CN206332907U - The circuit board of high efficiency and heat radiation - Google Patents
The circuit board of high efficiency and heat radiation Download PDFInfo
- Publication number
- CN206332907U CN206332907U CN201621319173.0U CN201621319173U CN206332907U CN 206332907 U CN206332907 U CN 206332907U CN 201621319173 U CN201621319173 U CN 201621319173U CN 206332907 U CN206332907 U CN 206332907U
- Authority
- CN
- China
- Prior art keywords
- radiator structure
- radiating
- copper pipe
- circuit board
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses the circuit board of high efficiency and heat radiation, including circuit substrate and the radiator structure layer and membrane waterproofing located at its bottom, radiator structure layer includes being filled with silica-gel desiccant between some copper pipes of abreast permutation, some copper pipes；At least one end of each copper pipe extends beyond the end of circuit substrate；Set copper pipe strengthens radiating part beyond the end of circuit substrate as copper pipe, and one end of the corresponding copper pipe enhancing radiating part of circuit substrate is substrate radiating end, then is cased with radiator structure outside substrate radiating end；Copper pipe radiating part inserts the inside of radiator structure.The circuit board of the utility model, not only including the heat dissipating layer on circuit substrate, also adds radiator structure in the end of circuit substrate, and the waste heat in heat dissipating layer is exported and radiated, and radiating efficiency is high.
Description
Technical field
The utility model is related to the circuit board of heat dissipation for circuit board technical field, more particularly to high efficiency and heat radiation.
Background technology
Printed circuit board (PCB) has already taken up important status in the electronics industry.In recent ten years, China's printed circuit
Plate manufacturing is quickly grown, and develops but have also discovered that many problems are to be solved therewith, the material of existing pcb board heat dissipating layer is more
For aluminium sheet or ceramics, both thermal conductivity of material are poor so that the heat dissipating layer temperature of corresponding region is high immediately below element, its
Remaining regional temperature is low, causes element local temperature too high and cisco unity malfunction, so dissipating on circuit board in the prior art
Still there is very big problem in heat.
Even if having occurred in that the scheme of large quantities of improvement heat dissipation for circuit board in the prior art, but still can not thoroughly it solve
Certainly the problem of heat dissipation for circuit board.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the utility model provides the circuit board of high efficiency and heat radiation, and it is not only wrapped
The heat dissipating layer on circuit substrate is included, also radiator structure is added in the end of circuit substrate, the waste heat in heat dissipating layer is led
Go out radiating, radiating efficiency is high.
The technical scheme that the utility model is used is：The circuit board of high efficiency and heat radiation, including circuit substrate and located at its bottom
The radiator structure layer and membrane waterproofing in portion,
Radiator structure layer includes being filled with silica-gel desiccant between some copper pipes of abreast permutation, some copper pipes；
At least one end of each copper pipe extends beyond the end of circuit substrate；
Set copper pipe strengthens radiating part, the corresponding copper pipe enhancing radiating of circuit substrate beyond the end of circuit substrate as copper pipe
The one end in portion is substrate radiating end, then is cased with radiator structure outside substrate radiating end；
Copper pipe radiating part inserts the inside of radiator structure.
Further, radiator structure is U-shaped fin, and it strengthens radiating part accordingly towards the copper pipe of each copper pipe
Provided with a radiating connecting hole, to place copper enhancing radiating part.
Further, some grid-like radiating projections, each grid are provided with above at least one table of radiator structure
Shape radiating projection is by glue sticking on the surface of radiator structure.
Further, some heat emission holes are provided with above at least one table of radiator structure.
Further, radiator structure is made up of aluminium.
Compared with prior art, the beneficial effects of the utility model are：The circuit board of high efficiency and heat radiation of the present utility model, its
Increase heat dissipating layer in circuit substrate bottom, heat dissipating layer is made up of the preferable copper pipe of thermal conduction characteristic, and is filled out between each copper pipe
Drier is filled, while by copper pipe extension circuit substrate, for connecting radiator structure, enhancing the heat dispersion of circuit substrate, is dissipated
Hot fast, surplus is not warm substantially for circuit, and service life is longer.
Brief description of the drawings
Fig. 1 is the structural representation of the cross section of one embodiment of the circuit board of high efficiency and heat radiation
Fig. 2 is the front view of Fig. 1 one embodiment；
Fig. 3 is the front view of another embodiment of the circuit board of high efficiency and heat radiation；
Wherein：1- circuit substrates, 11- substrate radiating ends；2- radiator structures layer, 3- membrane waterproofings, 4- copper pipes, 41- copper pipes
Strengthen radiating part；5- radiator structures, 51- radiating connecting holes, the grid-like radiating projections of 52-, 53- heat emission holes；6- silica-gel desiccants.
Embodiment
In order to deepen to understand of the present utility model, with reference to the accompanying drawings and examples to the utility model furtherly
Bright, the embodiment is only used for explaining the utility model, and protection domain of the present utility model is not constituted and limited.
As shown in figure 1, the circuit board of high efficiency and heat radiation, including circuit substrate 1 and radiator structure layer 2 located at its bottom and anti-
Water film 3, radiator structure layer 2 includes being filled with silica-gel desiccant 6 between some copper pipes 4 of abreast permutation, some copper pipes 4；
At least one end of each copper pipe 4 extends beyond the end of circuit substrate 1；Referring to shown in Fig. 2 and Fig. 3, setting copper pipe 4 surpasses
Go out the end of circuit substrate 1 strengthens radiating part 41 for copper pipe, and one end of the corresponding copper pipe of circuit substrate 1 enhancing radiating part 41 is base
Plate radiating end 11, then be cased with radiator structure 5 outside substrate radiating end 11；Copper pipe radiating part 41 inserts the inside of radiator structure 5.
In the above-described embodiments, radiator structure 5 is U-shaped fin, and it strengthens radiating part towards the copper pipe of each copper pipe
41 accordingly provided with a radiating connecting hole 51, to place copper enhancing radiating part.Can by radiator structure 5 at least one
Provided with some grid-like radiating projections 52 above table, each grid-like radiating projection 52 is by glue sticking in radiator structure 5
Surface, play preferable radiating effect.
As shown in Fig. 2 can also above at least one table of radiator structure 5 on be provided with some heat emission holes 53, improve more
Good radiating effect.Further radiator structure 5 can also be made up of aluminium, light weight, low cost, excellent in heat dissipation effect.
What embodiment of the present utility model was announced is preferred embodiment, but is not limited thereto, the common skill of this area
Art personnel, easily according to above-described embodiment, understand spirit of the present utility model, and make different amplifications and change, but as long as
Spirit of the present utility model is not departed from, all in protection domain of the present utility model.
Claims (5)
1. the circuit board of high efficiency and heat radiation, it is characterised in that including circuit substrate（1）With the radiator structure layer located at its bottom（2）
And membrane waterproofing（3）, the radiator structure layer（2）Some copper pipes including abreast permutation（4）, some copper pipes（4）It
Between be filled with silica-gel desiccant（6）Each described copper pipe（4）At least one end extend beyond circuit substrate（1）End
Portion；Set copper pipe（4）Beyond circuit substrate（1）End for copper pipe strengthen radiating part（41）, circuit substrate（1）Corresponding copper pipe
Strengthen radiating part（41）One end be substrate radiating end（11）, then substrate radiating end（11）It is cased with radiator structure outside（5）；The copper
Pipe radiating part（41）Insert radiator structure（5）Inside.
2. the circuit board of high efficiency and heat radiation according to claim 1, it is characterised in that the radiator structure（5）Dissipated to be U-shaped
Backing, it strengthens radiating part towards the copper pipe of each copper pipe（41）Accordingly provided with a radiating connecting hole（51）, so as to
Place copper enhancing radiating part.
3. the circuit board of high efficiency and heat radiation according to claim 2, it is characterised in that the radiator structure（5）At least one
Some grid-like radiating projections are provided with above individual table（52）, each described grid-like radiating projection（52）Existed by glue sticking
Radiator structure（5）Surface.
4. the circuit board of high efficiency and heat radiation according to claim 2, it is characterised in that the radiator structure（5）At least one
Some heat emission holes are provided with above individual table（53）.
5. the circuit board of the high efficiency and heat radiation according to claim 1-4 any one, it is characterised in that the radiator structure
（5）It is made up of aluminium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621319173.0U CN206332907U (en) | 2016-12-05 | 2016-12-05 | The circuit board of high efficiency and heat radiation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621319173.0U CN206332907U (en) | 2016-12-05 | 2016-12-05 | The circuit board of high efficiency and heat radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206332907U true CN206332907U (en) | 2017-07-14 |
Family
ID=59289227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621319173.0U Expired - Fee Related CN206332907U (en) | 2016-12-05 | 2016-12-05 | The circuit board of high efficiency and heat radiation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206332907U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995393A (en) * | 2017-12-01 | 2018-05-04 | 信利光电股份有限公司 | A kind of heat dissipation equipment and a kind of camera module |
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
-
2016
- 2016-12-05 CN CN201621319173.0U patent/CN206332907U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995393A (en) * | 2017-12-01 | 2018-05-04 | 信利光电股份有限公司 | A kind of heat dissipation equipment and a kind of camera module |
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
| CN108566729B (en) * | 2018-06-25 | 2020-12-15 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170714 Termination date: 20201205 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |