CN104470194A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN104470194A CN104470194A CN201310429022.5A CN201310429022A CN104470194A CN 104470194 A CN104470194 A CN 104470194A CN 201310429022 A CN201310429022 A CN 201310429022A CN 104470194 A CN104470194 A CN 104470194A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- board substrate
- flexible circuit
- layer
- flexible pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A flexible circuit board comprises a flexible circuit board substrate, a mixed heat dissipation layer and a reinforcing plate. The flexible circuit board substrate comprises a circuit substrate, a conductive line layer formed on the circuit substrate, and a cover layer covering the conductive line layer. The mixed heat dissipation layer comprises adhesive and heat dissipation material uniformly dispersed in the adhesive, and is adhered to the surface of the cover layer of the flexible circuit board substrate. The reinforcing plate is adhered to the side, away from the flexible circuit board substrate, of the mixed heat dissipation layer. The invention further relates to a manufacturing method of the flexible circuit board.
Description
Technical field
The present invention relates to a kind of flexible PCB with radiator structure and preparation method thereof.
Background technology
Due to the mechanical strength of flexible PCB and hardness all undesirable, with other circuit board or part in conjunction with time, usually need to add last layer stiffening plate.At present, conventional stiffening plate material is polyimides or epoxy glass cloth laminated board, and the radiating effect of two kinds of materials itself is all not good.
In prior art, even if selected the material such as metallic aluminium or stainless steel with certain radiating effect, but also cannot avoid the obstruct of sticker between stiffening plate and flexible PCB, radiating effect is still undesirable.
Summary of the invention
In view of this, the invention provides and a kind ofly can have flexible PCB of better heat dispersion and preparation method thereof.
A kind of manufacture method of flexible PCB, comprise step: provide a stiffening plate, the material forming the first adhesion coating and the second adhesion coating described in the first adhesion coating, heat radiation material layer and the second adhesion coating successively at described stiffening plate one side surface is sticker, thus forms multilager base plate; And a flexible circuit board substrate is provided, and described multilager base plate is fitted in described flexible circuit board substrate, and described second adhesion coating is adjacent with described flexible circuit board substrate, multilager base plate described in pressing and described flexible circuit board substrate, described first adhesion coating, heat radiation material layer and the second adhesion coating are merged mutually and forms mixing heat dissipating layer, thus form flexible PCB.
A kind of flexible PCB, it comprises: flexible circuit board substrate, mixing heat dissipating layer and stiffening plate.The cover layer that described flexible circuit board substrate comprises circuit substrate, is formed at the conductive circuit layer on circuit substrate and is covered in described conductive circuit layer.Described mixing heat dissipating layer comprises sticker and is dispersed in the heat sink material in described sticker, and described mixing heat dissipating layer is adhered to the cover surface of described flexible circuit board substrate.Described stiffening plate is adhered to the side of described mixing heat dissipating layer away from described flexible circuit board substrate.
Relative to prior art, flexible PCB provided by the invention arrange between circuit board substrate with stiffening plate there is homodisperse heat sink material mix heat dissipating layer, thus can effectively to dispel the heat to flexible circuit board substrate.In addition, louvre is offered in stiffening plate and mixing heat dissipating layer, described louvre extends to the cover layer of described circuit board substrate from stiffening plate, and mixing heat dissipating layer is filled in louvre further to make the heat sink material of mixing heat dissipating layer contact with hole wall and to be exposed to the external world, make stiffening plate larger with the contact area mixing heat dissipating layer, thus further circuit board substrate is dispelled the heat, greatly improve radiating effect.
Accompanying drawing explanation
Fig. 1 is that the side at stiffening plate that the embodiment of the present invention provides applies the first adhesion coating, heat dissipating layer and the second adhesion coating successively and forms the cutaway view of multilager base plate.
Fig. 2 is the distribution schematic diagram of multilager base plate interior formation louvre in FIG.
Fig. 3 is the cutaway view of louvre in multilager base plate in fig. 2.
Fig. 4 is the cutaway view multilager base plate in Fig. 3 with louvre being fitted in flexible circuit board substrate.
Fig. 5 is multilager base plate and flexible circuit board substrate and form the cutaway view of flexible PCB in pressing Fig. 4.
Main element symbol description
| Flexible PCB | 100 |
| Stiffening plate | 110 |
| Multilager base plate | 111 |
| Louvre | 112 |
| Mixing heat dissipating layer | 120 |
| First adhesion coating | 121 |
| Second adhesion coating | 122 |
| Heat dissipating layer | 123 |
| Flexible circuit board substrate | 130 |
| Circuit substrate | 131 |
| Conductive circuit layer | 132 |
| Cover layer | 133 |
Following embodiment will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Embodiment
Refer to Fig. 1 and Fig. 5, the present embodiment provides a kind of manufacture method of flexible PCB, comprises step:
The first step, refer to Fig. 1, one stiffening plate 110 is provided, sticker is coated on described stiffening plate 110, form the first adhesion coating 121, described first adhesion coating 121 adds heat sink material and forms heat radiation material layer 123, be away from the surface-coated sticker of described first adhesion coating 121 in heat radiation material layer 123, form the second adhesion coating 122, thus form multilager base plate 111.
Described multilager base plate 111 comprises stiffening plate 110, heat radiation material layer 123 and is arranged at the first adhesion coating 121 and the second adhesion coating 122 of the relative both sides of heat radiation material layer 123, and described first adhesion coating 121 is adhered to a side surface of described stiffening plate 110.
In the present embodiment, the material of described heat radiation material layer 123 a kind ofly can to flow with sticker and the fluid body spread or graininess heat sink material in bonding processes, described fluid body heat sink material can be thermal plastic insulation, and described graininess heat sink material can be the granular heat filling of the good metal of heat conductivility or nonmetal particulate filler.Described thermal plastic insulation can be selected from one or more mixtures of adhesive, silica gel, heat-conducting cream, conductive filler glue etc.; The granular heat filling of described metal can be selected from one or more mixtures of silver powder, copper powder, aluminium powder, iron powder, zinc powder, bronze etc.; The good nonmetal particulate filler of described heat conductivility can be selected from one or more mixtures in aluminium oxide, magnesium oxide, zinc oxide, aluminium nitride, boron nitride, carborundum, high conductive graphite powdered carbon, ceramic powder etc.
Described stiffening plate 110 is for the rigidity of reinforcing flexible circuit board, and supporting material can be phenolic resins, glass fibre, poly terephthalic acid class plastics, polyimide material, metallic plate five type by material, in the present embodiment, described stiffening plate 110 adopts polyimide material as supporting material.
Second step, refers to Fig. 2 and Fig. 3, and described multilager base plate 111 forms five louvres 112.
Adopt the mode of machine drilling to produce five louvres 112 on described multilager base plate 111, described louvre 112 runs through stiffening plate 110, first adhesion coating 121, heat radiation material layer 123 and the second adhesion coating 122 successively.In the present embodiment, the open centre of described five louvres 112 not on same straight line, and wherein the open centre of any three louvres 112 not on same straight line.
3rd step, refer to Fig. 4 and Fig. 5, one flexible circuit board substrate 130 is provided, and the described multilager base plate 111 with multiple louvre 112 is fitted in the one end on a described flexible circuit board substrate 130 wherein surface, multilager base plate 111 described in pressing and described flexible circuit board substrate 130, described first adhesion coating 121, heat radiation material layer 123 and the second adhesion coating 122 are merged mutually and forms mixing heat dissipating layer 120, thus form flexible PCB 100.
The cover layer 133 that described flexible circuit board substrate 130 comprises circuit substrate 131, is formed at the conductive circuit layer 132 on described circuit substrate 131 and is covered in described conductive circuit layer 131.Usually, the area of described multilager base plate 111 is less than the area of described flexible circuit board substrate 130.
Described flexible circuit board substrate 130 and multilager base plate 111 are positioned in pressing machine, pressing is carried out under predetermined temperature and pressure condition, in the process of pressing, described first adhesion coating 121 and the second adhesion coating 122 flow to the direction of heat radiation material layer 123 under described predetermined temperature and pressure, heat sink material in described heat radiation material layer 123 is evenly spread in described first adhesion coating 121 and the second adhesion coating 122 under the sticker mobilization of predetermined pressure and the first adhesion coating 121 and the second adhesion coating 122, thus make the sticker in described first adhesion coating 121 and the second adhesion coating 122 mutually merge to be formed with the heat sink material in heat radiation material layer 123 and mix heat dissipating layer 120.And described mixing heat dissipating layer 120 is filled in described louvre 112 under pressure further.After pressing, described circuit board substrate 130 with mix heat dissipating layer 120 strong bond, thus make stiffening plate 110 be adhered to the part surface of described circuit board substrate 130 near one end.The heat sink material of described heat radiation material layer 123 is uniformly distributed in described mixing heat dissipating layer 120, thus can carry out efficiently radiates heat to the flexible circuit board substrate 130 contacted with described mixing heat dissipating layer 120; In addition, the mixing heat dissipating layer 120 being filled in the louvre 112 of described stiffening plate 110 inside contacts with the inwall of louvre 112 and is exposed to the external world, increase stiffening plate 110 and the contact area mixing heat dissipating layer 120, thus can dispel the heat to flexible circuit board substrate 130 better.
Refer to Fig. 5, the present embodiment provides a kind of flexible PCB 100, and it comprises flexible circuit board substrate 130, mixing heat dissipating layer 120 and stiffening plate 110.
The cover layer 133 that described flexible circuit board substrate 130 comprises circuit substrate 131, is formed at the conductive circuit layer 132 on circuit substrate 131 and is covered in described conductive circuit layer 132, described mixing heat dissipating layer 120 comprises sticker and is dispersed in the heat sink material in described sticker, described mixing heat dissipating layer 120 is adhered to the part surface of cover layer 133 near one end of described flexible circuit board substrate 130, and described stiffening plate 110 is adhered to the side of described mixing heat dissipating layer 120 away from described flexible circuit board substrate 130.
Described flexible PCB 100 has the multiple louvres 112 running through described stiffening plate 110 and mixing heat dissipating layer 120 successively, is filled with the material of described mixing heat dissipating layer 120 in described louvre 112.In the present embodiment, the quantity of described louvre 112 is 5, and the aperture of described louvre 112 is greater than 1mm, and the distance between two bore edges is greater than 1mm.The opening arrays mode of described louvre 112 can be regularly arranged, namely with the arrangement of circle, rectangle or other regular shapes, certainly, it can also be irregular alignment, but must satisfy condition: the quantity of louvre 112 is no less than three, the open centre of any three louvres 112 is not on same straight line.
Relative to prior art, the flexible PCB 100 of the present embodiment arrange between circuit board substrate 130 with stiffening plate 110 there is homodisperse heat sink material mix heat dissipating layer 120, thus can effectively to dispel the heat to flexible circuit board substrate 130.In addition, louvre 112 is offered in stiffening plate 110 and mixing heat dissipating layer 120, described louvre 112 extends to the cover layer 133 of described circuit board substrate 130 from stiffening plate 110, and mixing heat dissipating layer 120 is filled in louvre 112 further to make the heat sink material of mixing heat dissipating layer 120 contact with hole wall and to be exposed to the external world, make stiffening plate 110 larger with the contact area mixing heat dissipating layer 120, thus further circuit board substrate 130 is dispelled the heat, greatly improve radiating effect.
In addition, for the person of ordinary skill of the art, other various corresponding change can be made according to technical scheme of the present invention and technical conceive, and all these changes all should belong to the protection range of the claims in the present invention.
Claims (10)
1. a flexible PCB, it comprises: flexible circuit board substrate, mixing heat dissipating layer and stiffening plate, the cover layer that described flexible circuit board substrate comprises circuit substrate, is formed at the conductive circuit layer on circuit substrate and is covered in described conductive circuit layer, described mixing heat dissipating layer comprises sticker and is dispersed in the heat sink material in described sticker, described mixing heat dissipating layer is adhered to the cover surface of described flexible circuit board substrate, and described stiffening plate is adhered to the side of described mixing heat dissipating layer away from described flexible circuit board substrate.
2. flexible PCB as claimed in claim 1, it is characterized in that, described flexible PCB comprises multiple louvre, is filled with the material of described mixing heat dissipating layer in described louvre.
3. flexible PCB as claimed in claim 2, it is characterized in that, the quantity of described louvre is not less than 3, and aperture is greater than 1mm, and the distance between two bore edges is greater than 1mm.
4. flexible PCB as claimed in claim 3, it is characterized in that, the opening arrays mode of described louvre is regularly arranged, and regularly arranged is be on same circle by the line at the center of louvre or the line at the center of louvre is rectangle.
5. flexible PCB as claimed in claim 3, it is characterized in that, the open centre of any three described louvres is not on same straight line.
6. flexible PCB as claimed in claim 1, it is characterized in that, described heat sink material is fluid body heat sink material or graininess heat sink material.
7. flexible PCB as claimed in claim 6, it is characterized in that, described fluid body heat sink material is thermal plastic insulation, and described graininess heat sink material is the granular heat filling of metal or nonmetal granular heat filling.
8. flexible PCB as claimed in claim 7, it is characterized in that, described thermal plastic insulation is selected from one or more mixtures in adhesive, silica gel, heat-conducting cream, conductive filler glue.
9. flexible PCB as claimed in claim 7, it is characterized in that, the granular heat filling of described metal is one or more mixtures be selected from silver powder, copper powder, aluminium powder, iron powder, zinc powder, bronze; Described nonmetal particulate filler is be selected from one or more the mixture in aluminium oxide, magnesium oxide, zinc oxide, aluminium nitride, boron nitride, carborundum, high conductive graphite powdered carbon, ceramic powder.
10. a manufacture method for flexible PCB, comprises step:
There is provided a stiffening plate, the material forming the first adhesion coating and the second adhesion coating described in the first adhesion coating, heat radiation material layer and the second adhesion coating successively at described stiffening plate one side surface is sticker, thus forms multilager base plate; And
One flexible circuit board substrate is provided, and described multilager base plate is fitted in described flexible circuit board substrate, and described second adhesion coating is adjacent with described flexible circuit board substrate, multilager base plate described in pressing and described flexible circuit board substrate, described first adhesion coating, heat radiation material layer and the second adhesion coating are merged mutually and forms mixing heat dissipating layer, thus form flexible PCB.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310429022.5A CN104470194B (en) | 2013-09-22 | 2013-09-22 | Flexible PCB and preparation method thereof |
| TW102135221A TWI538575B (en) | 2013-09-22 | 2013-09-27 | Flexible circuit board and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310429022.5A CN104470194B (en) | 2013-09-22 | 2013-09-22 | Flexible PCB and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104470194A true CN104470194A (en) | 2015-03-25 |
| CN104470194B CN104470194B (en) | 2017-08-22 |
Family
ID=52915338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310429022.5A Active CN104470194B (en) | 2013-09-22 | 2013-09-22 | Flexible PCB and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104470194B (en) |
| TW (1) | TWI538575B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376929A (en) * | 2015-11-25 | 2016-03-02 | 亿和精密工业（苏州）有限公司 | Circuit board applied to internal of hand-held printer |
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN110267432A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuit board and preparation method thereof |
| CN111554842A (en) * | 2019-02-08 | 2020-08-18 | Sk新技术株式会社 | Battery module |
| CN111935946A (en) * | 2019-05-13 | 2020-11-13 | 群创光电股份有限公司 | Electronic device |
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| CN101287328A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board, processing method of said flexible circuit board and electronic device |
| CN201185507Y (en) * | 2008-04-30 | 2009-01-21 | 青岛海信电器股份有限公司 | Printed circuit board |
| US20100288726A1 (en) * | 2006-06-21 | 2010-11-18 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board |
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- 2013-09-22 CN CN201310429022.5A patent/CN104470194B/en active Active
- 2013-09-27 TW TW102135221A patent/TWI538575B/en active
Patent Citations (4)
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| CN1362851A (en) * | 2000-12-27 | 2002-08-07 | 松下电器产业株式会社 | Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |
| US20100288726A1 (en) * | 2006-06-21 | 2010-11-18 | Samsung Electro-Mechanics Co., Ltd. | Method for manufacturing printed circuit board |
| CN101287328A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Flexible circuit board, processing method of said flexible circuit board and electronic device |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105376929A (en) * | 2015-11-25 | 2016-03-02 | 亿和精密工业（苏州）有限公司 | Circuit board applied to internal of hand-held printer |
| CN105376929B (en) * | 2015-11-25 | 2018-11-23 | 亿和精密工业（苏州）有限公司 | A kind of circuit board for inside hand-hold printer |
| CN107846775A (en) * | 2017-12-22 | 2018-03-27 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of high heat conduction and its production method |
| CN107949160A (en) * | 2017-12-22 | 2018-04-20 | 珠海市航达科技有限公司 | A kind of hanging printed circuit board of the separated high heat conduction of thermoelectricity and its production method |
| CN111554842A (en) * | 2019-02-08 | 2020-08-18 | Sk新技术株式会社 | Battery module |
| US11848432B2 (en) | 2019-02-08 | 2023-12-19 | Sk On Co., Ltd. | Battery module |
| CN111554842B (en) * | 2019-02-08 | 2024-01-26 | Sk新能源株式会社 | Battery module |
| CN111935946A (en) * | 2019-05-13 | 2020-11-13 | 群创光电股份有限公司 | Electronic device |
| CN111935946B (en) * | 2019-05-13 | 2023-07-04 | 群创光电股份有限公司 | Electronic device |
| CN110267432A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of flexible circuit board and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201517704A (en) | 2015-05-01 |
| TWI538575B (en) | 2016-06-11 |
| CN104470194B (en) | 2017-08-22 |
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Effective date of registration: 20170307 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
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Address after: Guangdong Province, Shenzhen city Baoan District Street Community Yan Luo Yan Chuan song Luo Ding way Peng Park plant to building A3 building A1 Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |