strength 20-40kPa, Applicable temperature
For 0-120 DEG C.
According to the embodiment of the present invention, it is preferable that above-mentioned boron nitride nanosheet and carbopol gel compound thermal
Boundary material is prepared by least following steps：
(1) acrylic acid, water and trivalent iron salt or modified silicon ball are well mixed；
(2) boron nitride nanosheet is added, is well mixed；
(3) stirring 8-12 hours after；
(4) the stirring reaction 30-40 minutes and then in the presence of initiator, then stand reaction 35 ± 2 DEG C (in water-baths)
40-48 hours, obtain described boron nitride nanosheet and carbopol gel composite heat interfacial material.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, the mass ratio of used acrylic acid and water is 2:8-5:5, more preferably 2:8.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
The preparation process of thermal interfacial material further comprises step (5) after step (4)：Boron nitride nanosheet described in constant temperature drying
Reach required amount with the mass content of carbopol gel composite heat interfacial material to water therein.What the baking step obtained
The mass content of thermal interfacial material reclaimed water can be carried out conventional adjustment by those skilled in the art.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, the mol ratio of ferric ion and acrylic acid in used trivalent iron salt is (0.4-
0.6):100, the mol ratio is more preferably (0.45-0.55):100.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, used trivalent iron salt includes iron chloride and/or ferric nitrate etc..
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, the mass ratio of used modified silicon ball and acrylic acid is 0.09-0.11:100.The modification
Silicon ball can include vinyl silicon ball, and the diameter of the vinyl silicon ball can be 2.5-3.5nm.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, the mass ratio of used boron nitride nanosheet and acrylic acid is (1-5):10.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, used boron nitride nanosheet is through the following steps that be prepared：By boron nitride
Powder is put into water and/or alcohol ultrasound repeatedly and stirring, and makes total ultrasonic time control in 110-130 minutes；Then by water
And/or alcohol separates with the boron nitride powder after supersound process and (such as can use and make the side of water and/or alcohol explosive evaporation
Formula), after the boron nitride powder after supersound process is dried at 50-60 DEG C (can use baking oven carry out), obtain described
Boron nitride nanosheet.Wherein, the particle diameter of used boron nitride powder can be 1-100 μm, and resulting boron nitride is received
A diameter of 200-2000nm of rice piece, thickness in monolayer is about 0.8-1.2nm, and single-sheet thickness is about 5-15nm, and thermal conductivity is about
200-800W/mK.The ultrasonic power can be (120 ± 2) W, and frequency can be (40 ± 2) KHz.
According to the embodiment of the present invention, it is preferable that above-mentioned boron nitride nanosheet and carbopol gel compound thermal
The preparation process of boundary material also includes：When adding boron nitride nanosheet, it is additionally added in aluminum oxide, aluminium nitride and carborundum etc.
One or more of combinations.Also, one or more of combinations in used aluminum oxide, aluminium nitride and carborundum etc. with
The mass ratio of acrylic acid is (0-5):10, the mass ratio is preferably (1-5):10..
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, used initiator includes ammonium persulfate, and the ammonium persulfate and acrylic acid added
Mol ratio be (0.4-0.6):100, the mol ratio is preferably (0.45-0.55):100.
According to the embodiment of the present invention, it is preferable that compound in above-mentioned boron nitride nanosheet and carbopol gel
In the preparation process of thermal interfacial material, at least step (4) is carried out in a mold.In addition, step (1)-(3) can also be in mould
Carried out in tool.It is put into that is, sufficient raw material will can be stirred in mould, can also be in dispensing just directly in mould
Carried out in tool.And before initiator is added, can first it vacuumize to discharge the air in raw material；Adding initiator and stirring
After reacting 30-40 minutes, it can again vacuumize, then seal mould, be placed in 35 ± 2 DEG C of water-baths and stand reaction
40-48 hours.
Boron nitride nanosheet provided by the invention and carbopol gel composite heat interfacial material employ ferric ion-
Carbopol gel or modified silicon ball-carbopol gel make polyacrylic acid chain and the iron in the thermal interfacial material as matrix
Ion or modified silicon ball are linked to each other, and form long-chain and network structure, substantially increase mechanical performance (including the bullet of gel
Property, viscosity, tensile strength etc.), its restorability is improved, extends its service life.Wherein, modified silicon ball is as four
Valency thing can provide more hinged nodes to ensure more preferable mechanical performance.Meanwhile thermal interfacial material of the invention is at least adopted
By the use of boron nitride nanosheet as heat filling, because boron nitride nanosheet has excellent heat conductivility so that heat of the invention
Boundary material has higher thermal conductivity.Therefore, thermal interfacial material provided by the invention is a kind of deformable and recoverable solidifying
Gluey thermal interfacial material, it has excellent self-healing properties and can restored to the original state by controlling water content, and it also has
There is excellent heat conductivility, and can be brought into close contact in the various surfaces that need to be radiated, make between heater element and spreader surface
Gap in there is no air circulation completely, while it also has longer service life, is repeatedly being cut and split is entered again
After row self-healing, healing position still can bear higher stress and thermal conductivity reduces without obvious.
Present invention also offers the preparation of a kind of above-mentioned boron nitride nanosheet and carbopol gel composite heat interfacial material
Method, the preparation method comprise the following steps：
(1) acrylic acid, water and trivalent iron salt or modified silicon ball are well mixed；
(2) boron nitride nanosheet is added, is well mixed；
(3) stirring 8-12 hours after；
(4) the stirring reaction 30-40 minutes and then in the presence of initiator, then stand reaction 35 ± 2 DEG C (in water-baths)
40-48 hours, obtain described boron nitride nanosheet and carbopol gel composite heat interfacial material.
In above-mentioned preparation method, it is preferable that the mass ratio of used acrylic acid and water is 2:8-5:5, more preferably
2:8。
According to the embodiment of the present invention, it is preferable that further comprise in above-mentioned preparation method after step (4)
Step (5)：With the boron nitride nanosheet described in constant temperature drying and carbopol gel composite heat interfacial material to water therein
Mass content reaches required amount.The mass content for the thermal interfacial material reclaimed water that the baking step obtains can be by art technology
Personnel carry out conventional adjustment.
In above-mentioned preparation method, it is preferable that mole of ferric ion and acrylic acid in used trivalent iron salt
Than for (0.4-0.6):100, the mol ratio is more preferably (0.45-0.55):100.
In above-mentioned preparation method, it is preferable that used trivalent iron salt includes iron chloride and/or ferric nitrate etc..
In above-mentioned preparation method, it is preferable that the mass ratio of used modified silicon ball and acrylic acid is 0.09-0.11:
100.The modification silicon ball can include vinyl silicon ball, and the diameter of the vinyl silicon ball can be 2.5-3.5nm.
In above-mentioned preparation method, it is preferable that the mass ratio of used boron nitride nanosheet and acrylic acid is (1-5):
10。
In above-mentioned preparation method, it is preferable that used boron nitride nanosheet is through the following steps that be prepared：
Boron nitride powder is put into water and/or alcohol ultrasound repeatedly and stirring, and makes total ultrasonic time control in 110-130 minutes；
Then separate water and/or alcohol with the boron nitride powder after supersound process (such as can use makes water and/or alcohol seethe with excitement and steam
The mode of hair), (baking oven can be used to carry out) after the boron nitride powder after supersound process is dried at 50-60 DEG C, obtained
Described boron nitride nanosheet.Wherein, the particle diameter of used boron nitride powder can be 1-100 μm, resulting nitrogen
Change a diameter of 200-2000nm of boron nanometer sheet, thickness in monolayer is about 0.8-1.2nm, and single-sheet thickness is about 5-15nm, thermal conductivity
About 200-800W/mK.The ultrasonic power can be (120 ± 2) W, and frequency can be (40 ± 2) KHz.
According to the embodiment of the present invention, it is preferable that above-mentioned preparation method further comprises the steps：Adding
During boron nitride nanosheet, one or more of combinations for being additionally added in aluminum oxide, aluminium nitride and carborundum etc..Also, used
Aluminum oxide, aluminium nitride and carborundum etc. in one or more of combinations and the mass ratio of acrylic acid be (0-5):10, the matter
Amount is than being preferably (1-5):10.
In above-mentioned preparation method, it is preferable that used initiator includes ammonium persulfate, and the ammonium persulfate added
Mol ratio with acrylic acid is (0.4-0.6):100, the mol ratio is preferably (0.45-0.55):100.
In above-mentioned preparation method, it is preferable that at least step (4) is carried out in a mold；In addition, step (1)-(3)
It can also carry out in a mold.It is put into that is, sufficient raw material will can be stirred in mould, can also be in dispensing
With regard to directly carrying out in a mold.And before initiator is added, can first it vacuumize to discharge the air in raw material；Draw in addition
After sending out agent and stirring reaction 30-40 minutes, it can again vacuumize, then seal mould, be placed in 35 ± 2 DEG C of water-baths
Stand reaction 40-48 hours.
Compared with traditional thermal interfacial material, the advantage of thermal interfacial material of the invention mainly includes：
(1) compared to conventional solid thermal interfacial material
Conventional solid thermal interfacial material often is faced with filling the problem of gap between full two surfaces for needing heat transfer,
The air retained in gap will significantly reduce its heat conductivility.Compared to conventional solid thermal interfacial material, gel of the invention heat
Boundary material is soft and deformable, and it can be brought into close contact in any coarse or curved surface or gap, make hair
Enter completely without air in gap between thermal element and spreader surface, and then show of a relatively high heat-conductive characteristic,
It can be used in helping cooling integrated and integrated circuit and its related device played a protective role.
(2) compared to liquid thermal interfacial material
Liquid thermal interfacial material has mobility, in some instances it may even be possible to can be with the rise of temperature and adding up for usage time
And volatilize or be lost in.Compared to liquid thermal interfacial material, gel thermal interfacial material of the invention can shape, and
It will not flow or deform under wider temperature range, unless it absorbs a certain amount of moisture；And the thermal interfacial material of the present invention
The problem of will not volatilizing, and then heat-conductive characteristic is reduced in the absence of notable its of volatilization of thermal interfacial material；Therefore, it is of the invention solidifying
Gluey thermal interfacial material can be fixed in various types of gaps.
(3) compared to traditional disposable thermal boundary material
Compared to traditional disposable thermal boundary material, gel thermal interfacial material of the invention can in different application quilt
Reuse and there is longer service life, the thermal interfacial material is a kind of environment friendly material.
In summary, boron nitride nanosheet provided by the invention and carbopol gel composite heat interfacial material are that one kind can
Deformation and recoverable gel thermal interfacial material.Due to that can be transformed into different with deformability, the thermal interfacial material
Shape, therefore it can meet heater element surface or the spreader surface (such as coarse or curved surface) of different situations
Requirement, and can be brought into close contact in a variety of surfaces that need to be radiated, make various types of heater element with dissipating
There is no air circulation in gap between hot device surface completely, that is, there is splendid fit for different types of surface and gap
Ying Xing, and then improve heat conductivility.The thermal interfacial material has recoverability simultaneously, can be recovered by controlling water content
Original state, and there are excellent self-healing properties, after being repeatedly cut and split carries out self-healing again, healing position is still
Higher stress so can be born and thermal conductivity reduces without obvious, can also by absorbing water, dry and become arbitrary shape come quilt
Reuse, therefore the thermal interfacial material can be reused in different application and have longer service life.In addition,
Due to there is excellent heat conductivility as heat filling, the thermal interfacial material using boron nitride nanosheet.Therefore, the present invention carries
The boron nitride nanosheet of confession not only shows excellent heat-conductive characteristic with carbopol gel composite heat interfacial material, is also solid
Body heat boundary material generally can not be brought into close contact from different surfaces and liquid thermal interfacial material would generally volatilize or be lost in and carry
Solution is supplied.The gel thermal interfacial material of the present invention mainly can apply in the radiating of various integrated circuits, such as
CPU and relay radiating, can be used for other needs the field of heat transfer.
Embodiment
In order to which technical characteristic, purpose and the beneficial effect of the present invention is more clearly understood, now to the skill of the present invention
Art scheme carry out it is described further below, but it is not intended that to the present invention can practical range restriction.
Embodiment 1
Present embodiments provide a kind of boron nitride nanosheet and carbopol gel composite heat interfacial material, its be by with
What lower step was prepared：
(1) boron nitride powder is put into water and/or alcohol ultrasound repeatedly and stirring, and makes total ultrasonic time control 2
Hour, and the power of ultrasound can be 120W, frequency can be 40KHz；Then by water and/or alcohol explosive evaporation, by ultrasound
Boron nitride powder after processing is put into baking oven after 50 DEG C of drying, obtains boron nitride nanosheet；Wherein, used boron nitride
The particle diameter of powder is 1-20 μm, a diameter of 200-2000nm of resulting boron nitride nanosheet, and thickness in monolayer is about
1nm, single-sheet thickness are about 10nm, and thermal conductivity is about 300 ± 100W/mK；
(2) acrylic acid, water and iron chloride are well mixed；Wherein, the mass ratio of acrylic acid and water is 2:8, iron chloride
Mol ratio with acrylic acid is 0.5:100；
(3) boron nitride nanosheet that step (1) is prepared is added, is well mixed；Wherein, the boron nitride nanometer of addition
The mass ratio of piece and acrylic acid is 5:10；
(4) stirring 8-12 hours after；
(5) sufficient raw material will be stirred to be put into mould, vacuumized to discharge the air in raw material；Then add and draw
Agent ammonium persulfate simultaneously stirring reaction 0.5 hour is sent out, vacuumizes, then seals mould again, be placed in 35 DEG C of water-baths and stand
Reaction makes raw material fully react shaping in 48 hours, obtains the thick of boron nitride nanosheet and carbopol gel composite heat interfacial material
Product；Wherein, the mol ratio of the ammonium persulfate of addition and acrylic acid is 0.5:100；
(6) crude product of obtained gel thermal interfacial material is taken out, cut, weighed, then control quality with 30 DEG C
Constant temperature drying obtains described boron nitride nanosheet and polypropylene to the mass content of thermal interfacial material crude product reclaimed water to 40%
Acid gel composite heat interfacial material.
Test obtains the thermal conductivity of the boron nitride nanosheet and carbopol gel composite heat interfacial material of the present embodiment offer
Rate is 3.1981W/mK, complex viscosity 341291Pas, tensile strength 40.087kPa, and Applicable temperature is 0-120 DEG C.
The boron nitride nanosheet that the present embodiment provides is cut with carbopol gel composite heat interfacial material and spelled again
After conjunction, healing position can bear at least 10kPa stress, and thermal conductivity just has slight after cutting and healing three times
Reduce, thermal conductivity about reduces 10% or so.It can be seen that the present embodiment is using boron nitride nanosheet and ferric ion-poly- third
The compound obtained thermal interfacial material of olefin(e) acid gel has excellent self-healing performance, heat conductivility and reusable performance.
Embodiment 2
A kind of boron nitride nanosheet and carbopol gel composite heat interfacial material are present embodiments provided, the hot interface material
The preparation process of material is substantially the same manner as Example 1, and difference is：The boron nitride nanosheet of addition and the mass ratio of acrylic acid
For 2:10.
Test obtains the thermal conductivity of the boron nitride nanosheet and carbopol gel composite heat interfacial material of the present embodiment offer
Rate is 1.5898W/mK, complex viscosity 343962Pas, tensile strength 32.227kPa, and Applicable temperature is 0-120 DEG C.
Comparative example 1
This comparative example provides a kind of ferric ion-carbopol gel, preparation process and the base of embodiment 1 of the gel
This is identical, and difference is：It is added without boron nitride nanosheet.
The thermal conductivity that test obtains ferric ion-carbopol gel of this comparative example offer is 0.8553W/mK, multiple
Number viscosity is 128818Pas, tensile strength 21.302kPa.
Comparative example 2
This comparative example provides a kind of boron nitride nanosheet and carbopol gel composite heat interfacial material, the hot interface material
The preparation process of material is substantially the same manner as Example 1, and difference is：It is added without iron chloride.
Test obtains the thermal conductivity of the boron nitride nanosheet and carbopol gel composite heat interfacial material of this comparative example offer
Rate is 3.0072W/mK, complex viscosity 605.047Pas, tensile strength 3.186kPa.
Application examples
Product prepared by embodiment 1 and comparative example 1 is connected into same coarse ceramic bottom board respectively, and two panels is separated
Coarse potsherd, baseplate temp are 65 DEG C, and the initial temperature for the potsherd that the product that embodiment 1 is prepared with comparative example 1 connects is equal
For 23 DEG C.It has been observed that elapse over time, it is real when the temperature of the potsherd of product connection prepared by comparative example 1 is 47 DEG C
The temperature for applying the potsherd of the product connection of the preparation of example 1 has reached 54 DEG C, it is seen that the potsherd of product connection prepared by embodiment 1
Obvious heating faster, illustrates that the thermal conductivity of the product is more excellent.
Claims (10)
1. a kind of boron nitride nanosheet and carbopol gel composite heat interfacial material, the thermal interfacial material include polypropylene acid cure
Matrix body and heat filling, wherein the carbopol gel matrix includes ferric ion-carbopol gel or modification
Silicon ball-carbopol gel, the heat filling comprise at least boron nitride nanosheet.
2. boron nitride nanosheet according to claim 1 and carbopol gel composite heat interfacial material, wherein, used
Boron nitride nanosheet a diameter of 200-2000nm, thickness in monolayer 0.8-1.2nm, single-sheet thickness 5-15nm, thermal conductivity
For 200-800W/mK；The mass ratio of boron nitride nanosheet and acrylic acid is (1-5) used by preparing the thermal interfacial material:
10。
3. boron nitride nanosheet according to claim 1 and carbopol gel composite heat interfacial material, wherein, it is described to lead
Hot filler still further comprises one or more of combinations in aluminum oxide, aluminium nitride and carborundum, prepares the hot interface material
The mass ratio of one or more of combinations and acrylic acid used by material in aluminum oxide, aluminium nitride and carborundum is (0-5):
10, the mass ratio is preferably (1-5):10.
4. boron nitride nanosheet according to claim 1 and carbopol gel composite heat interfacial material, wherein, prepare institute
The mol ratio of ferric ion and acrylic acid is (0.4-0.6) used by stating thermal interfacial material:100, the mol ratio is preferably
(0.45-0.55):100；The mass ratio of modified silicon ball and acrylic acid is 0.09- used by preparing the thermal interfacial material
0.11:100。
5. boron nitride nanosheet according to claim 1 and carbopol gel composite heat interfacial material, its thermal conductivity are
1-3.5W/mK, complex viscosity 105-108Pas, tensile strength 20-40kPa, Applicable temperature are 0-120 DEG C.
6. boron nitride nanosheet according to claim 1 and carbopol gel composite heat interfacial material, it is by extremely
What few following steps were prepared：
(1) acrylic acid, water and trivalent iron salt or modified silicon ball are well mixed；
(2) boron nitride nanosheet is added, is well mixed；
(3) stirring 8-12 hours after；
(4) the stirring reaction 30-40 minutes and then in the presence of initiator, then reaction 40-48 hours are stood at 35 ± 2 DEG C, obtain
To described boron nitride nanosheet and carbopol gel composite heat interfacial material.
7. boron nitride nanosheet according to claim 6 and carbopol gel composite heat interfacial material, wherein, used
Trivalent iron salt include iron chloride and/or ferric nitrate；
Used initiator includes ammonium persulfate, and the ammonium persulfate and the mol ratio of acrylic acid that add are (0.4-0.6):
100, the mol ratio is preferably (0.45-0.55):100.
8. boron nitride nanosheet according to claim 6 and carbopol gel composite heat interfacial material, wherein, used
Boron nitride nanosheet through the following steps that being prepared：Boron nitride powder is put into water and/or alcohol repeatedly ultrasonic
And stirring, and make total ultrasonic time control in 110-130 minutes；Then by water and/or alcohol and the boron nitride after supersound process
Powder separates, and by the boron nitride powder after supersound process after 50-60 DEG C is dried, obtains described boron nitride nanosheet；
Wherein, the particle diameter of used boron nitride powder is 1-100 μm, a diameter of 200- of resulting boron nitride nanosheet
2000nm, thickness in monolayer 0.8-1.2nm, single-sheet thickness 5-15nm, thermal conductivity 200-800W/mK.
9. boron nitride nanosheet according to claim 6 and carbopol gel composite heat interfacial material, wherein, the heat
The preparation process of boundary material also includes：When adding boron nitride nanosheet, it is additionally added in aluminum oxide, aluminium nitride and carborundum
One or more of combinations；Also, one or more of combinations and propylene in used aluminum oxide, aluminium nitride and carborundum
The mass ratio of acid is (0-5):10, the mass ratio is preferably (1-5):10.
10. boron nitride nanosheet and carbopol gel composite heat interfacial material described in a kind of any one of claim 1-9
Preparation method, the preparation method comprise the following steps：
(1) acrylic acid, water and trivalent iron salt or modified silicon ball are well mixed；
(2) boron nitride nanosheet is added, is well mixed；
(3) stirring 8-12 hours after；
(4) the stirring reaction 30-40 minutes and then in the presence of initiator, then reaction 40-48 hours are stood at 35 ± 2 DEG C, obtain
To described boron nitride nanosheet and carbopol gel composite heat interfacial material.
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Cited By (3)
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| CN110343351A (en) * | 2019-07-25 | 2019-10-18 | 中国科学院合肥物质科学研究院 | A kind of selfreparing macromolecule heat conduction material and preparation method thereof |
| CN111393714A (en) * | 2020-03-25 | 2020-07-10 | 合烯电子科技(江苏)有限公司 | Preparation method of boron nitride composite structure filler for interface heat conduction material |
| CN112980123A (en) * | 2019-12-17 | 2021-06-18 | 上海大学 | High-thermal-conductivity insulation super-strong composite material and preparation method thereof |
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Cited By (4)
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| CN110343351A (en) * | 2019-07-25 | 2019-10-18 | 中国科学院合肥物质科学研究院 | A kind of selfreparing macromolecule heat conduction material and preparation method thereof |
| CN112980123A (en) * | 2019-12-17 | 2021-06-18 | 上海大学 | High-thermal-conductivity insulation super-strong composite material and preparation method thereof |
| CN111393714A (en) * | 2020-03-25 | 2020-07-10 | 合烯电子科技(江苏)有限公司 | Preparation method of boron nitride composite structure filler for interface heat conduction material |
| CN111393714B (en) * | 2020-03-25 | 2021-11-05 | 合烯电子科技(江苏)有限公司 | Preparation method of boron nitride composite structure filler for interface heat conduction material |
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