CN101985513A - POSS/epoxy nanometer hybrid material and preparation method and application thereof - Google Patents
POSS/epoxy nanometer hybrid material and preparation method and application thereof Download PDFInfo
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- CN101985513A CN101985513A CN 201010179346 CN201010179346A CN101985513A CN 101985513 A CN101985513 A CN 101985513A CN 201010179346 CN201010179346 CN 201010179346 CN 201010179346 A CN201010179346 A CN 201010179346A CN 101985513 A CN101985513 A CN 101985513A
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Abstract
The invention belongs to the technical field of chemical industry and photoelectricity, and in particular relates to a high-heat-resistant POSS/epoxy nanometer hybrid material and a preparation method and application thereof. The high-heat-resistant POSS/epoxy nanometer hybrid material comprises (a) at least one epoxy resin, (b) at least one polyhedral oligomeric silsesquioxane (POSS), (c) at least one acidic curing agent, (d) unnecessary organosilane, and (e) an unnecessary auxiliary agent. The POSS/epoxy nanometer hybrid material prepared by the method does not have a phase separation phenomenon, has the characteristics of the epoxy resin such as high caking property, mechanical strength, shearing strength and processability, and has the characteristics of the POSS such as high heat resistance, insulating property, elasticity, ageing resistance and transparency; the production and preparation process is simple, and easy to control; a solvent is not used in the production process; and the method is an environmental-friendly and energy-saving method for synthesizing the POSS/epoxy nanometer hybrid material. The POSS/epoxy nanometer hybrid material is used for an adhesive, an LED packaging material, a photoelectric conversion material, an insulating material, a coating material, a circuit protection material, an optical protection material and the like.
Description
Technical field
The invention belongs to chemical industry and field of photoelectric technology, be specifically related to a kind of excellent heat resistance, ageing resistance, the transparency, insulativity, sunproof POSS/ epoxy nanometer hybrid material and its production and application.More specifically, the present invention relates to a kind of POSS/ epoxy nanometer hybrid material, it comprises Resins, epoxy, polyhedral oligomeric silsesquioxane (POSS), acid curing agent, nonessential organosilane, and nonessential auxiliary agent.The invention still further relates to the preparation method and the application of POSS/ epoxy nanometer hybrid material.Composition of the present invention can be used as raw material and is applied to fields such as sizing agent, LED packaged material, photoelectric conversion material, insulating material, coated material, circuit protection material, optics protecting materials.
Background technology
The hexahedron that polyhedral oligomeric silsesquioxane (POSS) has the Si-O nanostructure does not have the machine frame core, and the periphery is an organic group, and diameter is minimum silicon dioxide granule at 1～3nm, is called as molecular silicas.The inorganic cage structure of POSS has under ultraviolet (UV) illumination that chemical property is stable, Heat stability is good, resistance to oxidation, weather-proof, advantages such as low-temperature performance good, surface energy is low, low-k, low-stress, damping low noise, environmental protection hypotoxicity, difficult combustion or uninflammability, its surperficial organo-functional group has fabulous polymer phase capacitive, POSS is introduced the polymer molecule segment, can be implemented on the nanoscale design and prepare novel Organic.But POSS is relatively poor to base material sticking power, and organic solvent resistance is poor, hardness is low, and the surface is easy to the adhesion dust when high temperature, cost an arm and a leg etc.Resins, epoxy has good mechanical property, electric property, adhesiveproperties, thermotolerance, solvent resistance and easy-formation processing, advantage such as with low cost, yet because it has the 3 D stereo reticulated structure, lack slip between molecular chain, C-C, carbon-oxygen bond can be less, surface energy is higher, and some hydroxyls that have etc. make that its internal stress is big, easy degradation with aging under the embrittlement, high temperature.Compound with epoxy/POSS, both can reduce the Resins, epoxy internal stress, Resins, epoxy toughness be can increase again, its thermotolerance and resistance to chemical reagents improved, have good acid-and base-resisting, salt, performance such as humidity, water-fast, oil resistant and anti-chemical atmosphere corrosion.
More to epoxy/POSS composite study at present, as strengthen hardness and the cohesive force of POSS with Resins, epoxy; Improve heat-resisting, the anti-UV and the electric property of Resins, epoxy with POSS.For example people (2006 national polymer material sciences and engineering symposial such as abundant China of Xue;) be raw material with vinyl POSS (OvPOSS) and epoxy group(ing) POSS (epoxy-POSS); in-situ polymerization prepares EP/OvPOSS and EP/epoxy-POSS nano composite material, and the adding of POSS has improved the intensity and the toughness of Resins, epoxy.People such as Huang (Hybrid Nanocomposites, 2009, be raw material 1927-1934) with eight (glycidyl ether siloxanes) octuple half siloxanes (OG) and bisglycidyl ether bisphenol A epoxide resin, by the synthetic POSS/ epoxy nano composite material of light polymerization process, because the strengthening action of cage shape POSS, the rubbery state storage modulus of nano composite material significantly improves.People such as Shang Yufei (functional materials, 2008,11,1817-1820.) carry out composite modified with epoxidation cage type silsesquioxane (EVOS) to isocyanic ester and epoxy resin copolymer, obtain the high-performance epoxy resin/isocyanic ester matrix material of ultralow dielectric, can be applicable to high-end electronic package material field.Korean Patent Korean patent 1020050004563A is utilizing Resins, epoxy to do in the electronic package material process, adds zinc borate-POSS fire retardant material, improves the flame retardant properties of Resins, epoxy.But adopt the method for simple blend to be separated poor mechanical property easily; Shortcoming by chemical modification method is the process complexity, can use solvent usually and cause purification difficult, and restive level of response.
Summary of the invention
The object of the present invention is to provide that a kind of technology is simple, easy to operate, temperature tolerance is good, good weatherability, good insulating, POSS/ epoxy nanometer hybrid material that photostabilization is good.
POSS/ epoxy nanometer hybrid material provided by the invention, it comprises Resins, epoxy, polyhedral oligomeric silsesquioxane (POSS), acid curing agent, nonessential organosilane, and nonessential auxiliary agent.
Preparation method and the application that above-mentioned POSS/ epoxy nanometer hybrid material also is provided of the present invention.
The present invention also provides a kind of method that obtains the POSS/ epoxy nanometer hybrid material by simple physical blend method original position.
The present invention also provides a kind of any solvent, environmental protection, energy-conservation POSS/ epoxy nanometer hybrid material green synthesis method.
The present invention is made into single component or two-component composition with Resins, epoxy and POSS by the simple physical blending means, in-situ hybridization curing takes place in Resins, epoxy and POSS in the later stage use under the solidifying agent katalysis, obtain the POSS/ epoxy nanometer hybrid material, do not contain any solvent in the composition, can not be separated yet.
A kind of POSS/ epoxy nanometer hybrid material that the present invention proposes, it comprises: (a) at least a Resins, epoxy, (b) at least a polyhedral oligomeric silsesquioxane (POSS), (c) at least a acid curing agent, (d) nonessential organosilane, (e) nonessential auxiliary agent is made into single component or two-component composition by the simple physical blending means, in-situ hybridization curing takes place in the POSS/ epoxy in the later stage use under the solidifying agent katalysis, generates POSS/ epoxy hybrid mixture; In the total amount of hybrid material, the mass fraction of each amounts of components is: 100 parts of Resins, epoxy, 5～500 parts of POSS, 0.01～100 part of acid curing agent, 0～100 part of organosilane, 0～30 part of auxiliary agent.
The POSS/ epoxy nanometer hybrid material that the present invention proposes does not contain any organic solvent, and solid content is 100wt%.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, in the hybrid material total amount, each amounts of components is preferably: 100 parts of Resins, epoxy, 5～300 parts of POSS, 0.01～70 part of acid curing agent, 0～70 part of organosilane, 0～20 part of auxiliary agent.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, Resins, epoxy is selected from the one or more combination of bisphenol A epoxide resin, aliphatic glycidyl ether resin, hydrogenated bisphenol A epoxy resin, cycloaliphatic epoxy resin.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, the limiting examples of described Resins, epoxy comprises: as: the bisphenol A epoxide resin GY240 that Switzerland Ciba company limited (Ciba) produces, GY250, GY260, GY226 etc. and cycloaliphatic epoxy resin PY284, CY179, the bisphenol A epoxide resin D.E.R.331 that Dow Chemical (DOW) is produced, D.E.R.331j, D.E.R.383, D.E.R.332, D.E.R.337 etc. and cycloaliphatic epoxy resin ERL 4229, ERL-4221, the bisphenol-A epoxy Epon 825 that U.S. Shell Co. Ltd (Shell) produces, Epon826, Epon828, Epon830, Epon834 etc. and hydrogenated bisphenol A epoxy resin EPONEX 1510, the hydrogenated bisphenol A epoxy resin HBGE. that BASF Aktiengesellschaft (BASF) produces, the cycloaliphatic epoxy resin JEw-0112 that Changhu Jiafa chemistry Co., Ltd. produces, the cycloaliphatic epoxy resin CER-170 that the gloomy luxuriant Fine Chemical Co., Ltd in Wuhan produces, the hydrogenated bisphenol A epoxy resin GEST3000 of Guangdong HongChang Electronic Materials Co., Ltd etc.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, described polyhedral oligomeric silsesquioxane (POSS) is for having (RSiO1.5) n polysilsesquioxane of polyhedral structure, wherein R can be mutually the same or different, but contain an epoxide group at least, all the other R groups can be distinguished independent be hydrogen atom, halogen atom, hydroxyl, C1-20 alkyl, alkenyl, alkynyl, aryl, alicyclic radical or alkoxy base, select its one or more combination.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, the limiting examples of described polyhedral oligomeric silsesquioxane (POSS) comprising: as: octa-epoxy POSS, diisobutyl-six epoxy group(ing) POSS, tetraphenyl-four epoxy group(ing) POSS, trivinyl-five epoxy group(ing) POSS, hexamethyl-bicyclic oxygen POSS, phenylbenzene-dimethyl-four epoxy group(ing) POSS, hexahydroxy--bicyclic oxygen POSS, dimethoxy-six epoxy group(ing) POSS etc.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, acid curing agent are one or more combination of acid anhydrides, hydrogenation acid anhydrides, metal carboxylate, the metal acetylacetonate complex compound of molecular weight 100～5000.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, metal described in the acid curing agent is selected from metal and is selected from second and third main group metal, fourth, fifth, the transition metal in six cycles and lanthanide series metal.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, the limiting examples of described acid curing agent comprises: as: Tetra hydro Phthalic anhydride, Tetra Hydro Phthalic Anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, MALEIC ANHYDRIDE, tung oil acid anhydride, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, zinc naphthenate, zinc octoate, cobalt naphthenate, stannous octoate, methyl ethyl diketone tin, methyl ethyl diketone zirconium, aluminium acetylacetonate, titanium acetylacetone, acetyl acetone, four acetyl acetones, methyl ethyl diketone platinum.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, organosilane are that molecular weight is one or more the combination in 100～2000 the band oxygen groups organo-siloxane; Described organosilane has following structure:
(R
4)
nSi(OR
5)
4-n
Wherein, n=1,2,3;
Or
R
5=contain the alkyl of 1～20 carbon atom, preferentially select the alkyl of 1～10 carbon atom for use.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, the limiting examples of described organosilane comprises KBM-303, KBM-403, KBE-402, the KBE-403 that produces as: Japanese Shin-Etsu Chemial Co., Ltd (Shin Etsu), DC Z-6040, DC Z-6042 that Dow corning company (Dow Corning) produces, Silquest 187, Silquest 186 that Singapore Momentive performance materials company (mpm) produces, German Wa Ke company (Wacker) produces
GF 80, GF 82, the silane that German goldschmidt chemical corporation (Degussa) is produced
GLYMO, homemade silane KH-560 etc.
The POSS/ epoxy nanometer hybrid material that the present invention proposes, auxiliary agent are one or more combination of UV light absorber commonly used in the sizing agent, ageing-resistant dose, thermo-stabilizer, toughner, viscosity increaser, thickening material etc.
In POSS/ epoxy nanometer hybrid material of the present invention, can also comprise other optional component, as long as they and consumption thereof bring adverse influence to POSS/ epoxy nanometer hybrid material of the present invention indistinctively.Optional component comprises tinting material, sterilant, sanitas, weighting agent etc., or combination arbitrarily.
The preparation method of the above-mentioned POSS/ epoxy nanometer hybrid material that the present invention proposes, its concrete steps are as follows:
(1) carries out blend by set of dispense than Resins, epoxy, POSS, the nonessential organosilane of weighing 20～70wt%, stirred 0.1～24 hour;
(2) remaining Resins, epoxy and solidifying agent are mixed the thing that is uniformly mixed, 1～24 hour time;
(3) under agitation condition, drip the uniform mixture that obtains in the step (2) in the blend that in step (1), obtains, stirred 0.1～5 hour;
(4) under agitation condition, drip nonessential auxiliary agent in the blend that in step (4), obtains, stirred 0.1～5 hour, promptly be mixed with described POSS/ epoxy nanometer hybrid material.
Among the present invention, described Resins, epoxy is selected from the one or more combination of bisphenol A epoxide resin, aliphatic glycidyl ether resin, hydrogenated bisphenol A epoxy resin, cycloaliphatic epoxy resin.
Among the present invention, described acid curing agent is acid anhydrides, hydrogenation acid anhydrides, metal carboxylate, the metal acetylacetonate complex compound of molecular weight 100～5000.
Among the present invention, described organosilane is that molecular weight is 100～2000 band oxygen groups organo-siloxane.
Among the present invention, described auxiliary agent is curable epoxide promotor commonly used in the sizing agent, UV light absorber, ageing-resistant dose, thermo-stabilizer, toughner, viscosity increaser, thickening material etc.
POSS/ epoxy nanometer hybrid material of the present invention is as the application of sizing agent, LED packaged material, photoelectric conversion material, insulating material, coated material, circuit protection material, optics protecting materials etc.
Utilize the present invention, the POSS/ epoxy nanometer hybrid material in-situ hybridization crosslinking curing under 0～200 ℃ of condition with obtaining after the simple physical blend obtains the POSS/ epoxy nanometer hybrid material.
Utilize the present invention, the POSS/ epoxy nanometer hybrid material in-situ hybridization crosslinking curing under 20～200 ℃ of conditions with obtaining after the simple physical blend obtains the POSS/ epoxy nanometer hybrid material.
A kind of excellent heat resistance, ageing resistance, the transparency, insulativity, sunproof POSS/ epoxy nanometer hybrid material that the present invention proposes have following characteristics:
(1) the present invention passes through simple blend with Resins, epoxy and epoxy POSS, utilize the epoxy reaction on acid curing agent and Resins, epoxy and the POSS, POSS/ epoxy in-situ hybridization, POSS are dispersed in and obtain the homogeneous phase nano-hybrid material in the Resins, epoxy, phenomenon of phase separation can not take place.
(2) the POSS/ epoxy nanometer hybrid material of the present invention preparation have that cohesiveness is good, thermotolerance is high, good insulating, ageing resistance is good, the transparency is good characteristics.
(3) production of the present invention and preparation process simple and be easy to control, production process does not contain any solvent, is a kind of environmental protection, energy-conservation POSS/ epoxy nanometer hybrid material green synthesis method.
(4) the POSS/ epoxy nanometer hybrid material of the present invention's preparation can be used as sizing agent, LED packaged material, photoelectric conversion material, insulating material, coated material, circuit protection material, optics protecting materials etc.
Description of drawings
Fig. 1 is the surfaces A FM afm scan photo of POSS/ epoxy nanometer hybrid material, and as can be seen from the figure, the POSS/ epoxy nanometer hybrid material surface of preparation is even, fine and close, is not separated.
Fig. 2 is the visible light transmissive rate curve of POSS/ epoxy nanometer hybrid material, and as can be seen from the figure, the POSS/ epoxy nanometer hybrid material transmittance of preparation increases than the transmittance of pure epoxy resin material.
Embodiment
The following example has further described and has proved the preferred embodiment in the scope of the invention.These embodiment that given only are illustrative, and are unintelligible for being limitation of the present invention.
Embodiment 1:
POSS/ epoxy nanometer hybrid material prescription 1
Form consumption (mass fraction)
Hydrogenated bisphenol A epoxy resin 100
Diisobutyl-six epoxy group(ing) POSS 10
Epoxy radicals silicone hydride 10
Methyl hexahydrophthalic anhydride 10
UV absorption agent 3
1-cyanoethyl-2-ethyl-4-methylimidazole 2
In reactor, add 50 parts of hydrogenated bisphenol A epoxy resins, 10 parts of diisobutyl-six epoxy group(ing) POSS, stirred 5 hours, add 10 parts of epoxy radicals silicone hydrides, continue to stir 0.5 hour, get the A component, stand-by.
In reactor, add 50 parts of hydrogenated bisphenol A epoxy resins, 10 parts of methyl hexahydrophthalic anhydrides, stirred 2 hours, add the A component, continue to stir 1 hour, add 3 parts of UV absorption agents, 2 parts of 1-cyanoethyl-2-ethyl-4-methylimidazole curing catalysts again, stirred 1 hour, obtain the POSS/ epoxy nanometer hybrid material.
100 ℃ of heating 3 hours, in-situ solidifying obtained the POSS/ epoxy nanometer hybrid material with above-mentioned POSS/ epoxy nanometer hybrid material.
Embodiment 2:
POSS/ epoxy nanometer hybrid material prescription 2
Form consumption (mass fraction)
Hydrogenated bisphenol A epoxy resin 100
Three hexyls-five epoxy group(ing) POSS 50
Tetraphenyl-four epoxy group(ing) POSS 50
Epoxy radicals silicone hydride 20
Stannous octoate 2
In reactor, add 50 parts of hydrogenated bisphenol A epoxy resins, 50 part of three hexyl-five epoxy group(ing) POSS, 50 parts of tetraphenyl-four epoxy group(ing) POSS, stirred 6 hours, add 20 parts of epoxy radicals silicone hydrides, continue to stir 1 hour, get the A component, stand-by.
In reactor, add 50 parts of hydrogenated bisphenol A epoxy resins, 2 parts of stannous octoates, stirred 2 hours, add the A component, continue to stir 5 hours, obtain the POSS/ epoxy nanometer hybrid material.
150 ℃ of heating 2 hours, in-situ solidifying obtained the POSS/ epoxy nanometer hybrid material with above-mentioned POSS/ epoxy nanometer hybrid material.
Embodiment 3:
POSS/ epoxy nanometer hybrid material prescription 3
Form consumption (mass fraction)
Cycloaliphatic epoxy resin 50
Hydrogenated bisphenol A epoxy resin 50
Octa-epoxy POSS 100
Methyl ethyl diketone zirconium 0.01
In reactor, add 50 parts of cycloaliphatic epoxy resins, 100 parts of hydroxy silicon oils, stirred 8 hours, get the A component, stand-by.
In reactor, add 50 parts of hydrogenated bisphenol A epoxy resins, 0.01 part of methyl ethyl diketone zirconium, stirred 10 hours, get the B component.
Above-mentioned A component, B component are mixed, and 80 ℃ of heating 10 hours, in-situ solidifying obtained the POSS/ epoxy nanometer hybrid material.
Embodiment 4:
POSS/ epoxy nanometer hybrid material prescription 4
Form consumption (mass fraction)
Cycloaliphatic epoxy resin 70
Bisphenol A epoxide resin 30
Hexahydroxy--bicyclic oxygen POSS 100
Phenylbenzene-dimethyl-four epoxy group(ing) POSS 200
Epoxy radicals silicone hydride 50
Hexahydrophthalic anhydride 70
In reactor, add 70 parts of cycloaliphatic epoxy resins, 100 parts of hexahydroxy--bicyclic oxygen POSS, 200 parts of phenylbenzene-dimethyl-four epoxy group(ing) POSS, stirred 5 hours, add 50 parts of epoxy radicals silicone hydrides again, continue to stir 2 hours, get the A component, stand-by.
In reactor, add 30 parts of bisphenol A epoxide resins, 70 parts of hexahydrophthalic anhydrides, stirred 10 hours, get the B component.
Above-mentioned A component, B component are mixed, placed 7 days in room temperature, in-situ solidifying obtains the POSS/ epoxy nanometer hybrid material.
Embodiment 5:
POSS/ epoxy nanometer hybrid material prescription 5
Form consumption (mass fraction)
Bisphenol A epoxide resin 100
Dimethoxy-six epoxy group(ing) POSS 60
Epoxy radicals silicone hydride 70
Titanium acetylacetone 1
Thermo-stabilizer 3
UV absorption agent 2
In reactor, add 50 parts of bisphenol A epoxide resins, 60 parts of dimethoxy-six epoxy group(ing) POSS, 70 parts of epoxy radicals silicone hydrides, stirred 24 hours, get the A component, stand-by.
In reactor, add 50 parts of bisphenol A epoxide resins, 1 part of titanium acetylacetone, stirred 14 hours, add 3 parts of thermo-stabilizers, 2 parts of UV absorption agents, continue to stir 5 hours, add the A component again, continue to stir 2 hours, obtain the POSS/ epoxy nanometer hybrid material.
130 ℃ of heating 2 hours, in-situ solidifying obtained the POSS/ epoxy nanometer hybrid material with above-mentioned POSS/ epoxy nanometer hybrid material.
Embodiment 6:
POSS/ epoxy nanometer hybrid material prescription 5
Form consumption (mass fraction)
Aliphatic glycidyl ether resin 60
Bisphenol A epoxide resin 40
Dimethoxy-six epoxy group(ing) POSS 200
Diisobutyl-six epoxy group(ing) POSS 300
Methyl ethyl diketone tin 10
MALEIC ANHYDRIDE 30
UV absorption agent 10
In reactor, add 60 parts of aliphatic glycidyl ether resins, 200 parts of dimethoxy-six epoxy group(ing) POSS, 300 parts of diisobutyl-six epoxy group(ing) POSS, stirred 24 hours, get the A component, stand-by.
In reactor, add 40 parts of bisphenol A epoxide resins, 10 parts of methyl ethyl diketone tin, 30 parts of MALEIC ANHYDRIDE, stirred 10 hours, add 10 parts of UV absorption agents, continue to stir 5 hours, add the A component again, continue to stir 5 hours, obtain the POSS/ epoxy nanometer hybrid material.
200 ℃ of heating 0.5 hour, in-situ solidifying obtained the POSS/ epoxy nanometer hybrid material with above-mentioned POSS/ epoxy nanometer hybrid material.
Claims (10)
1. POSS/ epoxy nanometer hybrid material, it is characterized in that said composition comprises: (a) at least a Resins, epoxy, (b) at least a polyhedral oligomeric silsesquioxane (POSS), (c) at least a acid curing agent, (d) nonessential organosilane, (e) nonessential auxiliary agent; Be made into single component or two-component composition by the simple physical blending means, in-situ hybridization curing takes place at 0-300 ℃ in Resins, epoxy and POSS in the later stage use under the solidifying agent katalysis, is not contained the POSS/ epoxy nanometer hybrid material of any solvent; In the total amount of POSS/ epoxy nanometer hybrid material, each amounts of components is: 100 parts of Resins, epoxy, 5～500 parts of POSS, 0.01～100 part of acid curing agent, 0～100 part of organosilane, 0～20 part of auxiliary agent;
Wherein, Resins, epoxy is selected from one or more the combination in bisphenol A epoxide resin, hydrogenated bisphenol A epoxy resin, aliphatic glycidyl ether resin, the cycloaliphatic epoxy resin;
(the RSiO of cage modle polysilsesquioxane (POSS) for having cage structure
1.5)
nPolysilsesquioxane, wherein R can be mutually the same or different, but contain an epoxide group at least, and all the other R groups can be distinguished independent be hydrogen atom, halogen atom, hydroxyl, C
1-20Alkyl, alkenyl, alkynyl, aryl, alicyclic radical or alkoxy base;
Acid curing agent is one or more combination of acid anhydrides, hydrogenation acid anhydrides, metal carboxylate, metal alkyl complex compound, the metal acetylacetonate complex compound of molecular weight 100～5000;
Organosilane is that molecular weight is one or more the combination in 100～2000 the band oxygen groups organo-siloxane;
Auxiliary agent is a usual auxiliaries in the sizing agent, is UV light absorber, ageing-resistant dose, one or more combination of thermo-stabilizer, toughner, viscosity increaser, thickening material.
2. POSS/ epoxy nanometer hybrid material according to claim 1 is characterized in that described Resins, epoxy is selected from one or more combination of bisphenol A epoxide resin, hydrogenated bisphenol A epoxy resin, cycloaliphatic epoxy resin.
3. POSS/ epoxy nanometer hybrid material according to claim 1 is characterized in that described solidifying agent is one or more combination of acid anhydrides, hydrogenation acid anhydrides, metal carboxylate, the metal acetylacetonate complex compound of molecular weight 100～5000.
4. according to the described acid curing agent of claim 3, it is characterized in that wherein said metal is selected from second and third main group metal, fourth, fifth, the transition metal in six cycles and lanthanide series metal.
5. according to the described acid curing agent of claim 4, it is characterized in that being selected from as Tetra hydro Phthalic anhydride, Tetra Hydro Phthalic Anhydride, hexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride, MALEIC ANHYDRIDE, tung oil acid anhydride, methyl tetrahydro phthalic anhydride, HHPA, methyl hexahydrophthalic anhydride, zinc naphthenate, zinc octoate, cobalt naphthenate, stannous octoate, methyl ethyl diketone tin, methyl ethyl diketone zirconium, aluminium acetylacetonate, titanium acetylacetone, acetyl acetone, four acetyl acetones, methyl ethyl diketone platinum.
6. POSS/ epoxy nanometer hybrid material according to claim 1 is characterized in that described organic epoxy silane is that molecular weight is 100～2000, one or more combination of the organosilane of band oxygen groups, and described organosilane has following structure:
(R
4)
nSi(OR
5)
4-n
Wherein, n=1,2,3;
Or
R
5=contain the alkyl of 1～20 carbon atom, preferentially select the alkyl of 1～10 carbon atom for use.
7. POSS/ epoxy nanometer hybrid material according to claim 1 is characterized in that each amounts of components is: 100 parts of Resins, epoxy, 5～500 parts of POSS, 0.01～100 part of acid curing agent, 0～100 part of organosilane, 0～20 part of auxiliary agent.
8. the preparation method of a POSS/ epoxy nanometer hybrid material as claimed in claim 1 is characterized in that concrete steps are as follows:
(1) carries out blend, 0.1～24 hour blend time by set of dispense than Resins, epoxy, POSS, the nonessential organosilane of weighing 20～70wt%;
(2) remaining Resins, epoxy and solidifying agent are mixed the thing that is uniformly mixed, 1～24 hour blend time;
(3) under agitation condition, drip the uniform mixture that obtains in the step (2) in the blend that in step (1), obtains, 0.1～5 hour blend time;
(4) under agitation condition, drip nonessential auxiliary agent in the blend that in step (4), obtains, drip the back and continue to stir 0.1～5 hour, promptly be mixed with the POSS/ epoxy nanometer hybrid material.
9. a POSS/ epoxy nanometer hybrid material as claimed in claim 1 is as the application of sizing agent, LED packaged material, photoelectric conversion material, insulating material, coated material, circuit protection material, optics protecting materials etc.
10. the application method of POSS/ epoxy nanometer hybrid material according to claim 1 is characterized in that the POSS/ epoxy nanometer hybrid material in-situ hybridization crosslinking curing under 0～300 ℃ of condition that will obtain after the blend.
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