KR20210130192A - Antenna array for 5G communication, antenna structure, noise suppression heat conduction sheet and heat conduction sheet - Google Patents

Abstract

An object of the present invention is to provide an antenna array for 5G communication having excellent heat dissipation and crosstalk suppression effect. In order to solve the above problems, the antenna array 1 for 5G communication of the present invention includes a substrate 10 and at least one high-frequency semiconductor device 20 sequentially formed on one surface 10a of the substrate 10; A noise suppressing heat conduction sheet 20 and a first heat dissipation member 41, and at least one antenna 50 and a second heat dissipation member 42 sequentially formed on the other side 10b of the substrate 10 are provided. do.

Description

Antenna array for 5G communication, antenna structure, noise suppression heat conduction sheet and heat conduction sheet

The present invention relates to an antenna array and antenna structure for 5G communication having excellent heat dissipation properties and crosstalk suppression effect, and a noise suppression heat conductive sheet and a heat conductive sheet suitable for use in the antenna array and antenna structure for 5G communication.

Towards 5G, the next-generation high-speed, large-capacity communication, various communication technologies have been developed to support high-speed and large-capacity communication. As one of them, "Massive MIMO" is known. Massive MIMO is an elemental technology employing "super-multi-element antenna", which is assumed to be mounted in a large number of tens or 100 or more antennas on the base station side.

As with the Massive MIMO structure, it is considered that by increasing the antenna elements horizontally and vertically, the beam throughout the communication tends to be thinned. By controlling the image by drawing a straight line like a laser light for a thinner and longer image, it becomes possible to pinpoint a radio wave with high directivity toward a communication device such as a specific smartphone. Therefore, by adopting this Massive MIMO, the effect in terms of large-capacity communication and utilization efficiency more than ever before is expected.

In the above-mentioned antenna array (collection of antenna structure) such as Massive MIMO, since a lot of heat is generated by the high-frequency semiconductor device (hereinafter sometimes referred to as “RFIC”) used, a heat dissipation member such as a heat sink is used. It is common to use it to radiate heat to the outside.

However, in the antenna array, although many RFICs exist, since they exist in one device, the amount of heat generated becomes large, and there is a fear that sufficient heat dissipation cannot be ensured in the prior art.

In addition, when a plurality of antennas and RFICs are aligned as in an antenna array, there is also a problem that crosstalk between the respective RFICs occurs. When this crosstalk becomes large, it becomes a factor of communication inhibition and erroneous communication. Therefore, in addition to the heat dissipation property mentioned above, development of the technique which can suppress crosstalk effectively has been desired.

For example, in Patent Document 1, for the purpose of suppressing loss due to reflection or radiation of an electromagnetic field in an input/output portion of a dielectric waveguide, a rectangular parallelepiped dielectric, an input/output electrode and a conductor film formed on the outer surface of the dielectric, , A massive MIMO system is disclosed in which an input/output electrode is provided with an inductive waveguide filter on a bottom surface of a dielectric that protrudes from a first end near the apex of the dielectric to the inside of the bottom, and a conductor non-formed portion is provided.

However, in the technique disclosed in Patent Document 1, although a certain noise suppression effect is obtained in the input/output portion of the dielectric waveguide, the heat dissipation property is not sufficient, and there is a problem that heat is generated by use for a long time. Further, further improvement has been desired for the crosstalk suppression effect when the number of antennas is increased.

Japanese Patent Laid-Open No. 2012-171557

The present invention has been made in view of such circumstances, and an object of the present invention is to provide an antenna array and antenna structure for 5G communication having excellent heat dissipation properties and crosstalk suppression effect. Another object of the present invention is to provide a noise suppressing heat conducting sheet and a heat conducting sheet suitable for use in an antenna array and antenna structure for 5G communication having excellent heat dissipation properties and crosstalk suppression effect.

The present inventors have repeatedly studied to solve the above problems, and by providing a noise suppression thermal conductive sheet on a high frequency semiconductor device (RFIC) formed on one side of a substrate, a high electromagnetic wave suppression effect is obtained, and a high electromagnetic wave suppression effect is obtained between each RFIC It was found that crosstalk can be suppressed. In addition, since the noise suppressing thermal conductive sheet is provided between the high frequency semiconductor device and the heat dissipating member, it is possible to efficiently transfer the heat generated from the high frequency semiconductor device to the heat dissipating member (first heat dissipating member), and the heat generated from the antenna Since heat can also be diffused by the heat dissipation member (2nd heat dissipation member), it also discovered that heat dissipation property could be improved.

This invention has been made based on the said knowledge, The summary is as follows.

(1) a substrate;

at least one high-frequency semiconductor device, a noise suppressing thermal conductive sheet, and a first heat dissipation member sequentially formed on one surface of the substrate;

At least one antenna and a second heat dissipation member sequentially formed on the other side of the substrate

An antenna array for 5G communication, characterized in that it comprises a.

According to the said structure, the outstanding heat dissipation property and the crosstalk suppression effect can be implement|achieved.

(2) The antenna array for 5G communication according to (1) above, further comprising a heat conduction sheet between the at least one antenna and the second heat dissipation member.

(3) The 5G communication antenna array according to the above (1) or (2), wherein the noise suppression thermal conductive sheet contains magnetic powder.

(4) The antenna array for 5G communication according to any one of (1) to (3), wherein the noise suppression heat conductive sheet includes carbon fiber.

(5) The 5G communication antenna array according to any one of (1) to (4), wherein the noise suppression thermal conductive sheet has a dielectric constant of 20 or more.

(6) The 5G communication antenna array according to any one of (1) to (5), wherein the noise suppression thermal conductive sheet has a magnetic permeability exceeding 1.

(7) The 5G communication antenna array according to any one of (1) to (6), wherein the noise suppression thermal conductive sheet has a thermal resistance of 300 Kmm ^{2 /W or less.}

(8) The antenna array for 5G communication according to any one of (1) to (7), wherein the antenna array for 5G communication is used for massive MIMO.

(9) a substrate;

a high-frequency semiconductor device, a noise suppression thermal conductive sheet, and a first heat dissipation member sequentially formed on one surface of the substrate;

An antenna and a second heat dissipation member sequentially formed on the other side of the substrate

It characterized in that it is provided with, the antenna structure.

According to the said structure, the outstanding heat dissipation property and the crosstalk suppression effect can be implement|achieved.

(10) It is a noise suppression heat conduction sheet used in an antenna array for 5G communication,

A noise suppressing heat conductive sheet provided between at least one high frequency semiconductor device formed on a substrate and a heat dissipation member.

With the above configuration, a noise suppression heat conductive sheet suitable for a semiconductor device having excellent heat dissipation properties and crosstalk suppression effect is obtained.

(11) It is a heat-conducting sheet used for antenna arrays for 5G communication,

A heat conductive sheet provided between at least one antenna formed on a substrate and a heat dissipation member.

According to the said structure, the heat conductive sheet suitable for the semiconductor device which has the outstanding heat dissipation property and the crosstalk suppression effect is obtained.

According to the present invention, it becomes possible to provide an antenna array and antenna structure for 5G communication having excellent heat dissipation properties and crosstalk suppression effect. Further, according to the present invention, it becomes possible to provide a noise suppressing heat conducting sheet and a heat conducting sheet suitable for use in an antenna structure and an antenna array for 5G communication having excellent heat dissipation properties and crosstalk suppression effect.

1 is a diagram schematically showing a state of a cross section of an embodiment of an antenna array for 5G communication according to the present invention.
2 is a diagram schematically showing a state of a cross section of another embodiment of the antenna array for 5G communication of the present invention.
3 is a graph showing the amount of near-end crosstalk S31 in Example 1 when the conditions of the noise suppression heat conduction sheet of the antenna array for 5G communication are changed.
4 is a graph showing the amount of near-end crosstalk (S31) when the dielectric constant of the noise suppression thermal conductive sheet of the antenna array for 5G communication is changed in Example 3, (a) is the amount of near-end crosstalk at 10 GHz, ( b) shows the amount of near-end crosstalk at 20 GHz, (c) shows the amount of near-end crosstalk at 40 GHz, and (d) shows the amount of near-end crosstalk at 60 GHz.
Fig. 5 is a graph showing the amount of near-end crosstalk S31 at 28 GHz when the magnetic permeability of the noise suppression thermal conductive sheet of the antenna array for 5G communication is changed in Example 4;

EMBODIMENT OF THE INVENTION Hereinafter, an example of embodiment of this invention is concretely demonstrated using drawings.

1 and 2 are diagrams schematically showing a cross section of an example of the embodiment of the antenna array for 5G communication of the present invention, respectively. In addition, about each figure, for convenience of description, the shape and scale of each member are shown in the state different from the actual thing. About the shape and scale of each member, it is possible to change suitably for every semiconductor device except what is prescribed|regulated in this specification.

<Antenna Array for 5G Communication>

5G communication antenna array 1 according to an embodiment of the present invention, as shown in Fig. 1,

a substrate 10;

At least one high-frequency semiconductor device 20, a noise suppression heat conductive sheet 30 and a first heat dissipation member 41 sequentially formed on one surface 10a of the substrate 10;

At least one antenna 50 and a second heat dissipation member 42 and 60 are sequentially formed on the other side 10b of the substrate 10 .

In the antenna array 1 for 5G communication according to an embodiment of the present invention, by providing the noise suppression thermal conductive sheet 30 , it is possible to absorb and/or block electromagnetic waves that become noise generated from the high frequency semiconductor device 20 . Therefore, the increase in crosstalk can be suppressed without hindering the transmission and reception of radio waves. In addition, in the antenna array 1 for 5G communication according to the embodiment of the present invention, since the noise suppression thermal conductive sheet 30 is provided between the high frequency semiconductor device 20 and the first heat dissipation member 41 , , heat generated from the high frequency semiconductor device 20 can be efficiently transmitted to the first heat dissipating member 41 , and excellent heat dissipation properties can be realized.

In addition, in the antenna array 1 for 5G communication according to the embodiment of the present invention, the heat generated from the antenna is efficiently dissipated by the second heat dissipation member 42 formed on the other surface 10b side of the substrate 20 . Since heat dissipation is possible, the heat dissipation property of the whole antenna array 1 for 5G communication can be further improved.

On the other hand, in the antenna array for 5G communication according to the prior art, as in the present invention, since the noise suppression thermal conductive sheet 30 is not provided in contact with the high frequency semiconductor device 20, a sufficient crosstalk suppression effect cannot be obtained. In addition, since the noise suppression thermal conductive sheet 30 is not provided between the high frequency semiconductor device 20 and the first heat dissipation member 41, it is considered that sufficient heat dissipation properties cannot be obtained either.

In addition, the "antenna array for 5G communication" in the present invention means "an antenna array used in a fifth generation (5G) mobile communication system". Incidentally, the term "antenna array" means an aggregate of antennas constituted by at least one antenna.

Therefore, the antenna array 1 for 5G communication according to the embodiment of the present invention is preferably used in a technique such as Massive MIMO from the viewpoint of transmitting and receiving high-frequency radio waves with low power consumption.

Next, each member constituting the antenna array 1 for 5G communication according to an embodiment of the present invention will be described.

(Board)

An antenna array 1 for 5G communication according to an embodiment of the present invention includes a substrate 10 as shown in FIG. 1 .

Here, the substrate 10 is a so-called double-sided substrate having circuits on both surfaces (one side 10a and the other side 10b). Other detailed conditions of the substrate 10 are not particularly limited, and a known substrate can be appropriately selected and used according to the required performance.

(High frequency semiconductor device)

An antenna array 1 for 5G communication according to an embodiment of the present invention includes a high-frequency semiconductor device 20 formed on one surface 10a of the substrate 10 as shown in FIG. 1 .

Here, about the said high frequency semiconductor device, it is a semiconductor device which processes a high frequency (RF) signal. It will not specifically limit, if it is a thing which can process a high frequency signal among the electronic components by a semiconductor. For example, integrated circuits, such as RFIC and LSI, CPU, MPU, a graphic operation element, etc. are mentioned.

In addition, in the antenna array 1 for 5G communication according to the embodiment of the present invention, in order to operate the antenna 50 to be described later, for example, as shown in FIG. 1 , in the antenna array 1 for 5G communication, the The same number of the high frequency semiconductor devices 20 as the antenna 50 is provided. However, the number of the high-frequency semiconductor devices 20 and the number of the antennas 50 are not necessarily the same, and depending on the design, one high-frequency semiconductor device 20 may operate a plurality of antennas. have.

In addition, in the antenna array 1 for 5G communication according to the embodiment of the present invention, on one surface 10a of the substrate 10, the entire circumference or a partial circumference of the high frequency semiconductor device 20 is surrounded. A land (not shown) may be prepared with

(noise suppression heat conduction sheet)

As shown in FIG. 1, the semiconductor device 1 of this invention is provided with the noise suppression heat conductive sheet 30 between the said high frequency semiconductor device 20 and the 1st heat dissipation member 41 mentioned later.

Since it is possible to absorb and/or block electromagnetic waves that become noise by the noise suppression thermal conductive sheet 30, it is possible not only to suppress the increase in crosstalk without hindering the transmission and reception of radio waves by the antenna but also , since the heat generated from the high-frequency semiconductor device 20 can be efficiently transmitted to the first heat dissipating member 41, excellent heat dissipation can also be realized.

Here, the noise suppression thermal conductive sheet refers to a sheet-like member having an electromagnetic noise suppression effect and thermal conductivity as the name suggests. In addition, the noise suppression effect and the performance of the thermal conductivity are not particularly limited, and basically, it is possible to appropriately change according to the performance required for the antenna array for 5G communication of the present invention.

In addition, the noise suppression effect of the noise suppression thermal conductive sheet may be as long as it can suppress noise generated from the high frequency semiconductor device 20 or the antenna 50 to be described later, for example, it has an effect of blocking electromagnetic noise. It may exist and may have the effect of absorbing electromagnetic wave noise.

The size of the noise suppressing heat conductive sheet 30 (a size along the extending direction of the sheet) is not particularly limited.

For example, as shown in FIG. 1 , it can be composed of a plurality of sheets having a size corresponding to the size of the high frequency semiconductor device 20 . By setting it as the aspect shown in FIG. 1, the pattern design of the said board|substrate 10 can be made easy.

In addition, as shown in FIG. 2 , the size of the noise suppressing heat conductive sheet 30 is increased so that a plurality of the high frequency semiconductor devices 20 are formed for one noise suppressing heat conductive sheet 30 . may be In the case of the aspect shown in FIG. 2, the more excellent noise suppression effect and heat dissipation property may be acquired.

In addition, the thickness of the noise suppression thermal conductive sheet 30 (thickness along the lamination direction of each member of the antenna array for 5G communication) is not particularly limited, and the high frequency semiconductor device 20 and the first heat dissipation member 41 are not particularly limited. ), the size of the antenna array 1 for 5G communication, and the like can be appropriately changed.

For example, from the viewpoint of realizing the effect of heat dissipation and crosstalk suppression at a higher level, the thickness of the noise suppression heat conductive sheet 30 is preferably 10 to 3000 µm, more preferably 200 to 500 µm. . When the thickness of the noise suppressing thermal conductive sheet 30 exceeds 3000 μm, since the distance between the semiconductor element 30 and the first heat dissipation member 41 becomes longer, there is a risk that thermal conductivity may decrease, and on the other hand, When the thickness of the noise suppressing thermal conductive sheet 30 is less than 10 μm, there is a fear that the crosstalk suppressing effect is reduced.

Further, the noise suppression thermal conductive sheet 30 preferably has a higher dielectric constant (relative permittivity) in terms of realizing an excellent crosstalk suppression effect.

Specifically, the dielectric constant of the noise suppression thermal conductive sheet 30 is preferably 20 or more, more preferably 25 or more, and still more preferably 30 or more. It is because the more excellent crosstalk suppression effect is acquired by making the dielectric constant of the said noise suppression heat conductive sheet 30 into 20 or more.

In addition, the method for adjusting the dielectric constant of the noise suppression thermal conductive sheet 30 is not particularly limited, but it can be appropriately adjusted by changing the type of binder resin, the material of the thermal conductive filler, compounding amount and orientation direction, etc., which will be described later. do.

Further, the noise suppressing thermal conductive sheet 30 preferably has a high magnetic permeability (relative magnetic permeability) from the viewpoint of realizing an excellent crosstalk suppression effect.

Specifically, it is preferable that the magnetic permeability of the noise suppression thermal conductive sheet 30 exceeds 1, more preferably 2 or more, and still more preferably 5 or more. This is because, when the magnetic permeability of the noise suppressing heat conductive sheet 30 exceeds 1, a more excellent crosstalk suppression effect is obtained.

In addition, the method for adjusting the magnetic permeability of the noise suppression thermal conductive sheet 30 is not particularly limited, but it can be appropriately adjusted by changing the type of binder resin or material of the thermal conductive filler, compounding amount and orientation direction, etc., which will be described later. do.

Also, the noise suppressing heat conduction sheet 30, heat resistance is 300Kmm ² / W, and it is preferred, particularly preferred 35Kmm ² / W is preferred, and 30Kmm ² / W or less than or less than. This is because heat generated from the high-frequency semiconductor device 20 can be more efficiently transmitted to the first heat dissipation member 41 , thereby further improving heat dissipation. Furthermore, the thermal resistance of the noise suppressing heat conduction sheet 30 is, preferably 1Kmm ² / W or more, more preferably 10Kmm ² / W or more. By setting the thermal resistance of the noise suppressing thermal conductive sheet 30 to 1 Kmm ² /W or more, the rate of change in thermal resistance can be reduced even when the contact thermal resistance is changed.

In addition, the noise suppression heat conductive sheet 30 preferably has magnetic properties. This is because the noise suppression thermal conductive sheet 30 can have electromagnetic wave absorption performance, so that a more excellent crosstalk suppression effect can be obtained.

Here, the method for adjusting the magnetic properties of the noise suppressing heat conductive sheet 30 is not particularly limited, but it is possible to adjust the noise suppression heat conductive sheet 30 by containing a magnetic powder or the like and changing the compounding amount thereof. do.

In addition, it is preferable that the noise suppression heat conductive sheet 30 has adhesiveness or adhesiveness on the surface. It is because the adhesiveness of the noise suppression heat conductive sheet 30 and another member (the high frequency semiconductor device 20, the 1st heat radiation member 41) can be improved.

In addition, a method for imparting adhesion to the surface of the noise suppression thermal conductive sheet 30 is not particularly limited. For example, it is possible to achieve adhesion by optimizing the binder resin constituting the noise suppression heat conductive sheet 30 to be described later, and to separately provide an adhesive layer with adhesiveness on the surface of the noise suppression heat conduction sheet 30 possible.

In addition, the noise suppression heat conductive sheet 30 preferably has flexibility. Since the shape of the noise suppression thermal conductive sheet 30 can be easily changed, the ease of assembling the antenna array 1 for 5G communication is improved, and the surface shape of the high frequency semiconductor device 20 can be followed. Therefore, the bonding strength with the high frequency semiconductor device 20 can be increased. Although it does not specifically limit about the softness|flexibility of the said noise suppression heat conductive sheet 30, For example, it is preferable to make the storage elastic modulus at 25 degreeC measured by dynamic elastic modulus measurement into the range of 50 kPa - 50 MPa.

In addition, about the material which comprises the said noise suppression heat conductive sheet 30, if it has a noise suppression effect and thermal conductivity, it will not specifically limit.

For example, the noise suppression thermally conductive sheet 30 may be made of a material containing a binder resin, a thermally conductive filler, and other components.

Hereinafter, the material constituting the noise suppression thermal conductive sheet 30 will be described.

・Binder resin

The binder resin constituting the noise suppression heat conductive sheet refers to a resin component used as a base material of the noise suppression heat conductive sheet. It does not specifically limit about the kind, Well-known binder resin can be selected suitably. For example, a thermosetting resin is mentioned as one of binder resin.

Examples of the thermosetting resin include crosslinkable rubber, epoxy resin, polyimide resin, bismaleimide resin, benzocyclobutene resin, phenol resin, unsaturated polyester, diallyl phthalate resin, silicone, polyurethane, polyimide silicone, Thermosetting polyphenylene ether, thermosetting modified polyphenylene ether, etc. are mentioned. These may be used individually by 1 type, and may use 2 or more types together.

Examples of the crosslinkable rubber include natural rubber, butadiene rubber, isoprene rubber, nitrile rubber, hydrogenated nitrile rubber, chloroprene rubber, ethylene propylene rubber, chlorinated polyethylene, chlorosulfonated polyethylene, butyl rubber, halogenated butyl rubber, Fluorine rubber, urethane rubber, acrylic rubber, polyisobutylene rubber, silicone rubber, etc. are mentioned. These may be used individually by 1 type, and may use 2 or more types together.

Moreover, while it is excellent in moldability and weather resistance among the thermosetting resins mentioned above, it is preferable to use silicone from the point of the adhesiveness with respect to an electronic component, and followability|trackability. There is no restriction|limiting in particular as silicone, The kind of silicone can be suitably selected according to the objective.

From the viewpoint of obtaining the above-described moldability, weather resistance, adhesiveness, and the like, the silicone is preferably a silicone composed of a main ingredient of a liquid silicone gel and a curing agent. Examples of such silicone include addition-reaction liquid silicone, thermal vulcanization type millable type silicone using a peroxide for vulcanization, and the like.

As the addition-reaction liquid silicone, it is preferable to use a two-component addition-reaction silicone or the like in which a polyorganosiloxane having a vinyl group is used as the main agent and a polyorganosiloxane having a Si-H group is used as a curing agent.

Further, in the combination of the main agent and the curing agent of the liquid silicone gel, the mixing ratio of the main agent and the curing agent is preferably, in a mass ratio, the main agent:curing agent = 35:65 to 65:35.

In addition, content in particular of the said binder resin in the said noise suppression heat conductive sheet is not restrict|limited, According to the objective, it can select suitably. For example, from the viewpoint of securing the formability of the sheet, the adhesion of the sheet, etc., the amount of the noise suppressing heat conductive sheet is preferably about 20% by volume to 50% by volume, and more preferably from 30% to 40% by volume. do.

· Thermally conductive filler

The noise suppression thermally conductive sheet 30 may include a thermally conductive filler in the binder resin. This thermally conductive filler is a component for improving the thermal conductivity of a sheet|seat.

In addition, about the shape, material, average particle diameter, etc. of a thermally conductive filler, if the thermal conductivity of a sheet|seat can be improved, it will not specifically limit.

For example, about a shape, it can be set as a spherical shape, an elliptical spherical shape, a block shape, a granular flat shape, needle shape, fibrous shape, coil shape, etc. Among them, it is preferable to use a fibrous thermally conductive filler from the viewpoint of realizing higher thermal conductivity.

In addition, the "fibrous form" of the said fibrous thermally conductive filler means a shape with a high aspect-ratio (about 6 or more). Therefore, in the present invention, not only fibrous and rod-shaped thermally conductive fillers, but also granular fillers with high aspect ratio, flaky thermally conductive fillers, etc. are included in the fibrous thermally conductive fillers.

Here, the material of the thermally conductive filler is not particularly limited as long as it is a material with high thermal conductivity, and for example, metals such as silver, copper, and aluminum, ceramics such as alumina, aluminum nitride, silicon carbide, graphite, and carbon fiber and the like.

In addition, about the said thermally conductive filler, 1 type may be used, and 2 or more types may be mixed and used for it. In addition, when using 2 or more types of thermally conductive fillers, the same shape may be sufficient as all, and you may mix and use the thermally conductive fillers of different shapes, respectively.

Among these fibrous thermally conductive fillers, it is preferable to use a fibrous metal powder and carbon fibers, and more preferably use carbon fibers from the viewpoint of obtaining higher thermal conductivity.

There is no restriction|limiting in particular about the kind of said carbon fiber, According to the objective, it can select suitably. For example, those synthesized by pitch-based, PAN-based, and PBO fibers graphitized, arc discharge method, laser evaporation method, CVD method (chemical vapor deposition method), CCVD method (catalytic chemical vapor deposition method), etc. can be used can Among these, carbon fibers obtained by graphitizing PBO fibers and pitch-based carbon fibers are more preferred from the viewpoint of obtaining high thermal conductivity and conductivity.

In addition, the said carbon fiber can be used by surface-treating a part or all of the as needed. As the surface treatment, for example, oxidation treatment, nitriding treatment, nitration, sulfonation, or attaching or bonding a metal, a metal compound, an organic compound, etc. to the surface of a functional group or carbon fiber introduced to the surface by these treatments treatment and the like. As said functional group, a hydroxyl group, a carboxyl group, a carbonyl group, a nitro group, an amino group etc. are mentioned, for example.

In addition, the average length of the long axis (average long axis length) of the thermally conductive filler is also not particularly limited and can be appropriately selected, but it is preferably in the range of 50 µm to 300 µm from the viewpoint of reliably obtaining high thermal conductivity, It is more preferable that it is the range of 75 micrometers - 275 micrometers, It is especially preferable that it is the range of 90 micrometers - 250 micrometers.

Moreover, there is no restriction|limiting in particular also about the average minor axis length of the said thermally conductive filler, and it can select suitably. For example, it is preferable that it is the range of 4 micrometers - 20 micrometers, and, as for the said average minor axis length, it is more preferable that it is the range of 5 micrometers - 14 micrometers from a point which reliably acquires high thermal conductivity.

About the aspect-ratio (average long-axis length/average minor-axis length) of the said thermally conductive filler, it is preferable that it is 6 or more, and it is more preferable that it is 7-30 from a point which acquires high thermal conductivity. Even when the aspect ratio is small, an improvement effect such as thermal conductivity is observed, but since a large characteristic improvement effect is not obtained due to a decrease in orientation or the like, the aspect ratio is set to 6 or more. On the other hand, when it exceeds 30, since the dispersibility in a noise suppression heat conductive sheet falls, there exists a possibility that sufficient thermal conductivity may not be obtained.

Here, the average major axis length and the average minor axis length of the thermally conductive filler can be measured with, for example, a microscope, a scanning electron microscope (SEM), or the like, and an average can be calculated from a plurality of samples.

Moreover, in the said noise suppression heat conductive sheet 30, there is no restriction|limiting in particular as content of the said heat conductive filler, Although it can select suitably according to the objective, It is preferable that it is 4 volume% - 40 volume%, and 5 volume% - 30 volume% It is more preferable that it is volume %, and it is especially preferable that it is 6 volume% - 20 volume%. If the content is less than 4% by volume, it may become difficult to obtain a sufficiently low thermal resistance, and if it exceeds 40% by volume, the moldability of the noise suppressing thermally conductive sheet and the orientation of the fibrous thermally conductive filler are affected. there is a risk of throwing it away.

In addition, in the noise suppressing heat conductive sheet 30, it is preferable that the heat conductive filler is oriented in one direction or in a plurality of directions. It is because higher thermal conductivity and electromagnetic wave absorptivity can be implement|achieved by orientating the said thermally conductive filler.

For example, when it is desired to improve the heat dissipation of the antenna array for 5G communication of the present invention by increasing the thermal conductivity by the noise suppression thermal conductive sheet 30, the thermally conductive filler is oriented in a substantially vertical shape with respect to the sheet surface. can do it On the other hand, when changing the flow of electricity in the noise suppressing heat conductive sheet to enhance the noise suppression effect, the heat conductive filler can be oriented in a substantially parallel shape or other direction with respect to the sheet surface.

Here, the substantially perpendicular or substantially parallel direction to the sheet surface means a direction substantially perpendicular or substantially parallel to the sheet surface direction. However, since there is some variation in the orientation direction of the thermally conductive filler at the time of manufacture, in the present invention, a deviation of about ±20° from the direction perpendicular or parallel to the extension direction of the sheet surface is allowed. do.

In addition, it does not specifically limit about the method of adjusting the orientation angle of the said thermally conductive filler. For example, the orientation angle can be adjusted by producing a sheet molded article serving as the source of the noise suppressing heat conductive sheet, and adjusting the cut angle in a state in which the fibrous heat conductive filler is oriented.

・Inorganic filler

In addition, the noise suppression thermal conductive sheet 30 may further include an inorganic filler in addition to the above-described binder resin and thermally conductive fiber. This is because it is possible to further increase the thermal conductivity of the noise suppression thermal conductive sheet or to improve the strength of the sheet.

The inorganic filler is not particularly limited in shape, material, average particle size, and the like, and may be appropriately selected according to the purpose. As said shape, a spherical shape, an elliptical spherical shape, a block shape, a granular shape, flat shape, needle shape etc. are mentioned, for example. Among these, a spherical shape and an elliptical shape are preferable at the point of fillability, and a spherical shape is especially preferable.

Examples of the inorganic filler material include aluminum nitride (aluminum nitride: AlN), silica, alumina (aluminum oxide), boron nitride, titania, glass, zinc oxide, silicon carbide, silicon (silicon), silicon oxide, aluminum oxide. , metal particles, and the like. These may be used individually by 1 type, and may use 2 or more types together. Among these, alumina, boron nitride, aluminum nitride, zinc oxide, and silica are preferable, and from the point of thermal conductivity, alumina and aluminum nitride are especially preferable.

Moreover, as the said inorganic filler, what was surface-treated can also be used. When the inorganic filler is treated with a coupling agent as the surface treatment, the dispersibility of the inorganic filler is improved, and the flexibility of the noise suppressing heat conductive sheet is improved.

The average particle diameter of the inorganic filler can be appropriately selected according to the type of the inorganic material or the like.

When the said inorganic filler is alumina, it is preferable that the average particle diameter is 1 micrometer - 10 micrometers, It is more preferable that it is 1 micrometer - 5 micrometers, It is especially preferable that it is 4 micrometers - 5 micrometers. When the said average particle diameter is less than 1 micrometer, there exists a possibility that a viscosity may become large and it may become difficult to mix. On the other hand, when the average particle diameter exceeds 10 μm, there is a fear that the thermal resistance of the noise suppressing thermal conductive sheet becomes large.

Further, when the inorganic filler is aluminum nitride, the average particle diameter thereof is preferably 0.3 µm to 6.0 µm, more preferably 0.3 µm to 2.0 µm, and particularly preferably 0.5 µm to 1.5 µm. If the average particle diameter is less than 0.3 μm, there is a fear that the viscosity becomes large and difficult to mix, and when it exceeds 6.0 μm, there is a fear that the thermal resistance of the noise suppression heat conductive sheet becomes large.

In addition, about the average particle diameter of the said inorganic filler, it can measure with a particle size distribution meter or a scanning electron microscope (SEM), for example.

・Magnetic metal powder

In addition, the noise suppressing thermal conductive sheet 30, in addition to the above-described binder resin, fibrous thermally conductive fibers, and inorganic fillers, it is preferable to further include a magnetic metal powder. By including the magnetic metal powder, the noise absorption performance of the noise suppression thermal conductive sheet can be increased, and the crosstalk suppression effect of the antenna array for 5G communication of the present invention can be further improved.

The type of the magnetic metal powder is not particularly limited, and a known magnetic metal powder can be appropriately selected, except that the magnetic properties of the noise suppression heat conductive sheet 30 can be improved to improve electromagnetic wave absorption. . For example, an amorphous metal powder or a crystalline metal powder can be used. Examples of the amorphous metal powder include those of Fe-Si-B-Cr, Fe-Si-B, Co-Si-B, Co-Zr, Co-Nb, and Co-Ta. and, as the crystalline metal powder, for example, pure iron, Fe-based, Co-based, Ni-based, Fe-Ni-based, Fe-Co-based, Fe-Al-based, Fe-Si-based, Fe-Si-Al-based, Fe-Ni-Si-Al-type thing, etc. are mentioned. Further, as the crystalline metal powder, a microcrystalline metal powder obtained by adding a small amount of N (nitrogen), C (carbon), O (oxygen), B (boron) or the like to the crystalline metal powder and refinement may be used.

In addition, about the said magnetic metal powder, you may use what mixed 2 or more types of things from which a material differs or an average particle diameter differs.

Moreover, about the said magnetic metal powder, it is preferable to adjust shapes, such as a spherical shape and a flat shape. For example, in the case of making the filling property high, it is preferable to use a spherical magnetic metal powder having a particle diameter of several micrometers to several tens of micrometers. Such a magnetic metal powder can be produced by, for example, an atomization method or a method of thermally decomposing metal carbonyl. The atomization method has the advantage of being easy to make a spherical powder, and is a method in which molten metal is flowed out from a nozzle, jets of air, water, inert gas, etc. When producing an amorphous magnetic metal powder by the atomization method, in order to prevent the molten metal from crystallizing, it is preferable to set the ^{cooling rate to about 1×10 6 (K/s).}

When an amorphous alloy powder is manufactured by the atomizing method mentioned above, the surface of amorphous alloy powder can be made into a smooth state. When the amorphous alloy powder with few surface irregularities and a small specific surface area is used as the magnetic metal powder in this way, the filling properties with respect to the binder resin can be improved. Moreover, filling property can further be improved by performing a coupling process.

In addition to the above-described binder resin, thermally conductive filler, inorganic filler, and magnetic metal powder, the noise suppressing thermally conductive sheet may contain other components as appropriate depending on the purpose.

As other components, a thixotropic imparting agent, a dispersing agent, a hardening accelerator, a retarder, a non-tacking agent, a plasticizer, a flame retardant, antioxidant, a stabilizer, a coloring agent, etc. are mentioned, for example.

(first heat dissipation member)

In the semiconductor device 1 of the present invention, as shown in FIG. 1 , a first heat dissipation member 41 at a position in contact with the noise suppression heat conductive sheet 30 on one side 10a side of the substrate 10 . ) is provided.

Here, the first heat dissipation member 41 is a member that absorbs heat generated from the heat source (high frequency semiconductor device 20 ) and dissipates it to the outside. By being connected to the high frequency semiconductor device 20 through the noise suppression heat conduction sheet 30, the heat generated by the high frequency semiconductor device 20 is diffused to the outside, and high heat dissipation of the antenna array 1 for 5G communication can be realized. .

The type of the first heat dissipation member 41 is not particularly limited, and may be appropriately selected according to the heat dissipation property required for the antenna array for 5G communication of the present invention. For example, a radiator, a cooler, a heat sink, a heat spreader, a die pad, a cooling fan, a heat pipe, a metal cover, a housing, etc. are mentioned. Among these heat dissipating members, it is preferable to use a radiator, a cooler, or a heat sink from the viewpoint of obtaining more excellent heat dissipation properties. Moreover, about the material which comprises the 1st heat dissipation member 41 mentioned above, metals, such as aluminum, copper, stainless steel, and graphite, etc. may be included from the point of improving thermal conductivity.

(antenna)

An antenna array 1 for 5G communication according to an embodiment of the present invention includes at least one antenna 50 formed on the other side 10b of the substrate 10 as shown in FIG. 1 . .

Here, the antenna is a device for transmitting and receiving radio waves in a wireless communication environment. In the antenna array 1 for 5G communication according to the embodiment of the present invention, an antenna used in a normal antenna array can be used, and it can be appropriately selected according to the performance required for the antenna array for 5G communication.

Further, in the antenna array 1 for 5G communication according to the embodiment of the present invention, the arrangement pitch P of the antenna 50 is preferably 1/4 or more and 1 or less with respect to the communication wavelength, and 1/ It is preferable that it is 4 or more and 1/2 or less. For example, when the communication wavelength to be used is 28 GHz, the arrangement pitch P of the antenna 50 is preferably 2.5 to 10 mm, more preferably 2.5 to 5 mm. Moreover, when the communication wavelength to be used is 24 GHz, it is preferable to set it as 18-75 mm, and it is more preferable to set it as 18-37 mm. This is because the radio wave radiation characteristics of the antenna array can be improved.

In addition, the number of the antennas 50 in the antenna array 1 for 5G communication according to an embodiment of the present invention is not particularly limited as long as it is at least one, and may be appropriately selected according to the specifications and required performance of the antenna array for 5G communication. can decide

In addition, it is preferable that the number of the said antenna 50 is plural (two or more) from a viewpoint of communication speed improvement and utilization efficiency improvement. For example, when the antenna array 1 for 5G communication according to the embodiment of the present invention is Massive MIMO, the number of the antennas 50 may be 128.

(Second heat dissipation member)

The antenna array 1 for 5G communication according to an embodiment of the present invention includes the second heat dissipation member 42 on the other side 10b side of the substrate 10 as shown in FIG. 1 . .

Here, the second heat dissipation member 42 is a member that absorbs heat generated from a heat source (antenna 50 ) and radiates it to the outside.

The type of the second heat dissipation member 42 is not particularly limited, and may be appropriately selected according to the heat dissipation property required for the antenna array for 5G communication of the present invention. For example, a radiator, a cooler, a heat sink, a heat spreader, a die pad, a cooling fan, a heat pipe, a metal cover, a housing, etc. can be used similarly to the above-described first heat dissipation member 41 . It is preferable to use a heat spreader from the point which can implement|achieve the outstanding space saving property while obtaining the outstanding heat dissipation property among these heat dissipation members.

In addition, as shown in FIG. 1 , an antenna 50 is provided under the second heat dissipation member 42 . A heat conduction sheet 60 , which will be described later, is attached to the second heat dissipation member 42 and the antenna 50 . ), it is recommended that the second heat dissipation member 42 and the antenna 50 be spaced apart to some extent so that the second heat dissipation member 42 and the antenna 50 do not contact each other. desirable. The distance between the second heat dissipation member 42 and the antenna 50 at that time is not particularly limited, but is preferably about 500 to 2000 µm.

(heat conduction sheet)

In addition, in the antenna array 1 for 5G communication according to an embodiment of the present invention, as shown in FIG. 1 , between the at least one antenna 50 and the second heat dissipation member 42 , a heat conduction sheet is provided. It is preferable to further provide (60). By connecting the antenna 50 and the second heat dissipation member 42 through the heat conduction sheet 60, heat generated from the antenna 50 is diffused to the outside, and high heat dissipation of the antenna array 1 for 5G communication can be realized

Here, the thermally conductive sheet 60 means a sheet-like member having thermal conductivity. The performance of the thermal conductivity is not particularly limited, and it is basically possible to appropriately change according to the performance required for the antenna array for 5G communication of the present invention. In addition, the heat conduction sheet 60 does not have a noise suppression effect, unlike the noise suppression heat conduction sheet 30 described above. This is because, when the heat conductive sheet 60 has a noise suppression effect, there is a possibility that the radio wave transmission/reception performance of the antenna 50 may be deteriorated.

In addition, the size of the heat conductive sheet 60 (size along the sheet extending direction (excluding the sheet thickness direction)) is not particularly limited. For example, as shown in FIG. 1 , a plurality of sheets having the same size as the size of the antenna 50 can be configured. Also, as shown in FIG. 2 , the size of the heat-conducting sheet 60 may be increased so that a plurality of the antennas 50 may be formed for one heat-conducting sheet 30 .

In addition, the thickness of the heat conductive sheet 60 (thickness along the lamination direction of each member of the antenna array for 5G communication) is not particularly limited, and the distance between the antenna 50 and the second heat dissipation member 42 is , can be appropriately changed according to the size of the antenna array 1 for 5G communication and the like.

For example, it is preferable that the thickness of the said heat conductive sheet 60 is 500 micrometers or less, and it is more preferable that it is 300 micrometers or less at the point which can implement|achieve heat dissipation at a higher level. When the thickness of the heat conductive sheet 60 exceeds 500 μm, the distance between the antenna 50 and the second heat dissipation member 42 increases, so that there is a risk that thermal conductivity may decrease.

Further, it is the heat conductive sheet 60 is particularly preferred, heat resistance 300Kmm ² / W is preferred, and, 35Kmm and more preferably ² / W or less 30Kmm ² / W or less or less. This is because heat generated from the antenna 50 can be more efficiently transmitted to the second heat dissipation member 42 , thereby further improving heat dissipation. Furthermore, the thermal resistance of the heat conductive sheet 60 is, preferably 1Kmm ² / W or more, more preferably 10Kmm ² / W or more. By setting the thermal resistance of the thermal conductive sheet 60 to 1 Kmm ² /W or more, the rate of change in thermal resistance decreases even when the contact thermal resistance changes.

Moreover, it is preferable that the said heat conductive sheet 60 has adhesiveness or adhesiveness on the surface. This is because adhesiveness between the heat conductive sheet 60 and other members (the antenna 50 and the second heat dissipation member 42 ) can be improved.

In addition, the method of imparting adhesiveness to the surface of the heat conductive sheet 60 is not particularly limited. For example, the binder resin constituting the heat conductive sheet 60 to be described later may be made to have adhesiveness by optimizing it, and it is also possible to separately provide an adhesive layer with adhesiveness on the surface of the heat conductive sheet 60 .

In addition, the heat conductive sheet 60 preferably has flexibility. Since the shape of the heat conductive sheet 60 can be easily changed, the ease of assembling the antenna array 1 for 5G communication is improved, and the surface shape of the antenna 50 can be tracked. The bonding strength with the antenna 50 may be increased. Although it does not specifically limit about the flexibility of the said heat conductive sheet 60, For example, it is preferable to make the storage elastic modulus at 25 degreeC measured by dynamic elastic modulus measurement into the range of 50 kPa - 50 MPa.

In addition, about the material which comprises the said heat conductive sheet 60, if it has high heat conductivity, it will not specifically limit.

For example, the heat conductive sheet 30 may be made of a material including a binder resin, a heat conductive filler, and other components.

Hereinafter, the material constituting the heat conductive sheet 60 will be described.

The binder resin constituting the heat conductive sheet 60 is a resin component serving as a base material of the heat conductive sheet. About the kind and content, it is the same as that of the binder resin of the noise suppression heat conductive sheet 30 mentioned above.

The thermally conductive filler contained in the thermally conductive sheet 60 is a component for improving the thermal conductivity of the sheet. About the shape, material, average particle diameter, content, etc., it is the same as that of the binder resin of the noise suppression heat conductive sheet 30 mentioned above.

In addition, the heat conductive sheet 60 can also contain other components suitably according to the objective in addition to the binder resin and heat conductive filler mentioned above.

Examples of other components include inorganic fillers, thixotropy imparting agents, dispersing agents, curing accelerators, retarders, non-tacking agents, plasticizers, flame retardants, antioxidants, and stabilizers described in the noise suppression thermal conductive sheet 30 described above. , a coloring agent, and the like.

In addition, since a high noise suppression effect is not requested|required, it is preferable that the said heat conductive sheet 60 does not contain magnetic powder, or when it contains it, it is small.

(other absences)

The antenna array 1 for 5G communication according to an embodiment of the present invention includes the above-described substrate 10 , the high frequency semiconductor device 20 , the noise suppression thermal conductive sheet 30 , the first heat dissipation member 41 , and the second In addition to the heat dissipation member 42 , the antenna 50 , and the heat conduction sheet 60 as a suitable member, it is possible to appropriately provide a member normally used for an antenna array.

For example, as shown in FIG. 1 , the antenna array 1 for 5G communication according to the embodiment of the present invention may further include a case member 70 .

In addition, although not shown, the adhesive layer etc. for bonding each member can also be formed as needed.

<Manufacturing method of antenna array for 5G communication>

The manufacturing method of the antenna array for 5G communication of the present invention is not particularly limited, except that the noise suppression thermal conductive sheet 30 is formed above or below the at least one high frequency semiconductor device 20 .

For example, as shown in FIG. 1 , when the noise suppression heat conduction sheet 30 is composed of a plurality of sheets having the same size as the size of the high frequency semiconductor device 20 , the noise suppression heat conduction sheet 30 is configured in advance. After cutting the sheet 30 to adjust the size, laminating and crimping each high frequency semiconductor device 20 is provided. Further, as shown in Fig. 2, in the case where the noise suppression thermal conductive sheet 30 is composed of one sheet, after all the high frequency semiconductor devices 20 are formed on the substrate 10, one sheet of the noise suppression heat conductive sheet 30 is formed. A step of laminating and crimping the suppressed heat conductive sheets 30 is provided.

In addition, about the other process, it can be performed according to the manufacturing process of the conventional antenna array.

In addition, when the heat conductive sheet 60 is provided between the antenna 50 and the second heat dissipation member 42 , the antenna 50 is provided in the same manner as in the process of forming the noise suppression heat conductive sheet 30 . ), the step of laminating the heat conductive sheet 60 on the antenna 50 and pressing the thermal conductive sheet 60 is further provided.

<Antenna Structure>

An antenna structure according to an embodiment of the present invention includes a substrate, a high-frequency semiconductor device, a noise suppression thermal conductive sheet, and a first heat dissipation member sequentially formed on one surface of the substrate, and an antenna sequentially formed on the other surface of the substrate and a second heat dissipation member.

In the antenna structure according to an embodiment of the present invention, by providing a noise suppression thermal conductive sheet on one side of the substrate, it is possible to absorb and/or block electromagnetic waves that become noise, so that transmission and reception of radio waves by the antenna is performed. Increase in crosstalk can be suppressed without inhibiting. In addition, in the antenna structure according to the embodiment of the present invention, since the noise suppressing thermal conductive sheet is provided between the high frequency semiconductor device and the first heat dissipating member, heat generated from the high frequency semiconductor device is efficiently transferred to the first heat dissipating member. can be transmitted, and excellent heat dissipation can be realized.

Incidentally, the antenna structure in the present invention means a structure having an antenna function including an antenna device including one antenna, an antenna array including a plurality of antennas, and the like.

In addition, each member constituting the antenna structure according to the embodiment of the present invention is the same as the member described in the antenna array for 5G communication according to the embodiment of the present invention described above.

<Noise suppression heat conduction sheet>

The noise suppression heat conduction sheet according to an embodiment of the present invention is a noise suppression heat conduction sheet used in an antenna array for 5G communication.

And, in the present invention, as shown in Fig. 1, at least one high-frequency semiconductor device 20 formed on the substrate 10 of the antenna array 1 for 5G communication, and a heat dissipation member (in Fig. 1, a first heat dissipation member) It is provided between the members 41).

The noise suppression thermal conductive sheet 30 according to an embodiment of the present invention can absorb and/or block electromagnetic waves that become noise, and has excellent thermal conductivity. Therefore, in the antenna array 1 for 5G communication, by using it between the high frequency semiconductor device 20 and a heat radiation member, increase in crosstalk can be suppressed and heat radiation property can be improved. Therefore, the noise suppression thermal conductive sheet 30 according to an embodiment of the present invention is suitable for use in an antenna array for 5G communication.

In addition, about the structure of the noise suppression heat conductive sheet 30 concerning one Embodiment of this invention, it is the same as that of the noise suppression heat conductive sheet demonstrated in the antenna array for 5G communication which concerns on one Embodiment of this invention mentioned above.

<Heat Conduction Sheet>

A heat conduction sheet according to an embodiment of the present invention is a heat conduction sheet used for an antenna array for 5G communication.

And, in the present invention, as shown in FIG. 1 , at least one antenna 50 formed on the substrate 10 of the antenna array 1 for 5G communication, and a heat dissipation member (in FIG. 1 , a second heat dissipation member ( 42)).

Since the thermal conductive sheet 60 according to the embodiment of the present invention has excellent thermal conductivity, in the antenna array 1 for 5G communication, it is used between the antenna 50 and the heat radiating member to improve heat dissipation. . Therefore, the heat conductive sheet 60 according to an embodiment of the present invention is suitable for use in an antenna array for 5G communication.

In addition, the configuration of the heat conductive sheet 60 according to the embodiment of the present invention is the same as that of the thermal conductive sheet described in the antenna array for 5G communication according to the embodiment of the present invention described above.

[Example]

Next, the present invention will be specifically described based on Examples. However, the present invention is not limited to the following examples at all.

<Example 1>

In Example 1, using the three-dimensional electromagnetic field simulator ANSYS HFSS (manufactured by ANSYS Corporation), an analysis model of the antenna array as shown in Fig. 1 was produced, and crosstalk when the conditions of the noise suppression heat conduction sheet were changed. It evaluated about the inhibitory effect and heat dissipation.

(1) Regarding the crosstalk suppression effect of the antenna array, all conditions were the same except for the noise suppression heat conduction sheet. The conditions of each member constituting the antenna array are shown below. In order to simulate the antenna array, a model of the antenna array in which only two antenna parts of the antenna array are cut out was manufactured, and repeated boundary conditions were applied. The size of the model of the cut out antenna part is 10 mm in width, 10 mm in depth, and 5 mm in height.

In the antenna array model in which only two antenna portions are cut out, two microstrip lines are simulated to be arranged in parallel or in a straight line, and the size is assumed to be an antenna array having 128 antennas.

About the board|substrate 10, the board|substrate material was made into the double-sided glass epoxy board|substrate of FR4.

The high frequency semiconductor device 20 was simulated with a microstrip line having a width of 55 µm, a thickness of 20 µm, and a length of 2000 µm. In addition, in each sample, the output of the high frequency semiconductor device 20 is 5W.

The first heat dissipation member 41 was a heat sink made of an aluminum plate of the same size (width 20 mm, depth 10 mm) as the model of the antenna array.

As for the antenna 50, a patch antenna having a resonance frequency of 28 GHz was used.

For the heat conductive sheet 60, a two-component addition reaction type liquid silicone was used as the resin binder, and 15 mass% of pitch-based carbon fibers having an average fiber length of 150 µm were contained as a fibrous heat conductive filler. The size of the thermal conductive sheet 60 is 5 mm in width, 5 mm in depth, and 0.5 mm in thickness, and the thermal resistance is 40 Kmm ² /W.

For the second heat dissipation member 42, a heat spreader made of aluminum nitride having the same size as the model of the antenna array was used.

For the case member 70, a resin case was used.

(2) The structure of the noise suppression heat conduction sheet used for each analysis model of an antenna array is as follows.

Comparative Example 1-1: Air was used as a noise suppression heat conductive sheet. That is, the space|interval of 500 micrometers was provided between the high frequency semiconductor device 20 and the 1st heat dissipation member 41 without using the noise suppression heat conductive sheet 30. As shown in FIG.

Comparative Example 1-2: An insulating sheet containing 85 mass % of magnetic powder was used as the noise suppression heat conductive sheet 30 . The thickness of the sheet is 500㎛, and the heat resistance is 300Kmm ² /W.

Comparative Example 1-3: A sheet including a dielectric (dielectric constant 4) was used as the noise suppressing heat conductive sheet 30 . The thickness of the sheet is 500㎛, and the heat resistance is 200Kmm ² /W.

Invention Example 1-1: A sheet containing 6% by mass of a fibrous thermally conductive filler (pitch-based carbon fibers having an average fiber length of 200 µm) and 85% by mass of magnetic powder was used as the noise suppressing thermally conductive sheet 30 . The thickness of the sheet is 500㎛, and the heat resistance is 40Kmm ² /W.

(Evaluation of crosstalk inhibitory effect)

The crosstalk suppression effect of each analysis model of the antenna array was evaluated by measuring the transmission characteristics between two microstrip lines. The terminals at both ends of the microstrip line selected for one high-frequency semiconductor device are port 1 and port 2 respectively along the longitudinal direction of the model, and the other terminal is similarly used as port 3 and port 4, and the near-end cross expected in each analysis model. The amount of torque S31 was calculated. The calculated S31 is shown in FIG. 3 .

From the result of FIG. 3, with respect to the analysis model of Invention Example 1-1 included in the scope of the present invention, and the analysis model of Comparative Example 1-1 in which the noise suppression heat conduction sheet 30 is not used, a good crosstalk suppression effect was obtained. Confirmed.

(Evaluation of heat dissipation)

For evaluation of heat dissipation of each analytical model of the antenna array, the predicted surface temperature of the high-frequency semiconductor device 20 after a steady state was calculated under the condition of a temperature of 25°C. Table 1 shows the calculated surface temperatures.

From the result of Table 1, it turned out that the analytical model of Invention Example 1-1 included in the range of this invention has the most favorable heat dissipation property. On the other hand, in the analysis model of Comparative Example 1-1 in which the noise suppression heat conductive sheet 30 was not used, the surface temperature of the high frequency semiconductor device 20 was high, and it was found that heat dissipation was not obtained.

<Example 2>

In Example 2, under the same conditions as in Example 1, an analysis model of the antenna array as shown in FIG. 1 was produced using the three-dimensional electromagnetic field simulator, and the dielectric constant of the noise suppression heat conductive sheet was changed. The crosstalk inhibitory effect was evaluated.

(1) For each analysis model of the antenna array, except for the conditions of the noise suppression heat conduction sheet, all the same conditions were set, and the conditions were as described in Example 1.

(2) The dielectric constant and magnetic permeability of the noise suppression thermal conductive sheet used for each analysis model of the antenna array are as follows. In addition, samples 1 and 2 were all set to the same conditions about conditions other than the dielectric constant of a noise suppression heat conductive sheet.

Sample 2-1: A sheet having a dielectric constant of 10 and a magnetic permeability of 5 was used as the noise suppressing heat conductive sheet 30 .

Sample 2-2: A sheet having a dielectric constant of 20 and a magnetic permeability of 5 was used as the noise suppressing heat conductive sheet 30 .

In the evaluation of the crosstalk suppression effect, the amount of near-end crosstalk (S31) expected in each analysis model at 10 GHz, 20 GHz, 40 GHz, and 60 GHz was calculated by electromagnetic field analysis software (ANSYS, HFSS). S31 calculated at 10 GHz, 20 GHz, 40 GHz, and 60 GHz is shown in FIGS. 4 (a) to (d).

From the results of Figs. 4(a) to 4(d), it was found that in any frequency band, the higher crosstalk suppression effect was obtained in the sample 2-2 in which the dielectric constant of the noise suppressing heat conductive sheet 30 was 20.

<Example 3>

In Example 3, under the same conditions as in Example 1, an analysis model of the antenna array as shown in Fig. 1 was produced using the three-dimensional electromagnetic field simulator, and the dielectric constant of the noise suppression heat conductive sheet was changed. The crosstalk inhibitory effect was evaluated.

(1) For each analysis model of the antenna array, all conditions were the same except for the conditions of the noise suppression heat conduction sheet, and each condition was as described in Example 1.

(2) The dielectric constant and magnetic permeability of the noise suppression thermal conductive sheet used for each analysis model of the antenna array are as follows. In addition, samples 1 and 2 were all set to the same conditions about conditions other than the dielectric constant of a noise suppression heat conductive sheet.

Sample 3-1: A sheet having a dielectric constant of 10 and a magnetic permeability of 5 was used as the noise suppressing heat conductive sheet 30 .

Sample 3-2: A sheet having a dielectric constant of 10 and a magnetic permeability of 1 was used as the noise suppressing heat conductive sheet 30 .

And the evaluation of the crosstalk suppression effect computed the amount of the near-end crosstalk (S31) estimated by each analysis model in 28 GHz by electromagnetic field analysis software (ANSYS, HFSS). The calculated S31 is shown in FIG. 5 .

From the results of FIG. 5 , it was found that the sample 3-1 having a higher magnetic permeability of the noise suppressing heat conductive sheet 30 obtained a higher crosstalk suppression effect.

[Industrial Applicability]

According to the present invention, it becomes possible to provide an antenna array and antenna structure for 5G communication having excellent heat dissipation properties and crosstalk suppression effect. Further, according to the present invention, it becomes possible to provide a noise suppressing heat conducting sheet and a heat conducting sheet suitable for use in an antenna structure and an antenna array for 5G communication having excellent heat dissipation properties and crosstalk suppression effect.

1: Antenna Array for 5G Communication
10: substrate
10a: one side of the substrate
10b: the other side of the board
20: high-frequency semiconductor device
30: noise suppression heat conduction sheet
41: first heat dissipation member
42: second heat dissipation member
50: antenna
60: heat conduction sheet
70: case member
P: placement pitch of the antenna

Claims (11)

board and
at least one high-frequency semiconductor device, a noise suppressing thermal conductive sheet, and a first heat dissipation member sequentially formed on one surface of the substrate;
At least one antenna and a second heat dissipation member sequentially formed on the other side of the substrate
An antenna array for 5G communication, characterized in that it comprises a. The antenna array for 5G communication according to claim 1, further comprising a heat conduction sheet between the at least one antenna and the second heat dissipation member. The antenna array for 5G communication according to claim 1 or 2, wherein the noise suppression thermal conductive sheet contains magnetic powder. The antenna array for 5G communication according to any one of claims 1 to 3, characterized in that the noise suppression heat conductive sheet contains carbon fiber. The antenna array for 5G communication according to any one of claims 1 to 4, wherein the noise suppression thermal conductive sheet has a dielectric constant of 20 or more. The antenna array for 5G communication according to any one of claims 1 to 5, wherein the noise suppression thermal conductive sheet has a magnetic permeability greater than 1. The antenna array for 5G communication according to any one of claims 1 to 6, wherein the noise suppression thermal conductive sheet has a thermal resistance of 300Kmm ^{2 /W or less.} The antenna array for 5G communication according to any one of claims 1 to 7, wherein the antenna array for 5G communication is used for Massive MIMO. board and
a high-frequency semiconductor device, a noise suppression thermal conductive sheet, and a first heat dissipation member sequentially formed on one surface of the substrate;
An antenna and a second heat dissipation member sequentially formed on the other side of the substrate
It characterized in that it is provided with, the antenna structure. It is a noise suppression heat conduction sheet used for antenna array for 5G communication,
A noise suppressing heat conductive sheet provided between at least one high frequency semiconductor device formed on a substrate and a heat dissipation member. It is a heat conduction sheet used for antenna array for 5G communication,
A heat conductive sheet provided between at least one antenna formed on a substrate and a heat dissipation member.

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