CN206237674U - Pcb board with radiator structure - Google Patents
Pcb board with radiator structure Download PDFInfo
- Publication number
- CN206237674U CN206237674U CN201621354689.9U CN201621354689U CN206237674U CN 206237674 U CN206237674 U CN 206237674U CN 201621354689 U CN201621354689 U CN 201621354689U CN 206237674 U CN206237674 U CN 206237674U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- dissipating layer
- heat dissipating
- heat
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of pcb board with radiator structure, including two parallel arrangement of substrates, the heat dissipating layer for radiating is provided between substrate described in two, insulating barrier is equipped between the heat dissipating layer and any substrate, the heat dissipating layer is in finned setting, four the week side of boss walls of substrate described in two offer radiating groove, and the side wall of substrate described in two is coated with heat dissipation film.
Description
Technical field
The utility model is related to PCB technical fields, more particularly to a kind of pcb board with cooling mechanism.
Background technology
The general thermal diffusivity of pcb board for being used at present is all bad, it usually needs by peripheral radiating subassembly (such as：Radiating
Fan) radiating and cooling is carried out to pcb board.Although the cooling-down effect that above-mentioned way can be played to pcb board, also correspondingly increases
Hardware cost is added.
Utility model content
Main purpose of the present utility model is to propose a kind of pcb board with radiator structure, to improve dissipating for pcb board itself
Heat energy power, so as to hardware cost can be reduced to a certain extent.
To achieve the above object, the utility model proposes a kind of pcb board with radiator structure, including two parallel arrangement of
Substrate, is provided with the heat dissipating layer for radiating between substrate described in two, is equipped between the heat dissipating layer and any substrate
Insulating barrier, it is characterised in that the heat dissipating layer is in finned setting, four the week side of boss walls of substrate described in two offer radiating groove,
And the side wall of substrate described in two is coated with heat dissipation film.
Preferably, the heat dissipating layer is equipped with graphite linings towards the both sides of substrate described in two.
Preferably, some louvres for radiating uniformly are offered on substrate described in two.
The pcb board with radiator structure that the utility model is provided, the pcb board is set up in finned between two substrates
The heat dissipating layer of setting, to increase the area of dissipation of heat dissipating layer, so as to improve the heat-sinking capability of pcb board.Additionally, the side wall of substrate
Radiating groove is also had additional, and increases heat dissipation film on the wall of side, further improve the heat-sinking capability of pcb board itself, to reduce
The setting of peripheral radiating subassembly, so as to reduce hardware cost.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to the structure shown in these accompanying drawings.
Fig. 1 has the profile of the pcb board of radiator structure for the utility model；
Fig. 2 is the enlarged drawing at A in Fig. 1.
The realization of the utility model purpose, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
The utility model proposes a kind of pcb board with radiator structure.
With reference to Fig. 1 and 2, Fig. 1 has the profile of the pcb board of radiator structure for the utility model；Fig. 2 is in Fig. 1 at A
Enlarged drawing.In the utility model embodiment, the pcb board with radiator structure includes：Heat dissipating layer 1, insulating barrier 2 and two substrates
3。
Two substrates 3 are PCB substrate 3, and two substrates 3 are in parallel setting.In order to accelerate the radiating efficiency of two substrates 3, in two bases
The heat dissipating layer 1 for radiating is provided between plate 3.Heat dissipating layer 1 is fabricated by by metal material, with good radiating effect.It is excellent
Selection of land, heat dissipating layer 1 is fabricated by by copper material or aluminium.In order to expand the area of dissipation of heat dissipating layer 1, to improve dissipating for pcb board
The thermal efficiency, in the present embodiment, heat dissipating layer 1 is in finned setting, so as to expand the area of dissipation of heat dissipating layer 1.Additionally, in order to
The radiating effect of substrate 3 is further improved, in the present embodiment, four the week side of boss walls of two substrates 3 open up radiating groove 31, and two bases
The side wall of plate 3 is coated with heat dissipation film 5.It should be noted that the side wall of each substrate 3 can determine to dissipate according to the thickness of substrate 3
The quantity of heat channel 31.The radiating groove 31 is at least one.Heat dissipation film 5 is covered on the wall of side, so as to improve the radiating efficiency of base material.
Further, conducted to the efficiency of heat dissipating layer 1, in the present embodiment, heat dissipating layer 1 to improve the heat of substrate 3
Graphite linings 4 are equipped with towards the both sides of two substrates 3.When knowing, graphite has good heat conductivility to those skilled in the art, can
The heat that substrate 3 is come out quickly on conduction to heat dissipating layer 1, puies forward highly thermally conductive efficiency, so as to improve pcb board entirety
Radiating efficiency.
Further, in order to improve substrate 3 heat-sinking capability of itself, in the present embodiment, uniformly opened up on two substrates 3
There are some louvres 32 for radiating.Substrate 3 itself produce heat also can heat radiating via hole 32 distribute so that more
Further improve substrate 3 heat-sinking capability of itself.
The pcb board with radiator structure that the utility model is provided, the pcb board is set up in fin between two substrates 3
The heat dissipating layer 1 that formula is set, to increase the area of dissipation of heat dissipating layer 1, so as to improve the heat-sinking capability of pcb board.Additionally, substrate 3
Side wall also has additional radiating groove 31, and increases heat dissipation film 5 on the wall of side, further improves the heat-sinking capability of pcb board itself,
To reduce the setting of peripheral radiating subassembly, so as to reduce hardware cost.
Preferred embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited,
It is every under inventive concept of the present utility model, the equivalent structure made using the utility model specification and accompanying drawing content is become
Change, or directly/be used in other related technical fields indirectly and be included in scope of patent protection of the present utility model.
Claims (3)
1. a kind of pcb board with radiator structure, including two parallel arrangement of substrates, is provided with for dissipating between substrate described in two
The heat dissipating layer of heat, insulating barrier is equipped between the heat dissipating layer and any substrate, it is characterised in that the heat dissipating layer is in wing
Chip is set, and four the week side of boss walls of substrate described in two offer radiating groove, and the side wall of substrate described in two is coated with heat dissipation film.
2. there is the pcb board of radiator structure as claimed in claim 1, it is characterised in that base described in the heat dissipating layer direction two
The both sides of plate are equipped with graphite linings.
3. there is the pcb board of radiator structure as claimed in claim 1, it is characterised in that uniformly offered on substrate described in two
Some louvres for radiating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621354689.9U CN206237674U (en) | 2016-12-09 | 2016-12-09 | Pcb board with radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621354689.9U CN206237674U (en) | 2016-12-09 | 2016-12-09 | Pcb board with radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206237674U true CN206237674U (en) | 2017-06-09 |
Family
ID=58991976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621354689.9U Expired - Fee Related CN206237674U (en) | 2016-12-09 | 2016-12-09 | Pcb board with radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206237674U (en) |
-
2016
- 2016-12-09 CN CN201621354689.9U patent/CN206237674U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW201143590A (en) | Heat dissipation device | |
| TWI603441B (en) | Power module and manufacturing method thereof | |
| CN216357859U (en) | Heat dissipation module and electronic equipment | |
| CN210535228U (en) | Display module and display screen | |
| WO2012130063A1 (en) | Power supply module and electronic device utilizing the power supply module | |
| CN206237674U (en) | Pcb board with radiator structure | |
| CN204836913U (en) | Compound radiator and heat dissipation module | |
| WO2016192286A1 (en) | Heat dissipating member, and heat dissipating system and method for communication device | |
| CN208434247U (en) | A kind of heat-radiating device of electric component with soaking plate | |
| CN207133758U (en) | A kind of frivolous radiator | |
| CN206332907U (en) | The circuit board of high efficiency and heat radiation | |
| TWM631419U (en) | Liquid immersion radiator | |
| CN107995837A (en) | Air-cooled, water cooling two uses radiator | |
| CN208227422U (en) | A kind of heat radiating type circuit board | |
| CN209659847U (en) | A kind of graphite heat conducting and heat radiating fin | |
| CN209546176U (en) | A kind of heat transfer and radiator structure of single, double surface pyrotoxin | |
| US20170231109A1 (en) | Communication system and communication device therefor | |
| CN208028053U (en) | A kind of use for electronic products cooling fin of rapid cooling | |
| CN102427695A (en) | Copper-aluminum composite stepped cooling fin | |
| CN207410674U (en) | Heat radiator structure | |
| CN203015265U (en) | Heat radiation type PCB | |
| CN207458922U (en) | A kind of encapsulating structure of high-voltage MOS pipe | |
| WO2020102983A1 (en) | Circuit board and supercomputing server | |
| CN109195320A (en) | Semiconductor optimization heat-conducting method and structure based on graphene | |
| CN214256941U (en) | Radiator and power supply |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170609 Termination date: 20201209 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |