CN107974047A - A kind of formula of LED encapsulation material - Google Patents
A kind of formula of LED encapsulation material Download PDFInfo
- Publication number
- CN107974047A CN107974047A CN201711376109.5A CN201711376109A CN107974047A CN 107974047 A CN107974047 A CN 107974047A CN 201711376109 A CN201711376109 A CN 201711376109A CN 107974047 A CN107974047 A CN 107974047A
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- China
- Prior art keywords
- parts
- antioxidant
- formula
- led encapsulation
- encapsulation material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 24
- 239000000463 material Substances 0.000 title claims abstract description 24
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 35
- 239000003822 epoxy resin Substances 0.000 claims abstract description 20
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 20
- 239000004611 light stabiliser Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 12
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 12
- 239000013530 defoamer Substances 0.000 claims abstract description 12
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 239000012745 toughening agent Substances 0.000 claims abstract description 9
- IYAZLDLPUNDVAG-UHFFFAOYSA-N 2-(benzotriazol-2-yl)-4-(2,4,4-trimethylpentan-2-yl)phenol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 IYAZLDLPUNDVAG-UHFFFAOYSA-N 0.000 claims description 3
- RYAIMSPHUVXLQI-UHFFFAOYSA-N 4-(aminomethyl)-2-(benzotriazol-2-yl)phenol Chemical compound NCC1=CC=C(O)C(N2N=C3C=CC=CC3=N2)=C1 RYAIMSPHUVXLQI-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000010426 asphalt Substances 0.000 claims 3
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 claims 1
- 150000002576 ketones Chemical class 0.000 claims 1
- 230000032683 aging Effects 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 3
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/132—Phenols containing keto groups, e.g. benzophenones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of formula of LED encapsulation material, is according to mass parts composition：50~150 parts of epoxy resin, 20~50 parts of silica gel, 50~150 parts of curing agent, 5~15 parts of light stabilizer, 0.5~2 part of toughener, 1~2 part of accelerating agent, 2~3 parts of antioxidant MB, 0.05~2 part of antioxidant, 0.05~2 part of defoamer.LED encapsulation material in the present invention has excellent sealing performance, while also has preferable chemical stability, and is not susceptible to aging, so as to substantially increase the reliability of encapsulation.
Description
Technical field
The present invention relates to field of material technology, more particularly to a kind of formula of LED encapsulation material.
Background technology
In the prior art, common light emitting diode encapsulation is mainly bisphenol A-type transparent epoxy resin with material, but with white
The development of light LED, is based especially on the development of the white light LEDs of ultraviolet, it is necessary to which outer envelope material is keeping visible region high
There can be higher absorptivity while transparent to ultraviolet, to prevent the leakage of ultraviolet；Encapsulating material is required to have at the same time
There is the ability of stronger ultraviolet-resistant aging.Above-mentioned bisphenol A-type transparent epoxy resin is obviously difficult to meet these requirements, therefore,
How LED encapsulation performance is improved as one of current research hotspot.
For this reason, it is necessary in view of the above-mentioned problems, proposing a kind of formula of LED encapsulation material, it can solve the prior art
Present in problem.
The content of the invention
It is an object of the invention to provide a kind of formula of LED encapsulation material, to overcome deficiency of the prior art.
To achieve the above object, the present invention provides following technical solution：
A kind of formula of LED encapsulation material, is according to mass parts composition：50~150 parts of epoxy resin, silica gel 20~50
Part, 50~150 parts of curing agent, 5~15 parts of light stabilizer, 0.5~2 part of toughener, 1~2 part of accelerating agent, antioxidant MB 2~3
Part, 0.05~2 part of antioxidant, 0.05~2 part of defoamer.
Preferably, it is according to mass parts composition：75~150 parts of epoxy resin, 25~50 parts of silica gel, curing agent 75~150
Part, 7.5~15 parts of light stabilizer, 0.75~2 part of toughener, 1.25~2 parts of accelerating agent, 2.25~3 parts of antioxidant MB, antioxygen
0.75~2 part of agent, 0.75~2 part of defoamer.
Preferably, it is according to mass parts composition：100~150 parts of epoxy resin, 35~50 parts of silica gel, curing agent 100~
150 parts, 10~15 parts of light stabilizer, 1.25~2 parts of toughener, 1.75~2 parts of accelerating agent, 2.5~3 parts of antioxidant MB, antioxygen
1.5~2 parts of agent, 1.5~2 parts of defoamer.
Preferably, the epoxy resin is EP-400A.
Preferably, the curing agent is EP-400B.
Preferably, the mass ratio of the epoxy resin and the curing agent is 1:1.
Preferably, the light stabilizer be selected from 2- (2 '-hydroxyl -5 '-aminomethyl phenyl) benzotriazole, 2- (2 '-hydroxyl -5 ' -
T-octyl phenyl) benzotriazole, one kind in 2,4 dihydroxyl benzophenone.
Compared with prior art, the advantage of the invention is that：LED encapsulation material in the present invention has excellent leakproofness
Can, while also there is preferable chemical stability, and aging is not susceptible to, so as to substantially increase the reliability of encapsulation.
Embodiment
The present invention is described further by the following example：According to following embodiments, the present invention may be better understood.
However, as it will be easily appreciated by one skilled in the art that embodiment described specific material ratio, process conditions and its result are only used
In the explanation present invention, without the present invention described in detail in claims should will not be limited.
The present invention discloses a kind of formula of LED encapsulation material, is according to mass parts composition：50~150 parts of epoxy resin, silicon
20~50 parts of glue, 50~150 parts of curing agent, 5~15 parts of light stabilizer, 0.5~2 part of toughener, 1~2 part of accelerating agent, antioxidant
2~3 parts of MB, 0.05~2 part of antioxidant, 0.05~2 part of defoamer.
Wherein, the epoxy resin is EP-400A, and the curing agent is EP-400B, and, the epoxy resin with it is described
The mass ratio of curing agent is 1:1；The light stabilizer be selected from 2- (2 '-hydroxyl -5 '-aminomethyl phenyl) benzotriazole, 2- (2 ' -
Hydroxyl -5 '-t-octyl phenyl) benzotriazole, one kind in 2,4 dihydroxyl benzophenone.
The formula of following LED encapsulation materials illustrated with specifically embodiment in the present invention.
Embodiment 1
It is according to mass parts composition：50 parts of epoxy resin, 20 parts of silica gel, 50 parts of curing agent, 5 parts of light stabilizer, toughener
0.5 part, 1 part of accelerating agent, 2 parts of antioxidant MB, 0.05 part of antioxidant, 0.05 part of defoamer.
Embodiment 2
It is according to mass parts composition：75 parts of epoxy resin, 25 parts of silica gel, 75 parts of curing agent, 7.5 parts of light stabilizer, toughness reinforcing
0.75 part of agent, 1.25 parts of accelerating agent, 2.25 parts of antioxidant MB, 0.75 part of antioxidant, 0.75 part of defoamer.
Embodiment 3
It is according to mass parts composition：100 parts of epoxy resin, 35 parts of silica gel, 100 parts of curing agent, 10 parts of light stabilizer, toughness reinforcing
1.25 parts of agent, 1.75 parts of accelerating agent, 2.5 parts of antioxidant MB, 1.5 parts of antioxidant, 1.5 parts of defoamer.
Embodiment 4
It is according to mass parts composition：150 parts of epoxy resin, 50 parts of silica gel, 150 parts of curing agent, 15 parts of light stabilizer, toughness reinforcing
2 parts of agent, 2 parts of accelerating agent, 3 parts of antioxidant MB, 2 parts of antioxidant, 2 parts of defoamer.
LED encapsulation material in the present invention has excellent sealing performance, while also has preferable chemical stability, and
Aging is not susceptible to, so as to substantially increase the reliability of encapsulation.
Finally, it is to be noted that, term " comprising ", "comprising" or its any other variant be intended to it is non-exclusive
Property includes, so that process, method, article or equipment including a series of elements not only include those key elements, but also
Further include other elements that are not explicitly listed, or further include for this process, method, article or equipment it is intrinsic
Key element.
Claims (7)
1. a kind of formula of LED encapsulation material, it is characterised in that be according to mass parts composition：50~150 parts of epoxy resin, silicon
20~50 parts of glue, 50~150 parts of curing agent, 5~15 parts of light stabilizer, 0.5~2 part of toughener, 1~2 part of accelerating agent, antioxidant
2~3 parts of MB, 0.05~2 part of antioxidant, 0.05~2 part of defoamer.
2. the formula of LED encapsulation material according to claim 1, it is characterised in that be according to mass parts composition：Asphalt mixtures modified by epoxy resin
75~150 parts of fat, 25~50 parts of silica gel, 75~150 parts of curing agent, 7.5~15 parts of light stabilizer, 0.75~2 part of toughener, promotees
Into 1.25~2 parts of agent, 2.25~3 parts of antioxidant MB, 0.75~2 part of antioxidant, 0.75~2 part of defoamer.
3. the formula of LED encapsulation material according to claim 2, it is characterised in that be according to mass parts composition：Asphalt mixtures modified by epoxy resin
100~150 parts of fat, 35~50 parts of silica gel, 100~150 parts of curing agent, 10~15 parts of light stabilizer, 1.25~2 parts of toughener,
1.75~2 parts of accelerating agent, 2.5~3 parts of antioxidant MB, 1.5~2 parts of antioxidant, 1.5~2 parts of defoamer.
4. the formula of LED encapsulation material according to claim 1, it is characterised in that the epoxy resin is EP-400A.
5. the formula of LED encapsulation material according to claim 1, it is characterised in that the curing agent is EP-400B.
6. the formula of LED encapsulation material as claimed in any of claims 1 to 5, it is characterised in that the asphalt mixtures modified by epoxy resin
The mass ratio of fat and the curing agent is 1:1.
7. the formula of LED encapsulation material according to claim 1, it is characterised in that the light stabilizer be selected from 2- (2 '-
Hydroxyl -5 '-aminomethyl phenyl) benzotriazole, 2- (2 '-hydroxyl -5 '-t-octyl phenyl) benzotriazole, 2,4- dihydroxy hexichol first
One kind in ketone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376109.5A CN107974047A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of LED encapsulation material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711376109.5A CN107974047A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of LED encapsulation material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107974047A true CN107974047A (en) | 2018-05-01 |
Family
ID=62007049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711376109.5A Withdrawn CN107974047A (en) | 2017-12-19 | 2017-12-19 | A kind of formula of LED encapsulation material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107974047A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963053A (en) * | 2018-05-11 | 2018-12-07 | 苏州沃尚光电科技有限公司 | A kind of high light efficiency LED lamp bead and preparation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103289317A (en) * | 2013-01-29 | 2013-09-11 | 中科院广州化学有限公司 | LED packaging material, its preparation method and application |
| CN104403277A (en) * | 2014-12-25 | 2015-03-11 | 无锡嘉联电子材料有限公司 | Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging |
| CN106084782A (en) * | 2016-06-16 | 2016-11-09 | 刘操 | A kind of high transparency for LED encapsulation, high rigidity, aging resistance silica gel material and preparation method thereof |
| CN107245222A (en) * | 2017-06-06 | 2017-10-13 | 明光市泰丰新材料有限公司 | A kind of LED encapsulation material and preparation method thereof |
-
2017
- 2017-12-19 CN CN201711376109.5A patent/CN107974047A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103289317A (en) * | 2013-01-29 | 2013-09-11 | 中科院广州化学有限公司 | LED packaging material, its preparation method and application |
| CN104403277A (en) * | 2014-12-25 | 2015-03-11 | 无锡嘉联电子材料有限公司 | Preparation method of high-performance epoxy resin composition for LED (light-emitting diode) packaging |
| CN106084782A (en) * | 2016-06-16 | 2016-11-09 | 刘操 | A kind of high transparency for LED encapsulation, high rigidity, aging resistance silica gel material and preparation method thereof |
| CN107245222A (en) * | 2017-06-06 | 2017-10-13 | 明光市泰丰新材料有限公司 | A kind of LED encapsulation material and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108963053A (en) * | 2018-05-11 | 2018-12-07 | 苏州沃尚光电科技有限公司 | A kind of high light efficiency LED lamp bead and preparation method |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180501 |
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| WW01 | Invention patent application withdrawn after publication |