CN105255418A - Preparation method of high-transparency flexible epoxy resin adhesive - Google Patents
Preparation method of high-transparency flexible epoxy resin adhesive Download PDFInfo
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- CN105255418A CN105255418A CN201510740480.XA CN201510740480A CN105255418A CN 105255418 A CN105255418 A CN 105255418A CN 201510740480 A CN201510740480 A CN 201510740480A CN 105255418 A CN105255418 A CN 105255418A
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Abstract
The invention discloses a preparation method of a high-transparency flexible epoxy resin adhesive. The method comprises the steps of raw material preparation, proportional mixing, vacuum defoamation and curing, wherein in the step of raw material preparation, the epoxy resin adhesive is composed of a component A and a component B, wherein the component A comprises 60-80% of epoxy resin, 19-39% of low-viscosity modified epoxy resin, 0.1-0.5% of a defoaming agent and 0.1-0.5% of a flatting agent; and the component B comprises 64-99% of an amine curing agent, 0-20% of a curing agent promoter, 0-15% of a modifier, 0.2-0.5% of an antioxidant and 0.2-0.5% of an ultraviolet absorbent. The method has the beneficial effects that the adhesive prepared according to the invention has the characteristics of high transparency and good flexibility, therefore, the adhesive has broad market prospects in the covering and filling fields of lamp modules, LED components, flexible decorations, and the like.
Description
Technical field
The present invention relates to the preparation method field of epoxy resin adhesive, particularly relate to a kind of preparation method of high transparency flexible-epoxy sizing agent.
Background technology
Epoxy resin is the organic compound containing two or more epoxide groups in molecule, can react the polymkeric substance generating three-dimensional crosslinked network structure with broad variety solidifying agent.Epoxy resin has good cohesiveness, corrosion-resistant, insulation, the feature such as physical strength is high, shrinking percentage is low, good processability, at electronics, electrically, chemical anticorrosion, machinofacture, ship, space flight and aviation and numerous industrial circle play an important role, and becomes an indispensable class base mateiral in national economy.
Although epoxide resin material uses extensively, also there is many deficiencies, major embodiment is following 2 points: fragility is comparatively large, particularly under shock stress effect, easily produces cracking phenomena; Next is that cured article internal stress is comparatively large, easily causes cured article to be out of shape under certain condition, the generation of the problem such as cracking and damage, thus constrains the application of epoxide resin material in comparatively harsh environment.
By carrying out toughening modifying to epoxy resin, can reach and improve the intrinsic fragility of epoxy resin and internal stress, the object improving the shock strength of material, increase elongation at break, improve resistance to sudden heating and cohesiveness etc.At present the starting material adding in epoxy resin and have toughness effect are concentrated on mostly to the means that epoxy resin carries out toughening modifying, such as rubber (as nbr carboxyl terminal, acrylic elastomer modified epoxy etc.), nucleocapsid structure polymkeric substance (as butyl polyacrylate-polymethylmethacrylate, polyhutadiene-polymethylmethacrylate etc.), interpenetrating net polymer (as epoxy resin-polyurethane system, epoxy resin and acrylic ester system etc.), inorganic nano particle modified (as Nano-meter SiO_2
2, TiO
2, Al
2o
3deng).These materials can improve the problem that epoxide resin material fragility is large, cured article internal stress is excessive to a great extent, are widely used in actual use as a kind of universal means.
For the epoxy resin product of transparent system, in use there is limitation in the above-mentioned toughening material mentioned, such as, nbr carboxyl terminal is brown liquid, nucleocapsid structure polymkeric substance and inorganic nano-particle are all white solid powder, only have a few materials, such as polyurethane modified epoxy resin, modifying epoxy resin by organosilicon etc. may be used on the effect playing toughening modifying in transparent epoxy resin system.
High transparency flexible-epoxy sizing agent have water white transparency, viscosity low, normal temperature or middle low-temperature curing can be realized, and the light transmission of cured article is good, snappiness is given prominence to, the elongation at break of product can reach 100-300%, the preparation technology of product is easy simultaneously, can repeatedly repair or recoat operation.This series products may be used on lamp module, lamp string base, LED-backlit assembling, LED light-emitting section etc., and the coating of all kinds of soft ornament, label, trade mark etc. and embedding.
In recent years along with the development that LED industry and decorations industry are advanced by leaps and bounds, the demand of market to high transparency flexible-epoxy sizing agent also strengthens day by day, the anhydrides curing system of hot setting during this field current uses mostly, the fragility of product is larger, elongation at break is lower, can not meet the demand of this field to encapsulating products far away, thus the cry of market to high transparency flexible-epoxy sizing agent is increasingly strong.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of preparation method of high transparency flexible-epoxy sizing agent, to overcome the deficiency mentioned in above-mentioned background technology.
For achieving the above object, the present invention is achieved through the following technical solutions:
A preparation method for high transparency flexible-epoxy sizing agent, comprises the steps:
(1) raw material preparation: epoxy resin adhesive is made up of component A and B component, and wherein component A comprises 60-80% epoxy resin, 19-39% low viscosity modified epoxy, 0.1-0.5% defoamer and 0.1-0.5% flow agent; B component comprises 64-99% amine curing agent, 0-20% solidifying agent promotor, 0-15% properties-correcting agent, 0.2-0.5% oxidation inhibitor and 0.2-0.5% uv-absorbing agent;
The preparation method of described component A is as follows: join in reactor by the epoxy resin in component A, low viscosity modified epoxy, 2-4 hour is stirred under 80-100 DEG C of condition, make mixing of materials even, the compound being cooled to 50 DEG C of backward epoxy resin and thinner adds defoamer and flow agent, continue stirring 30 minutes, vacuum defoamation 10-20 minute subsequently, packing obtains finished product;
The preparation method of described B component is as follows: join in reactor by amine curing agent required in formula, solidifying agent promotor, properties-correcting agent, oxidation inhibitor and uv-absorbing agent, stirs 1 hour under 50-60 DEG C of condition, and make mixing of materials even, packing obtains finished product;
(2) be mixed in proportion: component A and B component are by weight 100/(25-50) mix;
(3) vacuum defoamation: vacuum defoamation 5-10 minute at normal temperatures;
(4) solidify: be cast in after device through machine, solidify under 20 DEG C of-60 DEG C of conditions and prepare for 2-24 hour.
Preferably, the epoxy resin in described component A comprises the mixture of one or more in flexible solid epoxy resin, liquid bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin and polyurethane modified epoxy resin, wherein:
Flexible solid epoxy resin is the one in NPES-601, NPES-901 and NPES-903;
Liquid bisphenol A epoxy resin is the one in E-51 and E-44;
The epoxy resin of hydrogenated bisphenol A epoxy resin to be epoxy equivalent (weight) be 180-500;
Polyurethane modified epoxy resin is own product, and preparation method is as follows:
The first step with polyvalent alcohol and isocyanic ester for terminal isocyanate group performed polymer prepared by raw material;
Secondary hydroxyl in second step terminal isocyanate group performed polymer and excessive epoxy resin is obtained by reacting polyurethane modified epoxy resin.
Preferably, the polyvalent alcohol used in described polyurethane modified epoxy resin is selected from the mixture of one or more in PPG1000, PPG2000, PPG3000 polyether glycol or CMA-1270, CMA-2270 polyester polyol; Isocyanic ester is MDI (4,4 '-diphenylmethanediisocyanate), TDI (2,4 toluene diisocyanate), HDI(1, hexamethylene-diisocyanate), one in IPDI (isophorone diisocyanate).
Preferably, the low viscosity modified epoxy in described component A is the one in 1,6-hexanediol diglycidyl ether, BDDE, polypropylene glycol diglycidyl ether, polyethyleneglycol diglycidylether.
Preferably, the defoamer in described component A is the mixture of one or more in BYK-A530, BYK-141, BYK-065, BYK-066N, TEGOAirex900, TEGOAirex962, TEGOAirex932, DOW CORNING 100F, DOW CORNING 163;
Flow agent in described component A is the one in BYK-310, BYK-320, BYK-358N, TEGOGlide450, PerenolS43.
Preferably, the amine curing agent in described B component is the mixture of one or more in aliphatics amine curing agent, alicyclic amine curing agent, polyether monoamine solidifying agent.
Preferably, in described B component, solidifying agent promotor is AEP; Properties-correcting agent in described B component is the one in nonyl phenol and DMP-30.
Preferably, oxidation inhibitor in described B component is phosphorous acid esters, comprise: two (3,5-di-tert-butyl-phenyl) pentaerythritol diphosphites (oxidation inhibitor 626), and three of Ciba (2,4-di-tert-butyl-phenyl) phosphorous acid ester, CGA12, TP-10, TP-10H, 317,517, polymerizability phosphite antioxidant TP-20, containing the mixture of one or more in the multiple functional radical phosphite antioxidant TP-80 of be obstructed phenolic group and macromole base.
Preferably, uv-absorbing agent in described B component is benzophenone or benzotriazole category, comprise: ESCALOL 567 (UV-9), 2-hydroxyl-4-octyloxybenzophenone (UV-531), 2-(2 '-hydroxyl-5 ' aminomethyl phenyl) benzotriazole (UV-P), 2-(2 ' hydroxyl-5 ' tertiary octyl phenyl) benzotriazole (UV-329), 2-PHENYLBENZIMIDAZOLE-5-SULFONIC ACID (UV-T), 2-(2H-benzotriazole-2-base)-4, 6-di-tert-pentyl phenol (UV-328), 2-cyano group-3, 3-diphenyl-ethyl acrylate (UV-335), N-(2-ethoxyl phenenyl) mixture of one or more in-N '-(4-ethylphenyl) oxalamide (UV-1033).
The beneficial effect of the preparation method of high transparency flexible-epoxy sizing agent of the present invention is: the sizing agent obtained by the present invention has high transparency, feature that snappiness is good, has wide market outlook in the coating of lamp module, LED component and flexible decorative product etc. and embedding field.
Embodiment
Below further describe concrete technical scheme of the present invention, so that those skilled in the art understands the present invention further, and do not form the restriction to its right.Especially, respectively A, B, C are labeled as after its title to polyurethane modified epoxy resin raw material in three embodiments, to show difference.
Embodiment one
In preparing the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin A is as follows:
1. the PPG3000 polyether glycol of PPG1000 and 75g of 150g is joined in reactor, in 100-110 DEG C, dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture, then be cooled to 70-100 DEG C, the IPDI of 77.7g is dropped in reactor, react after 2-3 hour, obtain terminal isocyanate group performed polymer.
2. by the E-51 epoxy resin of 634.2g in 100-110 DEG C; dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture; then be cooled to 70-90 DEG C; add the isocyanate terminated performed polymer of 240g under nitrogen protection; react after 2-3 hour; drop into the catalyst dibutyltin dilaurylate of 6.3g, continue reaction 0.5-1.0 hour, the polyurethane modified epoxy resin A of predetermined structure can be obtained.
Experimental formula is as follows:
Under the condition of fixed solid epoxy resin NPES-901 mass percent, the ratio of adjustment polyurethane modified epoxy resin A, E-44 and low viscosity modified epoxy, namely above shows the data of the formula 1 and formula 2 provided, proceeds as follows.
NPES-901, E-44, polyurethane modified epoxy resin A, polypropylene glycol diglycidyl ether are added in reactor, stir 2 hours under 90 DEG C of conditions, after being cooled to 50 DEG C, BYK-141, TEGOAirex932, BYK-310 are added and wherein continue stirring 30 minutes, vacuum defoamation subsequently 15 minutes, obtains component A; By D-230, Ancamine2519, Ancamine2074, AEP, 626, UV-328 adds in reactor, stir 1 hour under 50 DEG C of conditions, obtain B component.Component A is mixed by weight 100/33 with B component, vacuum defoamation at normal temperatures 10 minutes, be cast in after device through machine, the high transparency flexible-epoxy sizing agent that can obtain excellent performance after 6 hours is solidified under 50 DEG C of conditions, the contrast of aspect of performance has been carried out in the present invention simultaneously and a general commercially available prod of the same type, the results are shown in following table.
Upper table lists the technical indicator of formula 1 product and formula 2 products and commercially available prod, and 1 product of filling a prescription is add the good polyurethane modified epoxy resin A of toughness in system with the essential difference of formula 2 products.Result as can be seen from table, fill a prescription the significant parameter of 2 products and commercially available prod quite and slightly improve, but the gap that existence is larger compared with formula 1 product, be mainly reflected in the second-order transition temperature of product, the aspect such as elongation at break and hardness, the second-order transition temperature of 1 product of filling a prescription is 3 DEG C, under room temperature, there is good visco-elasticity, and elongation at break is 330%, hardness is ShoreA25, illustrate that sizing agent material has good anti-deformation behavior, effectively can solve ubiquitous fragility in this field sizing agent product larger, the problem such as fragile under external force.
After this illustrates and add polyurethane modified epoxy resin A in formula system, the toughness of sizing agent product is obviously improved, can on the basis keeping the original performance of sizing agent product, overcome some drawbacks of intrinsic existence in material, the over-all properties of product is able to effective lifting.
Embodiment two
In preparing the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin B is as follows:
1. the CMA-1270 polyester polyol of CMA-2270 and 105g of 120g is joined in reactor, in 100-110 DEG C, dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture, then be cooled to 70-100 DEG C, the HDI of 38.6g is dropped in reactor, react after 2-3 hour, obtain terminal isocyanate group performed polymer.
2. by the E-44 epoxy resin of 260.3g in 100-110 DEG C; dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture; then be cooled to 70-90 DEG C; add the isocyanate terminated performed polymer of 240g under nitrogen protection; react after 2-3 hour; drop into the catalyst dibutyltin dilaurylate of 2.6g, continue reaction 0.5-1.0 hour, the polyurethane modified epoxy resin B of predetermined structure can be obtained.
Experimental formula is as follows:
By NPES-903, E-51, polyurethane modified epoxy resin B, 1,6-hexanediol diglycidyl ether adds in reactor, stir 2 hours under 90 DEG C of conditions, after being cooled to 50 DEG C, BYK-066N, BYK-141, BYK-320 are added and wherein continue stirring 30 minutes, vacuum defoamation subsequently 10 minutes, obtains component A; D-230, nonyl phenol, AEP, TP-10, UV-329 are added in reactor, stirs 1 hour under 55 DEG C of conditions, obtain B component.Component A is mixed by weight 100/50 with B component, vacuum defoamation at normal temperatures 5 minutes, be cast in after device through machine, under 25 DEG C of conditions, solidify the high transparency flexible-epoxy sizing agent that can obtain excellent performance after 24 hours, test result sees the following form:
Embodiment three
In preparing the raw material of epoxy resin adhesive, the preparation method of polyurethane modified epoxy resin C is as follows:
1. the PPG2000 polyether glycol of 260g is joined in reactor, in 100-110 DEG C, dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture, then be cooled to 70-100 DEG C, the TDI of 90.5g is dropped in reactor, react after 2-3 hour, obtain terminal isocyanate group performed polymer.
2. by the E-44 epoxy resin of 488.3g in 100-110 DEG C; dewatering under the following condition of-0.95MPa, 2-3 is little is less than 0.05% up to moisture; then be cooled to 70-90 DEG C; add the isocyanate terminated performed polymer of 260g under nitrogen protection; react after 2-3 hour; drop into the catalyst dibutyltin dilaurylate of 4.9g, continue reaction 0.5-1.0 hour, the polyurethane modified epoxy resin C of predetermined structure can be obtained.
Experimental formula is as follows:
Polyurethane modified epoxy resin C, E-51, polyethyleneglycol diglycidylether are added in reactor, stir 3 hours under 80 DEG C of conditions, after being cooled to 50 DEG C, BYK-A530, DOW CORNING 163, TEGOGlide450 are added wherein continuation stirring 30 minutes, vacuum defoamation subsequently 10 minutes, obtains component A; D-400, AEP, TP-8, UV-335 are added in reactor, stir 1 hour under 60 DEG C of conditions, obtain B component.Component A is mixed by weight 100/50 with B component, vacuum defoamation at normal temperatures 5 minutes, be cast in after device through machine, under 60 DEG C of conditions, solidify the high transparency flexible-epoxy sizing agent that can obtain excellent performance after 3 hours, test result sees the following form:
As can be seen from above-mentioned three examples, this transmittance inventing the three sections of products mentioned, all higher than 90%, belongs to high transparency material; The second-order transition temperature of product is all less than 10 DEG C, and ShoreA hardness is all less than or equal to 30, and sizing agent material at room temperature has good visco-elasticity; The elongation at break of product is all greater than 300%, and tensile strength maintains about 1MPa, illustrates that sizing agent product has excellent toughness and good intensity.Simultaneously main technical details has obvious lifting compared with commercially available prod, can meet the high-end sealing of city's field alignment, insulating products in the growing demand of aspect of performance.
In sum, the present invention is by carrying out preferably to starting material, in conjunction with the homemade polyurethane modified epoxy resin of our company, through the scientific combination of formula, can obtain high transparency flexible-epoxy sizing agent, the transmittance of product is all higher than 90%, elongation at break is greater than 300%, tensile strength maintains about 1MPa, can meet the demand of market to this type of material, has wide market outlook and development space in the coating of lamp module, LED component and flexible decorative product etc. and embedding field.
Claims (9)
1. a preparation method for high transparency flexible-epoxy sizing agent, is characterized in that comprising the steps:
(1) raw material preparation: epoxy resin adhesive is made up of component A and B component, and wherein component A comprises 60-80% epoxy resin, 19-39% low viscosity modified epoxy, 0.1-0.5% defoamer and 0.1-0.5% flow agent; B component comprises 64-99% amine curing agent, 0-20% solidifying agent promotor, 0-15% properties-correcting agent, 0.2-0.5% oxidation inhibitor and 0.2-0.5% uv-absorbing agent;
The preparation method of described component A is as follows: join in reactor by the epoxy resin in component A, low viscosity modified epoxy, 2-4 hour is stirred under 80-100 DEG C of condition, make mixing of materials even, the compound being cooled to 50 DEG C of backward epoxy resin and thinner adds defoamer and flow agent, continue stirring 30 minutes, vacuum defoamation 10-20 minute subsequently, packing obtains finished product;
The preparation method of described B component is as follows: join in reactor by amine curing agent required in formula, solidifying agent promotor, properties-correcting agent, oxidation inhibitor and uv-absorbing agent, stirs 1 hour under 50-60 DEG C of condition, and make mixing of materials even, packing obtains finished product;
(2) be mixed in proportion: component A and B component are by weight 100/(25-50) mix;
(3) vacuum defoamation: vacuum defoamation 5-10 minute at normal temperatures;
(4) solidify: be cast in after device through machine, solidify under 20 DEG C of-60 DEG C of conditions and prepare for 2-24 hour.
2. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, it is characterized in that: the epoxy resin in described component A comprises the mixture of one or more in flexible solid epoxy resin, liquid bisphenol A epoxy resin, hydrogenated bisphenol A epoxy resin and polyurethane modified epoxy resin, wherein:
Flexible solid epoxy resin is the one in NPES-601, NPES-901 and NPES-903;
Liquid bisphenol A epoxy resin is the one in E-51 and E-44;
The epoxy resin of hydrogenated bisphenol A epoxy resin to be epoxy equivalent (weight) be 180-500;
Polyurethane modified epoxy resin is own product, and preparation method is as follows:
The first step with polyvalent alcohol and isocyanic ester for terminal isocyanate group performed polymer prepared by raw material;
Secondary hydroxyl in second step terminal isocyanate group performed polymer and excessive epoxy resin is obtained by reacting polyurethane modified epoxy resin.
3. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 2, is characterized in that: the polyvalent alcohol used in described polyurethane modified epoxy resin is selected from the mixture of one or more in PPG1000, PPG2000, PPG3000 polyether glycol or CMA-1270, CMA-2270 polyester polyol; Isocyanic ester is MDI (4,4 '-diphenylmethanediisocyanate), TDI (2,4 toluene diisocyanate), HDI(1, hexamethylene-diisocyanate), one in IPDI (isophorone diisocyanate).
4. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, it is characterized in that: the low viscosity modified epoxy in described component A is 1, one in 6-hexanediol diglycidyl ether, BDDE, polypropylene glycol diglycidyl ether, polyethyleneglycol diglycidylether.
5. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, is characterized in that: the defoamer in described component A is the mixture of one or more in BYK-A530, BYK-141, BYK-065, BYK-066N, TEGOAirex900, TEGOAirex962, TEGOAirex932, DOW CORNING 100F, DOW CORNING 163;
Flow agent in described component A is the one in BYK-310, BYK-320, BYK-358N, TEGOGlide450, PerenolS43.
6. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, is characterized in that: the amine curing agent in described B component is the mixture of one or more in aliphatics amine curing agent, alicyclic amine curing agent, polyether monoamine solidifying agent.
7. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, is characterized in that: in described B component, solidifying agent promotor is AEP;
Properties-correcting agent in described B component is the one in nonyl phenol and DMP-30.
8. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, it is characterized in that: the oxidation inhibitor in described B component is phosphorous acid esters, comprise: two (3,5-di-tert-butyl-phenyl) pentaerythritol diphosphites (oxidation inhibitor 626), and three of Ciba (2,4-di-tert-butyl-phenyl) phosphorous acid ester, CGA12, TP-10, TP-10H, 317,517, polymerizability phosphite antioxidant TP-20, containing the mixture of one or more in the multiple functional radical phosphite antioxidant TP-80 of be obstructed phenolic group and macromole base.
9. the preparation method of high transparency flexible-epoxy sizing agent as claimed in claim 1, it is characterized in that: the uv-absorbing agent in described B component is benzophenone or benzotriazole category, comprise: ESCALOL 567 (UV-9), 2-hydroxyl-4-octyloxybenzophenone (UV-531), 2-(2 '-hydroxyl-5 ' aminomethyl phenyl) benzotriazole (UV-P), 2-(2 ' hydroxyl-5 ' tertiary octyl phenyl) benzotriazole (UV-329), 2-PHENYLBENZIMIDAZOLE-5-SULFONIC ACID (UV-T), 2-(2H-benzotriazole-2-base)-4, 6-di-tert-pentyl phenol (UV-328), 2-cyano group-3, 3-diphenyl-ethyl acrylate (UV-335), N-(2-ethoxyl phenenyl) mixture of one or more in-N '-(4-ethylphenyl) oxalamide (UV-1033).
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
| CN103320073A (en) * | 2013-06-26 | 2013-09-25 | 株洲世林聚合物有限公司 | Pouring type epoxy resin-based high-damping encapsulation material |
-
2015
- 2015-11-04 CN CN201510740480.XA patent/CN105255418B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012021258A1 (en) * | 2010-08-10 | 2012-02-16 | 3M Innovative Properties Company | Epoxy structural adhesive |
| CN103320073A (en) * | 2013-06-26 | 2013-09-25 | 株洲世林聚合物有限公司 | Pouring type epoxy resin-based high-damping encapsulation material |
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