CN106867438A - A kind of epoxy resin embedding adhesive and its application method - Google Patents
A kind of epoxy resin embedding adhesive and its application method Download PDFInfo
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- CN106867438A CN106867438A CN201710127515.1A CN201710127515A CN106867438A CN 106867438 A CN106867438 A CN 106867438A CN 201710127515 A CN201710127515 A CN 201710127515A CN 106867438 A CN106867438 A CN 106867438A
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- epoxy resin
- embedding adhesive
- resin embedding
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Abstract
The invention provides a kind of epoxy resin embedding adhesive and its application method.The casting glue includes the component of following weight/mass percentage composition：6 16% matrix resin, 5 15% anhydride curing agent, 0.02 0.05% curing accelerator and 70 85% heat filling；Described matrix resin is by epoxy resin and response type toughener (70 90) in mass ratio:(10 30) constitute；The heat filling is by silicon nitride and/or boron nitride and ball-aluminium oxide (10 40) in mass ratio:(60 90) constitute.The application method of the casting glue is：Will formula ratio each component mix after pour into a mould by embedding thing, by pour be poured in by embedding thing first solidify 4 8h at 80 120 DEG C, 10 15h are then solidified at 130 150 DEG C.After the epoxy resin embedding adhesive solidification that the present invention is provided, with heat conductivility higher, insulating properties and good mechanical performance.
Description
Technical field
The invention belongs to adhesive technical field, and in particular to a kind of epoxy resin embedding adhesive and its application method.
Background technology
Casting glue is an extensive address, is usually used in the bonding of electronic component, transformer or motor coil etc., close
Envelope, embedding or coating protection.Casting glue it is uncured it is preceding be it is liquid, glue viscosity is according to the component of product, consumption, production work
Skill it is different and otherwise varied.Casting glue could realize its use value after being fully cured, and waterproof can be played after solidification and is prevented
Damp, dust-proof, insulation, heat conduction, secrecy, anticorrosion, heatproof, shockproof effect.
Epoxy resin embedding adhesive is the thermosetting that a class has the performance such as good bonding, corrosion-resistant, electric insulation, high intensity
Polymer composite, when the embedding that it is applied to the devices such as electronic component, motor coil, list when being worked due to these devices
Heat produced by the volume of position is more, it is therefore desirable to which Embedding Material has heat conductivility higher.And traditional epoxy resin
Thermal conductivity factor is only 0.2W/mk or so, far can not meet the cooling requirements of such devices.
At present, a kind of wide method for improving casting glue heat conductivility is addition heat filling.Existing epoxy resin
The heat filling that casting glue is added has graphite, carbon black, inorganic oxide, nitride etc..CN 103087665A disclose one kind
High-heat-conductiviinsulation insulation low-viscosity epoxy resin casting glue and preparation method thereof, it uses aluminum oxide and zinc oxide as heat filling,
But after the epoxy resin embedding adhesive solidification for obtaining, thermal conductivity factor is only 1.75-2.23W/mk, awaits further raising.
Additionally, traditional epoxy resin embedding adhesive is not weather-proof, when it is exposed under the open-air conditions such as daylight, cold and hot, wind and rain
When, easily there are the aging phenomena such as discoloration, cracking, intensity decline, therefore cannot be directly used to outdoor environment.CN
103059515A discloses modified epoxy pouring sealant of a kind of vinyl ester resin and preparation method thereof, by vinyl ester resin
To epoxy resin modification, so as to get epoxy pouring sealant there is more preferable weatherability and decay resistance, be suitable as outdoor filling
Closure material.But substantial amounts of silicon powder is filled with the epoxy pouring sealant, after the epoxy sealing adhesive curing, thermal conductivity factor is less than
0.6W/m·k。
Therefore, expect to obtain a kind of with heat conductivility higher in this area, can be used in the epoxy in outdoor environment
Resin casting glue.
The content of the invention
In view of the shortcomings of the prior art, it is an object of the invention to provide a kind of epoxy resin embedding adhesive and its use
Method.There is heat conductivility higher, insulating properties and good mechanical performance after epoxy resin embedding adhesive solidification.
It is that, up to this purpose, the present invention uses following technical scheme：
On the one hand, the present invention provides a kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Described matrix resin is by epoxy resin and response type toughener (70-90) in mass ratio:(10-30) is constituted；
The heat filling is by silicon nitride and/or boron nitride and ball-aluminium oxide (10-40) in mass ratio:(60-90) group
Into.
Thermal conductivity factor by selecting the heat filling of specific composition to improve product of the invention, by selecting suitable ring
Oxygen tree fat and the proportioning of response type toughener, make matrix resin have suitable viscosity, coordinate other components, obtain the present invention
Epoxy resin embedding adhesive solidification after have heat conductivility higher, insulating properties and good mechanical performance.
In the present invention, the weight/mass percentage composition of described matrix resin can be 6%, 7%, 8%, 9%, 10%, 11%,
12%th, 13%, 14%, 15% or 16% etc..
The weight/mass percentage composition of the anhydride curing agent can be 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%,
13%th, 14% or 15% etc..
The consumption of anhydride curing agent determines the crosslink density after the epoxy resin embedding adhesive solidification that the present invention is provided, its consumption
Excessively, the epoxy resin embedding adhesive after solidification can be made to be hardened become fragile；Its consumption is very few, then the epoxy resin embedding adhesive solidification for obtaining
Mechanical strength is relatively low afterwards, poor-performing.
The weight/mass percentage composition of the curing accelerator can be 0.02%, 0.022%, 0.025%, 0.028%,
0.03%th, 0.032%, 0.035%, 0.038%, 0.04%, 0.042%, 0.045%, 0.048%, 0.05%, 0.052%
Or 0.055% etc..
Although curing accelerator consumption is less, without curing accelerator, then the epoxy resin embedding adhesive needs for obtaining
The mechanical performance being lot more time to after solidification, and solidification is poor.
The weight/mass percentage composition of the heat filling can be 70%, 71%, 72%, 73%, 74%, 75%, 76%,
77%th, 78%, 79%, 80%, 81%, 82%, 83%, 84% or 85% etc..
The addition of heat filling is excessive, and the viscosity of the epoxy resin embedding adhesive for obtaining can be caused excessive, poor fluidity, fills
Envelope is incomplete, and mechanical performance does not reach requirement after solidification；The addition of heat filling is very few, then heat conductivility accordingly declines.
The epoxy resin can be 70 with the mass ratio of the response type toughener:30、72:28、75:25、78:22、
80:20、82:18、85:15、88:12 or 90:10 etc..
Epoxy resin keeps within the specific limits with the mass ratio of response type toughener, and the epoxy resin embedding adhesive for obtaining is consolidated
There could be good heat conductivility and mechanical performance after change.The ratio of response type toughener is excessive, can cause matrix resin
Viscosity is too high, not only limits the addition of heat filling, and it is uneven to disperse heat filling；The ratio of response type toughener
Example is too small, then mechanical performance is poor after the epoxy resin embedding adhesive for obtaining can be caused to solidify.
Silicon nitride and/or boron nitride and the mass ratio of ball-aluminium oxide can be 10 in the heat filling:90、12:88、
15:85、18:82、20:80、22:78、25:75、28:72、30:70、32:68、35:65、38:62 or 40:60 etc..
It should be noted that heat filling is by nitride and ball-aluminium oxide (10-40) in mass ratio in the present invention:
(60-90) is constituted, and wherein ball-aluminium oxide can reduce the viscosity of system, with addition higher；Nitride is silicon nitride
And/or boron nitride, it is of the invention to be not particularly limited for the ratio between silicon nitride and boron nitride.
Preferably, the epoxy resin embedding adhesive is based on weight/mass percentage composition, including following component：
Preferably, the epoxy resin embedding adhesive is based on weight/mass percentage composition, including following component：
Preferably, the epoxy resin is liquid cycloaliphatic epoxy resin.
Preferably, the liquid cycloaliphatic epoxy resin is liquid cycloaliphatic diglycidyl ether type epoxy resin and/or liquid
State cycloaliphatc glycidyl ester type epoxy resin.
The present invention is for liquid cycloaliphatic diglycidyl ether type epoxy resin and liquid cycloaliphatic glycidyl ester type epoxy
The specific species of resin is not particularly limited, and wherein liquid cycloaliphatic diglycidyl ether type epoxy resin is specifiable 1,2- rings
Hexanediol diglycidyl ether etc.；Liquid cycloaliphatic glycidyl ester type epoxy resin is specifiable hexamethylene -1,2- dicarboxyls
Sour 2-glycidyl ester, 4,5- epoxy tetrahydrophthalic acid 2-glycidyl esters etc..
Preferably, the response type toughener is polyethylene glycol and/or polypropylene glycol.
Preferably, the number-average molecular weight of the polyethylene glycol is 400-2000, for example can be 400,500,600,700,
800th, 900,1000,1100,1200,1300,1400,1500,1600,1700,1800,1900 or 2000 etc..
Preferably, the number-average molecular weight of the polypropylene glycol is 400-1000, for example can be 400,500,600,700,
800th, 900 or 1000 etc..
The molecular weight of polyethylene glycol and polypropylene glycol also has certain influence on the viscosity of matrix resin.The two molecular weight is excessive
When, can increase the viscosity of matrix resin, so as to limit the addition and its dispersiveness of heat filling；The two molecular weight is too small,
The epoxy resin embedding adhesive mechanical performance after solidification can be then caused to decline.
Preferably, the anhydride curing agent be HHPA (i.e. hexahydrophthalic anhydride) and methyl hexahydrophthalic anhydride (i.e.
Methylhexahydrophthalic anhydride) combination.
Preferably, the HHPA and the mass ratio of methyl hexahydrophthalic anhydride are (50-90):(10-50), for example can be
50:50、52:48、55:45、58:42、60:40、62:38、65:35、68:32、70:30、72:28、75:25、78:22、80:
20、82:18、85:15、88:12 or 90:10 etc..
The anhydride curing agent and regioselective response type toughener of the specific composition of present invention selection cooperate, and obtain
Epoxy resin embedding adhesive it is cured after have weatherability higher, can adapt to outwork environment.
Preferably, the curing accelerator is benzyl dimethylamine and/or the methylimidazole of 2- ethyls -4.
Preferably, the particle diameter of the ball-aluminium oxide is 10-20 μm, for example can be 10 μm, 11 μm, 12 μm, 13 μm, 14
μm, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm etc..
Preferably, the particle diameter of the silicon nitride and the boron nitride is each independently 5-10 μm, for example, can be 5 μm, 6
μm, 7 μm, 8 μm, 9 μm or 10 μm etc..
The addition of nano level heat filling is relatively low, and it is difficult to be uniformly dispersed in matrix resin, can cause asphalt mixtures modified by epoxy resin
Thermal conductivity factor after fat embedding adhesive curing is relatively low.The micron-sized heat filling of present invention selection, its dispersiveness is more preferable, with higher
Addition, contribute to the raising of heat conductivility.
It is not definitely fine and close due to there is certain space between coil when motor coil is poured into a mould, therefore, heat filling
In can penetrating into the space between coil with glue.If the particle diameter of heat filling is excessive, it is easily intercepted by coil, point
Dissipate uneven, so as to cause the epoxy resin embedding adhesive heat conductivility after solidification to decline；If the particle diameter of heat filling is too small, its
Easily settled during solidification, again result in the epoxy resin embedding adhesive heat conductivility after solidification and decline.The present invention
The heat filling of different-grain diameter is selected to use cooperatively, the space that can not only fill up mutually between filler increases the addition of filler
Amount, and continuous passage of heat is more readily formed, so as to improve thermal conductivity factor.
On the other hand, the present invention provides a kind of application method of above-mentioned epoxy resin embedding adhesive, and the application method is as follows：
Will formula ratio each component mix after pour into a mould by embedding thing, by pour be poured in by embedding thing first in 80-120 DEG C of (example
Such as can be 80 DEG C, 82 DEG C, 85 DEG C, 88 DEG C, 90 DEG C, 92 DEG C, 95 DEG C, 98 DEG C, 100 DEG C, 102 DEG C, 105 DEG C, 108 DEG C, 110
DEG C, 112 DEG C, 115 DEG C, 118 DEG C or 120 DEG C etc.) under solidify 4-8h (for example can be 4h, 4.5h, 5h, 5.5h, 6h, 6.5h,
7h, 7.5h or 8h etc.), then 130-150 DEG C (for example can be 130 DEG C, 132 DEG C, 135 DEG C, 138 DEG C, 140 DEG C, 142 DEG C,
145 DEG C, 148 DEG C or 150 DEG C etc.) under solidify 10-15h (for example can be 10h, 10.5h, 11h, 11.5h, 12h, 12.5h,
13h, 13.5h, 14h, 14.5h or 15h etc.).
It should be noted that in the epoxy resin embedding adhesive of present invention offer, component matrix resin and anhydride curing agent are not
Can long-term co-existence.Therefore, in actual applications, the two is stored respectively.Curing accelerator and heat filling can be each independent
Ground mixes storage with matrix resin or anhydride curing agent, or is when in use just well mixed each component, is configured to glue.
Preferably, the mixing is to carry out under agitation.
Preferably, the rotating speed of the stirring be 1500-2300r/min, for example can be 1500r/min, 1600r/min,
1700r/min, 1800r/min, 1900r/min, 2000r/min, 2100r/min, 2200r/min or 2300r/min etc..
Compared with prior art, the invention has the advantages that：
Thermal conductivity factor by selecting the heat filling of specific composition to improve product of the invention, by selecting suitable ring
Oxygen tree fat and the proportioning of response type toughener, make matrix resin have suitable viscosity.Each component cooperates, and makes of the invention obtaining
There is heat conductivility higher, insulating properties and good mechanical performance after the epoxy resin embedding adhesive solidification arrived.
After the epoxy resin embedding adhesive solidification that the present invention is provided, its thermal conductivity factor reaches 4-5W/mk, and specific insulation is
(0.8-5.3)×1016Ω cm, tensile strength is 80-95MPa, and bending strength is 130-150MPa, and impact strength is 11-
15kJ/m2。
Carried out preferably by the consumption to each component, the properties of the epoxy resin embedding adhesive after solidification are further carried
Height, its thermal conductivity factor is 4.6-5W/mk, and specific insulation is (2-5.3) × 1016Ω cm, tensile strength is 88-95MPa,
Bending strength is 142-150MPa, and impact strength is 13-15kJ/m2。
By selecting specific toughener and anhydride curing agent, coordinate other components, make the epoxy resin encapsulated after solidification
Glue has weatherability higher, can adapt to outwork environment.
Specific embodiment
Technical scheme is further illustrated below by specific embodiment.Those skilled in the art should be bright
, the embodiment be only to aid in understand the present invention, be not construed as to concrete restriction of the invention.
Embodiment 1
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin by 1,2- cylohexanediol diglycidyl ethers and polyethylene glycol (molecular weight 2000) in mass ratio
70:30 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 50:50 compositions；
Heat filling is by boron nitride (5 μm of particle diameter) and ball-aluminium oxide (10 μm of particle diameter) in mass ratio 10:90 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 1500r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 8h at 80 DEG C, then solidifies 10h at 150 DEG C.
Embodiment 2
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin by hexamethylene -1,2- dicarboxylic acids 2-glycidyl ester and polypropylene glycol (molecular weight 1000) by matter
Amount compares 80:20 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 60:40 compositions；
Heat filling is by silicon nitride (10 μm of particle diameter) and ball-aluminium oxide (15 μm of particle diameter) in mass ratio 25:75 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 1800r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 4h at 120 DEG C, then solidifies 15h at 130 DEG C.
Embodiment 3
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin is by 4,5- epoxy tetrahydrophthalic acid 2-glycidyl esters and polypropylene glycol (molecular weight 400)
In mass ratio 90:10 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 90:10 compositions；
Heat filling is by boron nitride (8 μm of particle diameter) and ball-aluminium oxide (20 μm of particle diameter) in mass ratio 40:60 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 2300r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 6h at 100 DEG C, then solidifies 12h at 140 DEG C.
Embodiment 4
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin by 1,2- cylohexanediol diglycidyl ethers and polyethylene glycol (molecular weight 400) in mass ratio
75:25 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 70:30 compositions；
Heat filling is by silicon nitride (6 μm of particle diameter) and ball-aluminium oxide (13 μm of particle diameter) in mass ratio 15:85 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 2000r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 5h at 90 DEG C, then solidifies 11h at 135 DEG C.
Embodiment 5
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin by 1,2- cylohexanediol diglycidyl ethers and polyethylene glycol (molecular weight 1000) in mass ratio
85:15 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 80:20 compositions；
Curing accelerator is made up of benzyl dimethylamine and the methylimidazole of 2- ethyls -4；
Heat filling is made up of silicon nitride (9 μm of particle diameter), boron nitride (10 μm of particle diameter) and ball-aluminium oxide (18 μm of particle diameter),
The gross mass of silicon nitride and boron nitride is 30 with the mass ratio of ball-aluminium oxide:70.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 2100r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 7h at 110 DEG C, then solidifies 13h at 145 DEG C.
Embodiment 6
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin by hexamethylene -1,2- dicarboxylic acids 2-glycidyl ester and polypropylene glycol (molecular weight 800) by matter
Amount compares 80:20 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 80:20 compositions；
Heat filling is by boron nitride (5 μm of particle diameter) and ball-aluminium oxide (10 μm of particle diameter) in mass ratio 35:65 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 1600r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 4h at 85 DEG C, then solidifies 12h at 130 DEG C.
Embodiment 7
A kind of epoxy resin embedding adhesive, based on weight/mass percentage composition, including following component：
Wherein matrix resin is by 4,5- epoxy tetrahydrophthalic acid 2-glycidyl esters and polyethylene glycol (molecular weight
1500) in mass ratio 70:30 compositions；
Anhydride curing agent is by HHPA and methyl hexahydrophthalic anhydride in mass ratio 65:35 compositions；
Heat filling is by silicon nitride (5 μm of particle diameter) and ball-aluminium oxide (15 μm of particle diameter) in mass ratio 20:80 compositions.
The application method of above-mentioned epoxy resin embedding adhesive is as follows：
The each component of formula ratio is well mixed under the rotating speed of 2200r/min, is poured into a mould by embedding thing, the quilt being poured in will be poured
Embedding thing first solidifies 5h at 95 DEG C, then solidifies 12h at 140 DEG C.
Embodiment 8
It is anhydride curing agent by HHPA and methyl hexahydrophthalic anhydride in mass ratio 45 with the difference of embodiment 7:55 groups
Into.
Embodiment 9
It is anhydride curing agent by HHPA and methyl hexahydrophthalic anhydride in mass ratio 95 with the difference of embodiment 7:5 groups
Into.
Comparative example 1
It is that heat filling is silicon nitride with the difference of embodiment 1.
Comparative example 2
It is that heat filling is ball-aluminium oxide with the difference of embodiment 1.
Comparative example 3
It is heat filling by boron nitride and ball-aluminium oxide in mass ratio 5 with the difference of embodiment 1:95 compositions.
Comparative example 4
It is heat filling by boron nitride and ball-aluminium oxide in mass ratio 45 with the difference of embodiment 1:55 compositions.
Comparative example 5
It is matrix resin by 1,2- cylohexanediol diglycidyl ethers and polyethylene glycol by quality with the difference of embodiment 1
Than 65:35 compositions.
Comparative example 6
It is matrix resin by 1,2- cylohexanediol diglycidyl ethers and polyethylene glycol by quality with the difference of embodiment 1
Than 95:5 compositions.
The performance data and testing standard of above-described embodiment 1-9 and comparative example 1-6 are as shown in table 1 below.
Table 1
From the performance data of embodiment 8-9 in table 1, the anhydride curing agent of special component of the present invention is not used, can lead
The mechanical performance of the epoxy resin embedding adhesive after solidification is caused to decline.From the performance data of comparative example 1-4, the present invention is not used
The heat filling of special component, after the epoxy resin embedding adhesive that obtains is cured, its thermal conductivity factor is relatively low, and heat conductivility is not reached
It is required that.From the performance data of comparative example 5-6, the ratio of response type toughener is too high, can cause the epoxy resin after solidification
Casting glue heat conductivility declines；The ratio of response type toughener is too small, then can cause the epoxy resin embedding adhesive machinery after solidification
Hydraulic performance decline.
Applicant states, the foregoing is only specific embodiment of the invention, but protection scope of the present invention not office
It is limited to this, person of ordinary skill in the field is it will be clearly understood that any belong to those skilled in the art and taken off in the present invention
In the technical scope of dew, the change or replacement that can be readily occurred in, within the scope of all falling within protection scope of the present invention and disclosing.
Claims (10)
1. a kind of epoxy resin embedding adhesive, it is characterised in that the epoxy resin embedding adhesive based on weight/mass percentage composition, including such as
Lower component：
Described matrix resin is by epoxy resin and response type toughener (70-90) in mass ratio:(10-30) is constituted；
The heat filling is by silicon nitride and/or boron nitride and ball-aluminium oxide (10-40) in mass ratio:(60-90) is constituted.
2. epoxy resin embedding adhesive according to claim 1, it is characterised in that the epoxy resin embedding adhesive presses quality hundred
Divide content meter, including following component：
3. epoxy resin embedding adhesive according to claim 1 and 2, it is characterised in that the epoxy resin embedding adhesive presses matter
Amount percentage composition meter, including following component：
4. the epoxy resin embedding adhesive according to claim any one of 1-3, it is characterised in that the epoxy resin is liquid
Cycloaliphatic epoxy resin；
Preferably, the liquid cycloaliphatic epoxy resin is liquid cycloaliphatic diglycidyl ether type epoxy resin and/or liquid fat
Ring race glycidyl ester type epoxy resin.
5. the epoxy resin embedding adhesive according to claim any one of 1-4, it is characterised in that the response type toughener is
Polyethylene glycol and/or polypropylene glycol；
Preferably, the number-average molecular weight of the polyethylene glycol is 400-2000；
Preferably, the number-average molecular weight of the polypropylene glycol is 400-1000.
6. the epoxy resin embedding adhesive according to claim any one of 1-5, it is characterised in that the anhydride curing agent is six
The combination of hydrogen phthalic anhydride and methyl hexahydrophthalic anhydride；
Preferably, the HHPA and the mass ratio of methyl hexahydrophthalic anhydride are (50-90):(10-50).
7. the epoxy resin embedding adhesive according to claim any one of 1-6, it is characterised in that the curing accelerator is benzyl
Base dimethylamine and/or the methylimidazole of 2- ethyls -4.
8. the epoxy resin embedding adhesive according to claim any one of 1-7, it is characterised in that the grain of the ball-aluminium oxide
Footpath is 10-20 μm；
Preferably, the particle diameter of the silicon nitride and the boron nitride is each independently 5-10 μm.
9. the application method of the epoxy resin embedding adhesive according to claim any one of 1-8, it is characterised in that described to use
Method is as follows：
Will formula ratio each component mix after pour into a mould by embedding thing, by pour be poured in 4- first at 80-120 DEG C is solidified by embedding thing
8h, then solidifies 10-15h at 130-150 DEG C.
10. application method according to claim 9, it is characterised in that the mixing is to carry out under agitation；
Preferably, the rotating speed of the stirring is 1500-2300r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710127515.1A CN106867438A (en) | 2017-03-06 | 2017-03-06 | A kind of epoxy resin embedding adhesive and its application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710127515.1A CN106867438A (en) | 2017-03-06 | 2017-03-06 | A kind of epoxy resin embedding adhesive and its application method |
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Cited By (12)
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| CN108410406A (en) * | 2018-03-12 | 2018-08-17 | 常州五荣化工有限公司 | A kind of preparation method of modified epoxy casting glue |
| CN109401708A (en) * | 2018-11-13 | 2019-03-01 | 固德电材系统（苏州）股份有限公司 | A kind of normal temperature cure casting glue and its application method |
| CN110305298A (en) * | 2019-06-26 | 2019-10-08 | 苏州太湖电工新材料股份有限公司 | A kind of Epoxy curing accelerators and its preparation method and application suitable for epoxy glue |
| CN110577722A (en) * | 2019-09-12 | 2019-12-17 | 江苏硕阳电子科技有限公司 | Epoxy resin mixed heat-conducting insulating material for air-core reactor and preparation method thereof |
| CN112409969A (en) * | 2020-11-10 | 2021-02-26 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for filling and sealing torque motor rotor and filling and sealing method |
| CN112694856A (en) * | 2019-06-26 | 2021-04-23 | 苏州太湖电工新材料股份有限公司 | Two-component epoxy pouring sealant |
| CN112745480A (en) * | 2020-12-25 | 2021-05-04 | 天津晶东化学复合材料有限公司 | Curing agent for ultrahigh molecular weight epoxy resin |
| CN113574132A (en) * | 2019-03-15 | 2021-10-29 | 汉高股份有限及两合公司 | Thermally conductive potting composition |
| CN114149775A (en) * | 2021-11-12 | 2022-03-08 | 中广核核电运营有限公司 | Epoxy resin pouring sealant, canned motor pump stator and processing method thereof |
| CN114525100A (en) * | 2022-03-16 | 2022-05-24 | 安徽工业技术创新研究院六安院 | High-thermal-conductivity low-viscosity epoxy pouring sealant and preparation method thereof |
| CN114921207A (en) * | 2022-03-28 | 2022-08-19 | 诚亿电子（嘉兴）有限公司 | High-thermal-conductivity metal substrate insulating and heat-conducting glue |
| CN115232444A (en) * | 2022-09-02 | 2022-10-25 | 重庆大学 | High-thermal-conductivity spherical boron nitride composite epoxy resin and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108410406A (en) * | 2018-03-12 | 2018-08-17 | 常州五荣化工有限公司 | A kind of preparation method of modified epoxy casting glue |
| CN109401708A (en) * | 2018-11-13 | 2019-03-01 | 固德电材系统（苏州）股份有限公司 | A kind of normal temperature cure casting glue and its application method |
| CN113574132A (en) * | 2019-03-15 | 2021-10-29 | 汉高股份有限及两合公司 | Thermally conductive potting composition |
| CN110305298A (en) * | 2019-06-26 | 2019-10-08 | 苏州太湖电工新材料股份有限公司 | A kind of Epoxy curing accelerators and its preparation method and application suitable for epoxy glue |
| CN112694856A (en) * | 2019-06-26 | 2021-04-23 | 苏州太湖电工新材料股份有限公司 | Two-component epoxy pouring sealant |
| CN110305298B (en) * | 2019-06-26 | 2021-06-22 | 苏州太湖电工新材料股份有限公司 | Epoxy curing accelerator suitable for epoxy adhesive and preparation method and application thereof |
| CN110577722A (en) * | 2019-09-12 | 2019-12-17 | 江苏硕阳电子科技有限公司 | Epoxy resin mixed heat-conducting insulating material for air-core reactor and preparation method thereof |
| CN112409969A (en) * | 2020-11-10 | 2021-02-26 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for filling and sealing torque motor rotor and filling and sealing method |
| CN112745480A (en) * | 2020-12-25 | 2021-05-04 | 天津晶东化学复合材料有限公司 | Curing agent for ultrahigh molecular weight epoxy resin |
| CN114149775A (en) * | 2021-11-12 | 2022-03-08 | 中广核核电运营有限公司 | Epoxy resin pouring sealant, canned motor pump stator and processing method thereof |
| CN114525100A (en) * | 2022-03-16 | 2022-05-24 | 安徽工业技术创新研究院六安院 | High-thermal-conductivity low-viscosity epoxy pouring sealant and preparation method thereof |
| CN114921207A (en) * | 2022-03-28 | 2022-08-19 | 诚亿电子（嘉兴）有限公司 | High-thermal-conductivity metal substrate insulating and heat-conducting glue |
| CN115232444A (en) * | 2022-09-02 | 2022-10-25 | 重庆大学 | High-thermal-conductivity spherical boron nitride composite epoxy resin and preparation method thereof |
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