CN105255418B - A kind of preparation method of high transparency flexible-epoxy adhesive - Google Patents
A kind of preparation method of high transparency flexible-epoxy adhesive Download PDFInfo
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- CN105255418B CN105255418B CN201510740480.XA CN201510740480A CN105255418B CN 105255418 B CN105255418 B CN 105255418B CN 201510740480 A CN201510740480 A CN 201510740480A CN 105255418 B CN105255418 B CN 105255418B
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Abstract
The invention discloses a kind of preparation method of high transparency flexible-epoxy adhesive, this method include raw material prepare, in proportion mixing, vacuum defoamation, cure these steps；Wherein raw material prepares epoxy resin adhesive and is made of component A and B component, and component A includes 60 80% epoxy resin, 19 39% low viscosity modified epoxies, 0.1 0.5% antifoaming agent and 0.1 0.5% levelling agent；B component includes 64 99% amine curing agents, 0 20% curing agent accelerating agent, 0 15% modifying agent, 0.2 0.5% antioxidant and 0.2 0.5% ultraviolet absorber.Advantage is：Adhesive obtained has the characteristics that high transparency, flexibility are good through the invention, and foreground is had a vast market in the coating of lamp module, LED component and flexible decorative product etc. and embedding field.
Description
Technical field
The present invention relates to the preparation method field of epoxy resin adhesive more particularly to a kind of high transparency flexible-epoxies
The preparation method of adhesive.
Background technology
Epoxy resin is the organic compound containing two or more epoxy groups in molecule, can be with multiple types
The reaction of type curing agent generates the polymer of three-dimensional crosslinked network structure.Epoxy resin has good caking property, corrosion-resistant, exhausted
The features such as edge, high mechanical strength, shrinking percentage are low, processing performance is good, in electronics, electrical, chemical anticorrosion, machine-building, ship fortune
Defeated, space flight and aviation and numerous industrial circles play an important role, and become indispensable a kind of basic material in national economy
Material.
Although epoxide resin material is using extensively, there is also many deficiencies, are mainly reflected at following 2 points：Brittleness compared with
Greatly, especially cracking phenomena is also easy to produce under impact stress effect；Followed by solidfied material internal stress is larger, holds under certain condition
The generation for the problems such as easily causing to cure composition deformation, cracking and damage, to constrain epoxide resin material in more harsh environment
In application.
By carrying out toughening modifying to epoxy resin, can reach improves epoxy resin intrinsic brittleness and internal stress, carries
The purpose of impact strength, increase elongation at break, improvement thermal shock resistance and the caking property of high material etc..At present to epoxy resin
The means for carrying out toughening modifying have focused largely on raw material of the addition with toughness effect, such as rubber into epoxy resin（Such as
Nbr carboxyl terminal, acrylic rubber modified epoxy etc.）, nucleocapsid polymer（Such as the poly- first of butyl polyacrylate-
Base methyl acrylate, polybutadiene-polymethyl methacrylate etc.）, interpenetrating net polymer（Such as epoxy resin-polyurethane body
System, epoxy resin and acrylic ester system etc.）, it is inorganic nano particle modified（Such as Nano-meter SiO_22、TiO2、Al2O3Deng）.These materials
The problem that epoxide resin material brittleness is big, solidfied material internal stress is excessive can be largely improved, as a kind of general hand
Section has been widely used in actual use.
For the epoxy resin product of transparent system, there is limitation in toughening material mentioned above in use, for example, end
Carboxy nitrile rubber is brown liquid, and nucleocapsid polymer and inorganic nano-particle are all white solid powders, only a small number of
Material, such as polyurethane modified epoxy resin, modifying epoxy resin by organosilicon etc. may be used on rising in transparent epoxy resin system
To the effect of toughening modifying.
High transparency flexible-epoxy adhesive has low water white transparency, viscosity, achievable room temperature or middle low-temperature setting, and
And the translucency of solidfied material is good, flexibility protrudes, the elongation at break of product can reach 100-300%, while the preparation work of product
Skill is easy, repeatedly can be repaired or be recoated operation.Such product may be used on lamp module, lamp string pedestal, LED backlight group
The coating and embedding of dress, LED light-emitting sections etc. and all kinds of soft ornaments, label, trade mark etc..
Recently as the development that LED industry and decorations industry are advanced by leaps and bounds, market is to high transparency flexible epoxy
The demand of Resin adhesive also increasingly increases, and the field uses the cured anhydride curing system of high temperature, product mostly at present
Brittleness it is larger, elongation at break is relatively low, far can not meet the needs of this field is to encapsulating products, thus market is to high saturating
The cry of bright flexible-epoxy adhesive is increasingly strong.
Invention content
The technical problem to be solved in the present invention is to provide a kind of preparation method of high transparency flexible-epoxy adhesive, with
Overcome the shortcomings of to mention in above-mentioned background technology.
To achieve the above object, the invention is realized by the following technical scheme：
A kind of preparation method of high transparency flexible-epoxy adhesive, includes the following steps：
（1）It is prepared by raw material：Epoxy resin adhesive is made of component A and B component, and wherein component A includes 60-80% epoxies
Resin, 19-39% low viscosity modified epoxies, 0.1-0.5% antifoaming agent and 0.1-0.5% levelling agents；B component includes 64-
99% amine curing agent, 0-20% curing agent accelerating agent, 0-15% modifying agent, 0.2-0.5% antioxidant and 0.2-0.5% UV absorptions
Agent；
The preparation method of the component A is as follows：Epoxy resin, low viscosity modified epoxy in component A is added to
It in reaction kettle, is stirred 2-4 hours under the conditions of 80-100 DEG C, material is made to be uniformly mixed, be cooled to 50 DEG C of backward epoxy resin and dilute
Antifoaming agent and levelling agent is added in the mixture for releasing agent, continues stirring 30 minutes, subsequent vacuum defoamation 10-20 minutes, packing obtained
Finished product；
The preparation method of the B component is as follows：Amine curing agent, curing agent accelerating agent, modifying agent needed for being formulated,
Antioxidant and ultraviolet absorber are added in reaction kettle, are stirred 1 hour under the conditions of 50-60 DEG C, so that material is uniformly mixed, are dispensed
To finished product；
（2）It mixes in proportion：Component A is with B component by weight 100/（25-50）It is uniformly mixed；
（3）Vacuum defoamation：Vacuum defoamation 5-10 minutes at normal temperatures；
（4）Solidification：After machine is cast in device, cures 2-24 hours under the conditions of 20 DEG C -60 DEG C and be prepared.
Preferably, the epoxy resin in the component A includes flexible solid epoxy resin, liquid bisphenol A epoxy resin, hydrogen
Change the mixture of one or more of bisphenol A epoxide resin and polyurethane modified epoxy resin, wherein：
Flexible solid epoxy resin is one kind in NPES-601, NPES-901 and NPES-903；
Liquid bisphenol A epoxy resin is one kind in E-51 and E-44；
Hydrogenated bisphenol A epoxy resin is the epoxy resin that epoxide equivalent is 180-500；
Polyurethane modified epoxy resin is own product, and preparation method is as follows：
The first step prepares terminal isocyanate group performed polymer using polyalcohol and isocyanates as raw material；
Second step is obtained by the reaction polyurethane with the secondary hydroxyl in excessive epoxy resin with terminal isocyanate group performed polymer and changes
Property epoxy resin.
Preferably, the polyalcohol used in the polyurethane modified epoxy resin be selected from PPG1000, PPG2000,
The mixture of one or more of PPG3000 polyether polyol or CMA-1270, CMA-2270 polyester polyol；Isocyanates
For MDI (4,4 '-methyl diphenylene diisocyanate), TDI (2,4 toluene diisocyanate), HDI（The own diisocyanates of 1,6-
Ester）, one kind in IPDI (isophorone diisocyanate).
Preferably, the low viscosity modified epoxy in the component A is 1,6- hexanediol diglycidyl ethers, Isosorbide-5-Nitrae-fourth
One kind in Hexanediol diglycidyl ether, polypropylene glycol diglycidyl ether, polyethyleneglycol diglycidylether.
Preferably, the antifoaming agent in the component A is BYK-A530, BYK-141, BYK-065, BYK-066N, TEGO
One or more of Airex 900, TEGO Airex 962, TEGO Airex 932, DOW CORNING 100F, DOW CORNING 163
Mixture；
Levelling agent in the component A is BYK-310, BYK-320, BYK-358N, TEGO Glide 450, Perenol
One kind in S43.
Preferably, the amine curing agent in the B component is aliphatic amine curing agent, alicyclic amines curing agent, gathers
The mixture of one or more of ether amine curing agent.
Preferably, curing agent accelerating agent is AEP in the B component；Modifying agent in the B component is nonyl phenol and DMP-
One kind in 30.
Preferably, the antioxidant in the B component is phosphorous acid esters, including：It is double（3,5- di-tert-butyl-phenyls）Season penta
Tetrol diphosphites（Antioxidant 626）And three (2,4- di-tert-butyl-phenyl) phosphite esters of Ciba, CGA12, TP-10,
TP-10H, 317,517, polymerism phosphite antioxidant TP-20, the multiple functional radical phosphorous acid containing be obstructed phenolic group and macromolecular base
The mixture of one or more of ester antioxidant TP-80.
Preferably, the ultraviolet absorber in the B component be benzophenone or benzotriazole, including：2- hydroxyls -4-
Methoxy benzophenone（UV-9）, 2- hydroxyl -4- octyloxybenzophenones（UV-531）、2-（The 2 '-aminomethyl phenyls of hydroxyl -5 '）Benzene
And triazole（UV-P）、2-（2 ' the t-octyl phenyl of hydroxyl -5 '）Benzotriazole（UV-329）, 2-PHENYLBENZIMIDAZOLE-5-SULFONIC ACID
（UV-T）、2-（2H- benzotriazole -2- bases）- 4,6- di-tert-pentyl phenols（UV-328）, 2- cyano -3,3- diphenylacrylates
Ethyl ester（UV-335）、N-（2- ethoxyl phenenyls）-N’-（4- ethylphenyls）Oxalamide（UV-1033）One or more of
Mixture.
The preparation method of high transparency flexible-epoxy adhesive of the present invention has the beneficial effect that：Through the invention
Adhesive obtained has the characteristics that high transparency, flexibility are good, in draping over one's shoulders for lamp module, LED component and flexible decorative product etc.
It covers and has a vast market foreground with embedding field.
Specific implementation mode
The specific technical solution of the present invention described further below, in order to which those skilled in the art is further understood that
The present invention, without constituting the limitation to its right.Particularly, to polyurethane modified epoxy resin raw material in three embodiments its
A, B, C are respectively labeled as behind title, to show difference.
Embodiment one
In being prepared to the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin A is as follows：
1. the PPG3000 polyether polyol of the PPG1000 of 150g and 75g is added in reaction kettle, in 100-110
DEG C, it is dehydrated under -0.95MPa the following conditions 2-3 hours and is less than 0.05% to moisture, 70-100 DEG C is then cooled to, into reaction kettle
The IPDI of 77.7g is put into, after reacting 2-3 hours, obtains terminal isocyanate group performed polymer.
2. the E-51 epoxy resin of 634.2g is dehydrated 2-3 hours to water under 100-110 DEG C, -0.95MPa the following conditions
Divide and be less than 0.05%, be then cooled to 70-90 DEG C, the isocyanate terminated performed polymer of 240g is added under nitrogen protection, reacts 2-3
After hour, the catalyst dibutyltin dilaurylate of 6.3g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin A.
Experimental formula is as follows：
Under conditions of fixed solid epoxy resin NPES-901 mass percents, adjustment polyurethane modified epoxy resin A,
The data of formula 1 and formula 2 that the ratio of E-44 and low viscosity modified epoxy, i.e. upper table provide, proceed as follows.
NPES-901, E-44, polyurethane modified epoxy resin A, polypropylene glycol diglycidyl ether are added in reaction kettle,
It is stirred 2 hours under the conditions of 90 DEG C, BYK-141, TEGO Airex 932, BYK-310 is added thereto continuation after being cooled to 50 DEG C
Stirring 30 minutes, subsequent vacuum defoamation 15 minutes obtains component A；By D-230, Ancamine 2519, Ancamine 2074,
AEP, 626, UV-328 are added in reaction kettle, are stirred 1 hour under the conditions of 50 DEG C, obtain B component.By weight by component A and B component
It is uniformly mixed than 100/33, vacuum defoamation at normal temperatures 10 minutes cures 6 after machine is cast in device under the conditions of 50 DEG C
It can be obtained the high transparency flexible-epoxy adhesive haveing excellent performance after hour, while the present invention and a same type are general
Commercial product has carried out the comparison of aspect of performance, as a result see the table below.
The technical indicator that upper table lists 1 product of formula and is formulated 2 products and commercial product, 1 product of formula and 2 production of formula
Product main difference is that adding the preferable polyurethane modified epoxy resin A of toughness in system.Result, which can be seen that, from table matches
The major parameter of 2 products of side is suitable with commercial product and slightly improves, but there are larger gaps compared with being formulated 1 product, main
It is embodied in the glass transition temperature, elongation at break and hardness etc. of product, is formulated the glass transition temperature of 1 product
It is 3 DEG C, there is preferable viscoplasticity at room temperature, and elongation at break is 330%, hardness is Shore A 25, illustrates adhesive
Material has preferable anti-deformation behavior, and the brittleness that can effectively solve the generally existing in the field adhesive product is larger, outside
The problems such as fragile under force effect.
After polyurethane modified epoxy resin A is added in formula system in this explanation, the toughness of adhesive product is obviously improved,
Some drawbacks being inherently present in material, the synthesis of product can be overcome on the basis of holding adhesive product original performance
Performance is effectively promoted.
Embodiment two
In being prepared to the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin B is as follows：
1. the CMA-1270 polyester polyol of the CMA-2270 of 120g and 105g is added in reaction kettle, in 100-110
DEG C, it is dehydrated under -0.95MPa the following conditions 2-3 hours and is less than 0.05% to moisture, 70-100 DEG C is then cooled to, into reaction kettle
The HDI of 38.6g is put into, after reacting 2-3 hours, obtains terminal isocyanate group performed polymer.
2. the E-44 epoxy resin of 260.3g is dehydrated 2-3 hours to water under 100-110 DEG C, -0.95MPa the following conditions
Divide and be less than 0.05%, be then cooled to 70-90 DEG C, the isocyanate terminated performed polymer of 240g is added under nitrogen protection, reacts 2-3
After hour, the catalyst dibutyltin dilaurylate of 2.6g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin B.
Experimental formula is as follows：
Reaction kettle is added in NPES-903, E-51, polyurethane modified epoxy resin B, 1,6 hexanediol diglycidylether
In, it is stirred 2 hours under the conditions of 90 DEG C, BYK-066N, BYK-141, BYK-320 is added thereto after being cooled to 50 DEG C and continue to stir
30 minutes, subsequent vacuum defoamation 10 minutes obtained component A；Reaction kettle is added in D-230, nonyl phenol, AEP, TP-10, UV-329
In, it is stirred 1 hour under the conditions of 55 DEG C, obtains B component.Component A is uniformly mixed with B component by weight 100/50, in room temperature
Lower vacuum defoamation 5 minutes can be obtained after curing 24 hours under the conditions of 25 DEG C and have excellent performance after machine is cast in device
High transparency flexible-epoxy adhesive, test result see the table below：
Embodiment three
In being prepared to the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin C is as follows：
1. the PPG2000 polyether polyol of 260g is added in reaction kettle, in 100-110 DEG C, -0.95MPa or less items
It is dehydrated under part 2-3 hours and is less than 0.05% to moisture, be then cooled to 70-100 DEG C, the TDI of 90.5g is put into reaction kettle, instead
After answering 2-3 hours, terminal isocyanate group performed polymer is obtained.
2. the E-44 epoxy resin of 488.3g is dehydrated 2-3 hours to water under 100-110 DEG C, -0.95MPa the following conditions
Divide and be less than 0.05%, be then cooled to 70-90 DEG C, the isocyanate terminated performed polymer of 260g is added under nitrogen protection, reacts 2-3
After hour, the catalyst dibutyltin dilaurylate of 4.9g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin C.
Experimental formula is as follows：
Polyurethane modified epoxy resin C, E-51, polyethyleneglycol diglycidylether are added in reaction kettle, 80 DEG C of conditions
BYK-A530, DOW CORNING 163, TEGO Glide450, are added thereto after being cooled to 50 DEG C and continue stirring 30 by lower stirring 3 hours
Minute, subsequent vacuum defoamation 10 minutes obtains component A；D-400, AEP, TP-8, UV-335 are added in reaction kettle, 60 DEG C of items
It is stirred 1 hour under part, obtains B component.Component A is uniformly mixed with B component by weight 100/50, vacuum defoamation at normal temperatures
5 minutes, after machine is cast in device, it is flexible that the high transparency haveing excellent performance is can be obtained after curing 3 hours under the conditions of 60 DEG C
Epoxy resin adhesive, test result see the table below：
The light transmittance for three sections of products that the invention is mentioned it can be seen from above three example is above 90%, belongs to high saturating
Bright material；The glass transition temperature of product is respectively less than 10 DEG C, and Shore A hardness is respectively less than or is equal to 30, adhesive material
Material has preferable viscoplasticity at room temperature；The elongation at break of product is all higher than 300%, and tensile strength maintains 1MPa or so,
Illustrate that adhesive product has excellent toughness and preferable intensity.Simultaneously compared with commercial product important technological parameters have it is bright
It is aobvious to be promoted, can meet the high-end sealing of city's field alignment, insulating products the needs of aspect of performance is growing.
In conclusion the present invention is preferred by being carried out to raw material, in conjunction with the homemade polyurethane modified epoxy tree of our company
Fat combines by the science of formula, high transparency flexible-epoxy adhesive can be made, and the light transmittance of product is above 90%,
Elongation at break is more than 300%, and tensile strength maintains 1MPa or so, can meet the needs of market is to such material, in lamps and lanterns mould
The coating of block, LED component and flexible decorative product etc. and embedding field have a vast market foreground and development space.
Claims (1)
1. a kind of preparation method of high transparency flexible-epoxy adhesive, it is characterised in that include the following steps：
(1) reaction kettle is added in NPES-903, E-51, polyurethane modified epoxy resin B, 1,6 hexanediol diglycidylether
In, it is stirred 2 hours under the conditions of 90 DEG C, BYK-066N, BYK-141, BYK-320 is added thereto after being cooled to 50 DEG C and continue to stir
30 minutes, subsequent vacuum defoamation 10 minutes obtained component A；
The mass percent of each raw material of component A is：
NPES-903：30%；E-51：15%；Polyurethane modified epoxy resin B：20%；1,6 hexanediol diglycidylether：
34.5%；BYK-066N：0.1%；BYK-141：0.2%；BYK-320：0.2%；
(2) D-230, nonyl phenol, AEP, TP-10, UV-329 are added in reaction kettle, are stirred 1 hour under the conditions of 55 DEG C, obtains B
Component；
The mass percent of each raw material of B component is：
D-230：69.5%；Nonyl phenol：15%；AEP：15%；TP-10：0.3%；UV-329：0.2%；
(3) component A is uniformly mixed with B component by weight 100/50, vacuum defoamation at normal temperatures 5 minutes is poured into a mould through machine
After device, the high transparency flexible-epoxy adhesive is obtained after curing 24 hours under the conditions of 25 DEG C；
The preparation method of the polyurethane modified epoxy resin B is：
The first step prepares terminal isocyanate group performed polymer using polyalcohol and isocyanates as raw material；
Polyurethane-modified ring is obtained by the reaction with the secondary hydroxyl in excessive epoxy resin in second step terminal isocyanate group performed polymer
Oxygen resin；
The CMA- for the CMA-2270 and 105g that polyalcohol in the preparation method of the polyurethane modified epoxy resin B is 120g
1270 polyester polyol；
The HDI that isocyanates in the preparation method of the polyurethane modified epoxy resin B is 38.6g；
The E-44 epoxy resin that epoxy resin in the preparation method of the polyurethane modified epoxy resin B is 260.3g.
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| CN105754531B (en) * | 2016-03-07 | 2018-03-06 | 慧融高科（武汉）新型材料有限公司 | Adhesive for porous pavement top layer and preparation method thereof |
| CN106281174B (en) * | 2016-09-22 | 2019-10-15 | 株洲时代电气绝缘有限责任公司 | A kind of high tenacity, impact resistance, high flexibility epoxy pouring sealant and preparation method thereof |
| CN106634434B (en) * | 2016-12-21 | 2019-03-01 | 柳州市昌泉贸易有限公司 | A kind of anti-flaming dope and preparation method thereof |
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| CN107573882B (en) * | 2017-09-18 | 2021-02-09 | 北京航天控制仪器研究所 | Low-temperature-cracking-resistant epoxy pouring sealant and preparation method and application thereof |
| CN109749409A (en) * | 2018-12-28 | 2019-05-14 | 中水电第十一工程局（郑州）有限公司 | A kind of dedicated ageing-resistant, resistant abrasion ceramic composite of waterwork |
| CN109868104B (en) * | 2019-02-28 | 2021-06-29 | 苏州金枪新材料股份有限公司 | Flexible epoxy adhesive and preparation method thereof |
| CN110256990B (en) * | 2019-07-03 | 2021-07-06 | 无锡嘉联电子材料有限公司 | High-transparency UV-resistant epoxy resin adhesive and preparation method thereof |
| CN112442327B (en) * | 2019-08-27 | 2022-05-27 | 上海乘鹰新材料有限公司 | Super-weather-resistant bi-component adhesive for building interior and exterior decoration |
| CN110684497A (en) * | 2019-10-28 | 2020-01-14 | 深圳市柳鑫实业股份有限公司 | Solvent-free heat-conducting glue and preparation method thereof |
| CN112795342A (en) * | 2020-12-28 | 2021-05-14 | 中冶建筑研究总院有限公司 | Epoxy resin building joint adhesive capable of being polished and preparation method thereof |
| CN115322518A (en) * | 2021-05-10 | 2022-11-11 | 财团法人工业技术研究院 | Resin composition, package structure and method for forming resin composition |
| CN115521746B (en) * | 2022-10-11 | 2023-08-29 | 深圳市郎搏万先进材料有限公司 | Epoxy resin composition, preparation method thereof and packaging adhesive for microelectronic components |
| CN115991899B (en) * | 2023-02-27 | 2023-05-19 | 内蒙古农业大学 | Novel anti-corrosion and rust-proof material for high-alkali high-salinity water body equipment and preparation method thereof |
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| WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
| CN103320073A (en) * | 2013-06-26 | 2013-09-25 | 株洲世林聚合物有限公司 | Pouring type epoxy resin-based high-damping encapsulation material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
| CN103320073A (en) * | 2013-06-26 | 2013-09-25 | 株洲世林聚合物有限公司 | Pouring type epoxy resin-based high-damping encapsulation material |
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