CN110256990A - A kind of high transparency epoxy resin adhesive of resistance to UV and preparation method thereof - Google Patents
A kind of high transparency epoxy resin adhesive of resistance to UV and preparation method thereof Download PDFInfo
- Publication number
- CN110256990A CN110256990A CN201910594211.5A CN201910594211A CN110256990A CN 110256990 A CN110256990 A CN 110256990A CN 201910594211 A CN201910594211 A CN 201910594211A CN 110256990 A CN110256990 A CN 110256990A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- parts
- resistance
- agent
- high transparency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/10—Transparent films; Clear coatings; Transparent materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention provides a kind of high transparency epoxy resin adhesives of resistance to UV and preparation method thereof, are related to adhesive field, are made of component A and B component；Component A includes the constituent of following parts by weight: 70-90.8 parts of A based epoxy resin, 9-29 parts of B based epoxy resin, 0.1-0.5 parts of defoaming agent, 0.1-0.5 parts of levelling agent；The A based epoxy resin is made of solid hydride bisphenol A epoxide resin, hydrogenated liquid bisphenol A epoxide resin, modifying epoxy resin by organosilicon；The B based epoxy resin is low viscosity epoxy resin；B component includes the constituent of following parts by weight: 84-97.6 parts of amine curing agent, 1-10 parts of curing agent promotor, 1-5 parts of modifying agent, 0.2-0.5 parts of antioxidant, 0.2-0.5 parts of ultraviolet absorber, the present invention is preferred by carrying out to raw material, in conjunction with appropriate preparation process, have a clear superiority in terms of light transmittance and uv-resistance.
Description
Technical field
The present invention relates to adhesive fields, and in particular to a kind of high transparency epoxy resin adhesive of resistance to UV and its preparation side
Method.
Background technique
Epoxy resin is a kind of adhesive kind being widely used, and has good insulating, high mechanical strength, processability
Well, the features such as caking property is good, plays considerable effect in numerous national economy fields.
The light transmittance of epoxy resin is very high, close with the light transmittance of the materials such as organic siliconresin, PS, PMMA, can be used as
Optical material uses, and some high-end LED lamp beads are exactly to be potted using special epoxy resin.
The higher field of glue transparency requirement is unable to satisfy using special epoxy resin encapsulated cost most of,
The fact that this just brings one can not avoid, that is, the uv-resistance of glue can have a greatly reduced quality, and some glue is super in outdoor application
Spending one or two years will turn to be yellow, and some glue is used more than 1 year indoors and can also be turned to be yellow, mainly epoxy resin of tracing it to its cause
Uv-resistance it is not good enough.
Some researchers are using the promotors such as the preferable auxiliary agent of addition uv-resistance and benzyl alcohol in the epoxy
Method improves the uv-resistance of epoxy resin, these methods can only improve the uv-resistance of epoxy resin to a certain extent
Can, but to epoxy resin uv-resistance and the more demanding field of the transparency be still unable to satisfy.
In this case, people tend to abandon epoxy resin, use the transparency and the preferable organosilicon tree of uv-resistance
Rouge is potted, but the price of organic siliconresin is generally higher, limits its high-volume use in the industrial production.
Summary of the invention
(1) the technical issues of solving
In view of the deficiencies of the prior art, the present invention provides a kind of high transparency epoxy resin adhesive of resistance to UV and its preparation sides
Method.
(2) technical solution
In order to achieve the above object, the present invention is achieved by the following technical programs:
A kind of high transparency epoxy resin adhesive of resistance to UV, the adhesive are made of component A and B component；
The component A includes the constituent of following parts by weight:
70-90.8 parts of A based epoxy resin, 9-29 parts of B based epoxy resin, 0.1-0.5 parts of defoaming agent, levelling agent 0.1-0.5
Part；
Wherein, the A based epoxy resin by solid hydride bisphenol A epoxide resin, hydrogenated liquid bisphenol A epoxide resin, have
Machine silicon modified epoxy resin composition, wherein solid hydride bisphenol A epoxide resin specific gravity shared in A based epoxy resin is 15-
25 parts, hydrogenated liquid bisphenol A epoxide resin specific gravity shared in A based epoxy resin is 55-75 parts, silicon-modified epoxy tree
Rouge specific gravity shared in A based epoxy resin is 10-20 parts；
The B based epoxy resin is low viscosity epoxy resin；
The B component includes the constituent of following parts by weight:
84-97.6 parts of amine curing agent, 1-10 parts of curing agent promotor, 1-5 parts of modifying agent, 0.2-0.5 parts of antioxidant, purple
Outer absorbent 0.2-0.5 parts.
Further, the solid hydride bisphenol A epoxide resin is the hydrogenated bisphenol A epoxy tree that equivalent is 500-1000
Rouge is ST-5080 or ST-5100, and hydrogenated liquid bisphenol A epoxide resin is the hydrogenated bisphenol A epoxy tree that equivalent is 200-300
Rouge, for any one in EP-4080E, ST-3000, YX-8000, modifying epoxy resin by organosilicon is that epoxide equivalent is 500-
1000 epoxy resin is ALBIFLEX 296.
Further, the low viscosity epoxy resin be hexahydrophthalic acid bisglycidyl ester, be CY-184 or
TTA184。
Further, the defoaming agent be DOW CORNING 163, TEGO Airex 962, TEGO Airex932, BYK-141,
Any one in BYK-A530, BYK-066N or two kinds of combinations；The levelling agent is BYK-333, BYK-310, TEGO
Any one in Glide 450.
Further, the amine curing agent is alicyclic amines curing agent, polyether amine curing agent, aliphatic amine are consolidated
Any one or more combination in agent.
Further, the amine curing agent is IPDA, NBDA, Aradur 3484, Aradur 2958, Aradur
3233, Ancamine 1618, EC301, ZD, 8100, any one or more combination in T403, D-230, D-400.
Further, the curing agent promotor is AEP, and the modifying agent is triethanolamine or DMP-30.
Further, the antioxidant be three (2,4- di-tert-butyl-phenyl) phosphite esters, V-73P, TP-10H, TP-20,
Any one or more combination in TP-80.
Further, the ultraviolet absorber is UV-P, UV-531, UV-328, UV-1033,2- (2H- benzotriazole -2-
Base) any one or more combination in -4,6- di-tert-pentyl phenol.
The preparation method of the above-mentioned high transparency epoxy resin adhesive of resistance to UV, specific as follows:
(1) hydrogenated liquid bisphenol A epoxide resin, low viscosity epoxy resin and organic-silicon-modified are sequentially added in a kettle
Reaction kettle is warming up to 80-100 DEG C of stirring 1-2h by epoxy resin, and solid hydride bisphenol-A epoxy tree is then added into reaction kettle
Rouge continues to stir 2-3h, is uniformly mixed material, is then cooled to 40-60 DEG C, defoaming agent and levelling are put into reaction kettle
Agent continues to stir 20-40min, subsequent vacuum defoamation 10-20min, and packing obtains component A；
(2) amine curing agent, curing agent promotor, modifying agent, antioxidant and UV absorption are successively put into reaction kettle
Reaction kettle is warming up to 50-60 DEG C by agent, stirs 1-2h, and packing obtains B component；
(3) it combines A and is uniformly mixed with B component by weight 100:25-50, vacuum defoamation 5-10min then will mixing
Object casting, can be obtained the high transparency epoxy resin adhesive of resistance to UV after solidifying 6-24h under the conditions of 20 DEG C -50 DEG C.
(3) beneficial effect
The present invention provides a kind of high transparency epoxy resin adhesive of resistance to UV and preparation method thereof, have below beneficial to effect
Fruit:
The present invention has carried out preferably raw material, with uv-resistance and the preferable a variety of hydrogenated bisphenol A epoxy resins of the transparency
Compounding is used as matrix resin, while weatherability of arranging in pairs or groups modifying epoxy resin by organosilicon outstanding, further improves the resistance to of finished product
UV performance and the transparency.In addition, by selecting curing system and auxiliary agent appropriate, glue can carry out real under room temperature or medium temperature
Now solidify, avoids glue and occur the possibility of xanthochromia in high temperature cure process and in use.
According to the data of experiment test, the light transmittance of formula provided by the invention, product can achieve 90% or more, belong to
High light transmission material, and the uv-resistance of product can be excellent, and product may insure not turn yellow using 4 years outdoors, similar with the country
Product is particularly evident compared to effect.
The adhesive is suitable for the more demanding field of light transmittance and uv-resistance to adhesive, is particularly suitable for outdoor photograph
Bright industry, such as the coating and encapsulating of large-scale outdoor LED component, outdoor lamp shell, billboard.
In addition, this patent and an other patent CN105255418A for our company's application are there are certain similitude
Prominent novelty of the invention, spy are explained as follows.
1, the purpose of patent CN105255418A is to obtain high transparency flexible-epoxy adhesive, and the purpose of this patent
It is to obtain the high transparency epoxy resin adhesive of resistance to UV, the purpose of the two patents is different.
2, high transparency flexible-epoxy adhesive in order to obtain, preferably solid bisphenol A in patent CN105255418A
Epoxy resin increases the flexibility of system, while selecting homemade polyurethane modified epoxy resin is raw material, is further increased
The flexibility and light transmittance of system；And in this patent, the high transparency epoxy resin adhesive of resistance to UV in order to obtain, preferably resistance to UV
Resin based on property excellent hydrogenated liquid bisphenol A epoxide resin and solid hydride bisphenol A epoxide resin, while weatherability of arranging in pairs or groups
Modifying epoxy resin by organosilicon outstanding further improves the uv-resistance energy and light transmittance of adhesive.Thus the two patents
Used raw material are entirely different.
3, the epoxy resin adhesive that patent CN105255418A is provided has the characteristics that high transparency high flexibility, application field
It is mostly limited as the indoor use of less demanding to the aging of product, and epoxy resin adhesive provided by the invention has high transparency
The excellent feature of uv-resistance, can not only use indoors, and bigger purposes is the outdoor application of the adhesive in outdoor application
The time limit can achieve 4 years or more, have extraordinary outdoor ageing-resistant performance.Thus the application field of the two patents is not yet
Together.
Specific embodiment
Embodiment 1:
A kind of high transparency epoxy resin adhesive of resistance to UV, is made of component A and B component；Component A includes epoxy resin ST-
5080,296 EP-4080E, ALBIFLEX, low viscosity epoxy resin CY-184, defoaming agent TEGO Airex 962, BYK-
A530, levelling agent BYK-310；B component includes amine curing agent Aradur 3484, D-230, Ancamine 1618, solidification
Agent accelerant A EP, modifying agent triethanolamine, antioxidant TP-10H and ultraviolet absorber UV-328.
It is specific the preparation method is as follows:
(1) preparation of A glue:
60.4 parts of EP-4080E, 10 parts of ALBIFLEX, 296,9 parts of CY-184 are sequentially added in a kettle, by reaction kettle
80 DEG C of stirring 2h are warming up to, 20 parts of ST-5080 are then added into reaction kettle, continues to stir 2.5h, is uniformly mixed material.With
Material is cooled to 50 DEG C afterwards, into reaction kettle put into 0.1 part of TEGO Airex 962 and 0.2 parts of BYK-A530 defoaming agent and
0.3 part of BYK-310 levelling agent continues to stir 30min, subsequent vacuum defoamation 10min, and packing obtains finished product；
(2) preparation of B glue:
The B component the preparation method is as follows: successively putting into 29.3 parts of Aradur, 3484,30 parts of D- into reaction kettle
230,25 parts of Ancamine, 1618,10 parts of AEP curing agent promotors, 5 parts of triethanolamines, 0.2 part of TP-10H antioxidant and 0.5
Reaction kettle is warming up to 60 DEG C by part UV-328 ultraviolet absorber, stirs 1h, and packing obtains finished product.
(3) glue in use, A combination be uniformly mixed with B component by weight 100:33.3, vacuum defoamation 6min, then
Adhesive is poured into product, solidifies under the conditions of 25 DEG C and the high transparency asphalt mixtures modified by epoxy resin of resistance to UV haveing excellent performance can be obtained afterwards for 24 hours
Rouge adhesive.
Embodiment 2:
A kind of high transparency epoxy resin adhesive of resistance to UV, is made of component A and B component；Component A includes epoxy resin ST-
5100,296 YX-8000, ALBIFLEX, low viscosity epoxy resin TTA-184, defoaming agent BYK-066N, levelling agent TEGO
Glide 450；B component includes amine curing agent Aradur 2958, D-230, D-400, EC301, curing agent accelerant A EP,
Modifying agent DMP-30, antioxidant TP-80 and ultraviolet absorber UV-1033.
It is specific the preparation method is as follows:
(1) preparation of A glue:
54.4 parts of YX-8000,15 parts of ALBIFLEX, 296,15 parts of TTA-184 are sequentially added in a kettle, by reaction kettle
100 DEG C of stirring 1.5h are warming up to, 15 parts of ST-5100 are then added into reaction kettle, continues to stir 2h, is uniformly mixed material.
Material is then cooled to 50 DEG C, 0.5 part of BYK-066N defoaming agent is put into reaction kettle and 0.1 part of TEGO Glide 450 flows
Flat agent continues to stir 30min, subsequent vacuum defoamation 8min, and packing obtains finished product；
(2) preparation of B glue:
The B component the preparation method is as follows: successively put into reaction kettle 32.4 parts of Aradur2958,10 parts of D-400,
30 parts of D-230,20 parts of EC301,6 parts of AEP curing agent promotors, 1 part of DMP-30,0.5 part of TP-80 antioxidant and 0.1 part of UV-
Reaction kettle is warming up to 50 DEG C by 1033 ultraviolet absorbers, stirs 1h, and packing obtains finished product.
(3) glue in use, A combination be uniformly mixed with B component by weight 2:1, vacuum defoamation 6min, then by gluing
Agent is poured into product, and the high transparency epoxy resin of the resistance to UV gluing haveing excellent performance can be obtained after solidifying 3h under the conditions of 50 DEG C
Agent.
Embodiment 3:
A kind of high transparency epoxy resin adhesive of resistance to UV, is made of component A and B component；Component A includes epoxy resin ST-
5080,296 ST-3000, ALBIFLEX, low viscosity epoxy resin CY-184, defoaming agent BYK-141, TEGO Airex 932,
Levelling agent BYK-333；B component includes amine curing agent Aradur 3233, IPDA, T403,8100, curing agent promotor
Bis- uncle of AEP, modifying agent triethanolamine, antioxidant V-73P and ultraviolet absorber UV-P and 2- (2H- benzotriazole -2- base) -4,6-
Amyl phenol.
It is specific the preparation method is as follows:
(1) preparation of A glue:
35.4 parts of ST-3000,20 parts of ALBIFLEX, 296,29 parts of CY-184 are sequentially added in a kettle, by reaction kettle
80 DEG C of stirring 1h are warming up to, 15 parts of ST-5080 are then added into reaction kettle, continues to stir 3h, is uniformly mixed material.Then
Material is cooled to 50 DEG C, 0.2 part of TEGO Airex 932 and 0.1 parts of BYK-141 defoaming agent and 0.2 part are put into reaction kettle
BYK-333 levelling agent continues to stir 30min, subsequent vacuum defoamation 5min, and packing obtains finished product；
(2) preparation of B glue:
The B component the preparation method is as follows: successively put into reaction kettle 35 parts of Aradur, 3233,20 parts of T403,
29.3 parts of IPDA, 10 part 8100,2 parts of AEP curing agent promotors, 3 parts of triethanolamines, 0.3 part of V-73P antioxidant and 0.2 part of UV-
P and 0.2 part of 2- (2H- benzotriazole -2- base) -4,6- di-tert-pentyl phenol ultraviolet absorber, is warming up to 60 DEG C for reaction kettle, stirs
1h is mixed, packing obtains finished product.
(3) glue in use, A combination be uniformly mixed with B component by weight 4:1, vacuum defoamation 6min, then by gluing
Agent is poured into product, and the high transparency epoxy resin of the resistance to UV gluing haveing excellent performance can be obtained after solidifying 12h under the conditions of 30 DEG C
Agent.
Embodiment 4:
A kind of high transparency epoxy resin adhesive of resistance to UV, is made of component A and B component；Component A includes epoxy resin ST-
5100,296 YX-8000, ALBIFLEX, low viscosity epoxy resin TTA184, defoaming agent DOW CORNING 163, BYK-A530, levelling
Agent TEGO Glide 450；B component includes amine curing agent Ancamine 1618, D-230, EC301, curing agent promotor
AEP, modifying agent DMP-30, antioxidant three (2,4- di-tert-butyl-phenyl) phosphite ester, TP-80 and ultraviolet absorber UV-531.
It is specific the preparation method is as follows:
(1) preparation of A glue:
52.8 parts of YX-8000,10 parts of ALBIFLEX, 296,12 parts of CY-184 are sequentially added in a kettle, by reaction kettle
80 DEG C of stirring 1h are warming up to, 25 parts of ST-5100 are then added into reaction kettle, continues to stir 2h, is uniformly mixed material, then
Material is cooled to 40 DEG C, 0.05 part of DOW CORNING 163 and 0.05 part BYK-A530 defoaming agent and 0.1 part are put into reaction kettle
450 levelling agent of TEGO Glide continues to stir 20min, subsequent vacuum defoamation 10min, and packing obtains finished product；
(2) preparation of B glue:
The B component the preparation method is as follows: successively putting into 33.6 parts of Ancamine1618,40 parts of D- into reaction kettle
230,24 parts of EC301,1 part of AEP curing agent promotor, 1 part of DMP-30,0.1 part of three (2,4- di-tert-butyl-phenyl) phosphite ester,
Reaction kettle is warming up to 50 DEG C by 0.1 part of TP-80 antioxidant and 0.2 part of UV-531 ultraviolet absorber, stirs 1h, and packing is obtained into
Product.
(3) glue in use, A combination be uniformly mixed with B component by weight 4:1, vacuum defoamation 5min, then by gluing
Agent is poured into product, and the high transparency epoxy resin of the resistance to UV gluing haveing excellent performance can be obtained after solidifying 6h under the conditions of 20 DEG C
Agent.
Embodiment 5:
A kind of high transparency epoxy resin adhesive of resistance to UV, is made of component A and B component；Component A includes epoxy resin ST-
5080,296 EP-4080E, ALBIFLEX, low viscosity epoxy resin CY-184, defoaming agent BYK-141, BYK-066N, levelling agent
TEGO Glide 450；B component includes amine curing agent Aradur 2958, D-230, curing agent accelerant A EP, modifying agent
Triethanolamine, antioxidant TP-10H and ultraviolet absorber UV-328.
It is specific the preparation method is as follows:
(1) preparation of A glue:
40 parts of EP-4080E, 10 parts of ALBIFLEX, 296,29 parts of CY-184 are sequentially added in a kettle, by reaction kettle liter
Then 20 parts of ST-5080 are added into reaction kettle, continues to stir 3h, is uniformly mixed material, then to 100 DEG C of stirring 2h for temperature
Material is cooled to 60 DEG C, 0.3 part of BYK-141 and 0.2 part of BYK-066N defoaming agent and 0.5 part of TEGO are put into reaction kettle
450 levelling agent of Glide continues to stir 40min, subsequent vacuum defoamation 20min, and packing obtains finished product；
(2) preparation of B glue:
The B component the preparation method is as follows: successively putting into 27.3 parts of Aradur, 2958,57 parts of D- into reaction kettle
230,10 parts of AEP curing agent promotors, 5 parts of triethanolamines, 0.2 part of TP-10H antioxidant and 0.5 part of UV-328 ultraviolet absorber,
Reaction kettle is warming up to 60 DEG C, stirs 2h, packing obtains finished product.
(3) glue in use, A combination be uniformly mixed with B component by weight 2:1, vacuum defoamation 10min, then by glue
Glutinous agent is poured into product, solidifies under the conditions of 50 DEG C and the high transparency epoxide-resin glue of resistance to UV haveing excellent performance can be obtained afterwards for 24 hours
Glutinous agent.
Comparative example 1:
Substantially the same manner as Example 1, difference is, the solid hydride bisphenol A epoxide resin in embodiment 1 is changed to general
Logical bisphenol A epoxide resin.
Embodiment 1 and the ingredient comparing result of comparative example 1 are as shown in table 1 below:
Table 1:
Comparative example 2:
Substantially the same manner as Example 1, difference is, the hydrogenated liquid bisphenol A epoxide resin in embodiment 1 is changed to general
Logical bisphenol A epoxide resin.
Embodiment 1 and the ingredient comparing result of comparative example 2 are as shown in table 2 below:
Table 2:
Comparative example 3:
Substantially the same manner as Example 1, difference is, the modifying epoxy resin by organosilicon in embodiment 1 is changed to commonly
Bisphenol A epoxide resin.
Embodiment 1 and the ingredient comparing result of comparative example 3 are as shown in table 3 below:
Table 3:
Performance test:
The following table 4 is 1-3 of the embodiment of the present invention and Commercial epoxy resins adhesive (Shenzhen Jing Hua Electron Material Co., Ltd
318) the performance test results.
Table 4:
As shown in Table 4:
The light transmittance of embodiment 1-3 epoxy resin adhesive provided by the invention 90% or more, belongs to high transparency material
Material, while uv-resistance can be all very good, is irradiated using the UV lamp of 300W, the product in embodiment 1-3 can be kept
The constant color of 3.5h or more, this illustrates that product provided by the invention has very excellent uv-resistance energy.
According to the test data of our company, outdoor natural light irradiation 1 is equivalent to using the energy of the UV lamp irradiation 1h of 300W
Year, outdoor natural light irradiation is equivalent to 4 years using the energy of the UV lamp irradiation 4h of 300W, thus three formulas provided by the invention
Product outdoors service life near or above 4 years.
It can also be seen that embodiment 1 is the preferable product of a comprehensive performance, the stretching of embodiment 2 from the result in table 4
Intensity highest illustrates that the product adhesive property of this formula is optimal, and the uv-resistance of embodiment 3 can reach 4.5h, show that this is matched
The product of side has more excellent uv-resistance energy, can require to choose tool according to the different of properties of product in practical applications
Have the product of different characteristics carry out using.
The performance in terms of tensile strength, hardness and water absorption rate is suitable with commercial product for the embodiment of the present invention 1, but in light transmission
Very big advantage is shown in terms of rate and uv-resistance, the light transmittance of embodiment 1 reaches 91.2%, belong to high light transmission material, and city
The light transmittance for selling product only has 86.7%；Embodiment 1 can just change colour at 3.5 hours, show after the irradiation of the UV lamp of 300W
Excellent uv-resistance energy, service life outdoors was close to 4 years, and 1.0 hours just under the same testing conditions for commercial product
It can change colour, service life outdoors is 1 year or so.
Comparison in this way it will be clear that adhesive provided by the invention in terms of light transmittance and uv-resistance energy
It is with the obvious advantage, it can satisfy the particular/special requirement of the high-end gluing agent material of city's field alignment, there is very extensive market potential, especially
It will fully develop talents in the resistance to UV adhesive field of high transparency.
The following table 5 is the performance test results of the embodiment of the present invention 1 and comparative example 1-3 epoxy resin adhesive.
Table 5:
From upper table 5:
(1) formula of embodiment 1 and comparative example 1 is close, only by the solid hydride bisphenol-A in embodiment 1 in comparative example 1
Epoxy resin ST-5080 is changed to common bisphenol A epoxide resin YD-128, and two different adhesive is solid at identical conditions
Change, the physical index of product has a certain difference.
From the results shown in Table 5, after ST-5080 being changed to YD-128, tensile strength, hardness and the water suction of product
Rate variation is little, and light transmittance and uv-resistance can decline more obviously, illustrate solid hydride bisphenol A epoxide resin to cured product
Light transmittance and uv-resistance can contribute larger, this raw material is irreplaceable in this recipe.
(2) formula of embodiment 1 and comparative example 2 is close, only by the hydrogenated liquid bisphenol-A in embodiment 1 in comparative example 2
Epoxy resin -4080E is changed to common bisphenol A epoxide resin YD-128, and two different adhesive is at identical conditions
Solidification, there is some difference for the physical index of product.
From the results shown in Table 5, after EP-4080E being changed to YD-128, product water absorption rate does not change, hardness
It increases, tensile strength, light transmittance and uv-resistance can have the light transmittance of a degree of decline, especially product and resistance to
UV declines more obvious, illustrates that hydrogenated liquid bisphenol A epoxide resin can contribute the light transmittance and uv-resistance of cured product
Larger, this raw material is irreplaceable in this recipe.
(3) formula of embodiment 1 and comparative example 3 is close, only by the organic silicon modified epoxy in embodiment 1 in comparative example 3
Oxygen Resin A LBIFLEX 296 is changed to common bisphenol A epoxide resin YD-128, and two different adhesive is in identical condition
Lower solidification, the physical index of product have a certain difference.
From the results shown in Table 5, after ALBIFLEX 296 being changed to YD-128, the stretching of the product of product is strong
Less, and the light transmittance of product and uv-resistance can have and decline to a certain degree for degree, hardness and water absorption rate variation, this illustrates that organosilicon changes
Property epoxy resin can be helpful to the translucency and uv-resistance of cured product, this raw material is irreplaceable in this recipe.
It is not difficult to find that solid hydride bisphenol-A epoxy used in the present invention from a series of comparative examples that the present invention provides
Resin, hydrogenated liquid bisphenol A epoxide resin and modifying epoxy resin by organosilicon are in the light transmittance and resistance to UV for improving cured product
Aspect of performance plays the role of conclusive, is an important innovations point in the present invention.By using these three epoxy resin,
It arranges in pairs or groups other raw material, a series of available epoxy resin adhesives with the resistance to UV characteristic of high transparency.
In conclusion by carrying out to raw material preferably, in conjunction with appropriate preparation process, it is resistance to that high transparency has been made in the present invention
UV epoxy resin adhesive, compared with presently commercially available product, adhesive provided by the invention has in terms of light transmittance and uv-resistance
It has a clear superiority, can satisfy demand of the market to such material, have a vast market foreground and develop sky in various fields
Between.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (10)
1. a kind of high transparency epoxy resin adhesive of resistance to UV, which is characterized in that the adhesive is made of component A and B component；
The component A includes the constituent of following parts by weight:
70-90.8 parts of A based epoxy resin, 9-29 parts of B based epoxy resin, 0.1-0.5 parts of defoaming agent, 0.1-0.5 parts of levelling agent；
Wherein, the A based epoxy resin is by solid hydride bisphenol A epoxide resin, hydrogenated liquid bisphenol A epoxide resin, organosilicon
Modified epoxy composition, wherein solid hydride bisphenol A epoxide resin specific gravity shared in A based epoxy resin is 15-25
Part, hydrogenated liquid bisphenol A epoxide resin specific gravity shared in A based epoxy resin is 55-75 parts, modifying epoxy resin by organosilicon
Shared specific gravity is 10-20 parts in A based epoxy resin；
The B based epoxy resin is low viscosity epoxy resin；
The B component includes the constituent of following parts by weight:
84-97.6 parts of amine curing agent, 1-10 parts of curing agent promotor, 1-5 parts of modifying agent, 0.2-0.5 parts of antioxidant, ultraviolet suction
Receive agent 0.2-0.5 parts.
2. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the solid hydride bisphenol-A
Epoxy resin is the hydrogenated bisphenol A epoxy resin that equivalent is 500-1000, is ST-5080 or ST-5100, hydrogenated liquid bisphenol-A
Epoxy resin is the hydrogenated bisphenol A epoxy resin that equivalent is 200-300, is any in EP-4080E, ST-3000, YX-8000
One kind, modifying epoxy resin by organosilicon are the epoxy resin that epoxide equivalent is 500-1000, are ALBIFLEX 296.
3. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the low viscosity epoxy resin
It is CY-184 or TTA184 for hexahydrophthalic acid bisglycidyl ester.
4. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the defoaming agent is DOW CORNING
163, TEGO Airex 962, TEGO Airex 932, any one or two kinds in BYK-141, BYK-A530, BYK-066N
Combination；The levelling agent is any one in BYK-333, BYK-310, TEGO Glide 450.
5. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the amine curing agent is rouge
Ring race amine curing agent, polyether amine curing agent, any one or more combination in aliphatic amine curing agent.
6. the high transparency epoxy resin adhesive of resistance to UV as claimed in claim 5, which is characterized in that the amine curing agent is
IPDA、NBDA、Aradur 3484、Aradur 2958、Aradur 3233、Ancamine 1618、EC301、ZD、8100、
Any one or more combination in T403, D-230, D-400.
7. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the curing agent promotor is
AEP, the modifying agent are triethanolamine or DMP-30.
8. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the antioxidant be three (2,
4- di-tert-butyl-phenyl) phosphite ester, any one or more combination in V-73P, TP-10H, TP-20, TP-80.
9. the high transparency epoxy resin adhesive of resistance to UV as described in claim 1, which is characterized in that the ultraviolet absorber is
Any one in UV-P, UV-531, UV-328, UV-1033,2- (2H- benzotriazole -2- base) -4,6- di-tert-pentyl phenol
Or multiple combinations.
10. a kind of preparation method of the high transparency epoxy resin adhesive of resistance to UV as claimed in any one of claims 1-9 wherein, special
Sign is, specific as follows:
(1) hydrogenated liquid bisphenol A epoxide resin, low viscosity epoxy resin and silicon-modified epoxy are sequentially added in a kettle
Reaction kettle is warming up to 80-100 DEG C of stirring 1-2h by resin, and solid hydride bisphenol A epoxide resin is then added into reaction kettle,
Continue to stir 2-3h, be uniformly mixed material, be then cooled to 40-60 DEG C, defoaming agent and levelling agent are put into reaction kettle, after
Continuous stirring 20-40min, subsequent vacuum defoamation 10-20min, packing obtain component A；
(2) amine curing agent, curing agent promotor, modifying agent, antioxidant and ultraviolet absorber are successively put into reaction kettle, it will
Reaction kettle is warming up to 50-60 DEG C, stirs 1-2h, and packing obtains B component；
(3) it combines A and is uniformly mixed with B component by weight 100:25-50, then vacuum defoamation 5-10min pours mixture
The high transparency epoxy resin adhesive of resistance to UV can be obtained after solidifying 6-24h under the conditions of 20 DEG C -50 DEG C in note.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910594211.5A CN110256990B (en) | 2019-07-03 | 2019-07-03 | High-transparency UV-resistant epoxy resin adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910594211.5A CN110256990B (en) | 2019-07-03 | 2019-07-03 | High-transparency UV-resistant epoxy resin adhesive and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110256990A true CN110256990A (en) | 2019-09-20 |
| CN110256990B CN110256990B (en) | 2021-07-06 |
Family
ID=67924132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910594211.5A Active CN110256990B (en) | 2019-07-03 | 2019-07-03 | High-transparency UV-resistant epoxy resin adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110256990B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002069269A (en) * | 2000-08-29 | 2002-03-08 | Dainippon Ink & Chem Inc | Ultraviolet-curable composition and optical disc |
| JP3339083B2 (en) * | 1992-10-27 | 2002-10-28 | 新日本理化株式会社 | Epoxy resin composition |
| CN1613911A (en) * | 2003-11-05 | 2005-05-11 | 长春人造树脂厂股份有限公司 | Epoxy composition for light semiconductor packing |
| CN103265923A (en) * | 2013-05-15 | 2013-08-28 | 陕西煤业化工技术研究院有限责任公司 | Epoxy resin composite for high-power LED (light-emitting diode) encapsulation and preparation method thereof |
| CN104479607A (en) * | 2014-12-31 | 2015-04-01 | 烟台泰盛精化科技有限公司 | Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature |
| CN105255418A (en) * | 2015-11-04 | 2016-01-20 | 无锡嘉联电子材料有限公司 | Preparation method of high-transparency flexible epoxy resin adhesive |
-
2019
- 2019-07-03 CN CN201910594211.5A patent/CN110256990B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3339083B2 (en) * | 1992-10-27 | 2002-10-28 | 新日本理化株式会社 | Epoxy resin composition |
| JP2002069269A (en) * | 2000-08-29 | 2002-03-08 | Dainippon Ink & Chem Inc | Ultraviolet-curable composition and optical disc |
| CN1613911A (en) * | 2003-11-05 | 2005-05-11 | 长春人造树脂厂股份有限公司 | Epoxy composition for light semiconductor packing |
| CN103265923A (en) * | 2013-05-15 | 2013-08-28 | 陕西煤业化工技术研究院有限责任公司 | Epoxy resin composite for high-power LED (light-emitting diode) encapsulation and preparation method thereof |
| CN104479607A (en) * | 2014-12-31 | 2015-04-01 | 烟台泰盛精化科技有限公司 | Low-stress transparent epoxy resin adhesive capable of curing fast at room temperature |
| CN105255418A (en) * | 2015-11-04 | 2016-01-20 | 无锡嘉联电子材料有限公司 | Preparation method of high-transparency flexible epoxy resin adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 李月锋等: "《LED热管理及散热技术应用》", 30 September 2018 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110256990B (en) | 2021-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105255418B (en) | A kind of preparation method of high transparency flexible-epoxy adhesive | |
| CN102850725B (en) | Epoxy potting material for microfiltration or ultrafiltration membrane filling and preparation method thereof | |
| CN102046690A (en) | Optical semiconductor sealing resin composition and optical semiconductor device using same | |
| CN103113812A (en) | POSS (Polyhedral oligomeric silsesquioxane)-based nano material modified polyester powder coating and preparation method thereof | |
| CN104403089A (en) | High-performance modified epoxy alicyclic amine curing agent and preparation method thereof | |
| CN101323772A (en) | Ultra-thin stone and aluminum honeycomb composite modified epoxy adhesive and preparation thereof | |
| CN103102759A (en) | Water-based glass paint containing modified diatomite and preparation method thereof | |
| CN104151530A (en) | Yellowing-resistance epoxy curing agent and preparation method thereof | |
| CN101585958B (en) | Composition and method for preparing artificial gem | |
| CN102816499B (en) | Quick-drying type environmental protection water epoxy floor paint and preparation method thereof | |
| CN108017937B (en) | Preparation method of silane modified polyether sealant calcium carbonate | |
| CN113527638B (en) | Epoxy curing agent and preparation method thereof, epoxy resin composition and application thereof | |
| CN110256990A (en) | A kind of high transparency epoxy resin adhesive of resistance to UV and preparation method thereof | |
| CN103045147B (en) | Cold-proof and damp-proof epoxy resin main agent for crystal glue drip and preparation method thereof | |
| CN103102766A (en) | High adhesive force water-based glass paint and preparation method thereof | |
| CN102875777B (en) | Novel epoxy hardener and preparation method thereof | |
| CN101230227A (en) | Viscosity-temperate epoxy thick paint | |
| CN106752362A (en) | A kind of waterborne glass ink and preparation method thereof | |
| CN102876199A (en) | Luminous epoxy paint and preparation method thereof | |
| CN114479739A (en) | Epoxy resin adhesive and application thereof in disposable production of transparent product | |
| CN110951451A (en) | Packaging adhesive for LED and preparation method thereof | |
| CN116083023A (en) | Epoxy resin-based adhesive for repairing ceramic cultural relics, preparation method and application | |
| CN109647197A (en) | A kind of casting formula of the component of hollow fiber nanofiltration membrane at room temperature | |
| CN110951298B (en) | Double-component epoxy matte seam beautifying agent | |
| CN108530608A (en) | A kind of Water-soluble methyl acrylic modified epoxy resin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |