CN104403277B - A kind of preparation method of LED encapsulation high-performance epoxy resin composition - Google Patents
A kind of preparation method of LED encapsulation high-performance epoxy resin composition Download PDFInfo
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Abstract
The invention discloses a kind of preparation method of LED encapsulation high-performance epoxy resin composition, this method include raw material prepare, in proportion mixing, vacuum defoamation, cure these steps；Wherein raw material prepares epoxy resin composition and is made of component A and B component, and component A includes the epoxy resin composition being made of cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol A epoxide resin, polyurethane modified epoxy resin, antifoaming agent, complementary color agent；B component includes curing agent mixture, modifying agent, antioxidant, ultraviolet absorber, light stabilizer, accelerating agent, the releasing agent being made of methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride.Advantage is：Improve the brittleness of epoxy resin, reduce the internal stress of material, while improve the resistance to low temperature of finished product；Increase ageing-resistant performance, color inhibition and the UV resistance of LED product.
Description
Technical field
The present invention relates to high-performance epoxy resin composition preparation method fields more particularly to a kind of LED to encapsulate high property
The preparation method of energy composition epoxy resin.
Background technology
LED is a kind of solid-state semiconductor device that can convert electrical energy into luminous energy, have it is energy-efficient, service life is long,
The features such as environmentally friendly, beautiful in colour, is widely used in landscape and decorative lighting, display backlight source, lamps for vehicle, traffic and extra large land
The fields such as signal lamp and the illumination of various particular job, play increasingly important role in national economy.
Material currently used for LED encapsulation mainly has two kinds of epoxy resin and an organic silica gel, both materials all have compared with
High transmittancy and longer service life.In contrast, organic silica gel weatherability is more preferable than epoxy resin, uvioresistant is old
The shortcomings of change ability is stronger, but there are preparation process complexity, at high price, poor mechanical property；Epoxy resin is as traditional envelope
Package material, mechanical property and adhesive property are excellent, less expensive, but there are stress in finished product is bigger than normal, resistant of high or low temperature
Can be poor, and the shortcomings that easy aging, thus in practical application encapsulating material, i.e. epoxy resin are selected generally according to requirement
It is chiefly used in that power is smaller, in the larger LED component of yield, and organic silica gel is chiefly used in and uvioresistant heat-resisting to material requirement higher
High power device on.
To improve various drawbacks intrinsic in epoxy resin encapsulating material, domestic and foreign scholars have carried out various trials,
Such as by introducing cycloaliphatic epoxy resin, addition ultraviolet absorber, antioxidant means, package material can be improved to a certain extent
The resistance to ag(e)ing of material, but in terms of reducing the stress of epoxide resin material and improving the high and low temperature resistance of epoxy resin, progress
Slowly.
The way for reducing the stress routine of epoxide resin material is to carry out toughening to epoxy resin, i.e., adds into epoxy systems
Add such as nbr carboxyl terminal（CTBN）, organic silicon rubber etc. as toughener, due to the light transmittance of LED material requirements finished products
Height, limits application of the deeper material of the colors such as CTBN in this system, and the phase of organosilicon material and epoxy-resin systems
Capacitive is poor, can only improve the performance of epoxy systems more by a small margin.Other kinds of toughening material more or less all exists and ring
The problems such as epoxy resin system compatibility is bad, reactivity is relatively low, it is difficult to reach ideal toughening effect, in the led less quilt
It uses.
The high and low temperature resistance for improving epoxide resin material need in itself be screened from resin material.To improve epoxy resin
Heat-resisting quantity, usually increase the ratio of low epoxide equivalent, multiple functionality epoxide resin, but this can make the crosslink density of finished product
Increase, stress bigger, so as to influence the performance of material；To improve the resistance to low temperature of epoxy resin, usually in system
Middle add in has flexible modified resin, and such modified resin usually has backbone, is reacted in epoxy resin structural
The resistance to low temperature of material can be improved afterwards, but the glass transition temperature of material can be also greatly reduced in this, so as to limit finished product
Application.
Therefore how the raw material used in LED epoxy resin encapsulating materials are carried out with appropriate selection and reduces epoxy
The high and low temperature resistance of stress, balance finished product in resin, is technical barrier urgently to be resolved hurrily.
Invention content
The technical problem to be solved in the present invention is to provide a kind of preparation sides of LED encapsulation high-performance epoxy resin composition
Method, to overcome the shortcomings of to mention in above-mentioned background technology.
To achieve the above object, the invention is realized by the following technical scheme：
A kind of preparation method of LED encapsulation high-performance epoxy resin composition, includes the following steps：
（1）It is prepared by raw material：Composition epoxy resin is made of component A and B component, and wherein component A includes 99.3-99.85%
The epoxy being made of cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, bisphenol A epoxide resin, polyurethane modified epoxy resin
Resin compound, the complementary color agent of the antifoaming agent and 0.05-0.2% of 0.1-0.5%；B component includes 90-97.45% by methyl hexahydro
The curing agent mixture of phthalic anhydride and hexahydrophthalic anhydride composition, the modifying agent of 1-5.5%, the antioxidant of 0.2-0.5%, 0.2-0.5% purple
Outer absorbent, the light stabilizer of 0.1-0.3%, 1-3% accelerating agent, the releasing agent of 0.05-0.2%；
（2）It mixes in proportion：Component A is with B component by weight 100/（90-150) it is uniformly mixed；
（3）Vacuum defoamation：Vacuum defoamation 10-30 minutes at 50-60 DEG C；
（4）Curing：After machine is cast in device, curing is carried out under the conditions of 120 DEG C -150 DEG C and is prepared.
Particularly, the cycloaliphatic epoxy resin in the component A is 4 vinyl epoxy cyclohexane, 3,4- epoxycyclohexyls
Methyl methacrylate, 3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyls carbonic ester, 3- epoxy ethyl -7- oxabicyclos
[4,1,0] heptane, bis- (7- oxabicyclos [4,1,0] 3- methyl in heptan adipate esters), dicyclopentadiene di-epoxy compounds, hexahydro
The mixture of one or more of phthalic acid bisglycidyl ester；
Hydrogenated bisphenol A epoxy resin in the component A is the epoxy resin that epoxide equivalent is 180-500；
Bisphenol A epoxide resin in the component A is the epoxy resin that epoxide equivalent is 180-220；
The specific preparation method of polyurethane modified epoxy resin in the component A is as follows：
First step polyalcohol and isocyanates are Material synthesis terminal isocyanate group performed polymer；
Second step terminal isocyanate group performed polymer reacts generation polyurethane with the secondary hydroxyl in excessive epoxy resin and changes
Property epoxy resin.
Particularly, the polyalcohol used in the polyurethane modified epoxy resin for PPG330N, PPG1000, PPG2000,
The mixture of one or more of PPG3000 polyether polyol or CMA-1270, CMA-2270, MX-2325 polyester polyol；
Isocyanates is MDI (4,4 '-methyl diphenylene diisocyanate), TDI (2,4 toluene diisocyanate), HDI
（Hexamethylene diisocyanate）, IPDI (isophorone diisocyanate) or H12One kind in MDI (hydrogenation MDI).
Particularly, the antifoaming agent in the component A is BYK-A530, BYK-141, BYK-065, BYK-066N, TEGO
One or more of Airex 900, TEGO Airex 962, TEGO Airex 932, DOW CORNING 100F, DOW CORNING 163
Mixture.
Particularly, the complementary color agent in the component A is with cobalt violet, permanent violet, phthalocyanine blue, ultramarine, solvent blue these purples
Or blue pigment（Dyestuff) with epoxy resin be the pre-dispersed mixture formed of raw material.
Particularly, mixture of the curing agent mixture for methyl hexahydrophthalic anhydride and hexahydrophthalic anhydride in the B component, wherein,
The weight accounting of methyl hexahydrophthalic anhydride is 70-99%, and the weight accounting of hexahydrophthalic anhydride is 1-30%.
Particularly, the modifying agent in the B component be ethylene glycol, it is 1,4-butanediol, diethylene glycol, 1,6- hexylene glycols, new
One kind in pentanediol, glycerine, trimethylolpropane.
Particularly, the antioxidant in the B component is phosphorous acid esters, is had double（3,5- di-tert-butyl-phenyls）Pentaerythrite
Diphosphites（Antioxidant 626）, three (2,4- di-tert-butyl-phenyls) phosphite esters, CGA12, phosphite antioxidant TP-10,
TP-10H, 317,517, polymerism phosphite antioxidant TP-20, the multiple functional radical phosphorous acid containing be obstructed phenolic group and macromolecular base
The mixture of one or more of ester antioxidant TP-80.
Particularly, the light stabilizer in the B component be hindered amines, have succinic acid with（4- hydroxyl -2,2,6,6- tetramethyls
The polymer of base -1- piperidine alcohols）（Light stabilizer 622）, it is double（2,2,6,6- tetramethyl -4- piperidyls）Sebacate（Light is steady
Determine agent 770）, bis- (hydroxybenzyl phosphate of 3,5-di-t-butyl-4 mono ethyl ester) nickel（Light stabilizer 802）, methacrylic acid（1,
2,2,6,6- pentamethvl alcohol）Ester（Light stabilizer 582L）, it is double（1,2,2,6,6- pentamethvl alcohol）-α-（Bis- uncles of 3,5-
Butyl -4- hydroxy phenyl methylene-α '-butyl-malonate）（Light stabilizer 5144）One or more of mixture.
Particularly, 4-phenyl phosphonium bromide may be selected in the accelerating agent in the B component（Ammonium）, triphenyl ethyl phosphonium chloride
（Ammonium）, tri-phenyl-ethyl phosphonium bromide（Ammonium）, triphenylbut base phosphonium bromide（Ammonium）, Si butyl phosphonium bromides（Ammonium）, benzyltriphenyl phosphonium bromine
Hua Phosphonium（Ammonium）, hexadecyl tributyl phosphonium bromide（Ammonium）, methoxyl methyl triphenyl phosphonium chloride（Ammonium）, the tetrabutyl-o, o- diethyl
One kind in Er Liu Dai Lin Suan Phosphonium, DBU salt.
Particularly, the ultraviolet absorber in the B component is benzophenone or benzotriazole, there is 2- hydroxyl -4- first
Oxygroup benzophenone（UV-9）, 2- hydroxyl -4- octyloxybenzophenones（UV-531）、2-（The aminomethyl phenyl of 2 '-hydroxyl -5 '）Benzo
Triazole（UV-P）、2-（2 ' the t-octyl phenyl of hydroxyl -5 '）Benzotriazole（UV-329）, 2-PHENYLBENZIMIDAZOLE-5-SULFONIC ACID（UV-
T）、2-（2 '-hydroxyl -3 ', 5 '-di-tert-butyl-phenyl）- 5- chlorinated benzotriazoles（UV-327）、2-（2H- benzotriazole -2-
Base）- 4,6- di-tert-pentyl phenols（UV-328）, 2-cyano -3,3-diphenyl ethyl acrylate（UV-335）、N-（2- ethyoxyls
Phenyl）-N’-（4- ethylphenyls）Oxalamide（UV-1033）One or more of mixture.
Particularly, the releasing agent used in the B component for silicone oil, fluorine containing silicone oil, organosilicon polymer TM-001 or
QV5110, tricaprylate or commercially available other releasing agents etc. reduce the material of surface tension.
The preparation method of LED encapsulation high-performance epoxy resin composition of the present invention has the beneficial effect that：Pass through
Reasonable screening to raw material, on the basis of conventional LED package Properties of Epoxy Resin is kept, due to adding in formula system
Polyurethane modified epoxy resin, can improve the brittleness of epoxy resin, reduce the internal stress of material, carry simultaneously to a certain extent
The resistance to low temperature of high finished product；The use of cycloaliphatic epoxy resin and hydrogenated bisphenol A epoxy resin improves the vitrifying of product
Transition temperature, increases the ageing-resistant performance of LED product, and the addition of antioxidant, ultraviolet absorber and light stabilizer further increases
The strong color inhibition and UV resistance of LED product；By experimental verification, the physical index of product is better than commercial like product,
The excellent combination property of product can meet particular/special requirement of the market to epoxy encapsulation LED product, have to a certain extent
Vast market prospect.
Specific embodiment
The specific technical solution of the present invention described further below, in order to which those skilled in the art is further understood that
The present invention, without forming the limitation to its right.Particularly, to polyurethane modified epoxy resin raw material in three embodiments its
A, B, C are respectively labeled as behind title, to show difference.
Embodiment one
In being prepared to epoxy resin composition raw material, the preparation method of polyurethane modified epoxy resin A is as follows：
1. the PPG1000 polyether polyol of 200g is added in reaction kettle, in less than 100-110 DEG C, -0.95MPa item
It is dehydrated under part 2-3 hours and is less than 0.05% to moisture, be then cooled to 70-100 DEG C, the TDI of 69.6g is put into reaction kettle, instead
After answering 2-3 hours, terminal isocyanate group performed polymer is obtained.
2. the E-44 epoxy resin of 375.6.0g is dehydrated 2-3 hours extremely under 100-110 DEG C, -0.95MPa the following conditions
Moisture is less than 0.05%, is then cooled to 70-90 DEG C, adds in the isocyanate terminated performed polymer of 200g under nitrogen protection, reacts 2-
After 3 hours, the catalyst dibutyltin dilaurylate of 3.7g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin A.
Experimental formula is as follows：
Under conditions of fixed cycloaliphatic epoxy resin and hydrogenated bisphenol A epoxy resin mass percent, polyurethane is adjusted
The formula 1 and the data of formula 2 that the ratio of modified epoxy A and E-51, i.e. upper table provide, proceed as follows.
A is combined to be uniformly mixed with B component by weight 100/110, vacuum defoamation 15 minutes at 50-60 DEG C, through machine
After being cast in device, cured under the conditions of 130 DEG C/6h, the performance indicator of product is as follows after curing.
Upper table lists commercial product, 1 product of formula and the technical indicator for being formulated 2 products, as can be seen from the table, formula
1 and formula 2 products refraction index, light transmittance, glass transition temperature（Tg）It is high than commercial product with hardness number, this master
If because having used a certain amount of cycloaliphatic epoxy resin in formula, the crosslink density of solidfied material is improved, can integrally be enhanced
The performance of product.In addition shear strength, impact strength, elongation at break and the high/low temperature alternation index of formula 2 and commercially available production
Condition is worked as, although better than commercial product in terms of overall performance, in terms of toughness there are still it is certain the defects of.But 1 production of formula
The These parameters of product greatly improve, and increase rate reaches more than 40%, and product is surveyed in more harsh high/low temperature alternation
Examination（-30℃/125℃）Dead lamp rate after 200 cycles has nearly 5% raising than commercial product.
After this explanation adds in polyurethane modified epoxy resin A in formula system, the toughness of product improves apparent, Ke Yi
On the basis of keeping the original performance of LED product, some drawbacks present in LED product are overcome, the comprehensive performance of product is carried
It rises, while the application field of LED product can be expanded, meet particular/special requirement of the market to LED product to a certain extent.
Embodiment two
In being prepared to epoxy resin composition raw material, the preparation method of polyurethane modified epoxy resin B is as follows：
1. the PPG3000 polyether polyol of the PPG1000 of a certain amount of 100g and 50g is added in reaction kettle, in
It 100-110 DEG C, is dehydrated under -0.95MPa the following conditions 2-3 hours and is less than 0.05% to moisture, be then cooled to 70-100 DEG C, to
The IPDI of 51.8g is put into reaction kettle, after reacting 2-3 hours, obtains terminal isocyanate group performed polymer.
2. the E-51 epoxy resin of 422.8g is dehydrated 2-3 hours to water under 100-110 DEG C, -0.95MPa the following conditions
Divide and be less than 0.05%, be then cooled to 70-90 DEG C, add in the isocyanate terminated performed polymer of 160g under nitrogen protection, react 2-3
After hour, the catalyst dibutyltin dilaurylate of 4.2g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin B.
Experimental formula is as follows：
A is combined to be uniformly mixed with B component by weight 100/130, vacuum defoamation 20 minutes at 50-60 DEG C, through machine
After being cast in device, cure under the conditions of 130 DEG C/1h+150 DEG C/5h, the performance indicator of product is as follows after curing.
Above-mentioned formula is the LED encapsulating products of a high Tg, and the Tg of this product is 162.3 DEG C as can be seen from the above table, far
Higher than commercial product（130℃-135℃）.For LED product, the Tg of product is higher, and the weatherability of LED light is stronger, identical
Under the conditions of product temperature tolerance and uv-resistance it is more prominent, so as to longer service life；In addition high-grade LED product into
Product examine usually all needs to carry out Lead free wave sodering detection process during surveying, i.e., to LED product under conditions of higher than 260-270 DEG C
Lead free wave sodering flow processing is carried out, product relatively low Tg can be because instantaneous high-temperature causes LED product that shape occurs in this process
Become, the spun gold in LED product is broken, cause the generation of the dead lamp phenomenon of significant proportion LED product, and Tg is higher than 150 DEG C of LED
Product can be largely avoided the appearance of this phenomenon.
Although can also be seen that the Tg higher of such product from upper table data, the shear strength of product, impact strength and
Elongation at break can be controlled in ideal range, while product is in high/low temperature due to adding modified epoxy B
Alternation is tested（-30℃/125℃）Dead lamp rate after 200 cycles is 6.3%, is illustrated after adding in modified epoxy B in system
The toughness of such product is preferable, can be applied to as a specialities high to Tg requirements while toughness reguirements is preferably led
Domain, such as outdoor display screen, great power LED.
Embodiment three
In being prepared to epoxy resin composition raw material, the preparation method of polyurethane modified epoxy resin C is as follows：
1. the CMA-2270 polyester polyol of 150g is added in reaction kettle, in less than 100-110 DEG C, -0.95MPa item
It is dehydrated under part 2-3 hours and is less than 0.05% to moisture, be then cooled to 70-100 DEG C, the HDI of 25.2g is put into reaction kettle, instead
After answering 2-3 hours, terminal isocyanate group performed polymer is obtained.
2. the E-44 epoxy resin of 173.5g is dehydrated 2-3 hours to water under 100-110 DEG C, -0.95MPa the following conditions
Divide and be less than 0.05%, be then cooled to 70-90 DEG C, add in the isocyanate terminated performed polymer of 160g under nitrogen protection, react 2-3
After hour, the catalyst dibutyltin dilaurylate of 1.7g is put into, the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin C.
Experimental formula is as follows：
A is combined to be uniformly mixed with B component by weight 100/120, vacuum defoamation 15 minutes at 50-60 DEG C, through machine
After being cast in device, cure under the conditions of 130 DEG C/1h+150 DEG C/5h, the performance indicator of product is as follows after curing.
There are resistance to ag(e)ing is poor, stress is larger, high and low temperature resistance is poor in finished product etc. as LED Embedding Materials for epoxy resin
Shortcoming limits its use in high-end LED embeddings in actual use.By adding in alicyclic epoxy in above-mentioned formula
Resin, hydrogenated bisphenol A epoxy resin and ultraviolet absorber and antioxidant etc. can improve the resistance to ag(e)ing of encapsulating material, lead to
Introducing polyurethane modified epoxy resin is crossed, shear strength, impact strength caused by stress is larger in encapsulating material can be improved
And elongation at break it is relatively low the problem of, while enhance the high/low temperature alternation performance of LED finished products.
As can be seen from the above table, by adjusting formula, the Tg of product reaches 153.5 DEG C, can meet high-grade LED product pair
The requirement of Tg, while the shear strength, impact strength and elongation at break index that characterize LED product toughness are higher, explanation
This matches the stress that can be substantially reduced in LED product, while product is tested in high/low temperature alternation（-30℃/125℃）200 follow
Dead lamp rate after ring is only 4.9%, far below commercial product（10% ratio）, thus the product is that a comprehensive performance is superior,
The encapsulating products that can be used in high-grade LED.
Claims (1)
1. a kind of preparation method of LED encapsulation high-performance epoxy resin composition, it is characterised in that include the following steps：
(1) the CMA-2270 polyester polyol of 150g is added in reaction kettle, in 100-110 DEG C, -0.95MPa the following conditions
Lower dehydration is less than 0.05% in 2-3 hours to moisture, is then cooled to 70-100 DEG C, the HDI of 25.2g is put into reaction kettle, instead
After answering 2-3 hours, terminal isocyanate group performed polymer is obtained；
(2) the E-44 epoxy resin of 173.5g is dehydrated 2-3 hours to moisture under 100-110 DEG C, -0.95MPa the following conditions
Less than 0.05%, 70-90 DEG C is then cooled to, adds in the isocyanate terminated performed polymer of 160g under nitrogen protection, reaction 2-3 is small
Shi Hou puts into the catalyst dibutyltin dilaurylate of 1.7g, and the reaction was continued 0.5-1.0 hours, you can obtains predetermined structure
Polyurethane modified epoxy resin；
(3) according to following masses percentage collocation raw material：
Component A：49.54% cycloaliphatic epoxy resin ERL4221,15% hydrogenated bisphenol A epoxy resin ST-3000,15%
Bisphenol A epoxide resin E-51,20% polyurethane modified epoxy resin composition epoxy resin composition；0.06% complementary color
Agent, the defoaming agent composition of the compositions of TEGO Airex 932 of 0.3% BYK-141 and 0.1%；The sum of dosage of more than raw material
For absolutely；
B component：The curing agent mixture of 87.5% methyl hexahydrophthalic anhydride and 6.0% hexahydrophthalic anhydride composition, 1.6% promotion
Agent DBU salt, 4.0% modifying agent trimethylolpropane, 0.3% antioxidant 626；0.3% ultraviolet absorber UV-328；
0.15% light stabilizer 770,0.15% releasing agent TM-001；The sum of dosage of more than raw material is absolutely；
(4) A combinations are uniformly mixed with B component by weight 100/120, and vacuum defoamation 15 minutes, are poured through machine at 50-60 DEG C
It notes after device, cures under the conditions of 130 DEG C/1h+150 DEG C/5h.
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| CN113549300A (en) * | 2021-08-20 | 2021-10-26 | 广东四会互感器厂有限公司 | Epoxy resin composition, preparation method and application thereof |
| CN113999492A (en) * | 2021-11-22 | 2022-02-01 | 无锡嘉联电子材料有限公司 | UV-resistant aging-resistant high-performance LED epoxy resin composition and preparation method thereof |
| CN114621716A (en) * | 2022-03-17 | 2022-06-14 | 上海富铭密封材料有限公司 | Outdoor epoxy resin composition and preparation method thereof |
| CN116769278A (en) * | 2023-05-30 | 2023-09-19 | 江苏恒隆通新材料科技有限公司 | Medium-temperature cured flexible epoxy laminated resin |
| CN118185240B (en) * | 2024-05-20 | 2024-08-16 | 东方飞源(山东)电子材料有限公司 | Low-chroma epoxy resin composition and preparation method thereof |
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