CN110256990B - High-transparency UV-resistant epoxy resin adhesive and preparation method thereof - Google Patents
High-transparency UV-resistant epoxy resin adhesive and preparation method thereof Download PDFInfo
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- CN110256990B CN110256990B CN201910594211.5A CN201910594211A CN110256990B CN 110256990 B CN110256990 B CN 110256990B CN 201910594211 A CN201910594211 A CN 201910594211A CN 110256990 B CN110256990 B CN 110256990B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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Abstract
The invention provides a high-transparency UV-resistant epoxy resin adhesive and a preparation method thereof, which relate to the field of adhesives and comprise a component A and a component B; the component A comprises the following components in parts by weight: 70-90.8 parts of A-type epoxy resin, 9-29 parts of B-type epoxy resin, 0.1-0.5 part of defoaming agent and 0.1-0.5 part of flatting agent; the A-type epoxy resin consists of solid hydrogenated bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin and organic silicon modified epoxy resin; the B-type epoxy resin is low-viscosity epoxy resin; the component B comprises the following components in parts by weight: 84-97.6 parts of amine curing agent, 1-10 parts of curing agent accelerator, 1-5 parts of modifier, 0.2-0.5 part of antioxidant and 0.2-0.5 part of ultraviolet absorber.
Description
Technical Field
The invention relates to the field of adhesives, and particularly relates to a high-transparency UV-resistant epoxy resin adhesive and a preparation method thereof.
Background
The epoxy resin is a widely applied adhesive variety, has the characteristics of good insulativity, high mechanical strength, good processability, good cohesiveness and the like, and plays a very important role in various national civilization fields.
The epoxy resin has high transmittance which is close to that of materials such as organic silicon resin, PS, PMMA and the like, and can be used as optical materials, and some high-end LED lamp beads are encapsulated by special epoxy resin.
In most fields with high requirements on the transparency of glue, the filling and sealing cost cannot be met by using special epoxy resin, which brings an unavoidable fact that the UV resistance of the glue is greatly reduced, some glues can be yellowed after being used outdoors for more than one or two years, and some glues can be yellowed after being used indoors for more than two or three years, and the reason is mainly that the UV resistance of the epoxy resin is poor.
Some researchers improve the UV resistance of the epoxy resin by adding an auxiliary agent with better UV resistance and a promoter such as benzyl alcohol into the epoxy resin, and the methods can only improve the UV resistance of the epoxy resin to a certain extent, but cannot meet the requirements of fields with higher requirements on the UV resistance and transparency of the epoxy resin.
In this case, epoxy resin is likely to be abandoned, and silicone resin with better transparency and UV resistance is used for encapsulation, but the price of silicone resin is generally higher, which limits the mass use in industrial production.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a high-transparency UV-resistant epoxy resin adhesive and a preparation method thereof.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B;
the component A comprises the following components in parts by weight:
70-90.8 parts of A-type epoxy resin, 9-29 parts of B-type epoxy resin, 0.1-0.5 part of defoaming agent and 0.1-0.5 part of flatting agent;
the A-type epoxy resin consists of solid hydrogenated bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin and organic silicon modified epoxy resin, wherein the solid hydrogenated bisphenol A epoxy resin accounts for 15-25 parts of the A-type epoxy resin, the liquid hydrogenated bisphenol A epoxy resin accounts for 55-75 parts of the A-type epoxy resin, and the organic silicon modified epoxy resin accounts for 10-20 parts of the A-type epoxy resin;
the B-type epoxy resin is low-viscosity epoxy resin;
the component B comprises the following components in parts by weight:
84-97.6 parts of amine curing agent, 1-10 parts of curing agent accelerator, 1-5 parts of modifier, 0.2-0.5 part of antioxidant and 0.2-0.5 part of ultraviolet absorbent.
Further, the solid hydrogenated bisphenol A epoxy resin is hydrogenated bisphenol A epoxy resin with the equivalent weight of 500-1000 and is ST-5080 or ST-5100, the liquid hydrogenated bisphenol A epoxy resin is hydrogenated bisphenol A epoxy resin with the equivalent weight of 200-300 and is any one of EP-4080E, ST-3000 and YX-8000, and the organosilicon modified epoxy resin is epoxy resin with the epoxy equivalent weight of 500-1000 and is ALBIFLEX 296.
Further, the low-viscosity epoxy resin is diglycidyl hexahydrophthalate, and is CY-184 or TTA 184.
Further, the defoaming agent is any one or two of Dow Corning 163, TEGO Airex 962, TEGO Airex 932, BYK-141, BYK-A530 and BYK-066N; the flatting agent is any one of BYK-333, BYK-310 and TEGO Glide 450.
Further, the amine curing agent is any one or combination of more of alicyclic amine curing agent, polyether amine curing agent and aliphatic amine curing agent.
Further, the amine curing agent is any one or combination of IPDA, NBDA, Aradur 3484, Aradur2958, Aradur 3233, Ancamine 1618, EC301, T403, D-230 and D-400.
Further, the curing agent accelerator is AEP, and the modifier is triethanolamine or DMP-30.
Further, the antioxidant is any one or combination of more of tris (2, 4-di-tert-butylphenyl) phosphite, V-73P, TP-10H, TP-20 and TP-80.
Further, the ultraviolet absorbent is any one or combination of more of UV-P, UV-531, UV-328, UV-1033 and 2- (2H-benzotriazole-2-yl) -4, 6-di-tert-amylphenol.
The preparation method of the high-transparency UV-resistant epoxy resin adhesive comprises the following specific steps:
(1) sequentially adding liquid hydrogenated bisphenol A epoxy resin, low-viscosity epoxy resin and organic silicon modified epoxy resin into a reaction kettle, heating the reaction kettle to 80-100 ℃, stirring for 1-2h, then adding solid hydrogenated bisphenol A epoxy resin into the reaction kettle, continuously stirring for 2-3h to uniformly mix materials, then cooling to 40-60 ℃, adding a defoaming agent and a flatting agent into the reaction kettle, continuously stirring for 20-40min, then carrying out vacuum defoaming for 10-20min, and subpackaging to obtain a component A;
(2) adding amine curing agent, curing agent accelerator, modifier, antioxidant and ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 50-60 ℃, stirring for 1-2h, and subpackaging to obtain a component B;
(3) mixing the component A and the component B according to the weight ratio of 100: and (2) uniformly mixing 25-50 parts of the components, defoaming in vacuum for 5-10min, pouring the mixture, and curing at the temperature of 20-50 ℃ for 6-24h to obtain the high-transparency UV-resistant epoxy resin adhesive.
(III) advantageous effects
The invention provides a high-transparency UV-resistant epoxy resin adhesive and a preparation method thereof, and the high-transparency UV-resistant epoxy resin adhesive has the following beneficial effects:
the raw materials are optimized, a plurality of hydrogenated bisphenol A epoxy resins with better UV resistance and transparency are compounded to serve as main resin, and the organosilicon modified epoxy resin with outstanding weather resistance is matched, so that the UV resistance and transparency of the finished product are further improved. In addition, by selecting a proper curing system and an auxiliary agent, the glue can be cured at normal temperature or middle temperature, and the possibility of yellowing of the glue in the high-temperature curing process and the use process is avoided.
According to data of experimental tests, the light transmittance of the product can reach more than 90%, the product belongs to a high-light-transmittance material, the UV resistance of the product is excellent, the product can be prevented from yellowing after being used outdoors for 4 years, and the effect is particularly obvious compared with domestic similar products.
The adhesive is suitable for the field with higher requirements on the transmittance and UV resistance of the adhesive, and is particularly suitable for the outdoor lighting industry, such as the coating and potting of large outdoor LED components, outdoor lamp shells, advertising boards and the like.
In addition, the patent has certain similarity with another patent CN105255418A applied by the same company, and the invention is specifically explained as follows in order to highlight the innovation of the invention.
1. Patent CN105255418A aims to obtain a highly transparent flexible epoxy adhesive, while the patent aims to obtain a highly transparent UV resistant epoxy adhesive, the purposes of the two patents are different.
2. In order to obtain the high-transparency flexible epoxy resin adhesive, solid bisphenol a epoxy resin is preferably selected in patent CN105255418A to increase the flexibility of the system, and meanwhile, self-made polyurethane modified epoxy resin is selected as a raw material to further increase the flexibility and light transmittance of the system; in the patent, in order to obtain the high-transparency UV-resistant epoxy resin adhesive, liquid hydrogenated bisphenol a epoxy resin and solid hydrogenated bisphenol a epoxy resin with excellent UV resistance are preferably used as main resins, and simultaneously, the organosilicon modified epoxy resin with outstanding weather resistance is matched, so that the UV resistance and the light transmittance of the adhesive are further improved. The raw materials used in these two patents are thus completely different.
3. The epoxy resin adhesive provided by the patent CN105255418A has the characteristics of high transparency and high flexibility, the application field is mostly limited to indoor use with low requirement on product aging, the epoxy resin adhesive provided by the invention has the characteristics of high transparency and excellent UV resistance, the epoxy resin adhesive can be used indoors, the epoxy resin adhesive has a larger application range and can be used outdoors, the outdoor service life of the epoxy resin adhesive can reach more than 4 years, and the epoxy resin adhesive has very good outdoor aging resistance. The application areas of these two patents are thus different.
Detailed Description
Example 1:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B; the component A comprises epoxy resin ST-5080, EP-4080E, ALBIFLEX 296, low-viscosity epoxy resin CY-184, defoaming agent TEGO Airex 962, BYK-A530 and leveling agent BYK-310; the component B comprises amine curing agent Aradur 3484, D-230, Ancamine 1618, curing agent accelerator AEP, modifier triethanolamine, antioxidant TP-10H and ultraviolet absorbent UV-328.
The preparation method comprises the following steps:
(1) preparation of glue A:
adding 60.4 parts of EP-4080E, 10 parts of ALBIFLEX 296 and 9 parts of CY-184 into a reaction kettle in sequence, heating the reaction kettle to 80 ℃, stirring for 2 hours, then adding 20 parts of ST-5080 into the reaction kettle, and continuing stirring for 2.5 hours to uniformly mix the materials. Cooling the materials to 50 ℃, adding 0.1 part of TEGO Airex 962, 0.2 part of BYK-A530 defoaming agent and 0.3 part of BYK-310 flatting agent into the reaction kettle, continuously stirring for 30min, then carrying out vacuum defoaming for 10min, and subpackaging to obtain a finished product;
(2) b, preparation of glue B:
the preparation method of the component B comprises the following steps: adding 29.3 parts of Aradur 3484, 30 parts of D-230, 25 parts of Ancamine 1618, 10 parts of AEP curing agent accelerator, 5 parts of triethanolamine, 0.2 part of TP-10H antioxidant and 0.5 part of UV-328 ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 60 ℃, stirring for 1 hour, and subpackaging to obtain a finished product.
(3) When the glue is used, the weight ratio of the component A to the component B is 100: 33.3, uniformly mixing, defoaming in vacuum for 6min, pouring the adhesive into a product, and curing at 25 ℃ for 24h to obtain the high-transparency UV-resistant epoxy resin adhesive with excellent performance.
Example 2:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B; the component A comprises epoxy resin ST-5100, YX-8000, ALBIFLEX 296, low-viscosity epoxy resin TTA-184, a defoaming agent BYK-066N and a flatting agent TEGO Glide 450; the component B comprises amine curing agents Aradur2958, D-230, D-400, EC301, curing agent accelerator AEP, modifier DMP-30, antioxidant TP-80 and ultraviolet absorbent UV-1033.
The preparation method comprises the following steps:
(1) preparation of glue A:
adding 54.4 parts of YX-8000, 15 parts of ALBIFLEX 296 and 15 parts of TTA-184 into a reaction kettle in sequence, heating the reaction kettle to 100 ℃, stirring for 1.5 hours, then adding 15 parts of ST-5100 into the reaction kettle, and continuing stirring for 2 hours to uniformly mix the materials. Cooling the materials to 50 ℃, adding 0.5 part of BYK-066N defoaming agent and 0.1 part of TEGO Glide 450 flatting agent into the reaction kettle, continuously stirring for 30min, then carrying out vacuum defoaming for 8min, and subpackaging to obtain a finished product;
(2) b, preparation of glue B:
the preparation method of the component B comprises the following steps: adding 32.4 parts of Aradur2958, 10 parts of D-400, 30 parts of D-230, 20 parts of EC301, 6 parts of AEP curing agent accelerator, 1 part of DMP-30, 0.5 part of TP-80 antioxidant and 0.1 part of UV-1033 ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 50 ℃, stirring for 1 hour, and subpackaging to obtain a finished product.
(3) When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 2:1, vacuum defoaming is carried out for 6min, then the adhesive is poured into a product, and curing is carried out for 3h at 50 ℃ to obtain the high-transparency UV-resistant epoxy resin adhesive with excellent performance.
Example 3:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B; the component A comprises epoxy resin ST-5080, ST-3000, ALBIFLEX 296, low-viscosity epoxy resin CY-184, a defoaming agent BYK-141, TEGO Airex 932 and a flatting agent BYK-333; the component B comprises amine curing agent Aradur 3233, IPDA, T403 and 8100, curing agent accelerator AEP, modifier triethanolamine, antioxidant V-73P, ultraviolet absorbent UV-P and 2- (2H-benzotriazole-2-yl) -4, 6-di-tert-amylphenol.
The preparation method comprises the following steps:
(1) preparation of glue A:
adding 35.4 parts of ST-3000, 20 parts of ALBIFLEX 296 and 29 parts of CY-184 into a reaction kettle in sequence, heating the reaction kettle to 80 ℃, stirring for 1h, adding 15 parts of ST-5080 into the reaction kettle, and continuously stirring for 3h to uniformly mix materials. Cooling the materials to 50 ℃, adding 0.2 part of TEGO Airex 932, 0.1 part of BYK-141 antifoaming agent and 0.2 part of BYK-333 leveling agent into the reaction kettle, continuously stirring for 30min, then carrying out vacuum defoaming for 5min, and subpackaging to obtain a finished product;
(2) b, preparation of glue B:
the preparation method of the component B comprises the following steps: adding 35 parts of Aradur 3233, 20 parts of T403, 29.3 parts of IPDA, 10 parts of 8100, 2 parts of AEP curing agent accelerator, 3 parts of triethanolamine, 0.3 part of V-73P antioxidant, 0.2 part of UV-P and 0.2 part of 2- (2H-benzotriazole-2-yl) -4, 6-di-tert-amylphenol ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 60 ℃, stirring for 1H, and subpackaging to obtain a finished product.
(3) When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 4:1, vacuum defoaming is carried out for 6min, then the adhesive is poured into a product, and curing is carried out for 12h at the temperature of 30 ℃ to obtain the high-transparency UV-resistant epoxy resin adhesive with excellent performance.
Example 4:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B; the component A comprises epoxy resin ST-5100, YX-8000, ALBIFLEX 296, low-viscosity epoxy resin TTA184, defoaming agent Dow Corning 163, BYK-A530 and flatting agent TEGO Glide 450; the component B comprises amine curing agents Ancamine 1618, D-230, EC301, curing agent accelerator AEP, modifier DMP-30, antioxidant tris (2, 4-di-tert-butylphenyl) phosphite, TP-80 and ultraviolet absorbent UV-531.
The preparation method comprises the following steps:
(1) preparation of glue A:
sequentially adding 52.8 parts of YX-8000, 10 parts of ALBIFLEX 296 and 12 parts of CY-184 into a reaction kettle, heating the reaction kettle to 80 ℃, stirring for 1h, then adding 25 parts of ST-5100 into the reaction kettle, continuously stirring for 2h to uniformly mix the materials, then cooling the materials to 40 ℃, adding 0.05 part of Dow Corning 163, 0.05 part of BYK-A530 defoaming agent and 0.1 part of GO TEGlide 450 flatting agent into the reaction kettle, continuously stirring for 20min, then carrying out vacuum defoaming for 10min, and subpackaging to obtain a finished product;
(2) b, preparation of glue B:
the preparation method of the component B comprises the following steps: adding 33.6 parts of Ancamine 1618, 40 parts of D-230, 24 parts of EC301, 1 part of AEP curing agent accelerator, 1 part of DMP-30, 0.1 part of tris (2, 4-di-tert-butylphenyl) phosphite, 0.1 part of TP-80 antioxidant and 0.2 part of UV-531 ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 50 ℃, stirring for 1 hour, and subpackaging to obtain a finished product.
(3) When the glue is used, the component A and the component B are uniformly mixed according to the weight ratio of 4:1, vacuum defoaming is carried out for 5min, then the adhesive is poured into a product, and curing is carried out for 6h at the temperature of 20 ℃ to obtain the high-transparency UV-resistant epoxy resin adhesive with excellent performance.
Example 5:
a high-transparency UV-resistant epoxy resin adhesive is composed of a component A and a component B; the component A comprises epoxy resin ST-5080, EP-4080E, ALBIFLEX 296, low-viscosity epoxy resin CY-184, defoaming agents BYK-141 and BYK-066N and a flatting agent TEGO Glide 450; the component B comprises amine curing agents Aradur2958 and D-230, curing agent accelerator AEP, modifier triethanolamine, antioxidant TP-10H and ultraviolet absorbent UV-328.
The preparation method comprises the following steps:
(1) preparation of glue A:
sequentially adding 40 parts of EP-4080E, 10 parts of ALBIFLEX 296 and 29 parts of CY-184 into a reaction kettle, heating the reaction kettle to 100 ℃, stirring for 2 hours, then adding 20 parts of ST-5080 into the reaction kettle, continuously stirring for 3 hours to uniformly mix materials, then cooling the materials to 60 ℃, adding 0.3 part of BYK-141, 0.2 part of BYK-066N defoaming agent and 0.5 part of TEGO Glide 450 leveling agent into the reaction kettle, continuously stirring for 40 minutes, then carrying out vacuum defoaming for 20 minutes, and subpackaging to obtain a finished product;
(2) b, preparation of glue B:
the preparation method of the component B comprises the following steps: adding 27.3 parts of Aradur2958, 57 parts of D-230, 10 parts of AEP curing agent accelerator, 5 parts of triethanolamine, 0.2 part of TP-10H antioxidant and 0.5 part of UV-328 ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 60 ℃, stirring for 2 hours, and subpackaging to obtain a finished product.
(3) When the glue is used, the weight ratio of the component A to the component B is 2:1, uniformly mixing, defoaming in vacuum for 10min, pouring the adhesive into a product, and curing at 50 ℃ for 24h to obtain the high-transparency UV-resistant epoxy resin adhesive with excellent performance.
Comparative example 1:
essentially the same as example 1 except that the solid hydrogenated bisphenol a epoxy resin in example 1 was replaced with a conventional bisphenol a epoxy resin.
The results of comparing the compositions of example 1 with comparative example 1 are shown in table 1 below:
table 1:
comparative example 2:
essentially the same as example 1 except that the liquid hydrogenated bisphenol a epoxy resin in example 1 was replaced with a conventional bisphenol a epoxy resin.
The results of comparing the compositions of example 1 and comparative example 2 are shown in table 2 below:
table 2:
comparative example 3:
basically the same as example 1 except that the silicone-modified epoxy resin in example 1 was replaced with a general bisphenol a epoxy resin.
The results of comparing the compositions of example 1 and comparative example 3 are shown in table 3 below:
table 3:
and (3) performance testing:
table 4 below shows the results of performance tests of examples 1 to 3 of the present invention and a commercially available epoxy resin adhesive (Shenzhen Jinhua electronic Material Co., Ltd., 318).
Table 4:
as can be seen from Table 4:
the epoxy resin adhesives in the embodiments 1 to 3 have the light transmittance of more than 90%, belong to high-transparency materials, and have very good UV resistance, and the products in the embodiments 1 to 3 can keep unchanged color for more than 3.5 hours by using a 300W UV lamp for irradiation, which shows that the products provided by the invention have very excellent UV resistance.
According to the test data of the company, the energy of 1h of irradiation by using a 300W UV lamp is equivalent to that of outdoor natural light for 1 year, and the energy of 4h of irradiation by using a 300W UV lamp is equivalent to that of outdoor natural light for 4 years, so that the service life of the three formula products provided by the invention is close to or more than 4 years.
From the results in table 4, it can be seen that example 1 is a product with better comprehensive performance, example 2 has the highest tensile strength, which indicates that the product adhesive property of the formula is the best, and example 3 has the UV resistance of 4.5h, which indicates that the product of the formula has more excellent UV resistance, and in practical application, products with different characteristics can be selected for use according to different requirements on product properties.
The tensile strength, hardness and water absorption of the product in example 1 are equivalent to those of the product in the market, but the product in example 1 has great advantages in light transmittance and UV resistance, the light transmittance of example 1 reaches 91.2%, and the product belongs to a high-light-transmittance material, while the light transmittance of the product in the market is only 86.7%; example 1 was irradiated with 300W UV lamp, and showed excellent UV resistance with a lifetime of approximately 4 years in the open air, whereas the commercial product was discolored at 1.0 hour under the same test conditions and with a lifetime of approximately 1 year in the open air.
The comparison shows that the adhesive provided by the invention has obvious advantages in light transmittance and UV resistance, can meet the special requirements of the market on middle-high-end adhesive materials, has very wide market potential, and is particularly useful in the field of high-transparency UV-resistant adhesives.
The following table 5 shows the performance test results of the epoxy resin adhesives of example 1 and comparative examples 1 to 3 of the present invention.
Table 5:
from table 5 above, it can be seen that:
(1) the formula of the example 1 is similar to that of the comparative example 1, in the comparative example 1, only the solid hydrogenated bisphenol A epoxy resin ST-5080 in the example 1 is replaced by the common bisphenol A epoxy resin YD-128, the two different adhesives are cured under the same condition, and the physical property indexes of the product have certain difference.
From the results in Table 5, it can be seen that the tensile strength, hardness and water absorption of the product are not greatly changed and the light transmittance and UV resistance are reduced significantly after replacing ST-5080 with YD-128, which indicates that the solid hydrogenated bisphenol A epoxy resin contributes greatly to the light transmittance and UV resistance of the cured product, and this raw material cannot be replaced in the formulation.
(2) The formula of the example 1 is similar to that of the comparative example 2, in the comparative example 2, only the liquid hydrogenated bisphenol A epoxy resin EP-4080E in the example 1 is replaced by the common bisphenol A epoxy resin YD-128, the two different adhesives are cured under the same condition, and the physical property indexes of the product have certain difference.
From the results in Table 5, it can be seen that, when EP-4080E is replaced by YD-128, the water absorption of the product is not changed, the hardness is improved, the tensile strength, the light transmittance and the UV resistance are reduced to some extent, and particularly, the light transmittance and the UV resistance of the product are obviously reduced, which indicates that the liquid hydrogenated bisphenol A epoxy resin greatly contributes to the light transmittance and the UV resistance of the cured product, and the raw material cannot be replaced in the formula.
(3) The formula of the embodiment 1 is similar to that of the comparative example 3, in the comparative example 3, only the organosilicon modified epoxy resin ALBIFLEX 296 in the embodiment 1 is replaced by the common bisphenol A epoxy resin YD-128, the two different adhesives are cured under the same condition, and the physical index of the product has certain difference.
From the results in table 5, it can be seen that the tensile strength, hardness and water absorption of the product do not change much after replacing ALBIFLEX 296 with YD-128, while the light transmittance and UV resistance of the product are reduced to some extent, which indicates that the silicone-modified epoxy resin contributes to the light transmittance and UV resistance of the cured product, and this raw material is not replaceable in this formulation.
It can be easily found from a series of comparative examples given in the present invention that the solid hydrogenated bisphenol a epoxy resin, the liquid hydrogenated bisphenol a epoxy resin, and the silicone-modified epoxy resin used in the present invention play a decisive role in improving the light transmittance and UV resistance of the cured product, and are an important innovation point in the present invention. By using the three epoxy resins and matching with other raw materials, a series of epoxy resin adhesives with high transparency and UV resistance can be obtained.
In conclusion, the high-transparency UV-resistant epoxy resin adhesive is prepared by optimizing raw materials and combining with a proper preparation process, and compared with the existing products sold in the market, the high-transparency UV-resistant epoxy resin adhesive provided by the invention has obvious advantages in light transmittance and UV resistance, can meet the requirements of the market on the materials, and has wide market prospects and development spaces in various fields.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. The high-transparency UV-resistant epoxy resin adhesive is characterized by consisting of a component A and a component B; the weight ratio of the component A to the component B is 100: 25-50, mixing uniformly;
the component A comprises the following components in parts by weight:
70-90.8 parts of A-type epoxy resin, 9-29 parts of B-type epoxy resin, 0.1-0.5 part of defoaming agent and 0.1-0.5 part of flatting agent;
the A-type epoxy resin consists of solid hydrogenated bisphenol A epoxy resin, liquid hydrogenated bisphenol A epoxy resin and organic silicon modified epoxy resin, wherein the solid hydrogenated bisphenol A epoxy resin accounts for 15-25 parts of the A-type epoxy resin, the liquid hydrogenated bisphenol A epoxy resin accounts for 55-75 parts of the A-type epoxy resin, and the organic silicon modified epoxy resin accounts for 10-20 parts of the A-type epoxy resin;
the B-type epoxy resin is low-viscosity epoxy resin; the low-viscosity epoxy resin is hexahydrophthalic acid diglycidyl ester;
the component B comprises the following components in parts by weight:
84-97.6 parts of amine curing agent, 1-10 parts of curing agent accelerator, 1-5 parts of modifier, 0.2-0.5 part of antioxidant and 0.2-0.5 part of ultraviolet absorbent;
the solid hydrogenated bisphenol A epoxy resin is ST-5080 or ST-5100, the liquid hydrogenated bisphenol A epoxy resin is any one of EP-4080E, ST-3000 and YX-8000, and the organosilicon modified epoxy resin is ALBIFLEX 296.
2. The highly transparent UV-resistant epoxy adhesive according to claim 1, wherein the low viscosity epoxy resin is CY-184 or TTA 184.
3. The highly transparent UV-resistant epoxy resin adhesive as claimed in claim 1, wherein the defoaming agent is any one or two of Dow Corning 163, TEGO Airex 962, TEGO Airex 932, BYK-141, BYK-A530 and BYK-066N; the flatting agent is any one of BYK-333, BYK-310 and TEGO Glide 450.
4. The highly transparent UV-resistant epoxy resin adhesive according to claim 1, wherein the amine curing agent is any one or a combination of more of alicyclic amine curing agent, polyether amine curing agent and aliphatic amine curing agent.
5. The highly transparent UV-resistant epoxy resin adhesive according to claim 4, wherein the amine curing agent is any one or more of IPDA, NBDA, Aradur 3484, Aradur2958, Aradur 3233, Ancamine 1618, EC301, T403, D-230 and D-400.
6. The highly transparent UV-resistant epoxy resin adhesive according to claim 1, wherein the curing agent accelerator is AEP and the modifier is triethanolamine or DMP-30.
7. The highly transparent UV-resistant epoxy resin adhesive according to claim 1, wherein the antioxidant is any one or more of tris (2, 4-di-tert-butylphenyl) phosphite, V-73P, TP-10H, TP-20, and TP-80.
8. The highly transparent UV-resistant epoxy resin adhesive according to claim 1, wherein the ultraviolet absorber is any one or a combination of UV-P, UV-531, UV-328 and UV-1033.
9. The preparation method of the highly transparent UV-resistant epoxy resin adhesive according to any one of claims 1 to 8, which is characterized by comprising the following steps:
(1) sequentially adding liquid hydrogenated bisphenol A epoxy resin, low-viscosity epoxy resin and organic silicon modified epoxy resin into a reaction kettle, heating the reaction kettle to 80-100 ℃, stirring for 1-2h, then adding solid hydrogenated bisphenol A epoxy resin into the reaction kettle, continuously stirring for 2-3h to uniformly mix materials, then cooling to 40-60 ℃, adding a defoaming agent and a flatting agent into the reaction kettle, continuously stirring for 20-40min, then carrying out vacuum defoaming for 10-20min, and subpackaging to obtain a component A;
(2) adding amine curing agent, curing agent accelerator, modifier, antioxidant and ultraviolet absorbent into a reaction kettle in sequence, heating the reaction kettle to 50-60 ℃, stirring for 1-2h, and subpackaging to obtain a component B;
(3) mixing the component A and the component B according to the weight ratio of 100: and (2) uniformly mixing 25-50 parts of the components, defoaming in vacuum for 5-10min, pouring the mixture, and curing at the temperature of 20-50 ℃ for 6-24h to obtain the high-transparency UV-resistant epoxy resin adhesive.
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